Abstract: A transaction card, and processes for the manufacture thereof, having a core layer, optionally, one or more layers or coatings over the core layer, and at least one of a magnetic stripe, a machine readable code, and a payment module chip disposed in or on the card and suitable for rendering the card operable for conducting a transaction. The core layer comprises a metal-doped cured epoxy comprised of metal particles distributed in a binder consisting essentially of a cured, polymerized epoxy resin, the core comprising greater than 50%, preferably greater than 75%, and more preferably greater than 90%, of the weight and/or volume of the card. In some embodiments, the core includes a metal insert enveloped with the metal-doped curable epoxy, wherein the periphery of the epoxy extends beyond the periphery of the metal insert and has material properties more conducive to cutting or punching than the metal insert.

Abstract: Glass-based articles comprise high effective fracture toughness. Glass-based articles comprise: a glass-based substrate comprising opposing first and second surfaces defining a substrate thickness (ts), a substantially planar central portion, and a perimeter portion; a polymer coating disposed on at least a portion of at least one of the first or the second surfaces; and an effective fracture toughness that is greater than or equal to 1.25 MPa·m0.5 as measured at room temperature.

Abstract: Described herein is a process for preparing a flexible packaging material. The process may comprise: providing a printed first flexible substrate comprising an ink composition on a surface of a first flexible substrate, the ink composition comprising a first thermoplastic resin; depositing a further composition comprising a cross-linker, a white pigment and a second thermoplastic resin onto the printed ink composition such that the thermoplastic resin of the ink composition is cross-linked; and laminating the first flexible substrate with a second flexible substrate such that the ink composition, the further composition and the cross-linker are disposed between the first and second flexible substrates.

Abstract: The present invention relates to a glass for chemical strengthening including, in mole percentage on an oxide basis: 45 to 75% of SiO2; 1 to 30% of Al2O3; 1 to 20% of Li2O; 0 to 5% of Y2O3; 0 to 5% of ZrO2; and 0 to 1% of TiO2, having a total content of one or more kinds of MgO, CaO, SrO, BaO and ZnO of 1 to 20%, having a total content of Na2O and K2O of 0 to 10%, having a total content of B2O3 and P2O5 of 0 to 10%, and having a value M expressed by the following expression of 1,000 or more: M=?5×[SiO2]+121×[Al2O3]+50×[Li2O]?35×[Na2O]+32×[K2O]+85×[MgO]+54×[CaO]?41×[Sr O]?4×[P2O5]+218×[Y2O3]+436×[ZrO2]?1180, in which each of [SiO2], [Al2O3], [Li2O], [Na2O], [K2O], [MgO], [CaO], [SrO], [P2O5], [Y2O3], and [ZrO2] designates a content of each component in mole percentage on an oxide basis.

Abstract: Provided is a dielectric ceramic composition comprising a main component of forsterite and calcium strontium titanate. A content ratio of forsterite in the main component is from 84.0 to 92.5 parts by mole, and a content ratio of calcium strontium titanate is from 7.5 to 16.0 parts by mole. (Sr+Ca)/Ti in the calcium strontium titanate is from 1.03 to 1.20 in terms of a molar ratio. With respect to a total of 100 parts by mass of the main component and a subcomponent except for Li-containing glass, from 2 to 10 parts by mass of Li-containing glass is added. The Li-containing glass includes Al2O3 in an amount of from 1% by mass to 10% by mass.

Abstract: A spark plug that prevents a decrease in strength of a member to which a mark is attached while ensuring a readability of the mark, and a method of manufacturing the spark plug. The spark plug is configured to ignite an air-fuel mixture in an internal combustion engine. The spark plug includes: a mark formed of an oxide film generated on a surface of a metallic member or is formed of the metallic member and the oxide film; and a coating material covering the whole mark and allowing transmission of light.

Abstract: A method for manufacturing a three-dimensional shaped object includes a structure shaping step of supplying a shaping material including metal powder or ceramic powder, and supplying a binder to a region corresponding to a structure S of the three-dimensional shaped object to be shaped in the shaping material (step S140), a support shaping step of shaping, with a support material including a resin, a support T supporting the structure S (step S130), and a degreasing step of degreasing the support T and the binder, the support T being in a state of supporting the structure S (step S200).

Abstract: An article that includes: a glass-based substrate comprising opposing major surfaces; a crack mitigating composite over one of the major surfaces, the composite comprising an inorganic element and a polymeric element; and a hard film disposed on the crack mitigating composite comprising an elastic modulus greater than or equal to the elastic modulus of the glass-based substrate. The crack mitigating composite is characterized by an elastic modulus of greater than 30 GPa. Further, the hard film comprises at least one of a metal-containing oxide, a metal-containing oxynitride, a metal-containing nitride, a metal-containing carbide, a silicon-containing polymer, a carbon, a semiconductor, and combinations thereof.

Abstract: A powder mixture including spherical barium titanate particles and spherical oxide particles and having an average particle diameter of 2 ?m or more and 30 ?m or less, wherein the spherical oxide particles have an average particle diameter of 0.05 ?m or more and 1.5 ?m or less, and the spherical oxide particles are contained in an amount of 0.02% by mass or more and 15% by mass or less based on the powder mixture. The spherical oxide particles are preferably amorphous silicon dioxide particles and/or aluminum oxide particles. According to the present invention, it is possible to provide a spherical barium titanate-based powder which enables to prepare a high dielectric resin composition with which reduced wire sweep amount and burr are achieved.

Abstract: A method for manufacturing a singulated feedthrough insulator for a hermetic seal of an active implantable medical device (AIMD) is described. The method begins with forming a green-state ceramic bar with a via hole filled with a conductive paste. The green-state ceramic bar is dried to convert the paste to an electrically conductive material filling via hole and then subjected to a pressing step. Following pressing, a green-state insulator is singulated from the green-state ceramic bar. The singulated green-state insulator in next sintered to form an insulator that is sized and shaped for hermetically sealing to close a ferrule opening. The thusly produced feedthrough is suitable installation in an opening in the housing of an active implantable medical device.

Abstract: The invention relates to a method for producing ceramics having piezoelectric properties in predominantly aqueous suspending agents.

Abstract: A powder mixture including spherical barium titanate particles and spherical oxide particles and having an average particle diameter of 2 ?m or more and 30 ?m or less, wherein the spherical oxide particles have an average particle diameter of 0.05 ?m or more and 1.5 ?m or less, and the spherical oxide particles are contained in an amount of 0.02% by mass or more and 15% by mass or less based on the powder mixture. The spherical oxide particles are preferably amorphous silicon dioxide particles and/or aluminum oxide particles. According to the present invention, it is possible to provide a spherical barium titanate-based powder which enables to prepare a high dielectric resin composition with which reduced wire sweep amount and burr are achieved.

Abstract: A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material. A method for producing a laminate material using the film material using at least one electrically conductive conductor structure, and to the corresponding film material and laminate material are described.

Abstract: A wiring board includes an insulating substrate and a wiring conductor. The insulating substrate includes a first layer having an upper surface and a lower surface and having a first content of aluminum oxide and containing mullite and a second layer stacked on the upper surface and/or the lower surface of the first layer and having a second content of aluminum oxide greater than the first content. The wiring conductor is located inside the first layer and contains a manganese compound and/or a molybdenum compound. A manganese silicate phase and/or a magnesium silicate phase in an interface area between the insulating substrate and the wiring conductor.

Abstract: An object of the present invention is to provide a golf ball having excellent spin performance on approach shots under a wet condition and excellent spin performance on approach shots under a condition that there is grass between the golf ball and the club face.

Abstract: A semiconductor apparatus includes a metal base plate, an upper surface ceramic substrate provided on an upper surface of the metal base plate, a semiconductor device provided on the upper surface ceramic substrate, and a substrate that is provided in the metal base plate and includes an embedded ceramic substrate, an upper surface metal pattern provided on an upper surface of the embedded ceramic substrate, and a lower surface metal pattern provided on a lower surface of the embedded ceramic substrate, wherein a thermal conductivity of the upper surface metal pattern and a thermal conductivity of the lower surface metal pattern are larger than a thermal conductivity of the metal base plate.

Abstract: Substantially equal amounts of thermal energy may be provided over a build area of an additive fabrication device using as few as one heat source by selectively attenuating thermal energy emitted by the heat source. The thermal energy may be selectively attenuated by a structure that blocks portions of the thermal energy from being directly incident upon the build area such that the heat is normalized over the build area. The heat distribution over the build area may, in some embodiments, approximate the heat distribution produced by a flat field heating element, yet may be produced at comparatively lower cost and with less complex engineering.

Abstract: Implementations of the present disclosure include methods and apparatuses utilized to reduce cracking of the substrate support surface of a high temperature electrostatic chuck within a processing chamber. In one implementation, a high temperature electrostatic chuck has a ceramic body. The ceramic body has a workpiece mounting surface and a bottom surface. A plurality of backside gas channels are formed in the workpiece mounting surface. A chucking mesh disposed in the ceramic body has a main chucking portion spaced a first distance from the workpiece mounting surface and an electrode mounting portion spaced a second distance from the workpiece mounting surface, wherein the second distance is greater than the first distance. An electrode is coupled the electrode mounting portion and is accessible from the bottom surface.

Abstract: A method of forming one or more high temperature co-fired ceramic articles, comprising the steps of:— a) forming a plurality of green compacts, by a process comprising dry pressing a powder comprising ceramic and organic binder to form a green compact; b) disposing a conductor or conductor precursor to at least one surface of at least one of the plurality of green compacts to form at least one patterned green compact; c) assembling the at least one patterned green compact with one or more of the plurality of green compacts or patterned green compacts or both to form a laminated assembly; d) isostatically pressing the laminated assembly to form a pressed laminated assembly; e) firing the pressed laminated assembly at a temperature sufficient to sinter the ceramic layers together.

Abstract: The objective of the present invention is to provide a technique that ensures conduction between a gate terminal of a semiconductor switching element and a wiring layer in a semiconductor device formed with a wiring layer inside a ceramic layer. This semiconductor device comprises: a wiring layer that is inside a ceramic layer formed above an insulation layer; and a metal layer for connecting terminals from the semiconductor switching element other than the gate terminal. The wiring layer and the gate terminal from the semiconductor switching element are connected electrically via a connection part formed from a conductive material. The connection part protrudes more than the metal layer toward the semiconductor switching element.

Abstract: An electronic component includes a multilayer body including a first insulator and a second insulator having a higher resistivity than the first insulator, metal conductors each positioned between the first insulator and the second insulator and including a predetermined end surface positioned at least near an end surface of the multilayer body, plating films each provided on the predetermined end surface of the metal conductor in a state extending out in a direction covering an end surface of the first insulator by a larger distance than in a direction covering an end surface of the second insulator, and an outer conductor provided on the outer sides of the plating films and electrically connected to the metal conductor through the plating films.

Abstract: A laminated glazing includes one or two plies of 0.5 to 12 mm thickness, and one or more structural plies of 3 to 20 mm thickness, wherein at least that face of at least one ply of 0.5 to 12 mm thickness which is oriented toward the one or more structural plies and/or at least one face of the latter includes an electrically conductive layer of thickness comprised between 2 and 1600 nm, except on at least one ablation line, the edges of this line having no hem, and their average slope being at most equal to 5%.

Abstract: A method for producing a multilayer ceramic electronic component the includes producing a multilayer sheet having a plurality of multilayer ceramic green sheets and internal electrode patterns respectively arranged along a plurality of interfaces between the ceramic green sheets, and having a first main surface and a second main surface that face each other in a lamination direction thereof; placing, and pressure-bonding under heating, a resin composition onto at least one of the first main surface and the second main surface of the multilayer sheet to produce a mother block having an unfixed protection layer thereon; and cutting the mother block along a first-direction cutting-plane line and a second-direction cutting-plane line that are orthogonal to each other to produce a plurality of green chips. The resin composition includes a resin component having a melting point or a glass transition temperature of lower than 100° C. and inorganic compound particles.

Abstract: Implementations of die singulation systems and related methods may include forming a plurality of die on a first side of a substrate, forming a seed layer on a second side of a substrate opposite the first side of the substrate, using a shadow mask, applying a mask layer over the seed layer, forming a backside metal layer over the seed layer, removing the mask layer, and singulating the plurality of die included in the substrate through removing substrate material in the die street and through removing seed layer material in the die street.

Abstract: A light converting device, comprising: a substrate functioning as a heatsink, a light converter adapted to convert laser light to converted light, wherein a peak emission wavelength of the converted light is in a longer wavelength range than a laser peak emission wavelength of the laser light, the light converter comprises a light entrance surface, a bonding surface opposite to the light entrance surface and at least one side surface, the bonding surface is mechanically and thermally coupled to the substrate, a reflective structure attached to or part of the substrate, wherein the reflective structure comprises at least one reflective metal surface arranged on the side of the substrate facing the light converter to reflect laser light and converted light, and a translucent ceramic protection layer, arranged between the reflective structure and the light converter, and having a thickness of less than 50 ?m.

Abstract: A method of fabricating a semiconductor device is provided. The method may include forming a first interlayer insulating film on a substrate, forming a second interlayer insulating film on the first interlayer insulating film, and forming a third interlayer insulating film on the second interlayer insulating film. Different amounts of carbon may be present in each of the first, second, and third interlayer insulating films. The third interlayer insulating film may be used as a mask pattern to form a via trench that extends at least partially into the first interlayer insulating film and the second interlayer insulating film. Supplying a carbon precursor may be interrupted between the forming of the second and third interlayer insulating films, such that the second interlayer insulating film and the third interlayer insulating film may have a discontinuous boundary therebetween.

Abstract: A piezoelectric PTZT film is formed of a metal oxide having a perovskite structure including Pb, Ta, Zr, and Ti, in which the metal oxide further includes carbon, and a content of the carbon is 80 to 800 ppm by mass. In a process for producing a liquid composition for forming a piezoelectric film, a Ta alkoxide, a Zr alkoxide, ?-diketones, and a diol are refluxed, a Ti alkoxide is added into a first synthesis solution obtained by the refluxing, and then refluxing is performed again, a Pb compound is added into a second synthesis solution obtained by performing the additional refluxing, and then refluxing is performed again, a solvent is removed from a third synthesis solution obtained by performing the additional refluxing, and then, dilution with alcohol is performed, to produce the liquid composition for forming a piezoelectric PTZT film.

Abstract: A build plate unit (400) for a three-dimensional printer includes a build plate (410) having an optically transparent member comprising a flexible, gas permeable, optically transparent sheet (414) having upper and lower opposing sides, wherein the flexible sheet upper side defines the build surface; and a flexible, gas permeable or impermeable, optically transparent base layer (412) on the lower side of the flexible sheet opposite the build region, wherein the build plate is configured to permit gas flow to the build surface.

Abstract: Described herein are various antimicrobial soda lime glass articles that have improved resistance to discoloration when exposed to harsh conditions, including manufacturing conditions. The improved antimicrobial glass articles described herein generally include a SLG substrate that has a thickness, t; a compressive stress layer of about 0.15*t or greater; and an antimicrobial agent-containing region having an antimicrobial agent and a thickness less than the thickness of the compressive stress layer. Roughly 2 to 20 microns of the primary surfaces of the glass substrate can be removed prior to development of the compressive stress and antimicrobial agent-containing region. In some aspects, prior-annealed and tempered, or prior-annealed, SLG is employed as the substrate. In some aspects, the substrate includes tin at one surface. The improved SLG substrates experience substantially no discoloration when exposed to harsh conditions. Methods of making and using the glass articles are also described.

Abstract: Described herein are various methods and manufacturing methods for making antimicrobial and strengthened, antimicrobial glass articles and substrates. The methods described herein generally include contacting the article with a KNO3-containing molten salt bath set at about 380 C to about 460 C for about 30 minutes to about 24 hours to form a compressive stress layer that extends inward from a surface of the glass substrate to a first depth; and contacting the article comprising the compressive stress layer with a AgNO3-containing molten salt bath set at about 300° C. to about 400° C. for about 5 minutes to about 18 hours to form an antimicrobial region that extends inward from the surface of the glass substrate to a second depth. The methods also include poisoning at least the AgNO3-containing molten salt bath and, in some cases, the KNO3-containing molten salt bath. Poisoning components include Na+ and Li+ ions.

Abstract: A multilayer ceramic substrate that includes a laminate having stacked ceramic layers formed of a ceramic material containing a main component, containing 48 to 75% by weight of Si, 20 to 40% by weight of Ba, and 10 to 40% by weight of Al, and an auxiliary component containing at least 2.5 to 20 parts by weight of Mn with respect to 100 parts by weight of the main component, and in the laminate, glass ceramic layers in which the entire or a portion of the thickness thereof exists within 100 ?m inside of the laminate as measured from opposed principal surfaces are further stacked.

Abstract: In an embodiment, in a multilayer ceramic capacitor 10, a first insulative layer 13-1 having parts A1, A2 covered by the first part 12b of each external electrode 12 is provided on one third-direction face, while a second insulative layer 13-2 having parts A3, A4 covered by the second part 12c of each external electrode 12 is provided on the other third-direction face, of the capacitor body 11 of the multilayer ceramic capacitor 10. The multilayer ceramic electronic component can prevent moisture intrusion into the component body as much as possible, even when the multilayer ceramic electronic component is made thin.

Abstract: A method of manufacturing a ceramic sintered body, includes: a film forming step of forming, on a surface of a heat-resistant metal material, a metal coating film made of a metal material having a standard free energy of formation of metal carbides lower than that of the heat-resistant metal material; a molding step of disposing the heat-resistant metal material provided with the coating film in the film forming step at a predetermined position in powder that serves as a starting material of a ceramic base, and molding a ceramic green body by press-molding the powder; and a sintering step of generating a ceramic sintered body by sintering the ceramic green body molded in the molding step.

Abstract: A glass sensor substrate including metallizable through vias and related process is provided. The glass substrate has a first major surface, a second major surface and an average thickness of greater than 0.3 mm. A plurality of etch paths are created through the glass substrate by directing a laser at the substrate in a predetermined pattern. A plurality of through vias through the glass substrate are etched along the etch paths using a hydroxide based etching material. The hydroxide based etching material highly preferentially etches the substrate along the etch path. Each of the plurality of through vias is long compared to their diameter for example such that a ratio of the thickness of the glass substrate to a maximum diameter of each of the through vias is greater than 8 to 1.

Abstract: The present invention is related to a method for the production of single crystalline MgTiO3 flakes, in particular in the geikielite crystal structure, to single crystalline MgTiO3 flakes obtained by this method as well as to the use thereof, in particular as pigments in several application media.

Abstract: A thermal management system is described. The thermal management system being well suited for electronic devices having limited size and operational components that produce excess heat. The thermal management system includes a thermal transport mechanism formed of material having anisotropic thermal conducting properties such that heat is transported from a heat source to a heat sink using a directed heat path. The directed heat path provided by regions having a first thermal conductivity embedded within a substrate characterized as having a second thermal conductivity that is less than the first thermal conductivity.

Abstract: The present invention provides a transparent substrate that significantly prevents the progress of a crack in a thin-plate glass and the rupture of the glass, and is excellent in bending property and flexibility. A transparent substrate according to an embodiment of the present invention includes: a thin-plate glass having a thickness of 10 ?m to 100 ?m; and a resin layer on at least one side of the thin-plate glass, wherein a shrinkage stress of the resin layer on the thin-plate glass is 5 MPa or more.

Abstract: A thermally conductive thick film dielectric ink for an electronic device includes a mixture of an organic medium, a glass binder, and a technical ceramic powder having ceramic particles dispersed throughout the thick film dielectric ink mixture.

Abstract: An optical waveguide having a plurality of optical paths is formed on a substrate. A reflection mechanism is arranged above the optical waveguide. The reflection mechanism includes mirror components, each of which has an inclined reflective surface, and a mask having a plurality of openings. Laser is irradiated to the mirror components and optical path conversion inclined surfaces are formed in the plurality of optical paths at the same time by the laser reflected on the mirror components.

Abstract: Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.

Abstract: Provided herein are apparatuses and methods, including patterning a first set of features in a servo zone to form a patterned servo zone while a first mask protects a data zone from the patterning. The first mask may be removed from the data zone. The apparatuses and methods may further include patterning a second set of features in the data zone to form a patterned data zone while a second mask protects the patterned servo zone from the patterning.

Abstract: A method of forming an optical structure in a continuous manufacturing process includes providing a continuous ribbon of flexible glass substrate (134) having a thickness of no more than 0.3 mm. The continuous ribbon of flexible glass substrate has a first side and a second side separated by a plane formed by the ribbon of flexible glass substrate. A liquid polarizer material (142) is applied on the ribbon of flexible glass substrate at one of the first and second sides as the continuous ribbon of flexible glass substrate moves by a polarizer material application apparatus to form a polarizing layer. A conductive material (150) is applied on the ribbon of flexible glass substrate at one of the first and second sides to form a touch layer for a touch sensitive display.

Abstract: There are disclosed an information-display-equipped electric-heating-type heater, and a method of using the above information. An information-display-equipped electric-heating-type heater includes a tubular honeycomb structure made of a conductive material and having porous partition walls to define and form a plurality of cells which become through channels for a fluid and extend from one end face to the other end face, and a circumferential wall positioned in an outermost circumference; and a pair of electrodes disposed on the circumferential wall of the honeycomb structure, and information concerning a heater performance of the electric-heating-type heater is displayed in the honeycomb structure.

Abstract: A method of making a glass having antimicrobial properties and high compressive stress. The method includes a first ion exchange step in which potassium cations are exchanged for sodium cations in the base glass to provide a surface layer under compressive stress, followed by a second ion exchange in which silver cations are exchanged for potassium and lithium ions in the glass to produce the antimicrobial glass. In some embodiments, the antimicrobial glass has a maximum compressive stress that is at least 80% of the maximum compressive stress obtained by the potassium-for-sodium exchange in the first bath. A base glass and an ion exchanged glass antimicrobial having antimicrobial properties are also provided.

Abstract: A dielectric ceramic layer includes main phase grains and a secondary phase. The main phase grains include a perovskite-type compound. The perovskite-type compound includes Zr, Mn and at least one element selected from the group consisting of Ti, Ca, Sr, and Ba. In the perovskite-type compound, a molar ratio z between Ti/(Zr+Ti) satisfies 0?z?0.2, a molar ratio between Zr/(Zr+Ti) is equal to 1?z, a molar ratio x between Sr/(Ca+Sr+Ba) satisfies 0?x?1.0, a molar ratio y between Ba/(Ca+Sr+Ba) satisfies 0?y?0.3, a molar ratio between Ca/(Ca+Sr+Ba) is equal to 1?x?y, and a molar ratio m between (Ca+Sr+Ba)/(Zr+Ti) satisfies 0.95?m<1.03. The secondary phase contains segregated Mn. In a body including the dielectric ceramic layer and an internal electrode alternately stacked, the secondary phase is located inside of a second region and not located inside of a third region.

Abstract: Disclosed is a plastic substrate, which includes a plastic film, a reflective and/or conductive metal layer, and a resin layer having a conductive material dispersed therein and which is useful as a lower substrate of a transmissive electronic paper display device or a display device.

Abstract: Resin layers and interlayers exhibiting enhanced adhesion to inorganic surfaces, such as glass, are provided. In some cases, the layers and interlayers may comprise at least one adhesion stabilizing agent for improving adhesion to various surfaces, even in the presence of moisture. Such layers and interlayers may be useful, for example, in multiple layer panels, such as, for example, safety glass used in automotive and architectural applications.

Abstract: In various embodiments, a substrate is provided. The substrate may include: a ceramic carrier having a first side and a second side opposite the first side; a first metal layer disposed over the first side of the ceramic carrier; a second metal layer disposed over the second side of the ceramic carrier; and a cooling structure formed into or over the second metal layer.

Abstract: A printed circuit board includes an inner layer having a supporting pattern and via pad patterns that are disposed to be spaced apart from each other in a lateral direction, an outer layer disposed over or below the inner layer and including a circuit pattern, a via plug connecting the circuit pattern layer to any one of the via pad patterns. The supporting pattern is stiffer than the via pad patterns, and at least two of the via pad patterns are electrically connected to each other by a via pad connecting pattern located at substantially the same level as the via pad patterns.

Abstract: A method for forming an oxide coated substrate comprising heating a pre-coating mixture in the presence of a substrate to synthesize an oxide coating on the substrate. The pre-coating mixture comprises a solubilized reducing additive, a solubilized oxidizing additive, and the substrate. The heating is conducted at a temperature sufficiently high enough to exothermically react the solubilized reducing additive and solubilized oxidizing additive and low enough to control the phase and composition of the oxide.