Abstract: A gold based jewelry alloy is disclosed of preferably the 10 to 18 karat range containing primarily gold, copper, zinc and silver. This alloy is formulated to create a unique color, a mid-range hue with a fresh, soft appearance that is very complimenting to a variety of skin tones and gem stones. Aside from characteristics of appearance, the alloy disclosed has an increased hardness over standard yellow alloys for longer wear and improved polish holding characteristics. The alloy disclosed has excellent castability and formability and responds well to typical jewelry manufacturing processes (i.e., tooling, stone setting, soldering, remelting, forging and plating). The alloy contains about 40% to about 76% gold, about 20% to about 52% copper, about 0% to about 12% zinc and about 0% to about 12% silver.

Abstract: Bonding wire for a semiconductor device contains high purity Au or Au alloy as a base metal and 25-10000 atppm of low boiling point element I having a boiling point lower than a melting point of the base metal and soluble in Au, or contains high purity Au or Au alloy as a base metal and 5-500 atppm of low boiling point element II having a boiling point lower than a melting point of the base metal and insoluble in Au, or contains high purity Au or Au alloy as a base metal and 5-10000 atppm of a mixture of low boiling point element I having a boiling point lower than a melting point of the base metal and soluble in Au and low boiling point element II having a boiling point lower than the melting point of the base metal and insoluble in Au under the condition of (content of the low boiling point element I)/25+(content of the low boiling point element II)/5.gtoreq.1.gtoreq.(content of the low boiling point element I)/10000+(content of the low boiling point element II)/500.

Abstract: A unique hardenable gold based alloy, especially a 14 karat gold alloy containing gold, silver, copper, zinc, cobalt and an alternative alloy additionally containing iridium. The alloy has a fine grained structure, a lower hardness in the soft condition, a nice yellow color and a capability to be hardened to an exceptional hardness value. The alloy contains approximately 58.3% gold (Au), between about 10% to about 14% silver (Ag), between about 2.5% to about 3.0% zinc (Zn), between about 0.2% to about 1.0% cobalt (Co) and the balance of the alloy being copper (Cu) with the special provision that the ratio of the weight percent amounts of copper to, the sum of the silver and two (2) times the zinc amount, [Cu/(Ag+2Zn)], has a value of between about 1.3 to about 2.5. The copper to silver weight percent ratio [Cu/Ag] of between about 2.0 to about 3.8, in combination with the ratio of copper to, silver+2.times.

Abstract: This invention concerns a new spring gold alloy and heat treatment process specific to the new gold spring alloy. The heat treatment process and gold spring alloy are specifically formulated to work synergistically so as to optimize the ductility of the alloy after a first step, and resistance to deformation of the alloy after a second step of the heat treatment process.

Abstract: A gold based alloy containing gold, silver, copper, zinc, silicon, iron, boron, nickel and indium for the manufacture of gold articles is described which has a lower melting point, extended remelting capabilities, high resistance to cracking, improved color consistency and increased ductility.

Abstract: A metal foil is provided for use in a metal-porcelain dental restoration, which metal foil provides improved color qualities to the finished restoration and improved bonding of the metal to the porcelain. The metal foil is made of an alloy comprising a major amount of gold, an amount of platinum or palladium, and an amount of a non-precious metal. An improved dental veneer and dental bridge can also be made using the metal foil of the invention.

Abstract: The gold wire used for the wire bonding of a semiconductor device comprises at least three kinds of elements selected from rare earth elements such as La, Ce and Pr: Be, Ca, Mg, Ag, Fe: and platinum group elements; and the balance of Au at high purity.

Abstract: A gold solder matching 14 karat yellow gold. The solder is typically employed in jewelry repair and is comprised of discrete particles of gold alloy and a flux to which a small amount of water is added to provide a fluid, liquid-like, easily worked solder. The gold alloy consists essentially of about 45% silver, about 20% copper, about 25% gold and about 10% brass.

Abstract: A bonding wire for use in semiconductor devices which consists essentially of 0.0003 to 0.01 wt. % of barium and the balance gold, the gold purity of said bonding wire being at least 99.99%. The bonding wire may further contain at least one element selected from the group consisting of 0.0005 to 0.005 wt. % of aluminum, 0.0001 to 0.003 wt. % of calcium, 0.0005 to 0.005 wt. % of silver and 0.0005 to 0.005 wt. % of palladium. The total content of the elements and barium in the bonding wire should not exceed 0.01 wt. % based on the weight of the bonding wire so that the gold purity of the bonding wire is at least 99.99%. The use of the additive elements improve the mechanical strength and wire-bondability, making the bonding wire highly suitable for use in wire bonding of semiconductor elements, especially for high-speed bonding.

Abstract: The present invention relates to a method for obtaining metallic alloys, to be used particularly in the field of dentistry.This method allows to accomplish a basic face-centered cubic lattice adapted to form the alloys, in which a homogeneous distribution of the atoms of the different elements is obtained, by precisely determining the number of atoms of each element forming the alloy, in close numerical relationship with the number of atoms of the other elements; it also allows the achievement of a plurality of alloys consisting of at least three among the following elements: gold, platinum, palladium, silver and copper, these alloys respecting the physico-chemical specifications necessary in the particular field of dentistry.

Abstract: A jewelry alloy is disclosed preferably of 3 to 5 karat gold having the color, hue and shine characteristics of 10 or higher karat yellow gold. Although the alloy disclosed is virtually identical in appearance to 10 to 18 karat yellow gold, it is substantially less expensive and provides a relatively low cost substitute for 10 and higher karat yellow gold. The alloy has the following composition, by weight:Gold: 17-25%Silver: 10-27%Copper: 40-60%Zinc: 3- 12%In addition to its appearance, the alloy disclosed has good corrosion and high tarnish resistance, good workability and castability and can be plated, if desired, and sized with conventional solders.

Abstract: This gold solder comprises an Au-Cu-Ag-Ge alloy with 3 to 6% germanium and has a melting temperature of 800.degree. C. or below. The gold content of the gold solder is 50 to 70% equivalent to 12 to 16 Karat. The gold solder that exhibits corrosion resistance corresponding to that of materials such as a gold alloy, stainless steel, stellite and sintered carbide makes it possible to solder at 800.degree. C. or below ornamental parts made of the above materials. As a result, any surface degradation is prevented during the soldering process of mirror-polished ornamental parts.

Abstract: A bonding gold wire for semiconductor elements comprising a gold alloy containing silver (Ag), calcium (Ca), iron (Fe), and magnesium (Mg) with or without an additional element selected from the group consisting of germanium, beryllium, gallium, and thallium, with the substantial balance being gold.