Abstract: A heat detection line includes a twisted pair wire composed of a pair of heat detecting wires being twisted together. Each heat detecting wire includes a conductor and an insulator covering a periphery of the conductor. The conductor is non-magnetic and composed of a copper alloy with a tensile strength of 900 MPa or more. A multi-core cable includes the heat detection line, a plurality of electric wires, and a sheath covering the heat detection line and the plurality of electric wires together. A melting point of the insulator of the heat detection line is lower than a melting point of an insulator of each of the plurality of electric wires.

Abstract: A multi-core cable includes a heat detection line including a twisted pair wire composed of a pair of heat detecting wires being twisted together, each of which includes a first conductor and a first insulator covering a periphery of the first conductor, a plurality of electric wires spirally twisted around the heat detection line, each of which includes a second conductor and a second insulator covering a periphery of the second conductor, and a sheath covering the heat detection line and the plurality of electric wires together. A melting point of the first insulator is lower than a melting point of the second insulator. The second conductor has a shape in a cross-section perpendicular to a cable longitudinal direction in which a width along a circumferential direction is gradually increased from a radially inward portion to a radially outward portion.

Abstract: The invention relates to a high-strength as-cast copper alloy containing tin, with excellent hot-workability and cold-workability properties, high resistance to abrasive wear, adhesive wear and fretting wear, and improved corrosion resistance and stress relaxation resistance, consisting (in wt. %) of: 4.0 to 23.0% Sn, 0.05 to 2.0% Si, 0.005 to 0.6 B, 0.001 to 0.08% P, optionally up to a maximum of 2.0% Zn, optionally up to a maximum of 0.6% Fe, optionally up to a maximum of 0.5% Mg, optionally up to a maximum of 0.25% Pb, with the remainder being copper and inevitable impurities, characterised in that the ratio of Si/B of the element content of the elements silicon and boron lies between 0.3 and 10. The invention also relates to a casting variant and a further-processed variant of the tin-containing copper alloy, a production method, and the use of the alloy.

Abstract: A metal alloy for use in a wire included in an electrochemical cell is disclosed having an amorphous structure, microcrystalline grains, or grains that are sized less than about one micron. In various embodiments, the microcrystalline grains are not generally longitudinally oriented, are variably oriented, or are randomly oriented. In some embodiments, the microcrystalline grains lack uniform grain size or are variably sized. In some embodiments, the microcrystalline grains have an average grain size of less than or equal to 5 microns. In some embodiments, the metal alloy lacks long-range crystalline order among the microcrystalline grains. In some embodiments, the wire is used in a substrate used in the electrochemical cell. In some embodiments, the metal alloy is formed using a co-extrusion process comprising warming up the metallic alloy and applying pressure and simultaneously passing a core material through a die to obtain a composite structure.

Abstract: A lead-acid battery grid made from a lead-based alloy containing, in addition to lead, tin at a concentration that is at least about 0.500%, silver at a concentration that is greater than 0.006%, and bismuth at a concentration that is at least about 0.005%, and, if calcium is present in the lead-based alloy, the calcium is at concentration that is no greater than about 0.010%.

Abstract: The present invention relates to a fusible alloy for pressure relief devices (PRDs), and the present invention provides a fusible alloy for PRD, the alloy comprising 29.0 to 33.0% by weight of Bi, 14.0 to 21.0% by weight of Sn, 2.0 to 5.0% by weight of In, and substantially Pb for the balance. The fusible alloy for PRD of the invention has a melting point appropriate for use according to the 110° C.-grade standards, and has excellent wettability upon melting.

Abstract: A lead calcium tin alloy to which cobalt has been added is described. The alloy is useful in the formation of anodes to be used in electrowinning cells. Electrowinning cells containing the cobalt alloys are particularly suited for electrowinning metals, such as copper, from sulfuric acid electrolytes. The cobalt-containing anodes improve the efficiency of oxygen evolution at the anode during electrowinning and reduce corrosion of the anode.

Abstract: To provide a solder alloy, a solder ball and an electronic member having a solder bump, used for connection with a mother board or the like, having a melting temperature of less than 250° C. for the solder alloy, achieving high drop impact resistance required in mobile devices or the like. A solder alloy is used which consists of not less than 0.1 mass ppm of boron and not greater than 200 mass ppm of boron and a remainder comprising substantially not less than 40% by mass of Sn, in which its melting temperature is less than 250° C.

Abstract: A solder ball is formed from an Sn—Pb alloy which consists essentially of about 2–65 mass % of Sn, 0–5 mass % of Ag, about 0.1–1 mass % of Sb, and 0.01–0.1 mass % of Cu, and 0.01–0.1 mass % of Bi, and a balance of Pb and incidental impurities. The solder ball has improved thermal fatigue resistance, good solderability, and good surface brightness after soldering.

Abstract: A method of joining workpieces using a solder alloy. The alloy contains either at least 1% or a maximum of about 10% by weight of an element or a mixture of elements selected from the group consisting of titanium, zirconium, hafnium, vanadium, niobium, and tantalum; either at least 0.01% or 0.01–10% by weight of an element or a mixture of elements selected from the group of the lanthanides (rare earths); either at least 0.5% or 0.5–10% by weight of an element or a mixture of elements selected from the group consisting of silver, copper, and indium; optionally either at least 0.01% or 0.01–1% by weight of gallium; and a remainder consisting of tin, lead, or of a mixture of tin and lead.

Abstract: The present invention relates to new compositions of matter, particularly metals and alloys, and methods of making such compositions. The new compositions of matter exhibit long-range ordering and unique electronic character.

Abstract: A lead alloy coating for a positive grid of a lead acid battery is provided. The lead alloy coating includes a tin content of at least about 0.1%, but not more than about 3%; and a residual lead content. The lead alloy coating optionally includes a calcium content of at least about 0.01%, but not more than about 0.1%, with or without a silver content of at least about 0.01%, but not more than about 0.1%. Alternatively, the lead alloy coating optionally includes a barium content of at least about 0.01%, but not more than about 0.1%, with or without a silver content of at least about 0.01%, but not more than about 0.1%.

Abstract: A solder interconnection uses preferably lead-rich solder balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate. After a solder ball has been formed using standard processes, a thin cap layer of preferably pure tin is deposited on a surface of the solder balls. An interconnecting eutectic alloy is formed upon reflow. Subsequent annealing causes tin to diffuse into the lead, or vice versa, and intermix, thereby raising the melting point temperature of the cap layer of the resulting assembly. This structure and process avoids secondary reflow problems during subsequent processing.

Abstract: A non-ceramic solder composition for coupling a semiconductor device to a conductive support, composed of a first amount of a solder component and a second amount of a filler component. The first and second amounts of the respective components are proportioned so that the solder composition has an overall coefficient of thermal expansion that is intermediate of the coefficients of thermal expansion of the semiconductor device and the conductive support.

Abstract: A process for the production of sliding elements in which an overlay of lead-tin-copper is applied by electroplating to the prefabricated semi-finished product, and in which a ternary, fluoroborate-free electroplating bath is used without brighteners and with the addition of non-ionic wetting agents and free alkyl sulfonic acid. After the deposition of the galvanic overlay a heat treatment is carried out in the temperature range of 150° C. to 200° C. for between 1 and 100 hours. The multilayer material for sliding elements comprises at least a backing and an overlay of 12 to 16 wt. % tin and 7 to 11 wt. % copper, the rest being lead. The overlay comprises 15 to 25 wt. % particles of intermetallic compound Cu6Sn5.

Abstract: A solder composition that bonds well to oxides and other surfaces to which solder bonding is conventionally difficult is provided. The solder is particularly useful for reliable bonding and packaging of optical components that often have oxide surfaces. The solder composition exhibits a microstructure containing a solder matrix in which is distributed fine, micron-scale islands of rare-earth-containing intermetallic particles. The existence of the islands makes the rare earth elements better available for bonding, and reduce the extent to which the rare earths are oxidized. Advantageously, the solder contains Au and/or Ag, in which the rare earth elements tend to have some solid solubility. Due to this solubility, the Au and/or Ag tend to provide some additional protection of the rare earths against oxidation, and thereby also provide accelerated dissolution of the rare earth into the molten solder.

Abstract: A lead acid battery grid made from a lead based alloy containing calcium, tin, and silver having the following composition: calcium above 0.06 and below 0.082%, tin above 1.0% and below 1.2%, silver between 0.005 and 0.020%, and optionally containing up to 0.025% aluminum. To enhance corrosion resistance and reduce grid growth, the grid optimally may contain 0.005 to 0.05% copper as an alloying element complementary to and as a replacement for part of the silver, provided the silver content does not fall below 0.005% and no more than a trace of aluminum is present.

Abstract: The invention, which enables wider use to be made of soft-soldering techniques, concerns an alloy, in particular a solder alloy, a method of joining workpieces by soldering using the solder alloy and the use of the alloy for soldering. The alloy proposed is characterized in that it contains at least 1% by wt. of an element or a mixture of elements from sub-group IVa and/or Va in the periodic table, at least 0.01% by wt. of an element or a mixture of elements from the lanthanide series; optionally at least 0.5% of silver or copper or indium or a mixture silver and/or copper and/or indium; and optionally at least 0.01% by wt. of gallium, the remainder consisting of tin or lead or a mixture of tin and lead plus, as applicable, the usual impurities. The alloy proposed can be used as solder in oxygen-containing atmospheres such as air, can be used at relatively low temperatures and efficiently wets normally difficult to wet surfaces such as ceramic surfaces.

Abstract: A process for altering surface properties of a mass of metal alloy solder comprising a first metal and a second metal. The process comprises exposing the mass to energized ions to preferentially sputter atoms of the first metal to form a surface layer ratio of first metal to second metal atoms that is less than the bulk ratio. The solder may be located on the surface of a substrate, wherein the process may further comprise masking the substrate to shield all but a selected area from the ion beam. The sputtering gas may comprises a reactive gas such as oxygen and the substrate may be an organic substrate. The process may further comprise simultaneously exposing the organic substrate to energized ions of the reactive gas to roughen the organic substrate surface.

Abstract: Lead and lead-alloy anodes for electrowinning metals such as zinc, copper, lead, tin, nickel and manganese from sulfuric acid solutions, whereby the electrodes are processed by a repetitive sequence of cold deformation and recrystallization heat treatment, within specified limits of deformation, temperature and annealing time, to achieve an improved microstructure consisting of a high frequency of special low .SIGMA. CSL grain boundaries (i.e.>50%). The resultant electrodes possess significantly improved resistance to intergranular corrosion, and yield (1) extended service life, (2) the potential for reduction in electrode thickness with a commensurate increase in the number of electrodes per electrowinning cell, and (3) the opportunity to extract higher purity metal product.

Abstract: A non-destructive method for identifying off-composition solder columns of for example, a ceramic column grid array. The method is performed at the ceramic module level prior to card assembly to avoid costly loss or rework post card assembly. The assembly of solder columns on a substrate is heated to a temperature below the melting temperature of pure-composition solder and above the temperature of attachment of a solder column to an organic board. Heating the assembly produces visually detectable changes characteristic of off-composition solder which are used for identifying which solder columns are composed of off-composition solder.

Abstract: An overlay alloy for sliding bearing is deposited on a lining by plating and consists of from 2 to less than 5% of tin, from 0.05 to 10% of indium, from 0.05 to 5% of copper, the balance consisting of lead and unavoidable compound. Seizure at high speed travel is almost completely eliminated.

Abstract: An enhanced fatigue life solder comprising, by weight, about 1-3% tin, about 1-3% silver and the balance essentially lead is provided. The solder is particularly useful for joining electronic components and in particular for making C-4 interconnections. A method for using the solder to make electronic components and electric components made using the method are also provided.

Abstract: A method of electrically connecting a semiconductor package to a substrate by using bump contacts formed by heating the tip of an alloy wire and directly joined to aluminum alloy wiring lines, an alloy wire for such a purpose, and a semiconductor device constructed by electrically connecting a semiconductor package to a substrate by such a method. The alloy wire is produced by drawing an alloy material produced by quench solidifying an alloy containing Pb, Sn or In as a principal element, and an additive element or additive elements. The tip of the alloy wire is heated to form a ball to be joined to the aluminum alloy wiring line as a bump contact. The Brinell hardness number of the ball is H.sub.B 6 or higher.

Abstract: This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stability and to a connection material to be used in the connecting method, wherein any one of Pb, Sn, In is applied as a major element and the alloy having additive elements mixed with it is made as a fine wire under a rapid cooling and condensation process and further to a semiconductor device made by the above-mentioned connecting method.

Abstract: This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stability and to a connection material to be used in the connecting method, wherein any one of Pb, Sn, In is applied as a major element and the alloy having additive elements mixed with it is made as a fine wire under a rapid cooling and condensation process and further to a semiconductor device made by the above-mentioned connecting method.

Abstract: A solder paste is composed of a vehicle (or flux) system and a mixture of at least two solder powders. One component of this mixture is a eutectic or near-eutectic Sn/Pb alloy powder, while the other component comprises powders selected from at least one elemental metal powder or at least one solder alloy powder or at least one elemental metal powder and at least one solder alloy powder. Said other component is a powder or combination of powders each of which has a liquidus temperature which is lower by at least 5 degrees Centigrade (.degree.C.) than the solidus temperature of said eutectic or near-eutectic Sn/Pb alloy powder or a solidus temperature which is higher by at least 5.degree. C. than the liquidus temperature of said eutectic or near-eutectic Sn/Pb alloy powder. The eutectic or near-eutectic Sn/Pb powder makes up from 5 to 95 weight percent of the total powder mixture. Alternatively, not all powders which comprise the second component need to obey this rule so long as at least 30% by wt.

Abstract: A method of electrically connecting a semiconductor package to a substrate by using bump contacts formed by heating the tip of an alloy wire and directly joined to aluminum alloy wiring lines, an alloy wire for such a purpose, and a semiconductor device constructed by electrically connecting a semiconductor package to a substrate by such a method. The alloy wire is produced by drawing an alloy material produced by quench solidifying an alloy containing Pb, Sn or In as a principal element, and an additive element or additives elements. The tip of the alloy wire is heated to form a ball to be joined to the aluminum alloy wiring line as a bump contact. The Brinell hardness number of the ball is H.sub.B 6 or higher.

Abstract: An improved dispersion strengthened lead-tin alloy solder is provided in which there is dispersed in the solder up to about 5 vol. percent of small particles, of a metal sulfide or a nickel-tin intermetallic.

Abstract: Low melting temperature copper-containing solders are disclosed for soldering and rework on copper surfaces. The amount of copper required in the solder in order to inhibit dissolution of the copper surface to be soldered has been found to be dopant level, below the binary tin-copper eutectic point.

Abstract: A quaternary overlay bearing alloy used as a surface layer of a sliding bearing consist by weight of Cu in an amount sufficient more than 3% to substantially improve seizure property not more than 6% of Cu, 1-10% of In, not less than 0.1 but less than 5% of Sn, and the balance lead and incidental impurities.

Abstract: The corrosion resistance of an insoluble anode for use under high current condition, which anode may be made from iron or copper for example, is improved by coating the anode with an alloy of lead, tin and indium.

Abstract: A conventional solder composition of Sn--Bi--Pb which is improved so that, when soldering job at a lower temperature, adequate adhesion strength and a resilient bond is obtained by virtue of additional incorporation of 0.005 to 1% GA and/or 0.01 to 0.1% Ni. The inventive solder is useful in assembly work in the electronic industry wherein thermally weak parts are subjected to soldering.

Abstract: A lead based alloy is modified by adding thereto a surfactant consisting of about 0.01 to 0.5 weight percent tellurium, about 0.01 to 0.5 weight percent selenium, about 0.01 to 0.5 weight percent selenium plus about 0.1-0.5 weight percent antimony, and mixtures thereof. The alloy is rapidly solidified by forming a melt thereof containing the surfactant addition and quenching the melt on a moving chill surface at a quenching rate of at least about 10.sup.3 .degree. C./sec. Addition of the surfactant lowers melt surface tension and thereby promotes improved wetting.

Abstract: A lead based, tin free alloy is modified by adding thereto about 0.5 to 4 weight percent of tin. The alloy is rapidly solidified by forming a melt thereof containing the tin addition and quenching the melt on a moving chill surface at a quenching rate of at least about 10.sup.5 .degree. C./sec. Addition of the tin inhibits formation of lead oxide film in the rapidly solidified alloy and substantially increases the storage life thereof.

Abstract: Electromigration activity is decreased and lifetime is extended in solder stripes employed as conductors and terminals on microelectronic devices by forming an alloy of a solute element, such as copper, with tin in a lead/tin solder and providing a substantially uniform distribution of particles of the intermetallic compound in the solder. The concentration of the solute element is maintained at less than about three times the tin concentration and less than about 10% of the amount of the solder.

Abstract: Insulated multiwire electric cable formed of solderable electric conductors protected by a lead alloy, remaining individually separate even after an operation for the electric insulation of their ply with electric conductors individually coated with a layer of an alloy which comprises for 100% by weight of alloy, a lead content greater than 90% by weight.

Abstract: A reuseable collector for use in a process for the bulk production of alloy by deposition from the vapor phase. The collector employs a coating of solder alloy on the deposition surface such that after deposition has been completed the solder alloy may be melted and the deposited alloy removed from the collector without the necessity of destroying the collector.

Abstract: A soft solder of Pb alloy for semiconductor devices that contains 1 to 65 wt % of Sn or In or both, the balance being Pb and incidental impurities which include less than 50 ppb of radioisotopes and the count of radioactive alpha-particles being not more than 0.5 CPH/cm.sup.2. The solder exhibits high adhesive strength and good wettability. The properties of this material may be further improved by addition of 1 to 10 wt % of Ag.

Abstract: The grain size and resistance to corrosion of lead-antimony alloys containing less than 4% of antimony and 0.005 to 0.1% copper, are improved by incorporating therein from 0.001 to 0.1% of a mixture of rare earths, preferably misch metal. The alloys may also contain up to 0.5% arsenic or up to 0.8% of tin.

Abstract: A process for metal-enrichment of lead bullion, wherein an alkali metal-desired metal intermetallic, such as sodium-antimony intermetallic, is added as a refining dross to the bullion and the desired metal is stripped from the dross and recovered as an enriched bullion. The process includes the steps of heating the lead bullion, in which the desired metal is to be recovered, to a temperature between 650.degree. F. and 900.degree. F.; agitating the molten bullion; adding said alkali metal-desired metal intermetallic to said bullion; mixing said intermetallic into said bullion; adding a stripping reagent for stripping said desired metal from said intermetallic; forming a desired metal-enriched lead bullion and a residue dross substantially void of said desired metal; and separating said enriched bullion from said residue dross. The process may also require a cleansing step to cleanse said enriched lead bullion of any said alkali metal in solution.

Abstract: Extraction of non-lead components (e.g. tin, indium, etc.) from solder joints with monocarboxylic acids of alkylated hydrophenanthrene nuclei to increase the lead content of the solder joints.