With Partial Filling Of Valleys On Outer Surface Patents (Class 428/173)
  • Patent number: 10328680
    Abstract: A method to form a digital print on a substrate including a polymer material by bonding particles in powder form to the surface of the substrate. The method may include: providing a substrate including a thermoplastic material and a transparent layer including a thermoplastic material, providing a continuous print layer including particles on the substrate or on the transparent layer, printing a digital image including color pigments on the print layer, and bonding the print layer with the color pigments to the transparent layer and to the substrate with heat and pressure such that the digital image is located between the transparent layer and the substrate.
    Type: Grant
    Filed: October 22, 2014
    Date of Patent: June 25, 2019
    Assignee: CERALOC INNOVATION AB
    Inventor: Darko Pervan
  • Patent number: 10303051
    Abstract: Provided is a hyperbranched polymer having such a backbone that is readily decomposable by an acid. The hyperbranched polymer is derived from, via reaction, monomers including a monomer (X) and a monomer (Y). The monomer (X) contains three or more hydroxy groups per molecule. The monomer (Y) contains two or more groups represented by General Formula (y) per molecule. The monomer (X) includes at least one compound selected from the group consisting of cyclodextrins, compounds represented by General Formula (I), pillararenes, compounds represented by General Formula (II), compounds represented by General Formula (III), and compounds represented by General Formula (IV). The monomer (Y) includes a compound represented by General Formula (1).
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: May 28, 2019
    Assignees: THE SCHOOL CORPORATION KANSAI UNIVERSITY, DAICEL CORPORATION
    Inventors: Hiroto Kudo, Ichiro Takase
  • Patent number: 10233559
    Abstract: A method for high rate assembly of nanoelements into two-dimensional void patterns on a non-conductive substrate surface utilizes an applied electric field to stabilize against forces resulting from pulling the substrate through the surface of a nanoelement suspension. The electric field contours emanating from a conductive layer in the substrate, covered by an insulating layer, are modified by a patterned photoresist layer, resulting in an increased driving force for nanoelements to migrate from a liquid suspension to voids on a patterned substrate having a non-conductive surface. The method can be used for the production of microscale and nanoscale circuits, sensors, and other electronic devices.
    Type: Grant
    Filed: November 14, 2016
    Date of Patent: March 19, 2019
    Assignee: Northeastern University
    Inventors: Asli Sirman, Ahmed Busnaina, Cihan Yilmaz, Jun Huang, Sivasubramanian Somu
  • Patent number: 10208394
    Abstract: Damascene templates have two-dimensionally patterned raised metal features disposed on an underlying conductive layer extending across a substrate. The templates are topographically flat overall, and the patterned conductive features establish micron-scale and nanometer-scale patterns for the assembly of nanoelements into nanoscale circuits and sensors. The templates are made using microfabrication techniques together with chemical mechanical polishing. These templates are compatible with various directed assembly techniques, including electrophoresis, and offer essentially 100% efficient assembly and transfer of nanoelements in a continuous operation cycle. The templates can be repeatedly used for transfer of patterned nanoelements thousands of times with minimal or no damage, and the transfer process involves no intermediate processes between cycles. The assembly and transfer processes employed are carried out at room temperature and pressure and are thus amenable to low cost, high-rate device production.
    Type: Grant
    Filed: June 13, 2016
    Date of Patent: February 19, 2019
    Assignee: Northeastern University
    Inventors: Ahmed Busnaina, Hanchul Cho, Sivasubramanian Somu, Jun Huang
  • Patent number: 10096710
    Abstract: A method of fabricating a semiconductor device comprises providing a substrate with a shallow trench isolation (STI) within the substrate and a gate stack. A cavity is formed between the gate stack and the STI. The cavity comprises one sidewall formed by the STI, one sidewall formed by the substrate, and a bottom surface formed by the substrate. A film is grown in the cavity and thereafter an opening formed by removing a first portion of the strained film until exposing the bottom surface of the substrate while a second portion of the strained film adjoins the STI sidewall. Another epitaxial layer is then grown in the opening.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: October 9, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Hsien Wu, Chih-Hsin Ko, Clement Hsingjen Wann
  • Patent number: 9997486
    Abstract: An anisotropic conductive film has a first connection layer and a second connection layer formed on surface of the first connection layer. The first connection layer is a photopolymerized resin layer, and the second connection layer is a thermo- or photo-cationically, anionically, or radically polymerizable resin layer. On the surface of first connection layer on the side of second connection layer, conductive particles for anisotropic conductive connection are arranged in a single layer. A region in which the curing ratio is lower than that of the surface of the first connection layer exists in a direction oblique to the thickness direction of the first connection layer. Alternatively, the curing ratio of a region relatively near another surface of the first connection layer among regions of the first connection layer in the vicinity of the conductive particles is lower than that of the surface of the first connection layer.
    Type: Grant
    Filed: February 3, 2015
    Date of Patent: June 12, 2018
    Assignee: DEXERIALS CORPORATION
    Inventors: Yasushi Akutsu, Reiji Tsukao
  • Patent number: 9917148
    Abstract: The present invention is notably directed to a method of fabrication of a microfluidic chip (1), comprising: providing (S10-S20) a wafer (10, 12) of semiconductor material having a diamond cubic crystal structure, exhibiting two opposite main surfaces (S1, S2), one on each side of the wafer, and having, each, a normal in the <100> or <110> direction; and performing (S30) self-limited, anisotropic wet etching steps on each of the two main surfaces on each side of the wafer, to create a via (20, 20a) extending transversely through the thickness of the wafer, at a location such that the resulting via connects an in-plane microchannel (31) on a first one (S1) of the two main surfaces to a second one (S2) of the two main surfaces, the via exhibiting slanted sidewalls (20s) as a result of the self-limited wet etching. The invention further concerns microfluidic chips accordingly obtained.
    Type: Grant
    Filed: November 5, 2015
    Date of Patent: March 13, 2018
    Assignee: International Business Machines Corporation
    Inventors: Emmanuel Delamarche, Bilge Eker, Yuksel Temiz
  • Patent number: 9793137
    Abstract: A method for patterning topography is provided. A substrate is provided with a plurality of lines. The method includes aligning and preparing a first directed self-assembly (DSA) pattern overlying the lines, transferring the first pattern to form first line cuts, aligning and preparing a second DSA pattern overlying the lines, and transferring the second pattern to form second line cuts. The DSA patterns include trenches and holes of diameter d, and each comprise a block copolymer having HCP morphology, a characteristic dimension Lo approximately equal to the line pitch, and a minority phase of the diameter d. The trenches are wet by a majority phase of the block copolymer and guide formation of the holes. The aligning and preparation of the DSA patterns include overlapping the two sets of trenches such that areas between holes of one pattern and adjacent holes of the other pattern are shared by adjacent trenches.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: October 17, 2017
    Assignee: Tokyo Electron Limited
    Inventors: Mark H. Somervell, Benjamen M. Rathsack
  • Patent number: 9673296
    Abstract: A semiconductor structure including a semiconductor wafer. The semiconductor wafer includes a gate structure, a first trench in the semiconductor wafer adjacent to a first side of the gate structure and a second trench adjacent to a second side of the gate structure, the first and second trenches filled with a doped epitaxial silicon to form a source in the filled first trench and a drain in the filled second trench such that each of the source and drain are recessed and have an inverted facet. In a preferred exemplary embodiment, the epitaxial silicon is doped with boron.
    Type: Grant
    Filed: November 10, 2015
    Date of Patent: June 6, 2017
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Thomas N. Adam, Kangguo Cheng, Ali Khakifirooz, Jinghong Li, Alexander Reznicek
  • Patent number: 9548242
    Abstract: The invention provides a fast, scalable, room temperature process for fabricating metallic nanorods from nanoparticles or fabricating metallic or semiconducting nanorods from carbon nanotubes suspended in an aqueous solution. The assembled nanorods are suitable for use as nanoscale interconnects in CMOS-based devices and sensors. Metallic nanoparticles or carbon nanotubes are assembled into lithographically patterned vias by applying an external electric field. Since the dimensions of nanorods are controlled by the dimensions of vias, the nanorod dimensions can be scaled down to the low nanometer range. The aqueous assembly process is environmentally friendly and can be used to make nanorods using different types of metallic particles as well as semiconducting and metallic nanotubes.
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: January 17, 2017
    Assignee: Northeastern University
    Inventors: Ahmed Busnaina, Cihan Yilmaz, TaeHoon Kim, Sivasubramanian Somu
  • Patent number: 9337362
    Abstract: A method for forming a conductive feature. The method includes providing a substrate and providing a conductive composition. The conductive composition includes metal particles, a non-acid protic solvent, and a high polarity solvent. The non-acid protic solvent and high polarity solvent are present in concentrations sufficient to ionize the non-acid protic solvent and remove oxides when heated. The method further includes heating the composition to a temperature less than about 250° C. to form a conductive feature having less than about ten times the resistivity of bulk copper.
    Type: Grant
    Filed: October 7, 2011
    Date of Patent: May 10, 2016
    Assignee: Air Products and Chemicals, Inc.
    Inventor: Chun Christine Dong
  • Publication number: 20150137331
    Abstract: Methods for fabricating sublithographic, nanoscale microstructures in line arrays utilizing self-assembling block copolymers, and films and devices formed from these methods are provided. Semiconductor structures may include self-assembled block copolymer materials in the form of lines of half-cylinders of a minority block matrix of a majority block of the block copolymer. The lines of half-cylinders may be within trenches in the semiconductor structures.
    Type: Application
    Filed: January 26, 2015
    Publication date: May 21, 2015
    Inventors: Dan B. Millward, Donald L. Westmoreland
  • Publication number: 20150070598
    Abstract: There are provided a cover window including: a first glass panel; a printed portion formed in a concave part of one surface of the first glass panel; and a second glass panel bonded to one surface of the first glass panel, a manufacturing method thereof, and a touchscreen including the same.
    Type: Application
    Filed: November 14, 2013
    Publication date: March 12, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Hun KIM, Seong Ho Kim, Jin Uk Lee
  • Publication number: 20150064492
    Abstract: The present disclosure provides materials exhibiting improved properties arising from a surface treatment thereof. In particular, thin films can be provided with a patterned surface, the patterned thin films exhibiting improved properties such as in relation to coercivity, mechanical coupling, and magnetic coupling. The disclosure further provides layered composites comprising one or more patterned thin films. The disclosure also provides methods of forming patterned thin films.
    Type: Application
    Filed: August 28, 2014
    Publication date: March 5, 2015
    Inventors: Goran Rasic, Justin Schwartz
  • Patent number: 8967992
    Abstract: Imprint lithography templates having alignment marks with highly absorptive material. The alignment marks are insensitive to the effects of liquid spreading and can provide stability and increase contrast to alignment system during liquid imprint filling of template features.
    Type: Grant
    Filed: April 25, 2012
    Date of Patent: March 3, 2015
    Assignees: Canon Nanotechnologies, Inc., Molecular Imprints, Inc.
    Inventors: Niyaz Khusnatdinov, Kosta S. Selinidis, Joseph Michael Imhof, Dwayne L. LaBrake
  • Publication number: 20150017391
    Abstract: The invention relates to a method for manufacturing a molded article from a first rubber polymer, which molded article comprises an insert from a second rubber polymer. The method comprises the steps of (A) providing an at least partially vulcanized article from the first rubber polymer, the article having a recess that extends in a depth direction and in transverse directions perpendicular to the depth direction, for accommodating the insert; (B) providing an at least partially vulcanized insert from the second rubber polymer, the insert having a shape such that it can be accommodated in the recess; (C) arranging an unvulcanized object from a third rubber polymer in the recess to partly fill the recess; (C) arranging the at least partly vulcanized insert in the recess to obtain an assembly; and (D) vulcanizing the assembly under pressure. The method yields a molded article having an optically sharp interface between the first rubber polymer and the insert.
    Type: Application
    Filed: July 9, 2014
    Publication date: January 15, 2015
    Inventors: Louis-Philippe Antoine Eugene Maria REUVEKAMP, Gerard NIJMAN
  • Publication number: 20140356584
    Abstract: A transparent conductive film includes: a substrate having a first surface and a second surface opposite to the first surface; a first grid groove, defined in the first surface of the substrate, the bottom of the first grid groove being of non-planar structure; and a first conductive layer, including a first conductive grid made of a conductive material filled in the first grid groove. Since the bottom of the first grid groove is not planar, it is beneficial to releasing tension as the liquid conductive material contacts the bottom of the first grid groove, so as to avoid the liquid conductive material shrinking into a plurality of spherical or near-spherical structures due to large tension, thereby reducing probability of the conductive material being formed as a plurality of spaced spherical or near-spherical structures after sintered, improving connectivity inside the conductive material, and guaranteeing conductivity of the transparent conductive film.
    Type: Application
    Filed: April 21, 2014
    Publication date: December 4, 2014
    Applicants: NANCHANG O-FILM TECH CO., LTD., SUZHOU O-FILM TECH CO., LTD., SHENZHEN O-FILM TECH CO., LTD.
    Inventors: YUNLIANG YANG, Lidong Liu, Chuanxin Cheng, Tao Xu
  • Patent number: 8877320
    Abstract: A microfluidic device comprising: a substrate having a microfluidic channel, an electrically conductive feature comprising an electrically conductive layer arranged on a primer layer and positioned with reference to the microfluidic channel, wherein the primer layer comprises: (i) an organic polymer selected from the group consisting of. (a) a homopolymer or copolymer including a vinyl lactam repeating unit, (b) a cellulose ether; (c) polyvinyl alcohol; and (d) unmodified or modified gelatin; and (ii) a porous particulate material, the organic polymer being dispersed in the porous particulate material, is provided. Methods for manufacturing the microfluidic devices and their use in a number of applications are also provided.
    Type: Grant
    Filed: February 17, 2012
    Date of Patent: November 4, 2014
    Assignee: Sony DADC Austria AG
    Inventors: Andrew John Naisby, Miguel Angel Torello Arevalo, Josef Kugler, Wolfgang Franz Reiter
  • Publication number: 20140262452
    Abstract: A method of making an embossed micro-structure includes providing a transfer substrate, an emboss substrate, and an embossing stamp having one or more stamp structures. Transfer material is coated on the transfer substrate. The transfer material on the transfer substrate is contacted with the stamp structures to adhere transfer material to the stamp structures. A curable emboss layer is coated on the emboss substrate. The stamp structures and adhered transfer material are contacted to the curable emboss layer on the emboss substrate to emboss a micro-structure in the curable emboss layer and transfer the transfer material to the embossed micro-structure. The curable emboss layer is cured to form a cured emboss layer having embossed micro-structures corresponding to the stamp structures and having transfer material in the embossed micro-structures. The stamp structures is removed from the cured emboss layer, substantially leaving the transfer material in the micro-structure.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Inventors: RONALD STEVEN COK, Shelby Forrester Nelson
  • Publication number: 20140199523
    Abstract: The present disclosure describes an article and a method of forming a microstructure. The method includes providing a substrate having a structured surface region comprising one or more recessed features with recessed surfaces. The structured surface region is substantially free of plateaus. The method includes disposing a fluid composition comprising a functional material and a liquid onto the structured surface region. The method includes evaporating liquid from the fluid composition. The functional material collects on the recessed surfaces such that a remainder of the structured surface region is substantially free of the functional material.
    Type: Application
    Filed: March 18, 2014
    Publication date: July 17, 2014
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Matthew S. Stay, Mikhail L. Pekurovsky, Cristin E. Moran, Matthew H. Frey
  • Patent number: 8771848
    Abstract: A bit patterned magnetic recording medium, comprises a non-magnetic substrate having a surface; a plurality of spaced apart magnetic elements on the surface, each of the elements constituting a discrete magnetic domain or bit; and a layer of a ferromagnetic material for regulating magnetic exchange coupling between said magnetic elements. The layer has a saturation magnetization Ms ranging from about 1 to about 2,000 emu/cm3, preferably below about 400 emu/cm3, more preferably below about 200 emu/cm3, and may overlie, underlie, or at least partially fill spaces between adjacent magnetic elements.
    Type: Grant
    Filed: October 10, 2006
    Date of Patent: July 8, 2014
    Assignee: Seagate Technology LLC
    Inventors: Erol Girt, Hans J. Richter, Alexander Y. Dobin
  • Patent number: 8741420
    Abstract: A component is disclosed. The component comprises a substrate comprising an outer surface and an inner surface, where the inner surface defines at least one hollow, interior space, where the outer surface defines one or more grooves, and where each of the one or more grooves extends at least partially along the surface of the substrate and has a base. One or more access holes extend through the base of a respective groove to place the groove in fluid communication with respective ones of the at least one hollow interior space. The component further comprises a coating disposed over at least a portion of the substrate surface, where the coating comprises one or more layers. At least one of the layers defines one or more permeable slots, such that the respective layer does not completely bridge each of the one or more grooves. The grooves and the coating together define one or more channels for cooling the component.
    Type: Grant
    Filed: December 5, 2013
    Date of Patent: June 3, 2014
    Assignee: General Electric Company
    Inventors: Ronald Scott Bunker, Dennis Michael Gray, Don Mark Lipkin
  • Patent number: 8741417
    Abstract: Compositions, structures and methods that relate to films having switchable reflectivity and anti-reflectivity depending on ambient conditions, such as temperature. A film with switchable reflectivity and anti-reflectivity includes a nanostructured first layer having nanopillars associated with nanowells. A hydrogel occupies at least a portion of the nanowells. As the hydrogel moves from a dehydrated state to a hydrated state, the surface of the film switches from being reflective to being anti-reflective in a repeatable and reversible process.
    Type: Grant
    Filed: April 16, 2010
    Date of Patent: June 3, 2014
    Assignee: Korea University Research and Business Foundation
    Inventors: Kwangyeol Lee, Donghoon Choi
  • Patent number: 8741421
    Abstract: A process for the manufacturing of a decorative surface element, which element comprises a base layer and a decorative upper surface. A radiation curing lacquer is printed in a predetermined pattern as an uppermost layer on the decorative upper surface. The radiation curing lacquer covers only parts of the decorative upper surface whereby the lacquer is exposed to radiation whereby it cures. A surface structure is hereby achieved.
    Type: Grant
    Filed: May 2, 2005
    Date of Patent: June 3, 2014
    Assignee: Pergo (Europe) AB
    Inventors: Krister Hansson, Johan Lundgren, Hakan Wernersson
  • Patent number: 8743546
    Abstract: The sheet structure includes a plurality of linear structure bundles 12 each of which comprises a plurality of linear structures of carbon atoms arranged, spaced from each other at a first gap and which are arranged at a second gap which is larger than the first gap; and a filling layer 14 filled in the first gap and the second gap and supporting the plurality of linear structure bundles 12.
    Type: Grant
    Filed: October 21, 2008
    Date of Patent: June 3, 2014
    Assignee: Fujitsu Limited
    Inventors: Taisuke Iwai, Daiyu Kondo, Yoshitaka Yamaguchi, Ikuo Soga, Shinichi Hirose
  • Publication number: 20140147622
    Abstract: A sandwich-type, structural, composite panel having a pattern of depressions formed at a lower outer surface thereof and stiffening supports received and retained therein is provided. The panel includes a first outer layer having a first outer surface, a second outer layer having a second outer surface and a core positioned between the outer layers and having a large number of cavities. The outer layers are bonded to the core by press molding. Crushed portions of the panel having a reduced thickness form the pattern of depressions at the second outer surface of the second outer layer. The stiffening supports are bonded or joined to the second outer layer within the pattern of depressions. The stiffening supports are sized, shaped and arranged within the pattern of depressions to provide the panel with strength to resist deflection from a load at various positions and orientations at the first outer surface.
    Type: Application
    Filed: February 8, 2013
    Publication date: May 29, 2014
    Applicant: GLOBAL IP HOLDINGS, LLC
    Inventors: Darius J. Preisler, Christopher A. Heikkila
  • Publication number: 20140140647
    Abstract: A high strength, low friction engineered material includes a low friction material filling interstices of a metal microlattice. The metal typically comprises 5 volume % to 25 volume % and the interstices typically comprise 75 volume % to 95 volume %, based on the total volume of the metal microlattice and the interstices. The low friction material preferably fills 100 volume % of the interstices. The metal microlattice can be formed of a single layer, or multiple layers, for example layers of nickel, copper, and tin. The low friction material is typically a polymer, such as polytetrafluoroethylene (PTFE), polyamide (PAI), polyetheretherketone (PEEK), polyethylene (PE), or polyoxymethylene (POM). The low friction material can also include additive particles to modify the material properties. The engineered material can be used in various automotive applications, for example as a bearing, or non-automotive applications.
    Type: Application
    Filed: November 20, 2013
    Publication date: May 22, 2014
    Applicant: Federal-Mogul Corporation
    Inventor: David Saxton
  • Patent number: 8696849
    Abstract: A novel reinforcement system for maximizing tensile strength and modulus of elasticity per ply for composite systems has one or more pockets with a first pocket edge, a second pocket edge, a pocket front surface, and a pocket rear surface. The pocket front surface and the pocket rear surface each have a pocket cross-stitch that perpendicularly traverses the pocket. The pocket traverses the fabric parallel and adjacent to the first fabric edge and the second fabric edge in a warp, or 0 degree, or x-axis direction. The pockets contain one or more fiber tows with a plurality of filaments in a stack.
    Type: Grant
    Filed: December 21, 2011
    Date of Patent: April 15, 2014
    Inventor: James J. Butler
  • Publication number: 20140057131
    Abstract: A metal/ceramic bonding substrate includes: a ceramic substrate; a metal plate bonded directly to one side of the ceramic substrate; a metal base plate bonded directly to the other side of the ceramic substrate; and a reinforcing member having a higher strength than that of the metal base plate, the reinforcing member being arranged so as to extend from one of both end faces of the metal base plate to the other end face thereof without interrupting that the metal base plate extends between a bonded surface of the metal base plate to the ceramic substrate and the opposite surface thereof.
    Type: Application
    Filed: March 29, 2011
    Publication date: February 27, 2014
    Applicant: DOWA METALTECH CO., LTD.
    Inventors: Hideyo Osanai, Takayuki Takahashi, Satoru Ideguchi, Hirotaka Kotani
  • Publication number: 20140023832
    Abstract: Building panels, especially floor panels, and a method of forming embossed in register surfaces with a digital ink head that applies a curable ink on the panel surface or on an upper side of a foil as a coating and forms an ink matrix that is used to create a cavity in the surface by applying a pressure on the ink matrix.
    Type: Application
    Filed: July 12, 2013
    Publication date: January 23, 2014
    Applicant: FLOOR IPTECH AB
    Inventors: Darko PERVAN, Tony Pervan
  • Publication number: 20140004310
    Abstract: Methods of fabricating coated components using multiple types of fillers are provided. One method comprises forming one or more grooves in an outer surface of a substrate. Each groove has a base and extends at least partially along the outer surface of the substrate. The method further includes disposing a sacrificial filler within the groove(s), disposing a permanent filler over the sacrificial filler, disposing a coating over at least a portion of the substrate and over the permanent filler, and removing the first sacrificial filler from the groove(s), to define one or more channels for cooling the component. A component with a permanent filler is also provided.
    Type: Application
    Filed: September 4, 2013
    Publication date: January 2, 2014
    Applicant: General Electric Company
    Inventors: Raul Basilio Rebak, Renee Bushey Rohling, Scott Andrew Weaver, Ronald Scott Bunker, Don Mark Lipkin, Lawrence Bernard Kool
  • Publication number: 20130337236
    Abstract: A method for growing elongated nanostructures (7) only on the bottom (3) of a recessed structure (4), the method comprising: a. providing a substrate (5) comprising said recessed structure (4), said recessed structure (4) comprising: said bottom (3), and at least one sidewall (6), b. modifying the chemical nature of the surface of said at least one sidewall (6) so that said at least one sidewall (6) has a lower affinity than said bottom (3) for a catalyst film (2), c. providing said catalyst film (2) onto said bottom (3), d. thermally and/or plasma treating said film (2) so as to form said catalyst nanoparticles (1), and e. growing elongated nanostructures (7) in said recessed structure (4) using the catalyst nanoparticles (1).
    Type: Application
    Filed: June 14, 2013
    Publication date: December 19, 2013
    Inventors: Daire J. Cott, Silvia Armini
  • Publication number: 20130316150
    Abstract: The invention is directed to a method of positioning nanoparticles on a patterned substrate. The method comprises providing a patterned substrate with selectively positioned recesses, and applying a solution or suspension of nanoparticles to the patterned substrate to form a wetted substrate. A wiper member is dragged across the surface of the wetted substrate to remove a portion of the applied nanoparticles from the wetted substrate, and leaving a substantial number of the remaining portion of the applied nanoparticles disposed in the selectively positioned recesses of the substrate. The invention is also directed to a method of making carbon nanotubes from the positioned nanoparticles.
    Type: Application
    Filed: May 13, 2013
    Publication date: November 28, 2013
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: INTERNATIONAL BUSINESS MACHINES CORPORATION
  • Publication number: 20130285214
    Abstract: Methods for fabricating sublithographic, nanoscale microstructures in line arrays utilizing self-assembling block copolymers, and films and devices formed from these methods are provided. Semiconductor structures may include self-assembled block copolymer materials in the form of lines of half-cylinders of a minority block matrix of a majority block of the block copolymer. The lines of half-cylinders may be within trenches in the semiconductor structures.
    Type: Application
    Filed: June 27, 2013
    Publication date: October 31, 2013
    Inventors: Dan B. Millward, Donald L. Westmoreland
  • Patent number: 8541093
    Abstract: A method for high resolution ink-jet print using a pre-patterned substrate employs an ink-jet printing device including an ink-jet head for discharging conductive ink droplets and a driving stage for supporting a substrate to which the conductive ink droplets are hit, to draw a fine line width pattern on the substrate. The method includes (A) forming a stripe pattern with repeated stripes on a substrate surface on which a fine line width pattern will be formed, thereby preparing a pre-patterned substrate; (B) loading the substrate to the ink-jet printing device; and (C) injecting conductive ink droplets to a substrate region where the stripe pattern is formed. An equivalent interval (d) of the stripe pattern and a fine line width (D) of the drawn fine line width pattern satisfy a relation of d<<D, and the hit ink droplets are flowed in an anisotropic form within the region.
    Type: Grant
    Filed: January 19, 2012
    Date of Patent: September 24, 2013
    Assignee: LG Chem, Ltd.
    Inventors: Tae-Su Kim, Jae-Jin Kim, Bu-Gon Shin, Duk-Sik Ha, Jung-Ho Park
  • Patent number: 8535783
    Abstract: An article has a metallic substrate. The substrate has a first surface region and a plurality of blind recesses along the first surface region. The substrate has perimeter lips at the openings of the plurality of recesses and extending partially over the respective associated recesses. A ceramic coating is along the first surface region.
    Type: Grant
    Filed: June 8, 2010
    Date of Patent: September 17, 2013
    Assignee: United Technologies Corporation
    Inventors: Paul M. Lutjen, Christopher W. Strock
  • Patent number: 8535794
    Abstract: Device, especially a piece of sporting equipment for use in surfing or similar activities, includes a base made of foamed plastic, which has at least one laminate coating made of a fabric laminate and an underlay compound. The device includes an intermediate layer between the base and the laminate coating. Likewise provided are a number of processes for producing fiber composites in connection with foamed plastics.
    Type: Grant
    Filed: January 30, 2006
    Date of Patent: September 17, 2013
    Inventors: Sven Brauers, Rouven Brauers
  • Patent number: 8518509
    Abstract: A decorative glass panel, and a method of production thereof, is provided for a door or window, and comprises a flat glass panel having an outer surface, an inner surface, and a thickness. A prescribed pattern is formed in at least the outer surface of the flat glass panel, the prescribed pattern including at least one substantially V-shaped groove. Each groove so formed has a width of between 9.0 mm and 19.5 mm and a depth of between 0.5 mm and 1.5 mm. An air-curable resin is applied within each substantially V-shaped groove forming the prescribed pattern.
    Type: Grant
    Filed: July 19, 2010
    Date of Patent: August 27, 2013
    Assignee: Glass Unlimited of High Point, Inc.
    Inventors: Terry L. Gajtka, Jr., Tina M. Robinson
  • Publication number: 20130189497
    Abstract: Nano-scale structures are provided wherein nano-structures are formed on a substrate surface and a base material is applied between the nano-structures.
    Type: Application
    Filed: October 13, 2011
    Publication date: July 25, 2013
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Peter Mardilovich, Qingqiao Wei, Anthony M. Fuller
  • Patent number: 8465829
    Abstract: The invention is directed to a method of positioning nanoparticles on a patterned substrate. The method comprises providing a patterned substrate with selectively positioned recesses, and applying a solution or suspension of nanoparticles to the patterned substrate to form a wetted substrate. A wiper member is dragged across the surface of the wetted substrate to remove a portion of the applied nanoparticles from the wetted substrate, and leaving a substantial number of the remaining portion of the applied nanoparticles disposed in the selectively positioned recesses of the substrate. The invention is also directed to a method of making carbon nanotubes from the positioned nanoparticles.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: June 18, 2013
    Assignee: International Business Machines Corporation
    Inventors: Charles T. Black, Christopher B. Murray, Robert L. Sandstrom
  • Publication number: 20130141079
    Abstract: Disclosed herein are a substrate and a method for manfuacturing the same, and a probe card employing the substrate as a space transformer, the substrate including: a substrate body; a key forming groove formed in one surface of the substrate body; and an alignment key formed on the key forming groove. According to the present invention, the recognition rate of the alignment key formed on the substrate can be increased, resulting in improved accuracy in a micro electro mecanical system (MEMS) process for forming micro probes on the substrate, thereby improving productivity and reliability of the substrate and the probe card incluing the same.
    Type: Application
    Filed: May 29, 2012
    Publication date: June 6, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD
    Inventors: Gyu Man HWANG, Ji Hwan Shin
  • Publication number: 20130129986
    Abstract: Techniques or processes for providing markings on products are disclosed. The markings provided on products can be textual and/or graphic. The techniques or processes can provide high resolution markings on surfaces that are flat or curved. In one embodiment, the products have housings and the markings are to be provided on the housings. For example, the housing for a particular product can include an outer housing surface and the markings can be provided on the outer housing surface.
    Type: Application
    Filed: January 22, 2013
    Publication date: May 23, 2013
    Applicant: Apple Inc.
    Inventor: Apple Inc.
  • Publication number: 20130122257
    Abstract: An apparatus includes a substrate having a top surface, a substantially regular array of raised structures located over the top surface, and a layer located on the top surface between the structures. Distal surfaces of the structures are farther from the top surface than remaining portions of the structures. The layer is able to contract such that the distal surfaces of the structures protrude through the layer. The layer is able to swell such that the distal surfaces of the structures are closer to the top surface of the substrate than one surface of the layer.
    Type: Application
    Filed: January 10, 2013
    Publication date: May 16, 2013
    Applicant: Alcatel-Lucent USA Inc.
    Inventor: Alcatel-Lucent USA Inc.
  • Publication number: 20130122243
    Abstract: We provide a cushioned mat with anti-fatigue qualities. In one embodiment the mat includes a PVC base layer reinforced by a polyester layer and having an indentation that holds a woven PVC fabric insert. Glue is applied to the insert and/or the base layer, which is then heat-pressed to complete and enhance the bond.
    Type: Application
    Filed: November 11, 2011
    Publication date: May 16, 2013
    Inventor: Lois Griffin
  • Patent number: 8426058
    Abstract: A metal-resin composite comprises a metal substrate with concavities in the surface, a first coating layer on the surface of the metal substrate, a second coating layer on the first coating layer, and a third coating layer on the second coating layer. The first coating layer fills the concavities and covers the surface of the substrate.
    Type: Grant
    Filed: June 16, 2010
    Date of Patent: April 23, 2013
    Assignee: BYD Co. Ltd.
    Inventors: Qing Gong, Liang Zhou, Xinkun Lv
  • Publication number: 20130068410
    Abstract: The invention enables thin film particles of a controlled shape and size to be generated directly upon release of a thin film coating from a textured Substrate upon which they are grown directly. The substrate comprises an array of discrete, steep sided plateaus of a selected size and shape, from which discrete particles of a corresponding shape and size are releasable usually by means of an intermediate release layer coating on the plateaus. The process is readily scalable for high volume production and permits monomodal or multimodal particle size distributions. Such particles may be used as specialised pigments in the security, anti-counterfeiting, defence and cosmetics industries.
    Type: Application
    Filed: August 20, 2010
    Publication date: March 21, 2013
    Applicant: QINETIQ LIMITED
    Inventors: David Edward Higgins, Peter Gerald Lederer, Andrew Martin Pitt, Siân Donohue
  • Publication number: 20130011626
    Abstract: There is provided a process for forming a laminated structure, the process comprising the step of bonding a polymer film to an array of structures disposed on a substrate, and wherein a plurality of cavities are formed between the polymer film and the array of structures during the bonding.
    Type: Application
    Filed: March 15, 2011
    Publication date: January 10, 2013
    Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
    Inventors: Jarrett Dumond, Hong Yee Low
  • Patent number: 8268427
    Abstract: A display sheet includes a substrate; front-side and rear-side synthetic resin composition layers formed on front and rear surfaces, respectively, of the substrate; and an ink layer formed by ink-jet on the front-side synthetic resin composition layer. The substrate is made of sailcloth having projections and depressions on front and rear surfaces thereof. A surface of the front-side synthetic resin composition layer is formed on an irregular surface having projections and depressions attributed to the projections and depressions of the surface of the substrate. The ink layer is formed by causing a fine ink to cover the projections and permeate the depressions.
    Type: Grant
    Filed: December 17, 2008
    Date of Patent: September 18, 2012
    Assignee: Koyo Sangyo Co., Ltd.
    Inventors: Tsumoru Nomura, Senichirou Araki, Yasuyo Omori, Naomi Kuwakubo, Atsushi Nagakura, Soichi Funayama
  • Publication number: 20120231229
    Abstract: An injection molding mold 1 comprises: a mold body 21 in which a through hole 313 which communicates with a cavity 4 is formed; a tubular member 331 which is engaged with the through hole 313; and an insertion member 332 which is inserted into the tubular member 331 with a predetermined clearance C1. The first end face 331d of the tubular member 331 and the second end face 332a of the insertion member 332 stick out from the cavity surface 312a defining the cavity 4.
    Type: Application
    Filed: May 23, 2012
    Publication date: September 13, 2012
    Applicant: FUJIKURA LTD.
    Inventor: Koichi YANO
  • Publication number: 20120213975
    Abstract: A microfluidic device comprising: a substrate having a microfluidic channel, an electrically conductive feature comprising an electrically conductive layer arranged on a primer layer and positioned with reference to the microfluidic channel, wherein the primer layer comprises: (i) an organic polymer selected from the group consisting of. (a) a homopolymer or copolymer including a vinyl lactam repeating unit, (b) a cellulose ether; (c) polyvinyl alcohol; and (d) unmodified or modified gelatin; and (ii) a porous particulate material, the organic polymer being dispersed in the porous particulate material, is provided. Methods for manufacturing the microfluidic devices and their use in a number of applications are also provided.
    Type: Application
    Filed: February 17, 2012
    Publication date: August 23, 2012
    Applicant: SONY DADC Austria AG
    Inventors: Andrew John NAISBY, Miguel Angel TORELLO AREVALO, Josef KUGLER, Wolfgang Franz REITER