Including Ceramic, Glass, Porcelain Or Quartz Layer Patents (Class 428/210)
  • Patent number: 10971456
    Abstract: An electronic component includes a multilayer body including a first insulator and a second insulator having a higher resistivity than the first insulator, metal conductors each positioned between the first insulator and the second insulator and including a predetermined end surface positioned at least near an end surface of the multilayer body, plating films each provided on the predetermined end surface of the metal conductor in a state extending out in a direction covering an end surface of the first insulator by a larger distance than in a direction covering an end surface of the second insulator, and an outer conductor provided on the outer sides of the plating films and electrically connected to the metal conductor through the plating films.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: April 6, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Ryosuke Washida, Jyunichi Nanjyo, Narimichi Makino
  • Patent number: 10836142
    Abstract: A laminated glazing includes one or two plies of 0.5 to 12 mm thickness, and one or more structural plies of 3 to 20 mm thickness, wherein at least that face of at least one ply of 0.5 to 12 mm thickness which is oriented toward the one or more structural plies and/or at least one face of the latter includes an electrically conductive layer of thickness comprised between 2 and 1600 nm, except on at least one ablation line, the edges of this line having no hem, and their average slope being at most equal to 5%.
    Type: Grant
    Filed: December 12, 2017
    Date of Patent: November 17, 2020
    Assignee: SAINT-GOBAIN GLASS FRANCE
    Inventors: Vincent Legois, Vincent Rachet, Thomas Tondu
  • Patent number: 10825610
    Abstract: A method for producing a multilayer ceramic electronic component the includes producing a multilayer sheet having a plurality of multilayer ceramic green sheets and internal electrode patterns respectively arranged along a plurality of interfaces between the ceramic green sheets, and having a first main surface and a second main surface that face each other in a lamination direction thereof; placing, and pressure-bonding under heating, a resin composition onto at least one of the first main surface and the second main surface of the multilayer sheet to produce a mother block having an unfixed protection layer thereon; and cutting the mother block along a first-direction cutting-plane line and a second-direction cutting-plane line that are orthogonal to each other to produce a plurality of green chips. The resin composition includes a resin component having a melting point or a glass transition temperature of lower than 100° C. and inorganic compound particles.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: November 3, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hidehiko Tanaka, Toshikazu Makino, Shinji Otani
  • Patent number: 10825725
    Abstract: Implementations of die singulation systems and related methods may include forming a plurality of die on a first side of a substrate, forming a seed layer on a second side of a substrate opposite the first side of the substrate, using a shadow mask, applying a mask layer over the seed layer, forming a backside metal layer over the seed layer, removing the mask layer, and singulating the plurality of die included in the substrate through removing substrate material in the die street and through removing seed layer material in the die street.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: November 3, 2020
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventor: Michael J. Seddon
  • Patent number: 10808903
    Abstract: A light converting device, comprising: a substrate functioning as a heatsink, a light converter adapted to convert laser light to converted light, wherein a peak emission wavelength of the converted light is in a longer wavelength range than a laser peak emission wavelength of the laser light, the light converter comprises a light entrance surface, a bonding surface opposite to the light entrance surface and at least one side surface, the bonding surface is mechanically and thermally coupled to the substrate, a reflective structure attached to or part of the substrate, wherein the reflective structure comprises at least one reflective metal surface arranged on the side of the substrate facing the light converter to reflect laser light and converted light, and a translucent ceramic protection layer, arranged between the reflective structure and the light converter, and having a thickness of less than 50 ?m.
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: October 20, 2020
    Assignee: LUMILEDS HOLDING B.V.
    Inventors: Claudia Goldmann, Rainald Gierth, Ulrich Hechtfischer, Josef Schug
  • Patent number: 10804145
    Abstract: A method of fabricating a semiconductor device is provided. The method may include forming a first interlayer insulating film on a substrate, forming a second interlayer insulating film on the first interlayer insulating film, and forming a third interlayer insulating film on the second interlayer insulating film. Different amounts of carbon may be present in each of the first, second, and third interlayer insulating films. The third interlayer insulating film may be used as a mask pattern to form a via trench that extends at least partially into the first interlayer insulating film and the second interlayer insulating film. Supplying a carbon precursor may be interrupted between the forming of the second and third interlayer insulating films, such that the second interlayer insulating film and the third interlayer insulating film may have a discontinuous boundary therebetween.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: October 13, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yeong Gil Kim, Han Seong Kim, Jong Min Baek, Ji Young Kim, Sung Bin Park, Deok Young Jung, Kyu Hee Han
  • Patent number: 10797219
    Abstract: A piezoelectric PTZT film is formed of a metal oxide having a perovskite structure including Pb, Ta, Zr, and Ti, in which the metal oxide further includes carbon, and a content of the carbon is 80 to 800 ppm by mass. In a process for producing a liquid composition for forming a piezoelectric film, a Ta alkoxide, a Zr alkoxide, ?-diketones, and a diol are refluxed, a Ti alkoxide is added into a first synthesis solution obtained by the refluxing, and then refluxing is performed again, a Pb compound is added into a second synthesis solution obtained by performing the additional refluxing, and then refluxing is performed again, a solvent is removed from a third synthesis solution obtained by performing the additional refluxing, and then, dilution with alcohol is performed, to produce the liquid composition for forming a piezoelectric PTZT film.
    Type: Grant
    Filed: February 15, 2016
    Date of Patent: October 6, 2020
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Toshihiro Doi, Nobuyuki Soyama
  • Patent number: 10792856
    Abstract: A build plate unit (400) for a three-dimensional printer includes a build plate (410) having an optically transparent member comprising a flexible, gas permeable, optically transparent sheet (414) having upper and lower opposing sides, wherein the flexible sheet upper side defines the build surface; and a flexible, gas permeable or impermeable, optically transparent base layer (412) on the lower side of the flexible sheet opposite the build region, wherein the build plate is configured to permit gas flow to the build surface.
    Type: Grant
    Filed: March 11, 2016
    Date of Patent: October 6, 2020
    Assignee: Carbon, Inc.
    Inventors: John Tumbleston, Edward T. Samulski, Robert K. Pinschmidt, Jr.
  • Patent number: 10723652
    Abstract: Described herein are various antimicrobial soda lime glass articles that have improved resistance to discoloration when exposed to harsh conditions, including manufacturing conditions. The improved antimicrobial glass articles described herein generally include a SLG substrate that has a thickness, t; a compressive stress layer of about 0.15*t or greater; and an antimicrobial agent-containing region having an antimicrobial agent and a thickness less than the thickness of the compressive stress layer. Roughly 2 to 20 microns of the primary surfaces of the glass substrate can be removed prior to development of the compressive stress and antimicrobial agent-containing region. In some aspects, prior-annealed and tempered, or prior-annealed, SLG is employed as the substrate. In some aspects, the substrate includes tin at one surface. The improved SLG substrates experience substantially no discoloration when exposed to harsh conditions. Methods of making and using the glass articles are also described.
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: July 28, 2020
    Assignee: CORNING INCORPORATED
    Inventors: Hongmei Hu, Jennifer Lynn Hunt, Sumalee Likitvanichkul, Ananthanarayanan Subramanian, Li Yao
  • Patent number: 10683234
    Abstract: Described herein are various methods and manufacturing methods for making antimicrobial and strengthened, antimicrobial glass articles and substrates. The methods described herein generally include contacting the article with a KNO3-containing molten salt bath set at about 380 C to about 460 C for about 30 minutes to about 24 hours to form a compressive stress layer that extends inward from a surface of the glass substrate to a first depth; and contacting the article comprising the compressive stress layer with a AgNO3-containing molten salt bath set at about 300° C. to about 400° C. for about 5 minutes to about 18 hours to form an antimicrobial region that extends inward from the surface of the glass substrate to a second depth. The methods also include poisoning at least the AgNO3-containing molten salt bath and, in some cases, the KNO3-containing molten salt bath. Poisoning components include Na+ and Li+ ions.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: June 16, 2020
    Assignee: CORNING INCORPORATED
    Inventors: Ekaterina Aleksandrovna Kuksenkova, Sumalee Likitvanichkul, Santona Pal, Mehmet Derya Tetiker
  • Patent number: 10626054
    Abstract: A multilayer ceramic substrate that includes a laminate having stacked ceramic layers formed of a ceramic material containing a main component, containing 48 to 75% by weight of Si, 20 to 40% by weight of Ba, and 10 to 40% by weight of Al, and an auxiliary component containing at least 2.5 to 20 parts by weight of Mn with respect to 100 parts by weight of the main component, and in the laminate, glass ceramic layers in which the entire or a portion of the thickness thereof exists within 100 ?m inside of the laminate as measured from opposed principal surfaces are further stacked.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: April 21, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Tomoki Kato, Sadaaki Sakamoto
  • Patent number: 10593476
    Abstract: In an embodiment, in a multilayer ceramic capacitor 10, a first insulative layer 13-1 having parts A1, A2 covered by the first part 12b of each external electrode 12 is provided on one third-direction face, while a second insulative layer 13-2 having parts A3, A4 covered by the second part 12c of each external electrode 12 is provided on the other third-direction face, of the capacitor body 11 of the multilayer ceramic capacitor 10. The multilayer ceramic electronic component can prevent moisture intrusion into the component body as much as possible, even when the multilayer ceramic electronic component is made thin.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: March 17, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Takashi Sasaki, So Sato, Yoshiaki Iijima
  • Patent number: 10462850
    Abstract: A method of manufacturing a ceramic sintered body, includes: a film forming step of forming, on a surface of a heat-resistant metal material, a metal coating film made of a metal material having a standard free energy of formation of metal carbides lower than that of the heat-resistant metal material; a molding step of disposing the heat-resistant metal material provided with the coating film in the film forming step at a predetermined position in powder that serves as a starting material of a ceramic base, and molding a ceramic green body by press-molding the powder; and a sintering step of generating a ceramic sintered body by sintering the ceramic green body molded in the molding step.
    Type: Grant
    Filed: October 24, 2011
    Date of Patent: October 29, 2019
    Assignee: NHK Spring Co., Ltd.
    Inventors: Satoshi Hirano, Toshihiro Tachikawa, Junichi Miyahara, Toshihiko Hanamachi
  • Patent number: 10438039
    Abstract: A glass sensor substrate including metallizable through vias and related process is provided. The glass substrate has a first major surface, a second major surface and an average thickness of greater than 0.3 mm. A plurality of etch paths are created through the glass substrate by directing a laser at the substrate in a predetermined pattern. A plurality of through vias through the glass substrate are etched along the etch paths using a hydroxide based etching material. The hydroxide based etching material highly preferentially etches the substrate along the etch path. Each of the plurality of through vias is long compared to their diameter for example such that a ratio of the thickness of the glass substrate to a maximum diameter of each of the through vias is greater than 8 to 1.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: October 8, 2019
    Assignee: Corning Incorporated
    Inventors: Yuhui Jin, Matthew Evan Wilhelm
  • Patent number: 10316427
    Abstract: The present invention is related to a method for the production of single crystalline MgTiO3 flakes, in particular in the geikielite crystal structure, to single crystalline MgTiO3 flakes obtained by this method as well as to the use thereof, in particular as pigments in several application media.
    Type: Grant
    Filed: November 20, 2014
    Date of Patent: June 11, 2019
    Assignee: Merck Patent GmbH
    Inventor: Ryuta Suzuki
  • Patent number: 10312174
    Abstract: A thermal management system is described. The thermal management system being well suited for electronic devices having limited size and operational components that produce excess heat. The thermal management system includes a thermal transport mechanism formed of material having anisotropic thermal conducting properties such that heat is transported from a heat source to a heat sink using a directed heat path. The directed heat path provided by regions having a first thermal conductivity embedded within a substrate characterized as having a second thermal conductivity that is less than the first thermal conductivity.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: June 4, 2019
    Assignee: Apple Inc.
    Inventor: Victor M. Vitale
  • Patent number: 10221090
    Abstract: The present invention provides a transparent substrate that significantly prevents the progress of a crack in a thin-plate glass and the rupture of the glass, and is excellent in bending property and flexibility. A transparent substrate according to an embodiment of the present invention includes: a thin-plate glass having a thickness of 10 ?m to 100 ?m; and a resin layer on at least one side of the thin-plate glass, wherein a shrinkage stress of the resin layer on the thin-plate glass is 5 MPa or more.
    Type: Grant
    Filed: August 3, 2010
    Date of Patent: March 5, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Takeshi Murashige, Daisuke Hattori, Yoshimasa Sakata, Takashi Yamaoka, Tatsuki Nagatsuka
  • Patent number: 10113073
    Abstract: A thermally conductive thick film dielectric ink for an electronic device includes a mixture of an organic medium, a glass binder, and a technical ceramic powder having ceramic particles dispersed throughout the thick film dielectric ink mixture.
    Type: Grant
    Filed: April 7, 2015
    Date of Patent: October 30, 2018
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Lisa M. Albaugh, David A. Smith, Timothy J. Guse
  • Patent number: 10022927
    Abstract: An optical waveguide having a plurality of optical paths is formed on a substrate. A reflection mechanism is arranged above the optical waveguide. The reflection mechanism includes mirror components, each of which has an inclined reflective surface, and a mask having a plurality of openings. Laser is irradiated to the mirror components and optical path conversion inclined surfaces are formed in the plurality of optical paths at the same time by the laser reflected on the mirror components.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: July 17, 2018
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Kenji Yanagisawa
  • Patent number: 9974168
    Abstract: Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: May 15, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Sumiyo Nakamura, Takahiro Sumi, Takahiro Oka
  • Patent number: 9928867
    Abstract: Provided herein are apparatuses and methods, including patterning a first set of features in a servo zone to form a patterned servo zone while a first mask protects a data zone from the patterning. The first mask may be removed from the data zone. The apparatuses and methods may further include patterning a second set of features in the data zone to form a patterned data zone while a second mask protects the patterned servo zone from the patterning.
    Type: Grant
    Filed: June 2, 2015
    Date of Patent: March 27, 2018
    Assignee: Seagate Technology LLC
    Inventors: Shuaigang Xiao, XiaoMin Yang, ZhaoNing Yu, Yautzong Hsu
  • Patent number: 9874961
    Abstract: A method of forming an optical structure in a continuous manufacturing process includes providing a continuous ribbon of flexible glass substrate (134) having a thickness of no more than 0.3 mm. The continuous ribbon of flexible glass substrate has a first side and a second side separated by a plane formed by the ribbon of flexible glass substrate. A liquid polarizer material (142) is applied on the ribbon of flexible glass substrate at one of the first and second sides as the continuous ribbon of flexible glass substrate moves by a polarizer material application apparatus to form a polarizing layer. A conductive material (150) is applied on the ribbon of flexible glass substrate at one of the first and second sides to form a touch layer for a touch sensitive display.
    Type: Grant
    Filed: June 2, 2014
    Date of Patent: January 23, 2018
    Assignee: Corning Incorporated
    Inventors: Ashish Hersh Chaturvedi, Tomohiro Ishikawa, Lili Tian
  • Patent number: 9874132
    Abstract: There are disclosed an information-display-equipped electric-heating-type heater, and a method of using the above information. An information-display-equipped electric-heating-type heater includes a tubular honeycomb structure made of a conductive material and having porous partition walls to define and form a plurality of cells which become through channels for a fluid and extend from one end face to the other end face, and a circumferential wall positioned in an outermost circumference; and a pair of electrodes disposed on the circumferential wall of the honeycomb structure, and information concerning a heater performance of the electric-heating-type heater is displayed in the honeycomb structure.
    Type: Grant
    Filed: September 23, 2014
    Date of Patent: January 23, 2018
    Assignee: NGK Insulators, Ltd.
    Inventors: Yoshimasa Omiya, Takashi Noro, Kazumi Mase
  • Patent number: 9840437
    Abstract: A method of making a glass having antimicrobial properties and high compressive stress. The method includes a first ion exchange step in which potassium cations are exchanged for sodium cations in the base glass to provide a surface layer under compressive stress, followed by a second ion exchange in which silver cations are exchanged for potassium and lithium ions in the glass to produce the antimicrobial glass. In some embodiments, the antimicrobial glass has a maximum compressive stress that is at least 80% of the maximum compressive stress obtained by the potassium-for-sodium exchange in the first bath. A base glass and an ion exchanged glass antimicrobial having antimicrobial properties are also provided.
    Type: Grant
    Filed: February 24, 2015
    Date of Patent: December 12, 2017
    Assignee: CORNING INCORPORATED
    Inventor: John Christopher Mauro
  • Patent number: 9748041
    Abstract: A dielectric ceramic layer includes main phase grains and a secondary phase. The main phase grains include a perovskite-type compound. The perovskite-type compound includes Zr, Mn and at least one element selected from the group consisting of Ti, Ca, Sr, and Ba. In the perovskite-type compound, a molar ratio z between Ti/(Zr+Ti) satisfies 0?z?0.2, a molar ratio between Zr/(Zr+Ti) is equal to 1?z, a molar ratio x between Sr/(Ca+Sr+Ba) satisfies 0?x?1.0, a molar ratio y between Ba/(Ca+Sr+Ba) satisfies 0?y?0.3, a molar ratio between Ca/(Ca+Sr+Ba) is equal to 1?x?y, and a molar ratio m between (Ca+Sr+Ba)/(Zr+Ti) satisfies 0.95?m<1.03. The secondary phase contains segregated Mn. In a body including the dielectric ceramic layer and an internal electrode alternately stacked, the secondary phase is located inside of a second region and not located inside of a third region.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: August 29, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Masahiro Naito
  • Patent number: 9733503
    Abstract: Disclosed is a plastic substrate, which includes a plastic film, a reflective and/or conductive metal layer, and a resin layer having a conductive material dispersed therein and which is useful as a lower substrate of a transmissive electronic paper display device or a display device.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: August 15, 2017
    Assignee: KOLON INDUSTRIES, INC.
    Inventors: Hak Gee Jung, Jeong Han Kim, Hyo Jun Park
  • Patent number: 9688018
    Abstract: Resin layers and interlayers exhibiting enhanced adhesion to inorganic surfaces, such as glass, are provided. In some cases, the layers and interlayers may comprise at least one adhesion stabilizing agent for improving adhesion to various surfaces, even in the presence of moisture. Such layers and interlayers may be useful, for example, in multiple layer panels, such as, for example, safety glass used in automotive and architectural applications.
    Type: Grant
    Filed: October 20, 2015
    Date of Patent: June 27, 2017
    Assignee: SOLUTIA INC.
    Inventors: Weihong Cui, Steven V. Haldeman, Francois Andre Koran, Pu Zhang
  • Patent number: 9585241
    Abstract: In various embodiments, a substrate is provided. The substrate may include: a ceramic carrier having a first side and a second side opposite the first side; a first metal layer disposed over the first side of the ceramic carrier; a second metal layer disposed over the second side of the ceramic carrier; and a cooling structure formed into or over the second metal layer.
    Type: Grant
    Filed: September 24, 2013
    Date of Patent: February 28, 2017
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Wolfram Hable, Andreas Grassmann, Frank Winter, Ottmar Geitner, Alexander Schwarz, Alexander Herbrandt
  • Patent number: 9565763
    Abstract: A printed circuit board includes an inner layer having a supporting pattern and via pad patterns that are disposed to be spaced apart from each other in a lateral direction, an outer layer disposed over or below the inner layer and including a circuit pattern, a via plug connecting the circuit pattern layer to any one of the via pad patterns. The supporting pattern is stiffer than the via pad patterns, and at least two of the via pad patterns are electrically connected to each other by a via pad connecting pattern located at substantially the same level as the via pad patterns.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: February 7, 2017
    Assignee: SK HYNIX INC.
    Inventor: Jong Hyun Nam
  • Patent number: 9555406
    Abstract: A method for forming an oxide coated substrate comprising heating a pre-coating mixture in the presence of a substrate to synthesize an oxide coating on the substrate. The pre-coating mixture comprises a solubilized reducing additive, a solubilized oxidizing additive, and the substrate. The heating is conducted at a temperature sufficiently high enough to exothermically react the solubilized reducing additive and solubilized oxidizing additive and low enough to control the phase and composition of the oxide.
    Type: Grant
    Filed: January 3, 2014
    Date of Patent: January 31, 2017
    Assignee: Nitto Denko Corporation
    Inventors: Ekambaram Sambandan, Rajesh Mukherjee, Takuya Fukumura, Amane Mochizuki
  • Patent number: 9511552
    Abstract: A method for producing an optical substrate includes: a step of preparing a long film-shaped mold having a concave-convex pattern surface having a concave-convex pattern; a step of forming a coating film made of a sol-gel material on the concave-convex pattern surface of the film-shaped mold; a step of adhering the coating film, which is formed on the concave-convex pattern surface of the film-shaped mold, to a substrate by arranging the concave-convex pattern surface of the film-shaped mold on which the coating film made of the sol-gel material is formed to face the substrate and by pressing a pressing roll against a surface of the film-shaped mold on a side opposite to the concave-convex pattern surface; a step of releasing the film-shaped mold from the coating film; and a step of curing the coating film adhered to the substrate.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: December 6, 2016
    Assignee: JX NIPPON OIL & ENERGY CORPORATION
    Inventors: Shigetaka Toriyama, Suzushi Nishimura, Naoto Kozasa, Madoka Takahashi
  • Patent number: 9349517
    Abstract: A coil component is of the type where a helical coil is directly contacting a magnetic body where such coil component still meets the demand for electrical current amplification. The coil component is structured in such a way that a helical coil is covered with a magnetic body. The magnetic body is mainly constituted by magnetic alloy grains and does not contain glass component, and each of the magnetic alloy grains has an oxide film of the grain on its surface.
    Type: Grant
    Filed: December 7, 2011
    Date of Patent: May 24, 2016
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Hitoshi Matsuura, Tomomi Kobayashi, Yoshikazu Okino, Hidemi Iwao, Kenichiro Nogi, Kenji Otake
  • Patent number: 9337408
    Abstract: A light-emitting diode device has a first carrier and at least one light-emitting diode chip, which is arranged on the first carrier. The first carrier has at least one first and one second carrier part, wherein the light-emitting diode chip rests only on the first carrier part. Furthermore, the first and second carrier parts each have a thermal conductivity. The thermal conductivity of the first carrier part is at least 1.5 times the thermal conductivity of the second carrier part. The first carrier part is surrounded laterally by the second carrier part.
    Type: Grant
    Filed: July 22, 2013
    Date of Patent: May 10, 2016
    Assignee: EPCOS AG
    Inventors: Thomas Feichtinger, Sebastian Brunner, Oliver Dernovsek, Klaus-Dieter Aichholzer, Georg Krenn, Axel Pecina, Christian Faistauer
  • Patent number: 9333789
    Abstract: A decal printing paper for ceramic surfaces has a base paper coated with a water-soluble release layer, an image transfer layer made of liquid cover coat with glass/ceramic flux added, and a printed image layer. The glass/ceramic flux contains glass frit with a relatively low melting point to provide a one-step printing paper with a glass/ceramic flux that delivers the required adhesion, as well as reducing the firing temperature. The image transfer layer can also include a dye colorant to provide a visual indication of a functional characteristic of the decal printing paper.
    Type: Grant
    Filed: May 6, 2015
    Date of Patent: May 10, 2016
    Assignee: Enduring Images, Inc.
    Inventor: Ronald Manwiller
  • Patent number: 9217192
    Abstract: In a semiconductor device 100 according to the present invention in which a semiconductor member 120 is stacked on a substrate 110, the semiconductor member 120 and the substrate 110 are bonded together by means of a semiconductor device bonding material 130 of which main component is zinc. Further, a coating layer to prevent diffusion of the semiconductor device bonding material 130 is provided on at least one of the surface of the substrate 110 and the surface of the semiconductor member 120. In addition, the coating layer 140 is configured such that a barrier layer 141 composed of nitride, carbide, or carbonitride and a protective layer 142 composed of a noble metal are stacked. Further, the nitride, the carbide, or the carbonitride composing the barrier layer 141 is selected so as to have free energy smaller than that of a material composing an insulating layer 111 provided in the substrate 110.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: December 22, 2015
    Assignee: OSAKA UNIVERSITY
    Inventors: Katsuaki Suganuma, Seongjun Kim
  • Patent number: 9215801
    Abstract: A via-holed ceramic substrate can be manufactured in a simple method by providing a via-holed ceramic substrate comprising: a sintered ceramic substrate; an electroconductive via formed in the sintered ceramic substrate, the electroconductive via having an electroconductive metal closely filled in a through-hole, the electroconductive metal containing a metal (A) having a melting point of 600° C. to 1100° C., a metal (B) having a melting point higher than the melting point of the metal (A), and an active metal; and an active layer formed in the interface between the electroconductive via and the sintered ceramic substrate.
    Type: Grant
    Filed: December 2, 2011
    Date of Patent: December 15, 2015
    Assignee: TOKUYAMA CORPORATION
    Inventors: Naoto Takahashi, Yasuyuki Yamamoto
  • Patent number: 9101064
    Abstract: Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; one or more anti-etching metal layers formed in a surface of the ceramic substrate; thin film electrode pattern formed on the anti-etching metal layers; and a plating layer formed on the thin film electrode pattern, wherein respective edge portions of the thin film electrode pattern are contacted with the anti-etching metal layer, and thus, an undercut defect occurring between the surface of the ceramic substrate and the thin film electrode pattern and between the thin film electrode patterns due to an etchant can be prevented and the binding strength of the entire thin film electrode pattern can be enhanced, resulting in securing durability and reliability of the thin film electrode patterns.
    Type: Grant
    Filed: July 13, 2012
    Date of Patent: August 4, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Hee Yoo, Byeung Gyu Chang, Taek Jung Lee, Yun Hwi Park
  • Patent number: 9076596
    Abstract: There are provided a laminated ceramic electronic component and a method of fabricating the same. The laminated ceramic electronic component include a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein the ceramic body includes an active layer that is a capacitance forming part and a cover layer that is a non-capacitance forming part formed on at least one of a top surface and a bottom surface of the active layer, and when a thickness of the ceramic body is t and a thickness of the cover layer is T, T?t×0.05 is satisfied and when an average particle diameter of a dielectric grain in the active layer is Da and an average particle diameter of a dielectric grain in the cover layer is Dc, 0.7?Dc/Da?1.5 is satisfied.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: July 7, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seok Hyun Yoon, Byoung Hwa Lee, Chang Hoon Kim, Sang Hoon Kwon
  • Publication number: 20150140297
    Abstract: A fabrication resource receives a base material such as metal or other suitable material. The fabrication resource applies optical energy to a surface of the base material. Application of the optical energy transforms a texture on the surface of the base material. Subsequent to transforming the texture on the surface of the base material, the fabrication resource then adheres a supplemental material such as paste including glass powder to the transformed texture on the surface. Application of heat to the paste fuses the glass powder of the applied paste into a glass layer that adheres to the transformed texture. The fabrication resource contacts an electronic circuit device onto an exposed facing of the glass layer and reheats the combination of the electronic circuit device, glass layer, and base material. The application of heat secures the electronic circuit device to the layer of glass and corresponding base material.
    Type: Application
    Filed: November 19, 2013
    Publication date: May 21, 2015
    Inventors: Steven E. Johnson, Keith St. Pierre, Eric Breault
  • Publication number: 20150132549
    Abstract: “Green”, ceramic tapes intended as building blocks for making complex, fully ceramic components and devices for electronic-, lab-on-chip-, and sensing applications, the manufacture of which comprises in sequence: I. mixing of a ceramic “green” paste, II. homogenisation of a ceramic “green” paste, III. dimensioning and optionally structuring the ceramic “green” paste, IV. drying of the dimensioned and structured ceramic paste, in which: step iii) is performed in a combination of an extruder and a calender, the extruder being provided with a circular extrusion die, splitting and unfolding the extruded tube to a flat, continuous tape strip, using methylcellulose or derivatives thereof as binder, and, an additional step chosen among cutting and punching the thus dimensioned and optionally structured “green” paste, thereby making thick, “green” tapes. A method for its manufacture is also contemplated.
    Type: Application
    Filed: May 10, 2013
    Publication date: May 14, 2015
    Inventors: Bernt Thorstensen, Maelenn Le Gall
  • Patent number: 9012016
    Abstract: The invention relates to an enamelled part (3, 11, 21) for a dial comprising a ceramic substrate (31) coated with a first enamel layer (4?, 12, 24, 33) to improve the appearance of said part. According to the invention, the part includes at least one other enamel layer (6?, 8?, 9, 14, 16, 25, 35, 37, 39, 41, 43, 45) partially covering the first enamel layer (4?, 12, 24, 33) so as to form a decoration with a similar improved appearance. The invention concerns the field of timepieces, jewellery and gems.
    Type: Grant
    Filed: March 23, 2012
    Date of Patent: April 21, 2015
    Assignee: Rubattel & Weyermann S.A.
    Inventors: Frederic Jeanrenaud, Stewes Bourban
  • Publication number: 20150103123
    Abstract: A method of printing a decoration on a substrate includes applying an ink coating in a predetermined design on the substrate by inkjet printing. The ink coating is cured to form a cured ink coating, and a portion of the cured ink coating is trimmed. Residual ink particles generated by the trimming are cleaned off the substrate. A printed substrate includes a substrate and a decoration printed on the substrate. The decoration comprises at least one layer of an inkjet-printed ink coating free of a saw edge and having a thickness in a range from 1.5 ?m to 5 ?m.
    Type: Application
    Filed: October 14, 2014
    Publication date: April 16, 2015
    Inventors: Tzu-Han Chen, Christopher Morton Lee, Yongshen Yan
  • Patent number: 9005737
    Abstract: A coated substrate. The coated substrate includes a unitary substrate having a major surface. A first coating is applied to a first surface segment of the major surface. A second coating applied to a second surface segment of the major surface. The first coating is different than the second coating.
    Type: Grant
    Filed: March 21, 2011
    Date of Patent: April 14, 2015
    Assignee: Apogee Enterprises, Inc.
    Inventors: Russell Huffer, Randy Leland Stull, Henry Boyum, Keith Grubb, Kristen Spurgeon
  • Publication number: 20150096354
    Abstract: A layer system having a layer region, whereby the layer region has a single-crystal silicon substrate with a front side and a back side, and whereby a textured surface is formed on the front side and the textured surface has a topography with different heights and a thin film layer of a metal oxide and/or an oxide ceramic is formed on the textured surface, whereby the thin film layer covers the textured surface only partially.
    Type: Application
    Filed: October 6, 2014
    Publication date: April 9, 2015
    Inventors: Christoph WILBERTZ, Dominik ZIMMERMANN
  • Publication number: 20150093554
    Abstract: Modified low emissivity (low-E) coated glass, so that windows using the processed glass allow uninterrupted use of RF devices within commercial or residential buildings. Glass processed in the manner described herein will not significantly diminish the energy conserving properties of the low-E coated glass. This method and apparatus disrupts the conductivity of the coating in small regions. In an embodiment, the method and apparatus ablates the low-E coating along narrow contiguous paths, such that electrical conductivity can no longer occur across the paths. The paths may take the form of intersecting curves and/or lines, so that the remaining coating consists of electrically isolated areas. The method and apparatus are applicable both to treating glass panels at the factory as well as treating windows in-situ after installation.
    Type: Application
    Filed: May 8, 2014
    Publication date: April 2, 2015
    Applicant: Eritek, Inc.
    Inventors: Eugenio Estinto, Robert Winsor
  • Patent number: 8993131
    Abstract: The present disclosure is directed to a metal-containing apparatus including a substrate member constructed of a metal that is highly resistant to pitting corrosion and wear in aggressive media. An exemplary metal-containing apparatus is a plate heat exchanger. The metal includes an oxidation layer on the surface thereof and a thin metal oxide nanoporous film on top of the oxidation layer. The nanoporous film is highly compliant and is comprised of oxygen and aluminum, titanium, silicon, zirconium and combinations thereof.
    Type: Grant
    Filed: July 15, 2009
    Date of Patent: March 31, 2015
    Assignee: Wisconsin Alumni Research Foundation
    Inventors: Marc A. Anderson, M. Isabel Tejedor, Ole Christensen
  • Patent number: 8993102
    Abstract: A glass panel includes a first surface, and a second surface and wherein the first and second surfaces are spaced apart by thickness of the glass panel. A first image is printed on the first surface of the glass panel and a second image is printed on same first surface of the glass panel and at least partially overlapping the first image. The second image printed on the first surface and at least partially overlapping the first image forms at least partially opaque imbedded into the glass panel image that when covered by a fluid becomes transparent to reveal the first image printed on the second surface of the glass panel.
    Type: Grant
    Filed: July 11, 2013
    Date of Patent: March 31, 2015
    Assignee: Dip-Tech Ltd.
    Inventor: Andy Shipway
  • Patent number: 8993105
    Abstract: When a multilayer ceramic substrate with a cavity is reduced in thickness, a bottom wall portion defining the bottom of the cavity is reduced in thickness, thereby leading to the problem that the bottom wall portion is likely to be broken. A bottom wall portion defining a cavity of a multilayer ceramic substrate has a stack structure formed with a high thermal expansion coefficient layer sandwiched between first and second low thermal expansion coefficient layers. This configuration generates compression stress in the low thermal expansion coefficient layers during a cooling process after firing, thereby allowing the mechanical strength at the bottom wall portion to be improved.
    Type: Grant
    Filed: November 5, 2010
    Date of Patent: March 31, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Yuichi Iida
  • Publication number: 20150079363
    Abstract: Pillar delivery films for vacuum insulated glass units. The delivery films include a support film or pocket tape, a sacrificial material on the support film, and a plurality of pillars. The pillars are at least partially embedded in the sacrificial material or formed within sacrificial material molds, and the sacrificial material is capable of being removed while leaving the pillars substantially intact. In order to make an insulated glass unit, the delivery films are laminated to a receptor such as a glass pane, and the support film and sacrificial material are removed to leave the pillars remaining on the glass.
    Type: Application
    Filed: September 13, 2013
    Publication date: March 19, 2015
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: MICHAEL BENTON FREE, MARTIN B. WOLK, TERRY O. COLLIER, MARGARET M. VOGEL-MARTIN, EVAN L. SCHWARTZ
  • Publication number: 20150064374
    Abstract: A laminate structure having a first chemically strengthened glass layer, a second chemically strengthened glass layer, and a polymer interlayer structure intermediate the first and second glass layers. The polymer interlayer structure can include a first polymeric layer adjacent to the first glass layer, a second polymeric layer adjacent to the second glass layer, and a polymeric rigid core intermediate the first and second polymeric layers.
    Type: Application
    Filed: August 28, 2014
    Publication date: March 5, 2015
    Inventors: Anurag Jain, Michael M. Laurin, Christianus Johannes Jacobus Maas, Michael John Moore, Charlie W. Wood