Abstract: A method of manufacturing a wiring substrate of the present invention includes the steps of, preparing a laminated body having such a structure that a peelable metal foil in which a lower metal foil and an upper metal foil are laminated peelably and an opening portion is provided on a peripheral side is pasted onto a supporting body, forming a through hole having a diameter smaller than the opening portion by processing a portion of the supporting body on an inner side of the opening portion to obtain a reference hole having a projection portion in an inside, forming a resin layer on the peelable metal foil and the projection portion in the reference hole to cover a side surface of the opening portion, and then forming a build-up wiring on the resin layer, removing portions of the build-up wiring and the laminated body corresponding to an area containing the opening portion to expose a peeling boundary of the peelable metal foil, peeling the upper metal foil from the lower metal foil at a boundary to separate

Abstract: Organic photosensitive optoelectronic devices are disclosed. The devises are thin-film crystalline organic optoelectronic devices capable of generating a voltage when exposed to light, and prepared by a method including the steps of: depositing a first organic layer over a first electrode; depositing a second organic layer over the first organic layer; depositing a confining layer over the second organic layer to form a stack; annealing the stack; and finally depositing a second electrode over the second organic layer.

Abstract: The invention provides an improvement to the useable lifetimes of phenolic-epoxy, phenolic-benzoxazine, phenolic-epoxy-benzoxazine mixtures and other phenolic mixtures through the use of protected phenolics, where a phenolic compound, polymer, or resin is released on demand by the addition of a deblocking agent.

Abstract: The invention is directed to a method by exposing at least a portion of a luminescent coating disposed on a surface of an article to ultraviolet light at one or more preselected wavelengths causing said luminescent coating to exhibit a luminescence spectrum, the luminescence spectrum exhibiting a plurality of intensity peaks that have been predetermined to create a standard; determining the intensity of at least two peaks in the luminescence spectrum of the coating; determining a peak intensity ratio of the at least two peaks; comparing the peak intensity ratio determined with the standard; and, classifying the article according to whether or not the peak intensity ratio does or does not match the standard; wherein the luminescent coating is a particulate luminescent composition comprising a rare earth doped fluoride represented by the chemical formula REx(CaaSrbBac)1?xF2+x?2yOy wherein RE represents a three-valent rare-earth element, 0.005?x?0.20, and 0?y?0.

Abstract: A method for manufacturing a metal clad laminate is provided. A poly(amic acid) solution is first formed. The poly(amic acid) solution includes a heat-conductive filler, a poly(amic acid) and a solvent. The thermal conductivity of the heat-conductive filler is higher than 10 W/m-° C. The content of the heat-conductive filler is about 10˜90 wt % of the solid content of the poly(amic acid) solution. Then, the poly(amic acid) solution is coated on a metal foil. Finally, the poly(amic acid) solution on the metal foil is heated to form a polyimide layer on the metal foil.

Abstract: Embodiments of an apparatus and methods for heating a substrate and a sacrificial layer are generally described herein. Other embodiments may be described and claimed.

Abstract: A composite for a transducer facilitates an increased actuation force as compared to similar prior art composites for transducers. The composite facilitates increased compliance of the transducer in one direction, an improved reaction time as compared to similar prior art composites for transducers, and provides an increased lifetime of the transducer in which it is applied.

Abstract: An ink formulation of a circuit element includes a first powder having a first melting temperature, a second powder having a second melting temperature that is higher than the first melting temperature, and a polymer binder. A method of fabricating a circuit element on a substrate employs the ink formulation and includes depositing the ink formulation on a substrate, curing the polymer binder, and melting the first powder at the first melting temperature to yield a solid solution that forms the circuit element.

Abstract: The invention provides an inkjet ink including a compound (A) obtained by polymerizing an acid anhydride group-containing compound (a1), an amino-containing compound (a2), and a hydroxy compound (a3), and provides a method for manufacturing this inkjet ink.

Abstract: An objective of the present invention is to provide a phosphorous-containing siliceous material having a specific permittivity of not more than 3.5. The phosphorus-containing silazane composition according to the present invention is characterized by comprising a polyalkylsilazane and at least one phosphorus compound in an organic solvent. A phosphorus-containing siliceous film may be formed by coating the composition onto a substrate to form a film which is then prebaked at a temperature of 50 to 300° C. and is then baked in an inert atmosphere at a temperature of 300 to 700° C. The phosphorus compound according to the present invention is preferably a pentavalent phosphoric ester or phosphazene compound.

Abstract: An encapsulant for encapsulating electronic components and a method of making and/or using the encapsulant may be provided. An electronic device that includes the encapsulant may be provided. The curable encapsulant composition may include a mixture of a functionalized polymer and at least one reactive monomer composition. The reactive monomer composition may include a reactive monomer component that may be a low temperature solid and may be present in an amount in the reactive monomer composition a range of greater than about 20 weight percent based on the total weight of reactive monomer composition. The mixture, at about low temperature, may be solid or tack-free, or both solid and tack-free.

Abstract: A dielectric composition which forms a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like. As such a layer, it includes a cured resin material and a predetermined percentage by weight of particulate fillers, thus not including continuous fibers, semi-continuous fibers or the like as part thereof.

Abstract: An insulating material comprising a cycloolefin polymer, specifically, an interlayer insulating material for a high-density assembly board having interlayer-connecting via holes at most 200 ?m in diameter, comprising a cycloolefin polymer containing at least 50 mol % of a repeating unit derived from a cycloolefin monomer; a dry film formed from a curable resin composition comprising a polymer having a number average molecular weight within a range of 1,000 to 1,000,000 as measured by gel permeation chromatography, and a hardener; and a resin-attached metal foil obtained by forming a film of a cycloolefin polymer on one side of a metal foil. Laminates, multi-layer laminates and build-up multi-layer laminates making use of these materials, and production processes thereof.

Abstract: It is an object to provide a conductive organic thin film having organic molecules that include at one end a terminal bonding group that is covalently bonded to a substrate surface, a conjugate bonding group that is located at any portion of the organic molecules and that is polymerized with other molecules, and a polar functional group that does not include active hydrogen and that is located at any portion between the terminal bonding group and the conjugate bonding group, wherein the organic molecules are oriented and their conjugate bonding groups are polymerized, forming a conduction network. The conductivity (?) of the conductive organic thin film at room temperature (25° C.) is at least 5.5×105 S/cm, and preferably at least 1×107 S/cm, without dopants, having significantly higher conductivity than metals such as gold and silver. In particular, a film of polypyrrole or polythienylene conjugate bonds that is polymerized through polymerization through electrolytic oxidation has high conductivity.

Abstract: Methods of making a magnetic recording device with an “anchored” conductive stud which is securely attached within its surrounding insulator materials. The conductive stud is formed over a conductive layer which is coupled to or part of a read or a write head element of the magnetic recording device. The conductive stud has a top stud portion and a bottom undercut portion formed over the conductive layer. In one illustrated embodiment, the bottom undercut portion has a width that is greater than the width of the top stud portion. Since an insulator is formed around the conductive stud and over its bottom undercut portion, a secure coupling between the conductive stud and the conductive layer is provided. Preferably, the conductive layer is made of copper (Cu), the conductive stud is made of gold (Au), and the insulator is alumina (Al2O3). A seed layer may be formed between the conductive stud and the conductive layer.

Abstract: Porous thermoset dielectric materials having low dielectric constants useful in electronic component manufacture are provided along with methods of preparing the porous thermoset dielectric materials. Also provided are methods of forming integrated circuits containing such porous thermoset dielectric material.

Abstract: The invention relates to a transparent substrate coated on at least one of its faces with a polymer layer deposited under vacuum. This polymer layer is provided with an adhesion prelayer of organic or organoinorganic nature. The invention also relates to the process for manufacturing such a coated substrate and to its applications.