Tin Containing Patents (Class 420/565)
  • Patent number: 10429874
    Abstract: A reference voltage circuit with current buffer including a low voltage reference to output a low voltage, a first resistor-capacitor (RC) filter to filter the low voltage, a buffer circuit to output a current to be used by a load, a second RC filter associated with the load, and a capacitor in parallel with the buffer circuit configured to increase a rise time of the buffer.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: October 1, 2019
    Assignee: NXP B.V.
    Inventors: Siamak Delshadpour, Xueyang Geng
  • Patent number: 7923155
    Abstract: A lead-acid battery grid made from a lead-based alloy containing, in addition to lead, tin at a concentration that is at least about 0.500%, silver at a concentration that is greater than 0.006%, and bismuth at a concentration that is at least about 0.005%, and, if calcium is present in the lead-based alloy, the calcium is at concentration that is no greater than about 0.010%.
    Type: Grant
    Filed: March 17, 2008
    Date of Patent: April 12, 2011
    Assignees: Northstar Battery Company, LLC, RSR Technologies
    Inventors: David R. Prengaman, Frank A. Fleming
  • Patent number: 7704452
    Abstract: A lead calcium tin alloy to which cobalt has been added is described. The alloy is useful in the formation of anodes to be used in electrowinning cells. Electrowinning cells containing the cobalt alloys are particularly suited for electrowinning metals, such as copper, from sulfuric acid electrolytes. The cobalt-containing anodes improve the efficiency of oxygen evolution at the anode during electrowinning and reduce corrosion of the anode.
    Type: Grant
    Filed: February 23, 2006
    Date of Patent: April 27, 2010
    Assignee: RSR Technologies, Inc.
    Inventors: David R. Prengaman, Andreas Siegmund
  • Publication number: 20040187986
    Abstract: A grid for a battery having a current collection lug and a plurality of wires is made by a method that includes forming the grid utilizing a punching operation. The grid is formed of an alloy including calcium in an amount of about 0.05 percent by weight to about 0.08 percent by weight, tin in an amount of about 1.2 percent by weight to about 1.8 percent by weight, and bismuth in an amount of less than about 0.04 percent by weight. The balance of the alloy comprises lead.
    Type: Application
    Filed: April 7, 2004
    Publication date: September 30, 2004
    Applicant: Johnson Controls Technology Company
    Inventor: Charles J. Schaeffer
  • Publication number: 20040142243
    Abstract: Provided is a lead-based alloy for a lead-acid battery, comprising not less than 0.02% and less than 0.05% by weight of calcium, not less than 0.4% and not more than 2.5% by weight of tin, not less than 0.005% and not more than 0.04% by weight of aluminum, not less than 0.002% and not more than 0.014% by weight of barium, and the balance of lead and unavoidable impurities.
    Type: Application
    Filed: January 8, 2004
    Publication date: July 22, 2004
    Applicants: The Furukawa Battery Co., Ltd., TOHO ZINC CO., LTD.
    Inventors: Jun Furukawa, Yasuyuki Nehyo, Yutaka Mori, Tomohiro Hiraki
  • Publication number: 20040110067
    Abstract: A lead alloy for use in battery grids include calcium in an amount between approximately 0.06 and 0.08 weight percent, tin in an amount between approximately 0.6 and 1.2 weight percent, and silver in an amount between approximately 0.005 and 0.015 weight percent.
    Type: Application
    Filed: December 6, 2002
    Publication date: June 10, 2004
    Applicant: Johnson Controls Technology Company
    Inventor: M. Eric Taylor
  • Publication number: 20040033157
    Abstract: A lead alloy for a grid for a battery is disclosed. The alloy includes calcium in an amount of about 0.05 percent by weight to about 0.0725 percent by weight, tin in an amount of about 1.2 percent by weight to about 1.8 percent by weight, silver in an amount of greater than about 0.001 percent by weight, and bismuth in an amount of about 0.0005 percent by weight to less than about 0.04 percent by weight. An alloy for a grid for a battery is also disclosed having calcium in an amount of about 0.05 percent by weight to about 0.07 percent by weight, tin in an amount of about 1.2 percent by weight to about 1.5 percent by weight, silver in an amount of greater than about 0.001 percent by weight and bismuth in an amount of greater than about 0.0115 percent by weight.
    Type: Application
    Filed: August 13, 2002
    Publication date: February 19, 2004
    Applicant: Johnson Controls Technology Company
    Inventor: Charles J. Schaeffer
  • Publication number: 20030183312
    Abstract: Provided for herein is a method of making an expanded metal grid, comprising: compression rolling a metal strip at a reduction ratio from about 1.25 to 1, to about 25 to 1 to produce a rolled strip, heating the rolled strip at a temperature of at least about 125° C., and at most about 325° C. for at least about 30 seconds, to produce a heat treated metal strip having an equiaxial grain structure within; and expanding the heat treated metal strip to produce the expanded metal grid.
    Type: Application
    Filed: March 28, 2002
    Publication date: October 2, 2003
    Inventor: Lu Zhang
  • Publication number: 20030017399
    Abstract: A lead alloy coating for a positive grid of a lead acid battery is provided. The lead alloy coating includes a tin content of at least about 0.1%, but not more than about 3%; and a residual lead content. The lead alloy coating optionally includes a calcium content of at least about 0.01%, but not more than about 0.1%, with or without a silver content of at least about 0.01%, but not more than about 0.1%. Alternatively, the lead alloy coating optionally includes a barium content of at least about 0.01%, but not more than about 0.1%, with or without a silver content of at least about 0.01%, but not more than about 0.1%.
    Type: Application
    Filed: July 19, 2001
    Publication date: January 23, 2003
    Inventors: Lu Zhang, John Lewis Ayres
  • Publication number: 20020182500
    Abstract: A lead alloy for lead acid-battery grids which essentially consists of about 0.05-0.07 wt % calcium; about 0.09-1.3 wt % tin; about 0.006-0.010 % silver; about 0.0100-0.0170 wt % barium and about 0.015-0.025 wt % aluminum with the balance lead. This lead alloy allows the improvement of the age hardening step, by eliminating the high temperature treatment process required for silver alloys in the manufacturing of lead-acid batteries. By using this lead alloy, a longer service life of the lead-acid batteries are also obtained by increasing the corrosion resistance and the mechanical strength of battery grids manufactured by the book molding process. Additionally, the reduced silver level used dramatically mitigates the problem of silver elimination from the stream of recycled lead in the secondary production of this metal.
    Type: Application
    Filed: June 4, 2001
    Publication date: December 5, 2002
    Applicant: ENERTEC MEXICO, S. de R.L. de C.V.
    Inventors: Luis Francisco Vazquez Del Mercado, Luis David Silva-Galvan
  • Patent number: 6267923
    Abstract: A lead alloy for battery grids is disclosed. The lead alloy contains calcium with a relative concentration by weight of between 0.05% and 0.12%; tin with a relative concentration by weight of less than 3%; aluminum with a relative concentration by weight of between 0.002% and 0.04%; and barium comprising a relative concentration by weight of less than 0.02%.
    Type: Grant
    Filed: November 23, 1998
    Date of Patent: July 31, 2001
    Assignee: Metaleurop S.A.
    Inventors: Luc Albert, Alain Goguelin, Jean-Louis Caillerie
  • Patent number: 6086691
    Abstract: Lead and lead-alloy anodes for electrowinning metals such as zinc, copper, lead, tin, nickel and manganese from sulfuric acid solutions, whereby the electrodes are processed by a repetitive sequence of cold deformation and recrystallization heat treatment, within specified limits of deformation, temperature and annealing time, to achieve an improved microstructure consisting of a high frequency of special low .SIGMA. CSL grain boundaries (i.e.>50%). The resultant electrodes possess significantly improved resistance to intergranular corrosion, and yield (1) extended service life, (2) the potential for reduction in electrode thickness with a commensurate increase in the number of electrodes per electrowinning cell, and (3) the opportunity to extract higher purity metal product.
    Type: Grant
    Filed: August 3, 1998
    Date of Patent: July 11, 2000
    Inventors: Edward M. Lehockey, Gino Palumbo, Peter Keng-Yu Lin, David L. Limoges
  • Patent number: 6059900
    Abstract: A high lead solder exhibiting improved wettability to metal substrates, an advantageously controlled melting range, and excellent thermal fatigue properties. It comprises about 98-100% lead and a minor amount, typically about 0.0005-0.1 wt %, based on the total weight of the solder composition, of an alkali metal selected from the group consisting of Na, K, and Li. Additional embodiments additionally comprise an amount of a grain-size controlling additive, e.g., 0.001-0.5 wt % (based on the total weight of all the components in the solder composition) selected from the group consisting of Ce, Ba, La, Pr, Nd, Sm, Eu, Gd, Th, Dy, Ho, Er, Tm, Yb, Y, Lu, Sc, Mg, Na, Se, Te, oxides thereof and mixtures thereof, in amount effective to control the Pb grain size; and 0-1 wt % of an element selected from the group consisting of Sn, In, Bi, Sb, Ag, Au, and Ga, and mixtures thereof.
    Type: Grant
    Filed: February 18, 1998
    Date of Patent: May 9, 2000
    Assignee: Indium Corporation of America
    Inventors: Frank W. Gayle, James A. Slattery
  • Patent number: 6016947
    Abstract: A non-destructive method for identifying off-composition solder columns of for example, a ceramic column grid array. The method is performed at the ceramic module level prior to card assembly to avoid costly loss or rework post card assembly. The assembly of solder columns on a substrate is heated to a temperature below the melting temperature of pure-composition solder and above the temperature of attachment of a solder column to an organic board. Heating the assembly produces visually detectable changes characteristic of off-composition solder which are used for identifying which solder columns are composed of off-composition solder.
    Type: Grant
    Filed: October 21, 1997
    Date of Patent: January 25, 2000
    Assignee: International Business Machines Corporation
    Inventors: Timothy W. Donahue, Ellyn M. Ingalls, Chon Cheong Lei, Wai Mon Ma, Horatio Quinones, Charles L. Reynolds, Jr., Peter J. Brofman
  • Patent number: 5550407
    Abstract: A method of electrically connecting a semiconductor package to a substrate by using bump contacts formed by heating the tip of an alloy wire and directly joined to aluminum alloy wiring lines, an alloy wire for such a purpose, and a semiconductor device constructed by electrically connecting a semiconductor package to a substrate by such a method. The alloy wire is produced by drawing an alloy material produced by quench solidifying an alloy containing Pb, Sn or In as a principal element, and an additive element or additive elements. The tip of the alloy wire is heated to form a ball to be joined to the aluminum alloy wiring line as a bump contact. The Brinell hardness number of the ball is H.sub.B 6 or higher.
    Type: Grant
    Filed: July 29, 1994
    Date of Patent: August 27, 1996
    Assignee: Tanaka Denshi Kogyo Kabushiki Kaisha
    Inventor: Toshinori Ogashiwa
  • Patent number: 5366692
    Abstract: A method of electrically connecting a semiconductor package to a substrate by using bump contacts formed by heating the tip of an alloy wire and directly joined to aluminum alloy wiring lines, an alloy wire for such a purpose, and a semiconductor device constructed by electrically connecting a semiconductor package to a substrate by such a method. The alloy wire is produced by drawing an alloy material produced by quench solidifying an alloy containing Pb, Sn or In as a principal element, and an additive element or additives elements. The tip of the alloy wire is heated to form a ball to be joined to the aluminum alloy wiring line as a bump contact. The Brinell hardness number of the ball is H.sub.B 6 or higher.
    Type: Grant
    Filed: November 28, 1990
    Date of Patent: November 22, 1994
    Assignee: Tanaka Denshi Kogyo Kabushiki Kaisha
    Inventor: Toshinori Ogashiwa
  • Patent number: 5120498
    Abstract: Heavy metal solders having exceptional ability to wet non-metals, especially glass, are produced by the incorporation of small amounts of the light reactive metals lithium, sodium, potassium, rubidium, cesium, calcium, or magnesium into the heavy metal solder compositions. These heavy metal solder compositions consist essentially of alloys contained within the heavy metal system Pb-Sn-In-Bi-Cd-Sb-Hg-Ga-Ag-Au or within subsystems thereof wherein each heavy metal element present in the system or subsystem can potentially constitute nearly the whole of the total depending upon the specific composition chosen. In cases where a low melting point is desired the resultant solder will in general have the formula:A.sub.a B.sub.bwherein A is at least three metals selected from the group consisting ofPb, Sn, In, Bi, Cd, Sb, Hg, Ga, Ag, and Au;and B is at least one metal selected from the group consisting ofLi, Na, K, Rb, Cs, and Ca, and Mg; andwhereinb ranges from about 0.0001 to about 0.1; anda ranges from about 0.
    Type: Grant
    Filed: May 15, 1991
    Date of Patent: June 9, 1992
    Assignee: C-Innovations, Inc.
    Inventor: Josiah C. Cocks
  • Patent number: 4725404
    Abstract: The invention is directed to a lead calcium alloy for electrode grids, the alloy being substantially antimony-free. Copper and/or sulphur in small amounts are added to said alloy in order to significantly improve the casting properties, the mechanical and the corrosion properties.
    Type: Grant
    Filed: June 11, 1986
    Date of Patent: February 16, 1988
    Assignee: Accumulatorenfabrik Sonnenschein GmbH
    Inventors: Winfried Reif, Magdy Abdel-Reihim, Andreas Schuler
  • Patent number: 4525327
    Abstract: A lead based alloy for electrode supports of a lead-acid storage cell, the alloy containing between 0.05% and 4% antimony between 0.02% and 0.3% magnesium, and no barium. The magnesium permits a reduced antimony content, thereby reducing the corrosion, self-discharge, and hydrogen-releasing overvoltage problems caused by the presence of antimony in electrode supports, without adversely affecting the beneficial mechanical properties provided by antimony. It is essential to have no barium, which causes cracking and high mass corrosion of the alloy during use in a lead-acid cell.
    Type: Grant
    Filed: December 28, 1982
    Date of Patent: June 25, 1985
    Assignee: Compagnie Europeenne d'Accumulateurs
    Inventors: Roland Bardin, Joel Mack, Jean-Jacques Counioux
  • Patent number: 4358518
    Abstract: A work hardenable Pb-Ca-Sr-Sn alloy having anti-recrystallization stability at temperatures below about 66.degree. C. The alloy comprises by weight: 0.03 % to 0.04% calcium; 0.15% to 0.4% strontium; 0.15% to 0.9% tin; 0% to 0.1% barium; and the balance principally lead. The alloy is useful in the manufacture of cold-worked Pb-acid storage battery components and particularly grids made by the expanded, wrought lead strip process.
    Type: Grant
    Filed: March 3, 1981
    Date of Patent: November 9, 1982
    Assignee: General Motors Corporation
    Inventor: Robert C. Matter