Abstract: According to the present disclosure, there is provided a light transmissive display device including a conductor to which a voltage for changing transmittance of the dimming element and a voltage outputting an electromagnetic wave for communication are applied in a time division manner, and a light transmitting member that is provided with a conductor and transmits light passing through the dimming element. This configuration makes it possible to suppress a space occupied by the dimming element and the antenna in a configuration including the dimming element and the antenna.

Abstract: The laminate of the present disclosure is a laminate including multiple glass ceramic layers each containing quartz and a glass that contains SiO2, B2O3, Al2O3, and M2O, where M is an alkali metal. An Al2O3 content of a surface layer portion of the laminate is higher than an Al2O3 content of an inner layer portion of the laminate, and a M2O content of the surface layer portion is lower than a M2O content of the inner layer portion.

Abstract: Disclosed herein is a method of coating, comprising providing an article having an internal passage therein to be coated; electrolytically applying a first layer that comprises chromium or a chromium alloy onto a surface of the internal passage; electrolytically applying a second layer comprising aluminum or an aluminum alloy onto the first layer; and heat treating the article to promote interdiffusion between the first layer and the second layer.

Abstract: A method of manufacturing an inductor component includes preparing an insulating paste that is photosensitive and that includes a filler material composed of quartz, a glass material and a resin material, and a conductive paste, forming a first insulating layer by applying the insulating paste, and exposing the first insulating layer in a state where a first portion of the first insulating layer is shielded by a mask. The method further includes removing the first portion of the first insulating layer to form a groove at a position corresponding to the first portion, applying the conductive paste in the groove to form a coil conductor layer in the groove, and applying the insulating paste on the first insulating layer and the coil conductor layer to form a second insulating layer.

Abstract: A cover window includes a glass substrates, a first coating layer disposed on a first surface of the glass substrate, and a second coating layer disposed on the first coating layer, where a thickness of the glass substrate is equal to or less than about 100 micrometers (?m), and a thickness of each of the first coating layer and the second coating layer ranges from about 50 angstroms (?) to about 400 ?.

Abstract: A glass article including at least about 40 mol % SiO2 and, optionally, a colorant imparting a preselected color is disclosed. In general, the glass includes, in mol %, from about 40-70 SiO2, 0-25 Al2O3, 0-10 B2O3; 5-35 Na2O, 0-2.5 K2O, 0-8.5 MgO, 0-2 ZnO, 0-10% P2O5 and 0-1.5 CaO. As a result of ion exchange, the glass includes a compressive stress (?s) at at least one surface and, optionally, a color. In one method, communicating a colored glass with an ion exchange bath imparts ?s while in another; communicating imparts ?s and a preselected color. In the former, a colorant is part of the glass batch while in the latter; it is part of the bath. In each, the colorant includes one or more metal containing dopants formulated to impart to a preselected color. Examples of one or more metal containing dopants include one or more transition and/or rare earth metals.

Abstract: In a ceramic/aluminum bonded body according to the present invention, a ceramic member and an aluminum member formed of aluminum or an aluminum alloy are bonded to each other, the ceramic member has a ceramic main body formed of silicon nitride, and an aluminum nitride layer or an aluminum oxide layer formed on the surface of the ceramic main body to which the aluminum member is bonded, the ceramic member and the aluminum member are bonded to each other through the aluminum nitride layer or the aluminum oxide layer, the ceramic main body is provided with silicon nitride phases and a glass phase formed between the silicon nitride phases, Al is present in a portion of the glass phase of the ceramic main body at an interface with the aluminum nitride layer or aluminum oxide layer.

Abstract: A multilayer electronic component that includes a stacked body having therein a plurality of dielectric layers including a CZ-based perovskite phase and an element M1, a plurality of internal electrode layers including Cu, and an interface layer including the element M1 in at least a portion of an interface with the plurality of internal electrode layers. Element M1 is an element that has a binding energy between CZ and Cu via the element M1 of less than or equal to ?9.8 eV by first-principles calculation using a pseudopotential method. When amounts of elements included in the dielectric layers are expressed as parts by mol, a ratio m1 of an amount of the element M1 to an amount of the Zr in the interface layer is 0.03?m1?0.25.

Abstract: A component used in an air conditioner includes a substrate and a nano-coating formed on a surface of the substrate, wherein the nano-coating includes a lower coating formed on the surface of the substrate; and an upper coating formed on the upper surface of the lower coating, a coating composition of the upper coating includes nanoparticles having a diameter of 10 nm to 30 nm, and an interval between adjacent nanoparticles among the plurality of nanoparticles located on a surface of the upper coating is 10 nm to 30 nm.

Abstract: A glass member includes a recessed portion, wherein in cross-sectional view, an angle formed between a principal surface of the glass member and an edge face of an opening of the recessed portion is 90 degrees to 130 degrees.

Abstract: Disclosed herein are integrated circuit (IC) packages with asymmetric adhesion material regions, as well as related methods and devices. For example, in some embodiments, an IC package may include a solder thermal interface material (STIM) between a die of the IC package and a lid of the IC package. The lid of the IC package may include an adhesion material region, in contact with the STIM, that is asymmetric with respect to the die.

Abstract: A hermetic package includes a base body, wherein dielectric material of a bottom of the base body is made of an organic material, an optical component mounted on the base body, and inorganic material hermetically enclosing the optical component along all surrounding sides.

Abstract: A transaction card, and processes for the manufacture thereof, having a core layer, optionally, one or more layers or coatings over the core layer, and at least one of a magnetic stripe, a machine readable code, and a payment module chip disposed in or on the card and suitable for rendering the card operable for conducting a transaction. The core layer comprises a metal-doped cured epoxy comprised of metal particles distributed in a binder consisting essentially of a cured, polymerized epoxy resin, the core comprising greater than 50%, preferably greater than 75%, and more preferably greater than 90%, of the weight and/or volume of the card. In some embodiments, the core includes a metal insert enveloped with the metal-doped curable epoxy, wherein the periphery of the epoxy extends beyond the periphery of the metal insert and has material properties more conducive to cutting or punching than the metal insert.

Abstract: Glass-based articles comprise high effective fracture toughness. Glass-based articles comprise: a glass-based substrate comprising opposing first and second surfaces defining a substrate thickness (ts), a substantially planar central portion, and a perimeter portion; a polymer coating disposed on at least a portion of at least one of the first or the second surfaces; and an effective fracture toughness that is greater than or equal to 1.25 MPa·m0.5 as measured at room temperature.

Abstract: Described herein is a process for preparing a flexible packaging material. The process may comprise: providing a printed first flexible substrate comprising an ink composition on a surface of a first flexible substrate, the ink composition comprising a first thermoplastic resin; depositing a further composition comprising a cross-linker, a white pigment and a second thermoplastic resin onto the printed ink composition such that the thermoplastic resin of the ink composition is cross-linked; and laminating the first flexible substrate with a second flexible substrate such that the ink composition, the further composition and the cross-linker are disposed between the first and second flexible substrates.

Abstract: The present invention relates to a glass for chemical strengthening including, in mole percentage on an oxide basis: 45 to 75% of SiO2; 1 to 30% of Al2O3; 1 to 20% of Li2O; 0 to 5% of Y2O3; 0 to 5% of ZrO2; and 0 to 1% of TiO2, having a total content of one or more kinds of MgO, CaO, SrO, BaO and ZnO of 1 to 20%, having a total content of Na2O and K2O of 0 to 10%, having a total content of B2O3 and P2O5 of 0 to 10%, and having a value M expressed by the following expression of 1,000 or more: M=?5×[SiO2]+121×[Al2O3]+50×[Li2O]?35×[Na2O]+32×[K2O]+85×[MgO]+54×[CaO]?41×[Sr O]?4×[P2O5]+218×[Y2O3]+436×[ZrO2]?1180, in which each of [SiO2], [Al2O3], [Li2O], [Na2O], [K2O], [MgO], [CaO], [SrO], [P2O5], [Y2O3], and [ZrO2] designates a content of each component in mole percentage on an oxide basis.

Abstract: Provided is a dielectric ceramic composition comprising a main component of forsterite and calcium strontium titanate. A content ratio of forsterite in the main component is from 84.0 to 92.5 parts by mole, and a content ratio of calcium strontium titanate is from 7.5 to 16.0 parts by mole. (Sr+Ca)/Ti in the calcium strontium titanate is from 1.03 to 1.20 in terms of a molar ratio. With respect to a total of 100 parts by mass of the main component and a subcomponent except for Li-containing glass, from 2 to 10 parts by mass of Li-containing glass is added. The Li-containing glass includes Al2O3 in an amount of from 1% by mass to 10% by mass.

Abstract: A spark plug that prevents a decrease in strength of a member to which a mark is attached while ensuring a readability of the mark, and a method of manufacturing the spark plug. The spark plug is configured to ignite an air-fuel mixture in an internal combustion engine. The spark plug includes: a mark formed of an oxide film generated on a surface of a metallic member or is formed of the metallic member and the oxide film; and a coating material covering the whole mark and allowing transmission of light.

Abstract: A method for manufacturing a three-dimensional shaped object includes a structure shaping step of supplying a shaping material including metal powder or ceramic powder, and supplying a binder to a region corresponding to a structure S of the three-dimensional shaped object to be shaped in the shaping material (step S140), a support shaping step of shaping, with a support material including a resin, a support T supporting the structure S (step S130), and a degreasing step of degreasing the support T and the binder, the support T being in a state of supporting the structure S (step S200).

Abstract: An article that includes: a glass-based substrate comprising opposing major surfaces; a crack mitigating composite over one of the major surfaces, the composite comprising an inorganic element and a polymeric element; and a hard film disposed on the crack mitigating composite comprising an elastic modulus greater than or equal to the elastic modulus of the glass-based substrate. The crack mitigating composite is characterized by an elastic modulus of greater than 30 GPa. Further, the hard film comprises at least one of a metal-containing oxide, a metal-containing oxynitride, a metal-containing nitride, a metal-containing carbide, a silicon-containing polymer, a carbon, a semiconductor, and combinations thereof.

Abstract: A method for manufacturing a singulated feedthrough insulator for a hermetic seal of an active implantable medical device (AIMD) is described. The method begins with forming a green-state ceramic bar with a via hole filled with a conductive paste. The green-state ceramic bar is dried to convert the paste to an electrically conductive material filling via hole and then subjected to a pressing step. Following pressing, a green-state insulator is singulated from the green-state ceramic bar. The singulated green-state insulator in next sintered to form an insulator that is sized and shaped for hermetically sealing to close a ferrule opening. The thusly produced feedthrough is suitable installation in an opening in the housing of an active implantable medical device.

Abstract: A powder mixture including spherical barium titanate particles and spherical oxide particles and having an average particle diameter of 2 ?m or more and 30 ?m or less, wherein the spherical oxide particles have an average particle diameter of 0.05 ?m or more and 1.5 ?m or less, and the spherical oxide particles are contained in an amount of 0.02% by mass or more and 15% by mass or less based on the powder mixture. The spherical oxide particles are preferably amorphous silicon dioxide particles and/or aluminum oxide particles. According to the present invention, it is possible to provide a spherical barium titanate-based powder which enables to prepare a high dielectric resin composition with which reduced wire sweep amount and burr are achieved.

Abstract: The invention relates to a method for producing ceramics having piezoelectric properties in predominantly aqueous suspending agents.

Abstract: A powder mixture including spherical barium titanate particles and spherical oxide particles and having an average particle diameter of 2 ?m or more and 30 ?m or less, wherein the spherical oxide particles have an average particle diameter of 0.05 ?m or more and 1.5 ?m or less, and the spherical oxide particles are contained in an amount of 0.02% by mass or more and 15% by mass or less based on the powder mixture. The spherical oxide particles are preferably amorphous silicon dioxide particles and/or aluminum oxide particles. According to the present invention, it is possible to provide a spherical barium titanate-based powder which enables to prepare a high dielectric resin composition with which reduced wire sweep amount and burr are achieved.

Abstract: A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material. A method for producing a laminate material using the film material using at least one electrically conductive conductor structure, and to the corresponding film material and laminate material are described.

Abstract: A wiring board includes an insulating substrate and a wiring conductor. The insulating substrate includes a first layer having an upper surface and a lower surface and having a first content of aluminum oxide and containing mullite and a second layer stacked on the upper surface and/or the lower surface of the first layer and having a second content of aluminum oxide greater than the first content. The wiring conductor is located inside the first layer and contains a manganese compound and/or a molybdenum compound. A manganese silicate phase and/or a magnesium silicate phase in an interface area between the insulating substrate and the wiring conductor.

Abstract: An object of the present invention is to provide a golf ball having excellent spin performance on approach shots under a wet condition and excellent spin performance on approach shots under a condition that there is grass between the golf ball and the club face.

Abstract: A semiconductor apparatus includes a metal base plate, an upper surface ceramic substrate provided on an upper surface of the metal base plate, a semiconductor device provided on the upper surface ceramic substrate, and a substrate that is provided in the metal base plate and includes an embedded ceramic substrate, an upper surface metal pattern provided on an upper surface of the embedded ceramic substrate, and a lower surface metal pattern provided on a lower surface of the embedded ceramic substrate, wherein a thermal conductivity of the upper surface metal pattern and a thermal conductivity of the lower surface metal pattern are larger than a thermal conductivity of the metal base plate.

Abstract: Substantially equal amounts of thermal energy may be provided over a build area of an additive fabrication device using as few as one heat source by selectively attenuating thermal energy emitted by the heat source. The thermal energy may be selectively attenuated by a structure that blocks portions of the thermal energy from being directly incident upon the build area such that the heat is normalized over the build area. The heat distribution over the build area may, in some embodiments, approximate the heat distribution produced by a flat field heating element, yet may be produced at comparatively lower cost and with less complex engineering.

Abstract: Implementations of the present disclosure include methods and apparatuses utilized to reduce cracking of the substrate support surface of a high temperature electrostatic chuck within a processing chamber. In one implementation, a high temperature electrostatic chuck has a ceramic body. The ceramic body has a workpiece mounting surface and a bottom surface. A plurality of backside gas channels are formed in the workpiece mounting surface. A chucking mesh disposed in the ceramic body has a main chucking portion spaced a first distance from the workpiece mounting surface and an electrode mounting portion spaced a second distance from the workpiece mounting surface, wherein the second distance is greater than the first distance. An electrode is coupled the electrode mounting portion and is accessible from the bottom surface.

Abstract: A method of forming one or more high temperature co-fired ceramic articles, comprising the steps of:— a) forming a plurality of green compacts, by a process comprising dry pressing a powder comprising ceramic and organic binder to form a green compact; b) disposing a conductor or conductor precursor to at least one surface of at least one of the plurality of green compacts to form at least one patterned green compact; c) assembling the at least one patterned green compact with one or more of the plurality of green compacts or patterned green compacts or both to form a laminated assembly; d) isostatically pressing the laminated assembly to form a pressed laminated assembly; e) firing the pressed laminated assembly at a temperature sufficient to sinter the ceramic layers together.

Abstract: The objective of the present invention is to provide a technique that ensures conduction between a gate terminal of a semiconductor switching element and a wiring layer in a semiconductor device formed with a wiring layer inside a ceramic layer. This semiconductor device comprises: a wiring layer that is inside a ceramic layer formed above an insulation layer; and a metal layer for connecting terminals from the semiconductor switching element other than the gate terminal. The wiring layer and the gate terminal from the semiconductor switching element are connected electrically via a connection part formed from a conductive material. The connection part protrudes more than the metal layer toward the semiconductor switching element.

Abstract: An electronic component includes a multilayer body including a first insulator and a second insulator having a higher resistivity than the first insulator, metal conductors each positioned between the first insulator and the second insulator and including a predetermined end surface positioned at least near an end surface of the multilayer body, plating films each provided on the predetermined end surface of the metal conductor in a state extending out in a direction covering an end surface of the first insulator by a larger distance than in a direction covering an end surface of the second insulator, and an outer conductor provided on the outer sides of the plating films and electrically connected to the metal conductor through the plating films.

Abstract: A laminated glazing includes one or two plies of 0.5 to 12 mm thickness, and one or more structural plies of 3 to 20 mm thickness, wherein at least that face of at least one ply of 0.5 to 12 mm thickness which is oriented toward the one or more structural plies and/or at least one face of the latter includes an electrically conductive layer of thickness comprised between 2 and 1600 nm, except on at least one ablation line, the edges of this line having no hem, and their average slope being at most equal to 5%.

Abstract: Implementations of die singulation systems and related methods may include forming a plurality of die on a first side of a substrate, forming a seed layer on a second side of a substrate opposite the first side of the substrate, using a shadow mask, applying a mask layer over the seed layer, forming a backside metal layer over the seed layer, removing the mask layer, and singulating the plurality of die included in the substrate through removing substrate material in the die street and through removing seed layer material in the die street.

Abstract: A method for producing a multilayer ceramic electronic component the includes producing a multilayer sheet having a plurality of multilayer ceramic green sheets and internal electrode patterns respectively arranged along a plurality of interfaces between the ceramic green sheets, and having a first main surface and a second main surface that face each other in a lamination direction thereof; placing, and pressure-bonding under heating, a resin composition onto at least one of the first main surface and the second main surface of the multilayer sheet to produce a mother block having an unfixed protection layer thereon; and cutting the mother block along a first-direction cutting-plane line and a second-direction cutting-plane line that are orthogonal to each other to produce a plurality of green chips. The resin composition includes a resin component having a melting point or a glass transition temperature of lower than 100° C. and inorganic compound particles.

Abstract: A light converting device, comprising: a substrate functioning as a heatsink, a light converter adapted to convert laser light to converted light, wherein a peak emission wavelength of the converted light is in a longer wavelength range than a laser peak emission wavelength of the laser light, the light converter comprises a light entrance surface, a bonding surface opposite to the light entrance surface and at least one side surface, the bonding surface is mechanically and thermally coupled to the substrate, a reflective structure attached to or part of the substrate, wherein the reflective structure comprises at least one reflective metal surface arranged on the side of the substrate facing the light converter to reflect laser light and converted light, and a translucent ceramic protection layer, arranged between the reflective structure and the light converter, and having a thickness of less than 50 ?m.

Abstract: A method of fabricating a semiconductor device is provided. The method may include forming a first interlayer insulating film on a substrate, forming a second interlayer insulating film on the first interlayer insulating film, and forming a third interlayer insulating film on the second interlayer insulating film. Different amounts of carbon may be present in each of the first, second, and third interlayer insulating films. The third interlayer insulating film may be used as a mask pattern to form a via trench that extends at least partially into the first interlayer insulating film and the second interlayer insulating film. Supplying a carbon precursor may be interrupted between the forming of the second and third interlayer insulating films, such that the second interlayer insulating film and the third interlayer insulating film may have a discontinuous boundary therebetween.

Abstract: A piezoelectric PTZT film is formed of a metal oxide having a perovskite structure including Pb, Ta, Zr, and Ti, in which the metal oxide further includes carbon, and a content of the carbon is 80 to 800 ppm by mass. In a process for producing a liquid composition for forming a piezoelectric film, a Ta alkoxide, a Zr alkoxide, ?-diketones, and a diol are refluxed, a Ti alkoxide is added into a first synthesis solution obtained by the refluxing, and then refluxing is performed again, a Pb compound is added into a second synthesis solution obtained by performing the additional refluxing, and then refluxing is performed again, a solvent is removed from a third synthesis solution obtained by performing the additional refluxing, and then, dilution with alcohol is performed, to produce the liquid composition for forming a piezoelectric PTZT film.

Abstract: A build plate unit (400) for a three-dimensional printer includes a build plate (410) having an optically transparent member comprising a flexible, gas permeable, optically transparent sheet (414) having upper and lower opposing sides, wherein the flexible sheet upper side defines the build surface; and a flexible, gas permeable or impermeable, optically transparent base layer (412) on the lower side of the flexible sheet opposite the build region, wherein the build plate is configured to permit gas flow to the build surface.

Abstract: Described herein are various antimicrobial soda lime glass articles that have improved resistance to discoloration when exposed to harsh conditions, including manufacturing conditions. The improved antimicrobial glass articles described herein generally include a SLG substrate that has a thickness, t; a compressive stress layer of about 0.15*t or greater; and an antimicrobial agent-containing region having an antimicrobial agent and a thickness less than the thickness of the compressive stress layer. Roughly 2 to 20 microns of the primary surfaces of the glass substrate can be removed prior to development of the compressive stress and antimicrobial agent-containing region. In some aspects, prior-annealed and tempered, or prior-annealed, SLG is employed as the substrate. In some aspects, the substrate includes tin at one surface. The improved SLG substrates experience substantially no discoloration when exposed to harsh conditions. Methods of making and using the glass articles are also described.

Abstract: Described herein are various methods and manufacturing methods for making antimicrobial and strengthened, antimicrobial glass articles and substrates. The methods described herein generally include contacting the article with a KNO3-containing molten salt bath set at about 380 C to about 460 C for about 30 minutes to about 24 hours to form a compressive stress layer that extends inward from a surface of the glass substrate to a first depth; and contacting the article comprising the compressive stress layer with a AgNO3-containing molten salt bath set at about 300° C. to about 400° C. for about 5 minutes to about 18 hours to form an antimicrobial region that extends inward from the surface of the glass substrate to a second depth. The methods also include poisoning at least the AgNO3-containing molten salt bath and, in some cases, the KNO3-containing molten salt bath. Poisoning components include Na+ and Li+ ions.

Abstract: A multilayer ceramic substrate that includes a laminate having stacked ceramic layers formed of a ceramic material containing a main component, containing 48 to 75% by weight of Si, 20 to 40% by weight of Ba, and 10 to 40% by weight of Al, and an auxiliary component containing at least 2.5 to 20 parts by weight of Mn with respect to 100 parts by weight of the main component, and in the laminate, glass ceramic layers in which the entire or a portion of the thickness thereof exists within 100 ?m inside of the laminate as measured from opposed principal surfaces are further stacked.

Abstract: In an embodiment, in a multilayer ceramic capacitor 10, a first insulative layer 13-1 having parts A1, A2 covered by the first part 12b of each external electrode 12 is provided on one third-direction face, while a second insulative layer 13-2 having parts A3, A4 covered by the second part 12c of each external electrode 12 is provided on the other third-direction face, of the capacitor body 11 of the multilayer ceramic capacitor 10. The multilayer ceramic electronic component can prevent moisture intrusion into the component body as much as possible, even when the multilayer ceramic electronic component is made thin.

Abstract: A method of manufacturing a ceramic sintered body, includes: a film forming step of forming, on a surface of a heat-resistant metal material, a metal coating film made of a metal material having a standard free energy of formation of metal carbides lower than that of the heat-resistant metal material; a molding step of disposing the heat-resistant metal material provided with the coating film in the film forming step at a predetermined position in powder that serves as a starting material of a ceramic base, and molding a ceramic green body by press-molding the powder; and a sintering step of generating a ceramic sintered body by sintering the ceramic green body molded in the molding step.

Abstract: A glass sensor substrate including metallizable through vias and related process is provided. The glass substrate has a first major surface, a second major surface and an average thickness of greater than 0.3 mm. A plurality of etch paths are created through the glass substrate by directing a laser at the substrate in a predetermined pattern. A plurality of through vias through the glass substrate are etched along the etch paths using a hydroxide based etching material. The hydroxide based etching material highly preferentially etches the substrate along the etch path. Each of the plurality of through vias is long compared to their diameter for example such that a ratio of the thickness of the glass substrate to a maximum diameter of each of the through vias is greater than 8 to 1.

Abstract: The present invention is related to a method for the production of single crystalline MgTiO3 flakes, in particular in the geikielite crystal structure, to single crystalline MgTiO3 flakes obtained by this method as well as to the use thereof, in particular as pigments in several application media.

Abstract: A thermal management system is described. The thermal management system being well suited for electronic devices having limited size and operational components that produce excess heat. The thermal management system includes a thermal transport mechanism formed of material having anisotropic thermal conducting properties such that heat is transported from a heat source to a heat sink using a directed heat path. The directed heat path provided by regions having a first thermal conductivity embedded within a substrate characterized as having a second thermal conductivity that is less than the first thermal conductivity.

Abstract: The present invention provides a transparent substrate that significantly prevents the progress of a crack in a thin-plate glass and the rupture of the glass, and is excellent in bending property and flexibility. A transparent substrate according to an embodiment of the present invention includes: a thin-plate glass having a thickness of 10 ?m to 100 ?m; and a resin layer on at least one side of the thin-plate glass, wherein a shrinkage stress of the resin layer on the thin-plate glass is 5 MPa or more.

Abstract: A thermally conductive thick film dielectric ink for an electronic device includes a mixture of an organic medium, a glass binder, and a technical ceramic powder having ceramic particles dispersed throughout the thick film dielectric ink mixture.