Abstract: A metal alloy for use in a wire included in an electrochemical cell is disclosed having an amorphous structure, microcrystalline grains, or grains that are sized less than about one micron. In various embodiments, the microcrystalline grains are not generally longitudinally oriented, are variably oriented, or are randomly oriented. In some embodiments, the microcrystalline grains lack uniform grain size or are variably sized. In some embodiments, the microcrystalline grains have an average grain size of less than or equal to 5 microns. In some embodiments, the metal alloy lacks long-range crystalline order among the microcrystalline grains. In some embodiments, the wire is used in a substrate used in the electrochemical cell. In some embodiments, the metal alloy is formed using a co-extrusion process comprising warming up the metallic alloy and applying pressure and simultaneously passing a core material through a die to obtain a composite structure.

Abstract: A method and apparatus for continuously casting lead alloy strip on a casting surface on substantially the upper half of a rotatable casting drum from a pool of molten lead alloy at a high speed comprising imparting a coarse texture to the casting surface, providing a tundish containing a pool of the molten lead alloy at a predetermined temperature adjacent a substantially vertical upwardly-moving portion of said casting drum, the tundish having a graphite lip insert having an open front defined by a lip insert floor and opposed sidewalls cooperating with and commencing at a substantially vertical portion of the casting surface to contain said molten lead alloy in the lip insert, controlling the height of the surface level and temperature of the molten lead alloy in the lip insert, moving the casting surface upwardly through the pool of molten lead alloy by rotating said drum for depositing the lead alloy thereon, cooling the casting surface of the drum to solidify a strip of the lead alloy on substantially t

Abstract: A lead-acid battery grid made from a lead-based alloy containing, in addition to lead, tin at a concentration that is at least about 0.500%, silver at a concentration that is greater than 0.006%, and bismuth at a concentration that is at least about 0.005%, and, if calcium is present in the lead-based alloy, the calcium is at concentration that is no greater than about 0.010%.

Abstract: A lead alloy for use in battery grids include calcium in an amount between approximately 0.06 and 0.08 weight percent, tin in an amount between approximately 0.6 and 1.2 weight percent, and silver in an amount between approximately 0.005 and 0.015 weight percent.

Abstract: Lead composition for use in the production of battery components particularly the electrode plates, having specific amounts or ranges of trace elements to maximise battery life. Ranges of trace elements include the combination of 20-100 ppm silver, 250-1000 ppm bismuth, and 250-1000 ppm zinc; or 100-1000 ppm antimony and 100-1000 ppm iron; or 250-1000 ppm bismuth, 250-1000 ppm zinc, 20-100 ppm silver, not more than 20 ppm antimony and not more than 30 ppm iron.

Abstract: A lead acid battery grid made from a lead based alloy containing calcium, tin, and silver having the following composition: calcium above 0.06 and below 0.082%, tin above 1.0% and below 1.2%, silver between 0.005 and 0.020%, and optionally containing up to 0.025% aluminum. To enhance corrosion resistance and reduce grid growth, the grid optimally may contain 0.005 to 0.05% copper as an alloying element complementary to and as a replacement for part of the silver, provided the silver content does not fall below 0.005% and no more than a trace of aluminum is present.

Abstract: A lead alloy for lead acid-battery grids which essentially consists of about 0.05-0.07 wt % calcium; about 0.09-1.3 wt % tin; about 0.006-0.010 % silver; about 0.0100-0.0170 wt % barium and about 0.015-0.025 wt % aluminum with the balance lead. This lead alloy allows the improvement of the age hardening step, by eliminating the high temperature treatment process required for silver alloys in the manufacturing of lead-acid batteries. By using this lead alloy, a longer service life of the lead-acid batteries are also obtained by increasing the corrosion resistance and the mechanical strength of battery grids manufactured by the book molding process. Additionally, the reduced silver level used dramatically mitigates the problem of silver elimination from the stream of recycled lead in the secondary production of this metal.

Abstract: A solder composition that bonds well to oxides and other surfaces to which solder bonding is conventionally difficult is provided. The solder is particularly useful for reliable bonding and packaging of optical components that often have oxide surfaces. The solder composition exhibits a microstructure containing a solder matrix in which is distributed fine, micron-scale islands of rare-earth-containing intermetallic particles. The existence of the islands makes the rare earth elements better available for bonding, and reduce the extent to which the rare earths are oxidized. Advantageously, the solder contains Au and/or Ag, in which the rare earth elements tend to have some solid solubility. Due to this solubility, the Au and/or Ag tend to provide some additional protection of the rare earths against oxidation, and thereby also provide accelerated dissolution of the rare earth into the molten solder.

Abstract: A lead acid battery grid made from a lead based alloy containing calcium, tin, and silver having the following composition: calcium above 0.06 and below 0.082%, tin above 1.0% and below 1.2%, silver between 0.005 and 0.020%, and optionally containing up to 0.025% aluminum. To enhance corrosion resistance and reduce grid growth, the grid optimally may contain 0.005 to 0.05% copper as an alloying element complementary to and as a replacement for part of the silver, provided the silver content does not fall below 0.005% and no more than a trace of aluminum is present.

Abstract: An anode for use in zinc electrowinning is described. The anode is made of a lead-silver alloy which has been cast as a billet rolled and subjected to heat treatment either during or after rolling. The temperature of treatment is high enough to cause recrystallization of the alloy and to prevent precipitation of any alloying elements. The anode has a surface grain structure which facilitates rapid oxidation of the anode to condition the anode. The anode preferably contains at least 0.03 to 0.45% silver and Lip to 0.08% calcium.

Abstract: A process for altering surface properties of a mass of metal alloy solder comprising a first metal and a second metal. The process comprises exposing the mass to energized ions to preferentially sputter atoms of the first metal to form a surface layer ratio of first metal to second metal atoms that is less than the bulk ratio. The solder may be located on the surface of a substrate, wherein the process may further comprise masking the substrate to shield all but a selected area from the ion beam. The sputtering gas may comprises a reactive gas such as oxygen and the substrate may be an organic substrate. The process may further comprise simultaneously exposing the organic substrate to energized ions of the reactive gas to roughen the organic substrate surface.

Abstract: An object of this invention is to provide a solder material capable of, when joining an electronic component to a substrate with the solder material, improving heat fatigue resistance thereof and reducing damage of Ni film interposed therebetween. A solution of this invention is to assemble an electronic part by soldering a semiconductor device with a substrate using solder balls made of a solder material containing from 0.01 to 4.99% by weight of Fe; from 0.01 to 4.99% by weight of Ni, total thereof being from 0.02 to 5.0% by weight; from 0.1 to 8.0% by weight of at least one of Ag and In; from 0 to 70% by weight of Pb, balance containing Sn and unavoidable impurity.

Abstract: Lead and lead-alloy anodes for electrowinning metals such as zinc, copper, lead, tin, nickel and manganese from sulfuric acid solutions, whereby the electrodes are processed by a repetitive sequence of cold deformation and recrystallization heat treatment, within specified limits of deformation, temperature and annealing time, to achieve an improved microstructure consisting of a high frequency of special low .SIGMA. CSL grain boundaries (i.e.>50%). The resultant electrodes possess significantly improved resistance to intergranular corrosion, and yield (1) extended service life, (2) the potential for reduction in electrode thickness with a commensurate increase in the number of electrodes per electrowinning cell, and (3) the opportunity to extract higher purity metal product.

Abstract: An enhanced fatigue life solder comprising, by weight, about 1-3% tin, about 1-3% silver and the balance essentially lead is provided. The solder is particularly useful for joining electronic components and in particular for making C-4 interconnections. A method for using the solder to make electronic components and electric components made using the method are also provided.

Abstract: A tin-lead alloy solder is provided which exhibits high joint strength under conditions which are likely to induce fatigue fracture. The tin-lead alloy solder comprises 15-80 wt. % lead, 0.1-5 wt. % silver, 0.1-10 wt. % antimony, and 0.0005-0.3 phosphorus, the balance being tin.

Abstract: This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stability and to a connection material to be used in the connecting method, wherein any one of Pb, Sn, In is applied as a major element and the alloy having additive elements mixed with it is made as a fine wire under a rapid cooling and condensation process and further to a semiconductor device made by the above-mentioned connecting method.

Abstract: This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stability and to a connection material to be used in the connecting method, wherein any one of Pb, Sn, In is applied as a major element and the alloy having additive elements mixed with it is made as a fine wire under a rapid cooling and condensation process and further to a semiconductor device made by the above-mentioned connecting method.

Abstract: A Pb-based overlay alloy of a plain bearing contains 3%-20% of In and more than 0.5% to 9% of Sb, and, preferably 0.1%-5% of Ag, Cu, Ni, and/or Mn, and exhibits improved properties at a high temperature and corrosive condition of deteriorated lubricating oil.

Abstract: A conductor for a fuse has a main composition of a Pb-Ag alloy containing silver of 0.5 to 20 wt. % and lead and unavoidable impurity for the rest. A conductor for a fuse in another example includes a Pb-Ag-Cu or/and Te alloy obtained by adding copper or/and tellurium of 0.05 to 1 wt. %, respectively, to the above mentioned Pb-Ag alloy. Each of those conductors for fuses has a diameter in the range from 0.05 to 0.3 mm and it is used as a fuse contained in a capacitor of a tantalum chip for example. Those conductors for fuses have excellent pre-arcing time/current characteristics and good drawability.

Abstract: Soldering material essentially consists of 20-50% of Pb, 0.5-less than 1% of Sb, 0.1-5% of In, and balance of Sn. Such material is suitable to solder electronic parts exposed to temperature variation and mechanical vibration.

Abstract: Soft-solder alloys for connecting ceramic parts without permetallization comprising 86 to 99% lead or tin, 0 to 13% silver and/or copper, 0 to 10% indium and 1 to 10% titanium and/or zirconium.

Abstract: The present invention relates to a composite material comprising a porous lead alloy containing from 0.7 to 1.0% silver or 0.1 to 1.0% calcium or 0.7 to 1.0% silver and 0.1 to 1.0% calcium and having its pores filled by a resin such as epoxy resin. The product has utility as a battery electrode and as a sound absorbing material.

Abstract: A lead based, tin free alloy is modified by adding thereto about 0.5 to 4 weight percent of tin. The alloy is rapidly solidified by forming a melt thereof containing the tin addition and quenching the melt on a moving chill surface at a quenching rate of at least about 10.sup.5 .degree. C./sec. Addition of the tin inhibits formation of lead oxide film in the rapidly solidified alloy and substantially increases the storage life thereof.

Abstract: Electromigration activity is decreased and lifetime is extended in solder stripes employed as conductors and terminals on microelectronic devices by forming an alloy of a solute element, such as copper, with tin in a lead/tin solder and providing a substantially uniform distribution of particles of the intermetallic compound in the solder. The concentration of the solute element is maintained at less than about three times the tin concentration and less than about 10% of the amount of the solder.

Abstract: A solder alloy which is particularly effective for use in automotive radiator applications comprises 87.5%-96.5% lead, 3%-10% tin, 0.5%-2.0% antimony, and 0-0.5% silver. The solder has high mechanical strength, is resistant to galvanic corrosion, and is readily solderable.

Abstract: A package of the flatpack type for microelectronic circuits comprises a metal base of material having good heat conductivity on which a metal frame is mounted by means of a hard brazing alloy. The frame has the function of supporting connections by means of insulating lead-in bushings of the glass bead type. The coefficient of expansion of the frame and of the base are matched so as to ensure that the base of the package does not exhibit any defect of surface planarity after cooling.

Abstract: Insulated multiwire electric cable formed of solderable electric conductors protected by a lead alloy, remaining individually separate even after an operation for the electric insulation of their ply with electric conductors individually coated with a layer of an alloy which comprises for 100% by weight of alloy, a lead content greater than 90% by weight.

Abstract: A reuseable collector for use in a process for the bulk production of alloy by deposition from the vapor phase. The collector employs a coating of solder alloy on the deposition surface such that after deposition has been completed the solder alloy may be melted and the deposited alloy removed from the collector without the necessity of destroying the collector.

Abstract: A soft solder of Pb alloy for semiconductor devices that contains 1 to 65 wt % of Sn or In or both, the balance being Pb and incidental impurities which include less than 50 ppb of radioisotopes and the count of radioactive alpha-particles being not more than 0.5 CPH/cm.sup.2. The solder exhibits high adhesive strength and good wettability. The properties of this material may be further improved by addition of 1 to 10 wt % of Ag.

Abstract: A semiconductor device, for example a power rectifier, formed in a semiconductor body has a contact area coated with a metal layer of, for example, gold. A metallic member is soldered to the layer with an alloy comprising at least 80% lead, the balance being indium and silver in a ratio of at least 4:1 and at most 10:1. One such solder which has good wetting characteristics for improved bond strength contains approximately 92% lead, 7% indium, and 1% silver.

Abstract: A lead-based alloy containing, based upon the total weight of the alloy, 0.8-1.6% antimony, 0.08-0.16% arsenic, 0.006-0.012% silver and, optionally, 0.2-0.5% tin, is disclosed for making lead-acid battery grids using a continuous casting process.

Abstract: A process for metal-enrichment of lead bullion, wherein an alkali metal-desired metal intermetallic, such as sodium-antimony intermetallic, is added as a refining dross to the bullion and the desired metal is stripped from the dross and recovered as an enriched bullion. The process includes the steps of heating the lead bullion, in which the desired metal is to be recovered, to a temperature between 650.degree. F. and 900.degree. F.; agitating the molten bullion; adding said alkali metal-desired metal intermetallic to said bullion; mixing said intermetallic into said bullion; adding a stripping reagent for stripping said desired metal from said intermetallic; forming a desired metal-enriched lead bullion and a residue dross substantially void of said desired metal; and separating said enriched bullion from said residue dross. The process may also require a cleansing step to cleanse said enriched lead bullion of any said alkali metal in solution.