Abstract: A rotary deblistering apparatus is described. It comprises a rotatable drum having plurality of circumferential pack holding means each adapted to hold and retain a blister pack. The drum can rotate to locate the pack holding means at a plurality of peripheral work positions including a pack loading position, a pack deblistering position, and a pack detachment position. The blister packs can be loaded onto the drum through a loading means, preferably the loading means has a storage magazine able to supply a continuous number of packs to the drum. For a peelable pack, prior weakening or cutting of the backing of the pack may be necessary or desired. Such action could be carried out at the pack deblistering position. Alternatively, there is a prior weakening and/or cutting position around the drum.

Abstract: A method and apparatus for picking up module ICs from customer trays utilizes a rotating table. In the apparatus and method, the customer tray is placed on the rotating table, and the rotating table is inclined a predetermined amount. The inclination of the rotating table causes the customer tray, and the module ICs held in the tray, to also be inclined. A grasping apparatus is then used to pick up the module ICs from the customer tray. The pick up apparatus may also be configured to incline the same amount as the rotating table. Once the module ICs have been picked up from the customer tray, they can be delivered to an unloading station, or to a module IC carrier.

Abstract: In a tray feeder, in which a drawing section draws a palette from a container and supplies the palette to a pick-up point where a pick-up head of a parts-mounting-apparatus picks up parts, the head starts lowering and halts at a stand-by position before the palette held by the drawing section arrives at the pick-up point. When the drawing section arrives at the pick-up point, the head lowers again from the stand-by position. This mechanism reduces a time necessary for picking up a part.

Abstract: A cassette station, a processing station having a coating unit and a developing unit, and an inspecting station having a film thickness inspecting apparatus and a defect inspecting apparatus are disposed in the direction approximately perpendicular to the direction of the disposition of cassettes of the cassette station in such a manner that the inspecting station is disposed midway between the cassette station and the processing station. In the structure, the inspecting station and the processing station are connected and wafers are automatically transferred among the stations, operations from the substrate process to the inspection can be simplified and the time period necessary therefore can be shortened.

Abstract: A wafer processing system occupies minimal floor space by using vertically mounted modules such as reactors, load locks, and cooling stations. Further saving in floor space is achieved by using a loading station which employs rotational motion to move a wafer carrier into a load lock. The wafer processing system includes a robot having extension, rotational, and vertical motion for accessing vertically mounted modules. The robot is internally cooled and has a heat resistant end-effector, making the robot compatible with high temperature semiconductor processing.

Abstract: A Bulk Mail Container (BMC) unloader uses a simple crossed four bar-linkage to move a predetermined point on a BMC unloader in a substantially straight line while the overall BMC unloader rotates about that predetermined point so as to upend the BMC container. This takes advantage of the crossed four-bar's substantially straight-line motion over a limited range of its motion, as well as the rotational motion of the particular unloader link disclosed herein. This is advantageous for unloading. In use, a BMC container is simply rolled into the BMC unloader, and the entire combination of the BMC container and BMC unloader is then actuated to produce substantially straight line motion along a suitably selected “center” point of the BMC unloader while the overall combination rotates about the center point so as to upend the BMC for unloading.

Abstract: A substrate processing apparatus includes a process tube for processing a plurality of substrates, two boats for accommodating the substrates, two boat elevators, a substrate transfer unit for loading and unloading the substrates into and from the boats when the boats are at the first position. In this apparatus, each boat elevator has one boat mounted thereon and each of the boat elevators carries a corresponding boat between a first position located below the process tube and two corresponding second positions. Each of the boat elevators performs loading and unloading the corresponding boat into and from the process tube at the first position. Further, in the apparatus, a center position of the process tube is disposed inside a triangle formed by connecting the substrate transfer unit and the two boat elevators.

Abstract: A tray feeder sequentially takes pallets, each holding a tray storing electronic parts, out of a magazine and feeds them to a pick-up position where the electronic parts are picked up by a transfer head of an electronic parts-mounting apparatus. The tray feeder comprises the magazines for containing the pallets in a stacked manner, a drawing portion for drawing the pallet from the magazine and carrying the same thereon, a lifting-lowering portion for vertically moving the drawing portion, a non-mounted-parts discharge portion provided above the magazines, and a replenishing portion for receiving the pallet, holding the empty tray from which the electronic parts have been picked up, and for recharging the pallet after fresh electronic parts are replenished. With this construction, there can be achieved the tray feeder that is excellent in the operation efficiency and is compact in size.

Abstract: A method for transporting a substrate between a carrier, which holds the substrate, and a semiconductor manufacturing unit, which receives the substrate. The method includes steps of applying the carrier, which holds the substrate, to a chamber, which houses the semiconductor manufacturing unit, in which chamber the environment of the semiconductor manufacturing unit is controlled, rotatably removing, by an opener, a door of the carrier and a door of the chamber, as a unit, from the carrier and the chamber, and transferring the substrate from the carrier and to the carrier, when the door of the carrier and the door of the chamber have been rotatably removed as a unit by the opener in the removing step. Also disclosed are semiconductor manufacturing apparatus utilizing such a method.

Abstract: A substrate handling robot includes an arm drive mechanism. A first arm is connected to the arm drive mechanism. A multiple substrate batch loader is connected to the first arm. A second arm is also connected to the arm drive mechanism. A single plane end effector is connected to the second arm. The multiple substrate batch loader produces a vacuum signal indicative of how many substrates are held by the multiple substrate batch loader. A vacuum signal interpreter alters the movement of the first arm in response to the substrate load number. An object sensor is connected to the second arm. The object sensor assesses the number of substrates in a cassette adjacent to the multiple substrate batch loader. A substrate loading sequence controller controls the first arm and the second arm in response to the number of substrates in the cassette, such that the second arm removes substrates from the cassette in such a manner as to facilitate complete loading of the multiple substrate batch loader.

Abstract: An integrated wafer transport and transfer device is disclosed, which includes a vehicle with an integrated docking platform for holding a wafer carrier such as a FOUP (front opening unified pod). The docking platform is positioned at the correct height for sealing the FOUP to the load lock of a process tool. Vertical and/or horizontal movement is required in some cases. Methods for delivering wafers to process tools are also described. In a preferred embodiment, wafers are carried inside a FOUP on a cart, such as an automatically guided vehicle or a personally guided vehicle. The cart is docked at a process tool and the FOUP is sealed to the load lock of the tool without removing the FOUP from the cart. After processing on one tool, the cart along with the FOUP can be moved to the next process tool for further processing. The FOUP can stay on the same cart until all processing is completed. This is especially useful for moving priority lots through the fabrication facility quickly.

Abstract: A transporting pack (10) for throttle valves (5), comprising a housing (14) with a base (16) and a cover (18), the throttle valves (12) having at least one bore (6, 7) and at least one spacer (40), is intended to be reusable and, at the same time, to protect the throttle valves (12) in a particularly reliable manner against damage and contamination caused by transportation. For this purpose, the base (16) of the housing (14) is connected to at least one rod (20, 22), it being possible for the throttle valves (5), in order to be arranged in the housing (14), to be pushed onto the at least one rod (20) by way of their at least one bore (24, 26).

Abstract: Methods for selectively moving a microelectronic-device substrate assembly in a processing machine having a first side, a second side opposite the first side, and a processing path extending from the first side to the second side. The processing machine can also include a cassette proximate to a second side of the processing station that moves to position a substrate at the processing path. In one aspect of the invention, the substrate handling apparatus includes a guide member attached to the processing machine, an arm slidably attached to the guide member, and a clamp attached to the arm. The guide member is generally fixedly attached to the processing machine, and the guide member generally has a shape corresponding to the processing path. The arm can include a first section moveably attached to the guide member to translate along the guide member, and a second section projecting from the first section to position at least a portion of the second section at least proximate to the processing path.

Abstract: A system and method for transporting semiconductor wafers in a semiconductor processing system, which may include a transport module and a process chamber. The system includes a container configured to house a plurality of semiconductor wafers, where the container is a separate component from the semiconductor processing system. A semiconductor wafer transport device is disposed in the transport module, which is configured to extend into the container from the transport module and deliver the semiconductor wafers to the process chamber.

Abstract: An apparatus for transferring wafers between wafer holders such as wafer cassettes, etching drums and the like includes a tank for containing a liquid transfer medium in which the wafers can be transferred. The apparatus includes a wafer transfer unit that can transfer a plurality of wafers such as semiconductor wafers between wafer holders, and maintain the wafers in a desired relative orientation during transfer. For example, the wafers can be maintained in a parallel relationship. The apparatus can be used to automatically transfer wafers to etching drums without cross-indexing of the wafers and without manual handling of the wafers.

Abstract: A Bulk Mail Container (BMC) unloader uses a simple crossed four bar-linkage to move a predetermined point on a BMC unloader in a substantially straight line while the overall BMC unloader rotates about that predetermined point so as to upend the BMC container. This takes advantage of the crossed four-bar's substantially straight-line motion over a limited range of its motion, as well as the rotational motion of the particular unloader link disclosed herein. This is advantageous for unloading. In use, a BMC container is simply rolled into the BMC unloader, and the entire combination of the BMC container and BMC unloader is then actuated to produce substantially straight line motion along a suitably selected “center” point of the BMC unloader while the overall combination rotates about the center point so as to upend the BMC for unloading.

Abstract: In order to achieve a higher compaction ratio with a wafer transfer apparatus for transferring wafers stacked in an interspaced manner in a first holding device, e.g.

Abstract: A wafer transport mechanism is disclosed capable of transferring workpiece cassettes between lot boxes and SMIF pods. The transport mechanism includes a frame having a first support platform on a first side of the frame for supporting a SMIF pod, and a second support platform on a second side of the frame for supporting a lot box. The frame further includes a carrier transfer mechanism which resides completely within the frame when in a home position. The transfer mechanism includes an arm and a gripper pivotally mounted to the arm. Once a SMIF pod and lot box are seated on their respective support platforms, the transfer mechanism transfers a cassette between the two containers.

Abstract: A Bulk Mail Container (BMC) unloader uses a simple crossed four bar-linkage to move a predetermined point on a BMC unloader in a substantially straight line while the overall BMC unloader rotates about that predetermined point so as to upend the BMC container. This takes advantage of the crossed four-bar's substantially straight-line motion over a limited range of its motion, as well as the rotational motion of the particular unloader link disclosed herein. This is advantageous for unloading. In use, a BMC container is simply rolled into the BMC unloader, and the entire combination of the BMC container and BMC unloader is then actuated to produce substantially straight line motion along a suitably selected “center” point of the BMC unloader while the overall combination rotates about the center point so as to upend the BMC for unloading.

Abstract: An apparatus for transferring wafers between wafer holders such as wafer cassettes, etching drums and the like includes a tank for containing a liquid transfer medium in which the wafers can be transferred. The apparatus includes a wafer transfer unit that can transfer a plurality of wafers such as semiconductor wafers between wafer holders, and maintain the wafers in a desired relative orientation during transfer. For example, the wafers can be maintained in a parallel relationship. The apparatus can be used to automatically transfer wafers to etching drums without cross-indexing of the wafers and without manual handling of the wafers.

Abstract: A method for performing a batch change in an automatic cheese winder, which has many identical winding stations disposed in sections and a transportation system for supplying yarn-wound spinning cops to and removing empty unwound spinning cops from the winding stations. Transport trays for transporting spinning cops or empty tubes revolve within the transportation system, which has many different transport paths, among others transverse transport paths leading to the winding stations. The clearing away of an old batch of yarn is done section by section. Thus, from the transverse transport paths of one winding station section, spinning cop-carrying transport trays are discharged until such time as that section has been cleared out. The temporary storage of empty transport trays in the transverse transport paths of a cleared winding station section is already begun while adjacent winding station sections are still being cleared.

Abstract: A method and apparatus for fabricating and drying wafers, including micro-electro-mechanical system (MEMS) structures, in a second, supercritical processing fluid environment. The apparatus utilizes an inverted pressure vessel connected to a supercritical processing fluid supply and recover system, with an internal heat exchanger connected to external heating and cooling sources, which is closed with a vertically movable base plate. A wafer cassette configured for supporting multiple wafers is submerged in a first processing fluid within a container, which is installed on the base plate for insertion into the pressure vessel. Vessel inlet and outlet tubes extend vertically downward from the ceiling of the pressure vessel to nearly the base plate. Container inlet and outlet tubes extend vertically downward from the ceiling of the pressure vessel to inside the container and nearly to the bottom of the container.

Abstract: A group of bolts are suppled into a placing surface of a tray, an isolated bolt is searched for by a visual sensor, and its deviation from a standard position at the time of teaching is determined. The isolated bolt is picked up by a robot that has been taught how to pick up an isolated bolt laying in a standard position. The position of the robot's hand is corrected according to the deviation from the standard position before the robot attempts to pick up the located isolated bolt. If no isolated bolt is found, a shaking device 1 is operated to loosen the piled-up bolts, and a new isolated bolt is again searched for by the visual sensor. The isolated bolt, if found, is picked up. The picking-up operation may be performed by searching for an isolated small set of bolts using a three-dimensional visual sensor. The oscillating excitation can also be provided by a robot.

Abstract: An apparatus for transferring wafers between wafer holders such as wafer cassettes, etching drums and the like includes a tank for containing a liquid transfer medium in which the wafers can be transferred. The apparatus includes a wafer transfer unit that can transfer a plurality of wafers such as semiconductor wafers between wafer holders, and maintain the wafers in a desired relative orientation during transfer. For example, the wafers can be maintained in a parallel relationship. The apparatus can be used to automatically transfer wafers to etching drums without cross-indexing of the wafers and without manual handling of the wafers.

Abstract: In a tray conveying apparatus and method for, for instance, semiconductor parts, a main station and substation which have a tray conveying function are driven slidably in a direction perpendicular to a tray conveying line by a station sliding mechanism. When the preparation of a satisfactory-parts tray is required, the sub-station is positioned on the conveying line, and a satisfactory-parts tray is prepared on this sub-station by means of the exchange of parts, etc. Afterward, both main station and sub-station are caused to slide so that the main station is positioned on the conveying line. In this state, the satisfactory-parts tray is positioned in the vicinity of the conveying line, and a tray on the main station is replenished with satisfactory parts from the satisfactory-parts tray. A table sliding mechanism is further provided that has an upper-stage table, which carries a defective-parts tray, and a lower table, which caries a reclaimable-parts tray.

Abstract: A method and apparatus for substrate processing at lower cost than existing processing systems are disclosed, which by implementing an arrangement using load locks of smaller dimensions or of a non-indexing type, as compared to existing large dimension or indexing load locks, along with a substrate loading and unloading technique can achieve the fast throughput of existing systems while reducing the size and cost of the load lock apparatus required. A processed substrate is returned by an internal robot from one of its processing modules to the shelf or slot in the small load lock from which the last substrate was removed for processing by the robot, rather than being returned to the original source shelf or slot from which it was removed for processing, as in the prior art. Also venting for a first one of the load locks is started as soon as the second load lock becomes the substrate source for the internal robot rather than waiting until the first load lock has been refilled with processed substrates.

Abstract: An apparatus for transporting pipette tips is provided which comprises a vacuum manifold and one or more air conduits. The vacuum manifold internally defines a vacuum chamber, and has a wall which defines one or more apertures. The vacuum manifold is adapted for use in conjunction with a vacuum source. An air conduit is fixed to each of the one or more apertures defined by the wall of the vacuum manifold. Each air conduit defines an air channel, and is sized such that it can be inserted through a proximal opening defined by the head of one of the pipette tips without contacting the inner surface of the head of the pipette tip. The air channel of each air conduit is larger than a distal opening defined by the body of the pipette tip, such that when each air conduit is inserted through the proximal opening of one of the pipette tips and a vacuum source is used in conjunction with the vacuum manifold to create a vacuum in the vacuum chamber, the pipette tips are held in engagement with the vacuum manifold.

Abstract: A mechanism for transferring an integrated circuit package from a source site to a destination site with use of air to push the integrated circuit package to minimize use of moving parts. The integrated circuit package initially travels through an input passage when the integrated circuit package is placed into an input passage opening at the source site. In addition, an intermediate resting site is disposed at the end of the input passage. The integrated circuit package stops to rest at the intermediate resting site after traveling through the input passage. An output passage has an output passage opening at the intermediate resting site, and the integrated circuit package travels through the output passage to reach the destination site at the end of the output passage.

Abstract: A tilt mechanism for periodically tilting a cassette configured to hold a plurality of wafers or workpieces such that the wafers or workpieces become gravity-loaded against a rear portion of the cassette. The tilt mechanism is mounted entirely above a worktable of a CMP or other processing machine and comprises a housing which houses a circular cam having a spiral groove formed therein. A tilt arm is pivotally mounted to the housing and extends vertically between a lower end which is adjacent the cam and an upper end which is fixed to a platform supporting a cassette holding a plurality of workpieces. A cam follower is attached to the lower end of the arm and projects into the groove. Rotary motion of the cam effects pivotal movement of the tilt arm which, in turn, effects tilting of the support platform and the cassette.

Abstract: A component conveying device is provided in which a lead component and a second component behind the lead component can be reliably separated and the lead component can be readily extracted with reduced error. The device includes a guide groove 6 for guiding and aligning the components P in a single line. A blade 5 is provided which moves back and forth in the groove. The components P are conveyed forward by moving the blade 5 forward at a low speed and then moving the blade backward in a high speed. A first stopper 31 holds a second component at the distal end of the device. A second stopper 41 stops the lead component P1 from moving back and forth, and a shutter 43 includes a magnet 49 for attracting the lead component. The second stopper is provided at a distal end portion of the guide groove 6.

Abstract: A wafer transfer method of semiconductor fabricating equipment is capable of successively arranging a plurality of wafers in a designated order (e.g., an ascending order, a descending order, an odd/even number order or an individual selection order). The wafer transfer method uses a first cassette containing the wafers, and a second cassette for receiving the wafers. A wafer transfer robot having a wafer transfer arm moves the wafers from the first cassette to the second cassette, after the wafer serial numbers have been read and sent to a computer. The computer uses a selected wafer arrangement order to decide where within the second cassette each wafer from the first cassette should be placed and then controls the wafer transfer robot to place each wafer into the desired location. With the wafers arranged in the selected order, it is not necessary to test each wafer after each fabricating process.

Abstract: A method and system are provided for flipping a tray of parts such as integrated circuit packages including a pair of flippable storage trays. A first storage tray has an upper surface which forms a grid of storage compartments wherein each of the storage compartments is adapted to hold a single integrated circuit package. Initially, the first tray is received at a flip station from a first part processing station. Then, the first and second trays are joined together so that they mate. Then, the mated first and second trays are inverted so that the packages are held in the second tray. Then, the first and second trays are separated and the second tray which now holds the plurality of packages is transferred to a second part processing station. Then, the cycle is repeated with a third tray of parts and the now empty first tray.

Abstract: The primary function of the optional handler is to make plates available on demand to the imaging engine. A multitude of plates are stored inside cassettes and these cassettes are loaded into the handler. There may be up to four cassettes residing in the handler. Inside a cassette there may be a protective interleaf sheet, sometimes called a slip sheet, between each plate which is removed by the handler and discarded. The handler receives commands from the engine control sequencer which provides instructions as to what cassette needs to be accessed to make a plate available to the picker mechanism so the plate may be conveyed to the imaging engine. Conversely the handler provides status information to the engine to make full interaction with the system possible.

Abstract: A chip peeling apparatus has a plurality of protrusions which include first protrusions and second protrusions lower than the first protrusions. A vacuum pump communicates through holes with grooves defined between adjacent ones of the protrusions. A UV sheet is attached to chips, and the chips are supported in the vicinity of their corners by the tops of the first protrusions. When the vacuum pump is actuated, the chips and streets disposed between the chips are lowered, and the chips are curved and supported in abutment against the tops of the second protrusions. Each of the chips is gradually peeled off the UV sheet under a force tending to recover the original shape of the curved sheet. The chip peeling apparatus is effective in preventing the chips from being damaged and positionally deviated when the chips are attracted and carried.

Abstract: The present invention generally provides a modular substrate cassette used to store substrates. The modular substrate cassette is designed to use different components that may be collectively assembled into different cassette configurations while substantially reducing or eliminating custom and complex fabrication costs. The modular substrate cassette may accommodate multiple substrate sizes, including 100 mm, 200 mm, and 300 mm substrates, as well as a variety of substrate shapes, including circular, square, and rectangular. In a preferred embodiment, the substrate supports use materials from standard geometries of bar stock and/or plate stock to minimize the costs of production. Also, in a preferred embodiment, the substrate cassette is designed to allow multi-directional access to substrates stored in the cassette.

Abstract: A method for unloading silicon wafers contained in a cassette from a sealed pod and supplying the wafers to an IC manufacturing process. The method includes receiving a base of the pod onto a loading platform of a pod loader interface and then unlocking the pod cover from the base. While maintaining the wafers in a clean mini-environment, the method raises the pod cover away from the base, contacts the now exposed cassette with an end effector of an articulated arm, secures the cassette to the end effector, and activates the arm to transport the wafers out of mini-environment for supplying the wafers to an IC manufacturing process. Preferably, the method further includes raising the articulated arm to lift the cassette before transferring the wafers to the process. Even more preferred, the method directs a flow of clean air within the mini-environment horizontally past the wafers.

Abstract: The present invention provides for safe and simple replacement or removal of individual feeders from a placement machine without any loss in performance by using a signal means to emit a signal to the CPU of the placement machine when a feeder is removed. Upon receipt of this signal, the CPU controls the pick-up head in such a way so that it does not collide with the feeder being removed. If the pick-up head is located directly above the pick-up position of the feeder to be removed, it can be moved momentarily upwards or sideways thanks to its fast drive before a collision occurs. If the pick-up head is located just on the way to the pick-up position of the feeder, the procedure is momentarily aborted so that a collision can be avoided.

Abstract: An apparatus for automatic loading or unloading printed circuit boards (PCBs) for semiconductor modules is disclosed. The apparatus employs an elastic jig carrier into which the PCBs are loaded. The jig carrier includes movable clamps for fixing the PCBs by elastic force. A jig opener of the apparatus applies opening force, in the reverse direction of the elastic force, to the movable clamps so that the PCBs can be loaded into or unloaded from the jig carrier by a picker. The jig carrier is transferred along a conveyor belt, while the PCBs are supplied from a PCB stage such as a tray to the jig carrier. The apparatus may further comprise a gripper and a rotator. The gripper grips the upright PCBs and the rotator rotates them to be horizontal, so that the picker can pick up the horizontal PCBs. The apparatus may also comprise an aligner for exact alignment of the PCBs in the jig carrier. A method for loading or unloading the PCBs into or from the jig carrier is also disclosed in connection with the apparatus.

Abstract: A dual stage load lock is provided for transfer of semiconductor wafers between an environment at atmospheric pressure and a high vacuum environment, such as a wafer processing system. The dual stage load lock includes a first load lock chamber and a second load lock chamber separated by a dividing ledge which extends a distance inwardly from the inner wall of the load lock assembly. The lower load lock chamber selectively communicates with a transfer chamber of the processing system, and is maintained at high vacuum. The upper load lock chamber selectively communicates with the external environment at atmospheric pressure. Therefore, the environment of the upper load lock chamber may vary between atmospheric pressure, when wafers are transferred between the load lock and the outside environment, and high vacuum, when the wafers are transferred between the first and second chambers of the load lock. The load lock may include modular chamber segments that can be arranged in a variety of configurations.

Abstract: Two FOUPs are stacked and moved together towards an equipment wall by a horizontal actuator. FOUP doors are withdrawn as a unit by a horizontal actuator, and lowered as a unit by a vertical actuator to provide access to the interior of the FOUPs.

Abstract: An apparatus and method are shown for indexing magazines and molded leadframes within the magazines comprising a lateral drive portion coupled to and located below the magazines for selectively moving a selected one of the magazines laterally at a first speed and for simultaneously moving the rest of the magazines laterally at a second speed, and a vertical drive portion having a portion for insertion into the selected one of the magazines when the magazines have ceased moving laterally for selectively moving the molded leadframes vertically within the selected one of the magazines. A plurality of magazine retaining members are also included each having a portion inserted into a portion of the lateral drive portion, and each having a cavity wherein a base portion of a corresponding one of the magazines rests.

Abstract: A method and apparatus for transferring a stack of flat articles from a cartridge. The method and apparatus are adapted for use in connection with a method and apparatus for automatically stacking mail into cartridges in output compartments of a sorting machine, robotically transferring filled cartridges from the output compartments to a buffer shelf; and from the buffer shelf to a docking station of a cartridge unloader and automatic feeder to the input of the sorting machine, and for transferring empty cartridges from the docking station to either the buffer or the output compartments of the sorter, is provided.

Abstract: A transfer device for wafers stacked in magazines has a vertically displaceable frame of a platform, with which the cover of the box surrounding the magazine in the closed condition. The magazine remains in the original position on the base of the box and is then supplied by a gripping device from this position to a processing system in which the wafers are removed from the magazine and are processed. A gripping device preferably has two extension arms arranged on both sides of the magazine as well as one stop element which can be caused to impact on the wafer edges. The stop element preferably has two lips consisting of an elastic material which lips can be caused to impact on the wafer edges. The device permits a very fast loading and unloading into or out of the processing system.

Abstract: An apparatus for displacing and detecting cross-slotted objects includes a cradle mounted to a frame, the cradle being sized and shaped to hold a tray of objects in slots. As the cradle rotates on the frame, a displacing assembly is deployed at the rear of the tray with projections that contact cross-slotted objects and urge the cross-slotted objects to move at least partially out of the tray. Suitably positioned sensors detect the displaced cross-slotted objects for notification to a controller. A method for detecting cross-slotted objects includes first displacing the cross-slotted objects, and second, detecting the displaced cross-slotted objects.

Abstract: A fan is attached directly adjacent to a clean air filter sealing an air inlet under a horizontal portion of a plenum chamber below a vertically movable loading platform which all move as a unit. A vertical portion of the plenum chamber, trapezoidal in cross-section, communicates with a wafer pod on the loading platform through an angled perforated grill sealing an air outlet from the vertical portion of the plenum chamber. Clean air flows evenly throughout the entire height of an angled perforated grill over the surfaces of the wafers. Mechanisms lift the pod cover and load and unload the wafer carrier.

Abstract: Semiconductor wafers are transferred from a closed type cassette into a wafer boat. First, the lowermost five wafers of 13 wafers held in the cassette are simultaneously transferred by five arms from the cassette into the uppermost part of the wafer boat. Then, the lowermost three wafers among the wafers left in the cassette are simultaneously transferred by the upper three arms from the cassette into the boat immediately under the five wafers previously transferred. Further, the uppermost five wafers left in the cassette are simultaneously transferred by the five arms from the cassette into the boat immediately under the eight wafers previously transferred.

Abstract: A wafer transfer mechanism and method involves inserting a wafer carrying arm into position within a wafer cassette so that a wafer may be detachably coupled to the arm. The arm is moved linearly to position the arm for coupling to the wafer, with the motion being reversed to remove the wafer from the cassette. After the arm clears the cassette, the arm may be pivoted about an axis which is transverse to the longitudinal axis of the arm to invert the wafer and deposit it at a destination location, such as onto a conveyor. A vacuum may be used to detachably couple the wafer to the arm with the vacuum being relieved to release the wafer at the destination location. A puff or pulse of air may be used to assist in decoupling the wafer from the arm.

Abstract: A substrate detecting apparatus includes: a light sensor unit having a light-emission element and a light-receiving element arranged to face each other across the cassette, and a vertical driving device for moving at least one of the light sensor unit and the cassette relative to each other in a vertical direction a substrate position detecter is also provided for detecting a vertical positional range of each substrate held in the cassette, based on a wave form of an output signal generated by the light sensor unit as the at least one of the light sensor unit and the cassette is vertically moving relative to each other. A substrate conveying apparatus includes a clearance measurement device for measuring a vertical clearance between a pair of substrates held in the cassette, and an arm driving device for inserting the conveyance arm between the pair of substrates while lifting up the conveyance arm along a slant locus when the vertical clearance is less than a predetermined critical value.

Abstract: The rack loader/unloader system includes a rack unloader and a container elevator disposed on opposite sides of a rack conveyor to unload containers from a rack at a transfer station. The container elevator enables unloaded containers to be transported away from the transfer station as replacement containers are accumulated to replace the unloaded containers. A rack loader displaces the replacement containers from the container elevator into the rack.

Abstract: A wafer cassette for storing a wafer is provided vertically above (direction Z) a transport path for a wafer which is carried by a robot arm driven by a drive mechanism to move along a transport guide extending from a wafer inlet from a wafer outlet. The wafer cassette is disposed at a position between the inlet and a pre-alignment mechanism. The wafer cassette is supported by a cassette retaining base. Drive members driven by a wafer up-down mechanism are fixed to both ends of the cassette retaining base which face opposite each other in a direction perpendicular to the transport path. Thus, the wafer cassette is vertically moved by the wafer up-down mechanism to deliver a wafer between the robot arm and the wafer cassette.