Other Noble Metal Containing Patents (Class 420/505)
  • Patent number: 9745647
    Abstract: An extrusion of a magnesium-based alloy consisting of, by weight: 0.5 to 1.5% manganese, 0.15 to 0.4% rare earth including lanthanum wherein the lanthanum content of the alloy is 0.15% to less than 0.3%, and up to 0.1% strontium, the balance being magnesium except for incidental impurities which includes zinc.
    Type: Grant
    Filed: February 3, 2015
    Date of Patent: August 29, 2017
    Assignee: MAGONTEC LIMITED
    Inventors: Matthew Robert Barnett, Christopher Huw John Davies, Aiden Graeme Beer
  • Publication number: 20150125338
    Abstract: Identifying a stable phase of a binary alloy comprising a solute element and a solvent element. In one example, at least two thermodynamic parameters associated with grain growth and phase separation of the binary alloy are determined, and the stable phase of the binary alloy is identified based on the first thermodynamic parameter and the second thermodynamic parameter, wherein the stable phase is one of a stable nanocrystalline phase, a metastable nanocrystalline phase, and a non-nanocrystalline phase.
    Type: Application
    Filed: March 12, 2012
    Publication date: May 7, 2015
    Inventors: Heather Murdoch, Christopher A. Schuh
  • Patent number: 8940403
    Abstract: An alloy wire made of a material selected from one of a group consisting of a silver-gold alloy, a silver-palladium alloy and a silver-gold-palladium alloy is provided. The alloy wire is with a polycrystalline structure of a face-centered cubic lattice and includes a plurality of grains. A central part of the alloy wire includes slender grains or equi-axial grains, and the other parts of the alloy wire consist of equi-axial grains. A quantity of the grains having annealing twins was 20 percent or more of the total quantity of the grains of the alloy wire.
    Type: Grant
    Filed: June 13, 2012
    Date of Patent: January 27, 2015
    Assignee: Wire Technology Co., Ltd.
    Inventors: Jun-Der Lee, Hsing-Hua Tsai, Tung-Han Chuang
  • Patent number: 8921259
    Abstract: An exhaust gas purification catalyst for removing CO or HC, which contains a carrier and an alloy of palladium and silver supported on this carrier.
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: December 30, 2014
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Naoto Nagata, Hirohito Hirata, Yusaku Inatomi
  • Publication number: 20140369884
    Abstract: The present invention provides an Ag alloy film which exhibits a low-level electrical resistivity nearly equivalent to that of a pure Ag film and which is superior to a conventional Ag alloy film in durability (specifically, resistances to salt water and halogen) and in the adhesion to a substrate. Further, the deposition rate of this Ag alloy film by sputtering is as high as that of a pure Ag film. Provided is an Ag alloy film useful as a reflecting film and/or a transmitting film or as an electrical wiring and/or an electrode, including 0.1 to 1.5 atomic % of at least one element selected from Pd, Au and Pt, and 0.02 to 1.5 atomic % of at least one element selected from at least one rare earth element, Bi and Zn with the balance being Ag and inevitable impurities.
    Type: Application
    Filed: January 22, 2013
    Publication date: December 18, 2014
    Applicant: KABUSHIKI KAISHA KOBE SEIKO SHO (Kobe Steel, Ltd.)
    Inventors: Yuki Tauchi, Yoko Shida, Hiroyuki Okuno
  • Publication number: 20140314617
    Abstract: A dental alloy contains palladium (Pd) and indium (In) for CAD/CAM machining. The dental alloy can further include one component selected from the group consisting of gold (Au), silver (Ag), nickel (Ni), cobalt (Co), and platinum (Pt). The dental alloy has a yield strength of 250 MPa to 450 MPa, breaking elongation of 2% to 8%, metal-ceramic adhesion of 20 MPa to 70 MPa, coefficient of linear thermal expansion of 14.0×10?6/K to 17.0×10?6/K, or density of 8 g/cm3 to 15 g/cm3.
    Type: Application
    Filed: April 13, 2012
    Publication date: October 23, 2014
    Applicant: CERAGEM BIOSYS CO., LTD.
    Inventors: Kyeong Jun Park, Jeong Jong Park, Sun Wook Cho
  • Publication number: 20140271340
    Abstract: A silver alloy with exceptional resistance to both tarnishing and firestain includes at least 92.50% silver, from 0.70 to 1.65% germanium, from 1.30 to 1.80% indium, from 0.000 to 0.015% boron, not more than 1.0% palladium and not more than 0.20% copper.
    Type: Application
    Filed: October 16, 2012
    Publication date: September 18, 2014
    Applicant: JOHNSON MATTHEY PUBLIC LIMITED COMPANY
    Inventors: Thierry Cpponex, Kang Ping Haung
  • Publication number: 20140212324
    Abstract: Provided by the present invention are a fine crystallite high-function metal alloy member, a method for manufacturing the same, and a business development method thereof, in which a crystallite of a metal alloy including a high-purity metal alloy whose crystal lattice is a face-centered cubic lattice, a body-centered cubic lattice, or a close-packed hexagonal lattice is made fine with the size in the level of nanometers (10?9 m to 10?6 m) and micrometers (10?6 m to 10?3 m), and the form thereof is adjusted, thereby remedying drawbacks thereof and enhancing various characteristics without losing superior characteristics owned by the alloy.
    Type: Application
    Filed: April 10, 2012
    Publication date: July 31, 2014
    Applicant: THREE-O CO., LTD.
    Inventor: Kazuo Ogasa
  • Publication number: 20140127075
    Abstract: A silver-based alloy composition which is soft and workable in an annealed condition, is hardenable through heat treatment, and is tarnish resistant. The preferred embodiment of the composition of the present invention includes a small percentage of palladium and a reduction from typical percentages of copper found in a sterling silver alloy. In one embodiment the silver-based alloy includes no copper at all.
    Type: Application
    Filed: October 3, 2013
    Publication date: May 8, 2014
    Applicant: RICHLINE GROUP, Inc.
    Inventor: Grigory RAYKHTSAUM
  • Publication number: 20140102761
    Abstract: A material for providing an electrically conducting contact layer, the material comprising a base material being any one of Ag, Cu, Sn, Ni, a first metal salt of one thereof, or an alloy of one or more thereof. The material further comprises In within a range of 0.01 at. % to 10 at. %, Pd within a range of 0.01 at. % to 10 at. %, and, unless already the base material comprises Sn at a higher amount, Sn within a range of 0.01 at. % to 10 at. %. From such material, a contact layer (6) can be provided that, compared to a coating of only the base material, has improved corrosion resistance and low contact resistance. Also disclosed is: an electrically conducting contact element (2) that comprises a substrate (4) and coated thereon a contact layer (6) comprising the material, a method for providing the contact element (2), and uses of the material as contact layer and target material.
    Type: Application
    Filed: February 9, 2012
    Publication date: April 17, 2014
    Applicant: Impact Coatings AB
    Inventors: Henrik Ljungcrantz, Christian Ulrich, Axel Flink, Torbjörn Joelsson
  • Publication number: 20140063762
    Abstract: A bonding wire according to the invention contains a core having a surface, in which the core contains silver as a main component and at least one element selected from gold, palladium, platinum, rhodium, ruthenium, nickel, copper, and iridium. The wire exhibits at least one of the following properties: I. an average size of crystal grains of the core is between 0.8 ?m and 3 ?m, II. the amount of crystal grains having an orientation in the <001> direction in a wire cross section is in a range of 10-20%, III. the amount of crystal grains having an orientation in the <111> direction in a wire cross section is in a range of 5-15%, and IV. the total amount of crystal grains having orientations in the <001> and <111> directions in a wire cross section is in a range of 15-40%.
    Type: Application
    Filed: August 30, 2013
    Publication date: March 6, 2014
    Applicant: HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
    Inventors: Jae-Sung RYU, Eun-Kyun CHUNG, Yong-Deok TARK
  • Publication number: 20140003992
    Abstract: Titanium sterling silver alloy compositions that exhibit enhanced tarnish resistance while maintaining an acceptable hardness. Applications and manufacturing methods thereof are disclosed.
    Type: Application
    Filed: March 11, 2012
    Publication date: January 2, 2014
    Inventor: Kenneth Fogel
  • Publication number: 20130164169
    Abstract: A manufacturing method for a composite alloy bonding wire and products thereof are provided. A primary material of Ag is melted in a vacuum melting furnace, and then a secondary metal material of Pd is added into the vacuum melting furnace and is co-melted with the primary material to obtain an Ag—Pd alloy solution. The obtained Ag—Pd alloy solution is drawn to obtain an Ag—Pd alloy wire. The Ag—Pd alloy wire is then drawn to obtain an Ag—Pd alloy bonding wire with a predetermined diameter.
    Type: Application
    Filed: September 26, 2012
    Publication date: June 27, 2013
    Inventor: Jun-Der Lee
  • Publication number: 20130126934
    Abstract: A bonding wire for semiconductor devices and a method of manufacturing the wire are provided. The bonding wire contains at least one element selected from zinc, tin, and nickel in an amount of 5 ppm to 10 wt %, the remainder containing silver and inevitable impurities. The method involves pouring a silver alloy according to the invention into a mold and melting the silver alloy, continuously casting the melted silver alloy, and drawing the continuously casted silver alloy.
    Type: Application
    Filed: November 19, 2012
    Publication date: May 23, 2013
    Applicant: Heraeus Materials Technology GmbH & Co. KG
    Inventor: Heraeus Materials Technology GmbH & Co. KG
  • Publication number: 20130094990
    Abstract: This invention provides sputtering target materials having high reflectance and excellent heat resistance, which are formed of Ag base alloys formed by adding a specific, minor amount of P to Ag and alloying them.
    Type: Application
    Filed: December 3, 2012
    Publication date: April 18, 2013
    Applicant: ISHIFUKU METAL INDUSTRY CO., LTD.
    Inventor: ISHIFUKU METAL INDUSTRY CO., LTD.
  • Patent number: 8367266
    Abstract: A porous catalyst layer formed from discrete particles of unsupported metal, wherein at least 80%, suitably at least 90%, of the discrete particles have a mass of from 1 to 1000 zeptograms, and wherein the catalyst layer has a metal volume fraction of less than 30% and a metal loading of less than 0.09 mg/cm2 is disclosed. The catalyst layer is suitable for use in fuel cells and other electrochemical applications.
    Type: Grant
    Filed: June 19, 2008
    Date of Patent: February 5, 2013
    Assignee: Johnson Matthey Fuel Cells Limited
    Inventors: Ian Roy Harkness, Jonathan David Brereton Sharman, Edward Anthony Wright
  • Publication number: 20120263624
    Abstract: An Ag—Au—Pd ternary alloy bonding wire for semiconductor devices made from 4-10 mass % of gold having a purity of 99.999 mass % or higher, 2-5 mass % of palladium having a purity of 99.99 mass % or higher, and remaining mass % of silver (Ag) having a purity of 99.999 mass % or higher; and this wire contains 15-70 mass ppm of oxidizing non-noble metallic elements, and is thermally annealed before being continuously drawn through dies, and is thermally tempered after being continuously drawn through the dies, and this wire is useful for ball bonding in a nitrogen atmosphere; Ag2Al and a Pd rich layer produced in the interface between the Ag—Au—Pd ternary alloy wire and an aluminum pad suppress the corrosion development between the Ag2Al intermetallic compound layer and the wire.
    Type: Application
    Filed: November 1, 2011
    Publication date: October 18, 2012
    Applicant: TANAKA DENSHI KOGYO K.K.
    Inventors: Jun Chiba, Satoshi Teshima, Tasuku Kobayashi, Yuki Antoku
  • Publication number: 20120248943
    Abstract: An electrode material capable of making more satisfactory the dispersion at the time of production and the aging property of a resonator than Au and capable of reducing the price as compared to Au. An resonator electrode material including a ternary alloy composed of Au and two metals M1 and M2, and being used as an excitation electrode to excite oscillation in a piezoelectric element, wherein the two metals M1 and M2 are, respectively, (a) metal M1: a metal exhibiting a tendency to decrease the temporal frequency property (?f1/f1) from the reference value f1, and (b) metal M2: a metal exhibiting a tendency to increase the temporal frequency property (?f1/f1) from the reference value f1. The metal M1 is preferably at least any one of Ag, Al and Ni, and the metal M2 is preferably at least any one of Pd, Ru, Pt, Ir, Rh and Cu.
    Type: Application
    Filed: April 28, 2010
    Publication date: October 4, 2012
    Inventors: Toshinori Ogashiwa, Masaaki Kurita, Takashi Terui, Takayuki Sagae, Katsunori Akane, Kenzo Okamoto, Kenichi Ueki, Shohei Takeda
  • Publication number: 20120196118
    Abstract: The present invention relates to an Ag alloy film. Particularly, it is preferably used as a reflective film or semi-transmissive reflective film for an optical information recording medium having high thermal conductivity/high reflectance/high durability in the field of optical information recording media, an electromagnetic-shielding film excellent in Ag aggregation resistance, and an optical reflective film on the back of a reflection type liquid crystal display device, or the like. The Ag alloy film of the present invention comprises an Ag base alloy containing Bi and/or Sb in a total amount of 0.005 to 10% (in terms of at %). Further, the present invention relates to a sputtering target used for the deposition of such an Ag alloy film.
    Type: Application
    Filed: April 2, 2012
    Publication date: August 2, 2012
    Applicant: KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.)
    Inventors: Yuuki TAUCHI, Katsutoshi Takagi, Junichi Nakai, Toshiki Sato
  • Publication number: 20120094140
    Abstract: The alloy fine particles of the present invention are fine particles of a solid solution alloy, in which a plurality of metal elements are mixed at the atomic level. The production method of the present invention is a method for producing alloy fine particles composed of a plurality of metal elements. This production method includes the steps of: (i) preparing a solution containing ions of the plurality of metal elements and a liquid containing a reducing agent; and (ii) mixing the solution with the liquid that has been heated.
    Type: Application
    Filed: April 23, 2010
    Publication date: April 19, 2012
    Applicant: JAPAN SCIENCE AND TECHNOLOGY AGENCY
    Inventors: Hiroshi Kitagawa, Kohei Kusada, Rie Makiura
  • Publication number: 20120093681
    Abstract: A manufacturing method for a composite alloy bonding wire and products thereof. A primary material of Ag is melted in a vacuum melting furnace, and then a secondary metal material of Pd is added into the vacuum melting furnace and is co-melted with the primary material to obtain an Ag—Pd alloy solution. The obtained Ag—Pd alloy solution is drawn to obtain an Ag—Pd alloy wire. The Ag—Pd alloy wire is then drawn to obtain an Ag—Pd alloy bonding wire with a predetermined diameter.
    Type: Application
    Filed: December 21, 2011
    Publication date: April 19, 2012
    Inventor: Jun-Der LEE
  • Publication number: 20120070332
    Abstract: This invention provides sputtering target materials having high reflectance and excellent heat resistance, which are formed of Ag base alloys formed by adding a specific, minor amount of P to Ag and alloying them.
    Type: Application
    Filed: November 29, 2011
    Publication date: March 22, 2012
    Inventors: Koichi HASEGAWA, Nobuo ISHII
  • Patent number: 8136370
    Abstract: A silver-palladium alloy formulated to provide an alloy with a whiter color and superior casting and fabrication properties as compared to nickel-based white gold and also to impart to an article of jewelry or the like favorable properties afforded by white gold. The alloy generally includes silver and palladium, with silver being the predominant component. In some embodiments, the alloy contains about 75%-85% silver and about 5%-15% palladium by weight.
    Type: Grant
    Filed: February 13, 2009
    Date of Patent: March 20, 2012
    Assignee: American Bullion Investment Company, Inc.
    Inventor: Charles Bennett
  • Patent number: 8101123
    Abstract: A manufacturing method for a composite alloy bonding wire and products thereof. A primary material of Au and Ag is melted in a vacuum melting furnace, and then a secondary metal material of Pd is added into the vacuum melting furnace and is co-melted with the primary material to obtain a Au—Ag—Pd alloy solution. The obtained Au—Ag—Pd alloy solution is drawn to obtain a Au—Ag—Pd alloy wire. The Au—Ag—Pd alloy wire is then drawn to obtain a Au—Ag—Pd alloy bonding wire with a predetermined diameter.
    Type: Grant
    Filed: March 23, 2009
    Date of Patent: January 24, 2012
    Inventor: Jun-Der Lee
  • Patent number: 8101030
    Abstract: A manufacturing method for a composite alloy bonding wire is provided. A primary material of Au and Ag is melted in a vacuum melting furnace, and then a secondary metal material of Pd is added into the vacuum melting furnace and is co-melted with the primary material to obtain a Au—Ag—Pd alloy solution. The obtained Au—Ag—Pd alloy solution is drawn to obtain a Au—Ag—Pd alloy wire. The Au—Ag—Pd alloy wire is then drawn to obtain a Au—Ag—Pd alloy bonding wire with a predetermined diameter.
    Type: Grant
    Filed: August 27, 2010
    Date of Patent: January 24, 2012
    Inventor: Jun-Der Lee
  • Publication number: 20110229368
    Abstract: The present disclosure relates to white precious metal alloy compositions comprising at least one of platinum and palladium alloyed with gold, silver, and optionally one or more additional alloying elements. More specifically, and in one embodiment, the present disclosure relates to white precious metal alloy compositions that are suitable for the manufacture of jewelry and other finished articles. In addition, the present invention also relates to a method of manufacturing finished articles from such white precious metal alloy compositions.
    Type: Application
    Filed: June 7, 2011
    Publication date: September 22, 2011
    Inventor: Heru Budihartono
  • Publication number: 20110211988
    Abstract: This invention provides sputtering target materials having high reflectance and excellent heat resistance, which are formed of Ag base alloys formed by adding a specific, minor amount of P to Ag and alloying them.
    Type: Application
    Filed: May 6, 2011
    Publication date: September 1, 2011
    Inventors: Koichi HASEGAWA, Nobuo Ishii
  • Patent number: 7959746
    Abstract: This invention provides sputtering target materials having high reflectance and excellent heat resistance, which are formed of Ag base alloys formed by adding a specific, minor amount of P to Ag and alloying them.
    Type: Grant
    Filed: October 8, 2004
    Date of Patent: June 14, 2011
    Assignee: Ishifuku Metal Industry Co., Ltd.
    Inventors: Koichi Hasegawa, Nobuo Ishii
  • Patent number: 7959855
    Abstract: The present disclosure relates to white precious metal alloy compositions comprising at least one of platinum and palladium alloyed with gold, silver, and optionally one or more additional alloying elements. More specifically, and in one embodiment, the present disclosure relates to white precious metal alloy compositions that are suitable for the manufacture of jewelry and other finished articles. In addition, the present invention also relates to a method of manufacturing finished articles from such white precious metal alloy compositions.
    Type: Grant
    Filed: May 22, 2007
    Date of Patent: June 14, 2011
    Inventor: Heru Budihartono
  • Publication number: 20110042135
    Abstract: The present invention relates to an Ag alloy film. Particularly, it is preferably used as a reflective film or semi-transmissive reflective film for an optical information recording medium having high thermal conductivity/high reflectance/high durability in the field of optical information recording media, an electromagnetic-shielding film excellent in Ag aggregation resistance, and an optical reflective film on the back of a reflection type liquid crystal display device, or the like. The Ag alloy film of the present invention comprises an Ag base alloy containing Bi and/or Sb in a total amount of 0.005 to 10% (in terms of at %). Further, the present invention relates to a sputtering target used for the deposition of such an Ag alloy film.
    Type: Application
    Filed: October 29, 2010
    Publication date: February 24, 2011
    Applicant: Kabushiki Kaisha Kobe Seiko Sho(Kobe Steel, Ltd.)
    Inventors: Yuuki TAUCHI, Katsutoshi Takagi, Junichi Nakai, Toshiki Sato
  • Publication number: 20100266443
    Abstract: A Pd—Ag alloy system that utilizes internal oxidation by including a base metal addition of only Ga is provided. The Pd—Ag—Ga alloy is particularly well-suited for use in porcelain-fused-to-metal (PFM) applications because the alloy does not form a dark oxide upon heating. The high oxygen potential of the material ensures the development of a tenacious chemical bond with the porcelain when used in PFM applications. Moreover, the addition of gallium lowers the liquidus temperature of the alloy to improve castability and strengthens the alloy significantly.
    Type: Application
    Filed: April 20, 2009
    Publication date: October 21, 2010
    Inventors: Paul J. Cascone, Arun Prasad
  • Publication number: 20100239455
    Abstract: A manufacturing method for a composite alloy bonding wire and products thereof. A primary material of Ag is melted in a vacuum melting furnace, and then a secondary metal material of Pd is added into the vacuum melting furnace and is co-melted with the primary material to obtain a Ag—Pd alloy solution. The obtained Ag—Pd alloy solution is drawn to obtain a Ag—Pd alloy wire. The Ag—Pd alloy wire is then drawn to obtain a Ag—Pd alloy bonding wire with a predetermined diameter.
    Type: Application
    Filed: March 23, 2009
    Publication date: September 23, 2010
    Inventor: Jun-Der LEE
  • Publication number: 20100239456
    Abstract: A manufacturing method for a composite alloy bonding wire and products thereof. A primary material of Au and Ag is melted in a vacuum melting furnace, and then a secondary metal material of Pd is added into the vacuum melting furnace and is co-melted with the primary material to obtain a Au—Ag—Pd alloy solution. The obtained Au—Ag—Pd alloy solution is drawn to obtain a Au—Ag—Pd alloy wire. The Au—Ag—Pd alloy wire is then drawn to obtain a Au—Ag—Pd alloy bonding wire with a predetermined diameter.
    Type: Application
    Filed: March 23, 2009
    Publication date: September 23, 2010
    Inventor: Jun-Der LEE
  • Patent number: 7744834
    Abstract: A method for manufacturing metal nanoparticles, the method including forming a mixture by dissociating a metallic salt of a metal selected from the group consisting of Ag, Pd, Pt, Au and an alloy thereof as a metal precursor in fatty acid; and adding a metallic salt of a metal selected from the group consisting of Sn(NO3)2, Sn(CH3CO2)2, and Sn(acac)2 as a metallic catalyst into the mixture and mixing the mixture and the metallic salt. According to the method, metal nanoparticles have a uniform particle size distribution and a high yield by performing in a non-aqueous environment without using any organic solvent, and are environmentally friendly due to no use of a reducing agent.
    Type: Grant
    Filed: April 13, 2007
    Date of Patent: June 29, 2010
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kwi-Jong Lee, Jae-Woo Joung, Byung-Ho Jun
  • Publication number: 20100015381
    Abstract: A silver alloy reflective film for optical information storage media, which can maintain superior environmental resistance, such as high hygrothermal resistance and high light stability, over the long term even when the metal reflective film is in direct contact with a resin layer. An optical information storage medium includes the reflective film and a sputtering target deposits the reflective film. The silver alloy reflective film includes one or more specific elements selected from Pr, Ho, Yb, Sm, Er, Tm, and Tb, to suppress deterioration occurring when the silver alloy reflective film is in direct contact with a resin layer, where silver in the reflective film migrates and aggregates into the adjacent resin layer.
    Type: Application
    Filed: August 28, 2007
    Publication date: January 21, 2010
    Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
    Inventors: Takayuki Tsubota, Takeshi Ohwaki, Hideo Fujii
  • Publication number: 20090191088
    Abstract: A manufacturing method for a composite metal bonding wire and products thereof. A material of Ag and Au is co-melted in a vacuum melting furnace, and then a plurality of trace metal elements are added into the vacuum melting furnace and co-melted with the material to obtain a composite metal ingot. The obtained composite metal ingot is drawn to obtain a composite metal wire. The composite metal wire is then drawn to obtain a composite metal bonding wire with a predetermined diameter.
    Type: Application
    Filed: January 28, 2008
    Publication date: July 30, 2009
    Inventor: Jun-Der LEE
  • Publication number: 20090181183
    Abstract: A metal nanoparticle composition includes a thermally decomposable or UV decomposable stabilizer. A method of forming conductive features on a substrate, includes providing a solution containing metal nanoparticles with a stabilizer; and liquid depositing the solution onto the substrate, wherein during the deposition or following the deposition of the solution onto the substrate, decomposing and removing the stabilizer, by thermal treatment or by UV treatment, at a temperature below about 180° C. to form conductive features on the substrate.
    Type: Application
    Filed: January 14, 2008
    Publication date: July 16, 2009
    Applicant: XEROX CORPORATION
    Inventors: Yuning LI, Yiliang WU, Hualong PAN, Ping LIU, Paul F. SMITH, Hadi K. MAHABADI
  • Patent number: 7465424
    Abstract: Provided is a sputtering target material which has a high reflectance and which is excellent in a sulfurization resistance, comprising an Ag alloy prepared by alloying Ag with a specific small amount of the metal component (A) selected from In, Sn and Zn, a specific small amount of the metal component (B) selected from Au, Pd and Pt and, if necessary, a small amount of Cu.
    Type: Grant
    Filed: March 15, 2002
    Date of Patent: December 16, 2008
    Assignee: Ishifuku Metal Industry Co., Ltd.
    Inventors: Koichi Hasegawa, Nobuo Ishii, Tomoyoshi Asaki
  • Publication number: 20080240975
    Abstract: An Ag-based alloy wire for a semiconductor package is highly reliable and can be fabricated with low costs. The Ag-based alloy wire includes 0.05˜5 wt % of at least one kind of a first additive ingredient selected from the group consisting of platinum (Pt), palladium (Pd), rhodium (Rh), osmium (Os), gold (Au), and nickel (Ni), and Ag as a remainder.
    Type: Application
    Filed: March 19, 2008
    Publication date: October 2, 2008
    Applicant: MK ELECTRON CO. LTD.
    Inventors: Jong Soo Cho, Jeong Tak Moon
  • Publication number: 20080166260
    Abstract: Silver alloy compositions having reduced susceptibility to sulphidation and reduced susceptibility to fire stain relative to 92.5% silver 7.5% copper alloy, and having mechanical properties for casting and forming comparable to or better than 92.5% silver 7.5% copper alloy, and having an appearance similar to 92.5% silver 7.5% copper alloy. The silver alloy compositions include at least 92.5% silver 2.0%-4.0% tin; 1.7%-2.6% zinc and 0.50%-1.5% indium.
    Type: Application
    Filed: February 3, 2006
    Publication date: July 10, 2008
    Applicants: CARRS OF SHEFFIELD (MANUFACTURING) LIMITED, SHEFFIELD HALLAM UNIVERSITY, CENTRE STEPHANOIS DE RECHERCHES MECANIQUES
    Inventors: Frederic Faverjon, Alan G. Hopkinson, James Storey
  • Publication number: 20080118392
    Abstract: Alloys for medical, surgical and microsurgical instruments are proposed which comprise 0.01% to 20% by weight of germanium, from 0-25% of shallow hydrogenic and/or non-hydrogenic acceptor dopants in terms of weight ratio in relation to germanium, from 0% up to 20% by weight of one or more of the following compounds such as platinum, gold, palladium, iridium, ruthenium, osmium, rhodium, niobium, tantalum, tungsten, aluminium, silicon, hafnium, yttrium, lanthanum, zirconium with the remainder, up to 100% by weight, constituted by silver and inevitable impurities, wherein instruments from these alloys possess properties such as no capacitive impedance in relation to the electrode-tissue interface; a Far Infrared Radiation (FIR) emitting capacity when energized by any form of energy; sulfurization, corrosion and oxidation resistant and have suitable hardness for their intended use; emit anions and may possess fractal surfaces.
    Type: Application
    Filed: June 8, 2007
    Publication date: May 22, 2008
    Applicant: MATTEO TUTINO
    Inventor: Francesco Di Salvo
  • Publication number: 20080095659
    Abstract: The present disclosure relates to white precious metal alloy compositions comprising at least one of platinum and palladium alloyed with gold, silver, and optionally one or more additional alloying elements. More specifically, and in one embodiment, the present disclosure relates to white precious metal alloy compositions that are suitable for the manufacture of jewelry and other finished articles. In addition, the present invention also relates to a method of manufacturing finished articles from such white precious metal alloy compositions.
    Type: Application
    Filed: May 22, 2007
    Publication date: April 24, 2008
    Inventor: Heru Budihartono
  • Patent number: 7118707
    Abstract: A silver-platinum alloy formulated to provide improved tarnish resistance and hardness as compared to sterling silver. The alloy can be incorporated in various jewelry, flatware, and like articles. The alloy generally includes silver and platinum, with silver being the predominant component. In certain applications, the alloy includes about 90–95.5% silver and about 0.5–6% platinum. A small amount of gallium can also be added to the composition to provide ease of manufacture of the alloy. The resulting alloy has the favorable properties afforded by sterling silver, but also has brighter surface finish, greater tarnish resistance and increased hardness as compared to traditional sterling silver.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: October 10, 2006
    Assignee: American Bullion Investment Company, Inc.
    Inventor: Marc Alan Robinson
  • Patent number: 6913657
    Abstract: A hard precious metal alloy member is constituted of a gold alloy, which has a gold Au content of from 37.50 to 98.45 wt %, and contains a hardening additive in a range of not less than 50 ppm but less than 15,000 ppm, wherein the hardening additive is constituted of gadolinium Gd only, or gadolinium Gd and at least one element selected from the group consisting of rare-earth elements other than Gd, alkaline-earth elements, silicon Si, aluminum Al, and boron B.
    Type: Grant
    Filed: March 4, 2002
    Date of Patent: July 5, 2005
    Inventor: Kazuo Ogasa
  • Patent number: 6815073
    Abstract: The present invention has an object to enhance the reliability of the electrical connection of a silver-based conductor film on the surface of a glass ceramic board. In order to achieve the object, according to the present invention, by the use of a conductor paste containing a silver particle having a specific surface area of 0.3 m2/g to 3.0 m2/g and no glass, printing is carried out on a glass ceramic board and the conductor paste is fired at a firing temperature having a difference of ±50° C. from a softening temperature of amorphous borosilicate glass contained in the glass ceramic. Consequently, a silver-based conductor film having high reliability of the electrical connection is formed on the ceramic board.
    Type: Grant
    Filed: August 30, 2001
    Date of Patent: November 9, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Hirayoshi Tanei, Tsuyoshi Fujita, Masato Kirigaya, Yasuo Akutsu, Kaoru Uchiyama, Hiroshi Soma, Hiroatsu Tokuda
  • Patent number: 6723281
    Abstract: The present invention relates to a metal material for electronic parts, electronic parts, electronic apparatuses, a method of processing metal materials, and electro-optical parts. For example, the present invention is applied to liquid crystal display panels, various semiconductor devices, wiring boards, chip parts, and the like. The present invention proposes a metal material for electronic parts which is characterized by lower resistivity, higher stability, and more excellent processability than the prior art. The present invention also proposes electronic parts and electronic apparatuses which use this metal material. An applicable metal material is an alloy containing Ag as a main component, 0.1 to 3 wt % of Pd, and 0.1 to 3 wt % in total of elements such as Al.
    Type: Grant
    Filed: July 11, 2000
    Date of Patent: April 20, 2004
    Assignees: Sony Corporation, Furuyametals Co., Ltd.
    Inventors: Takashi Ueno, Katsuhisa Aratani
  • Publication number: 20040048193
    Abstract: An optical data recording and storage medium includes a reflective layer formed from a silver alloy that contains, in addition to silver, about 0.1 to about 4.0 wt. %, based on the total weight of alloy, of samarium (Sm).
    Type: Application
    Filed: June 26, 2003
    Publication date: March 11, 2004
    Inventors: Heiner Lichtenberger, Derrick L. Brown, Scott Haluska
  • Patent number: 6689186
    Abstract: Provided are silver-containing powders and a method and apparatus for manufacturing the silver-containing particles of high quality, of a small size and narrow size distribution. An aerosol is generated from liquid feed and sent to a furnace, where liquid in droplets in the aerosol is vaporized to permit formation of the desired particles, which are then collected in a particle collector. The aerosol generation involves preparation of a high quality aerosol, with a narrow droplet size distribution, with close control over droplet size and with a high droplet loading suitable for commercial applications.
    Type: Grant
    Filed: September 22, 2000
    Date of Patent: February 10, 2004
    Assignee: Cabot Corporation
    Inventors: Mark J. Hampden-Smith, Toivo T. Kodas, Quint H. Powell, Daniel J. Skamser, James Caruso, Clive D. Chandler
  • Publication number: 20020122741
    Abstract: The dental alloys herein are formulated from a combination of palladium, silver and platinum and a small amount of one or more of indium, gallium, tin, germanium, zinc and manganese. The alloys may also contain one or more of gold, iridium, ruthenium, rhodium, rhenium, titanium, aluminum, silicon, hafnium, boron, and/or calcium. The alloys are particularly useful as substrate components for dental restorative materials including, but not limited to, orthodontic appliances, bridges, space maintainers, tooth replacement appliances, splints, crowns, partial crowns, dentures, posts, teeth, jackets, inlays, onlays, facing, veneers, facets, implants, abutments, cylinders, and connectors. The substrate may be defined as a main component of the dental restoration having one or more layers of material thereon, or as the complete restoration with no other material thereon.
    Type: Application
    Filed: December 17, 2001
    Publication date: September 5, 2002
    Inventors: Arun Prasad, Grant P. Day
  • Patent number: 6413649
    Abstract: The present invention is directed to brazing filler metals that can be used in the infiltration brazing of porous matrix materials without the need for a flux. The brazing filler metals contain two different Group II metals and a third metal of Group 9 and 10. A particular brazing filler metal of the invention contains silver, copper, and nickel. The invention is also directed to composite materials formed by infiltration of the brazing material into a porous matrix, and to methods for preparing the composite materials. The invention is further directed to composite articles fabricated from composite materials, including steel bearings or bushings, and to methods of preparing the composite articles.
    Type: Grant
    Filed: March 6, 1998
    Date of Patent: July 2, 2002
    Assignee: The Morgan Crucible Company plc
    Inventors: David J. Kepniss, Toshimasa Oyama