Abstract: A multilayer composite is provided. The composite may include a plurality of metallic glass layers interleaved with a plurality of polymer layers. The composite may have a thickness of up to 100 microns. The composite may have a fatigue strength of at least 1.5 times of the fatigue strength of a monolithic metallic glass having the same thickness as the composite and the same chemical composition as the metallic glass layer.

Abstract: The present disclosure relates to a polyimide-graphene composite material and a method for preparing same. More particularly, it relates to a polyimide-graphene composite material prepared by adding modified graphene and a basic catalyst during polymerization of a polyimide precursor so as to improve mechanical strength and electrical conductivity and enable imidization at low temperature and a method for preparing same.

Abstract: Transparent conductive films comprising silver nanowires dispersed in polyvinyl alcohol or gelatin can be prepared by coating from aqueous solvent using common aqueous solvent coating techniques. These films have good transparency, conductivity, and stability. Coating on a flexible support allows the manufacture of flexible conductive materials.

Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins, toughening components, and inorganic filler particles. The catalyst part (B) includes an aliphatic or cyclic amine compound as a curing agent and inorganic filler. In another embodiment, the structural adhesive composition is based on a one-part system, which includes the components of the resinous part (A) mixed with a latent amine curing agent. The one-part system may further include an imidazole and/or an aliphatic amine.

Abstract: The present invention is to provide an epoxy resin composition uniformly containing a large amount of inorganic fillers, excellent in heat resistance and flame resistance, and having good impregnation into a base material, and a prepreg using the epoxy resin composition, having good tackiness, and being easy in handling. Furthermore, it is to provide a printed wiring board using a metal-clad laminate formed using the prepreg and/or the prepreg or the epoxy resin composition, capable of easily conducting an ENEPIG process, and a semiconductor device using the printed wiring board, excellent in performances. An epoxy resin composition comprises a solid epoxy resin, a silica nanoparticle having an average particle diameter of 1 nm or more and 100 nm or less, and a silica particle having an average particle diameter larger than that of the silica nanoparticle, in the range of 0.1 ?m or more and 5.0 ?m or less.

Abstract: Certain mercapotetrazoles and mercaptotriazoles have been found to provide anti-corrosion properties when incorporated into silver nanowire containing films. The effectiveness of such compounds may be enhanced by their introduction into a layer disposed adjacent to a silver nanowire containing layer.

Abstract: Disclosed is a resin composition exhibiting a low thermal expansion coefficient, as well as higher heat resistance, flame resistance and insulation reliability than ever before when used in a multilayer printed wiring board that requires fine wiring work. Also disclosed are a prepreg, a resin sheet, a metal-clad laminate, a printed wiring board, a multilayer printed wiring board and a semiconductor device, all of which comprising the resin composition. The resin composition of the present invention comprises (A) an epoxy resin, (B) a cyanate resin and (C) an onium salt compound as essential components.

Abstract: A freight floor having a multilayer construction and that is formed as a composite material, comprising a core layer of carbon-fibre-reinforced and/or glass-fibre-reinforced plastic and a seating layer of a metal alloy, in particular an aluminium alloy.

Abstract: An article of armor includes a friction material operative to prevent penetration of a ballistic projectile. The armor is also operative to prevent penetration of a plurality of ballistic projectiles at a single point of impact. The armor may include a backing, or a facing, or may comprise an intermediate layer between a backing and facing in any combination. The armor of the invention applied directly to or attached to an article to be armored so as to cover all or any portion of the article. The backing and facing may include a friction material or a non-friction material. The friction material is a composite of a resin binder agent, a fibrous support structure, a friction modifier system, and a wear system.

Abstract: A solid electrolyte and a piezoelectric material are incorporated into composite shaped articles to provide them with self-healing and adaptive qualities. The piezoelectric constituent converts the mechanical energy concentrated in critical areas into electrical energy which, in turn, guides and drives electrolytic transport of mass within the solid electrolyte towards, and its electrodeposition at critical areas to render self-healing and adaptive effects.

Abstract: An overmolded composite structure that contains a metal component and a resinous component adhered to a surface thereof is provided. The resinous component is formed from a thermoplastic composition that contains at least one polyarylene sulfide and at least one mineral filler. The present inventors have discovered that the nature and relative concentration of the polyarylene sulfides, mineral fillers, and/or other materials in the thermoplastic composition can be selectively tailored so that the resulting resinous component has a coefficient of linear thermal expansion and/or color that is similar to the metal component.

Abstract: A laminate and a method of forming the laminate, including a fiber reinforced polymer layer and a glassy metal foil layer. The fiber reinforced polymer layer comprises fibers present in a polymer matrix. The glassy metal foil layer comprises an iron based glass forming alloy including nickel, boron, silicon and optionally chromium and exhibits spinodal glass matrix microconstituents including a glass matrix and a semicrystalline/crystalline phase.

Abstract: Provided is a structure of composite material, comprising a continuous first layer of composite material, a second layer of viscoelastic material, and a continuous impact-protection third layer. The first layer is formed by structural components in the form of a matrix and fibers. The second layer of viscoelastic material is added on top of the first layer and said second layer can be continuous or non-continuous. If a non-continuous second layer is used, elongate, circular or square cavities are arranged inside the layer. Optionally, reinforcements comprising carbon nanofibers or nanotubes are provided in either of the first and second layers. The third layer of impact-protection material is added in a continuous manner on top of the second layer, the third layer forming the outermost layer of the composite material. In addition, this third layer is electrically conductive.

Abstract: The invention relates to a fiber-metal laminate comprising mutually bonded fiber-reinforced composite layers and metal sheets, wherein the fiber and metal properties satisfy the following relationships simultaneously: (1) ?fibre tension>Ksf*?tu/(1.5*Et metal), (2) Efibre tension>Kstiff*Et metal, (3) ?fibre compression>ksf*?tu/(1.5*Klf*Et metal) wherein the strain concentration factor Ksf, stiffness factor Kstiff and the load factor Klf satisfy (4) 2.75?Ksf<5.7, (5) Kstiff?1.28, (6) 1.5?Klf?3.5 and ?tu=ultimate tensile strength of the metal, Et metal=tensile Young's modulus of the metal, ?fibre tension=elastic tensile strain of the fiber, Efibre tension=tensile elastic modulus of the fibre, ?fibre compression=elastic compression strain of the fiber. The fiber-metal laminate according to the invention shows an unprecedented combination of toughness and tensile strength.

Abstract: A laminated body of the present invention includes a resin layer in which a core portion composed of a fiber base member having a thickness of 25 ?m or less is embedded, the resin layer having two surfaces, and the resin layer through which at least one via-hole is adapted to be formed, and a metal layer bonded to at least one of the two surfaces of the resin layer, and the metal layer having at least one opening portion provided so as to correspond to the via-hole to be formed. Further, a method of manufacturing a substrate of the present invention includes preparing the above laminated body, forming the via-hole so as to pass through the resin layer by irradiating a laser beam onto the resin layer, and removing the metal layer from the resin layer after the via-hole is formed. Further, a substrate of the present invention is manufactured by using the above method. Furthermore, a semiconductor device of the present invention includes the above substrate, and a semiconductor element mounted on the substrate.

Abstract: The present invention relates to filled polymeric materials 16 including a thermoplastic polymer 18 and a metallic fiber 20 and to light weight composite materials 10, 12 which comprise a metallic layer 14 and a polymeric layer, the polymeric layer containing the filled polymeric material 16. The composite materials of the present invention may be formed using conventional stamping equipment at ambient temperatures. Composite materials of the present invention may also be capable of being welded to other metal materials using conventional welding techniques. The composites exhibit resistance to delamination.

Abstract: There are provided a resin composition comprising a crosslinking component with a weight average molecular weight of 1,000 or less having a plurality of styrene groups and represented by the following formula: wherein R is a hydrocarbon skeleton, each of R1s is a hydrogen atom or a hydrocarbon group, each of R2, R3 and R4 is a hydrogen atom or an alkyl group, m is an integer of 1 to 4, and n is an integer of 2 or more, at least one high-molecular weight compound, an inorganic filler, and at least one treating agent for said inorganic filler; its cured product; and a prepreg, a laminate sheet having a conductor layer, and a multilayer printed wiring board obtained by processing the conductor layer of the laminate sheet into wiring.

Abstract: Disclosed is a multilayer structure useful for preparing highly abrasion-resistant protective liners, including tubular articles such as multilayer tubes or pipes.

Abstract: A prepreg material infused with a bulk resin, where the bulk resin has shape memory alloy (SMA) particles intermixed in the resin to toughen the material when the material is used in an application and is cured. The SMA particles may be of various shapes and sizes. The material may form a prepreg fabric having interwoven fibers or a prepreg unidirectional tape having fibers oriented unidirectionally. Opposing surfaces of the material may be infused with quantities of bulk resin having different concentrations of SMA particles. The SMA particles may be mixed in the bulk resin while in their austenitic or martensitic states to suit the needs of specific applications.

Abstract: A flexible transparent conductive film is provided. The conductive film includes a hydrophilic transparent resin and silver nanowires distributed in the resin. A method for manufacturing the flexible transparent conductive film is also disclosed.

Abstract: Transparent conductive films comprising silver nanowires dispersed in cellulose ester polymers can be prepared by coating from organic solvent using common solvent coating techniques. These films have good transparency, conductivity, and stability. Coating on a flexible support allows the manufacture of flexible conductive materials.

Abstract: Provided is a curable resin composition that exhibits good heat resistance and low thermal expansion, and that realizes good solubility in solvents, a cured product thereof, a printed wiring board including the composition, a novel epoxy resin that imparts these properties, and a process for producing the same. A curable resin composition contains, as essential components, an epoxy resin (A) having, in its molecular structure, a glycidyloxy group and a skeleton in which a naphthalene structure and a cyclohexadienone structure are bonded to each other via methylene group(s); and a curing agent (B).

Abstract: Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.

Abstract: A hard armor composite includes a rigid facing and a ballistic fabric backing. The fabric backing is carried by the facing, and includes an array of bundled high-performance fibers. The fibers have a tensile strength greater than 7 grams per denier and a denier per filament ratio of less than 5.4.

Abstract: A composition useful as an impregnant for the making of laminates for printed wiring boards including an epoxy resin, a first cross-linking agent of a strene-maleic anhydride copolymer and a second co-cross-linking agent.

Abstract: Shaped articles with the inherent capability to evolve in response to at least one of external and internal stimuli are described. These articles comprise at least one solid electrolyte with at least one dissolved salt, and at least one interface which involves a solid electrolytes and a conductive solid. Electric potential gradients, generated within the solid electrolyte by at least one of external and internal stimuli, guide and drive the self-healing and adaptation phenomena.

Abstract: Disclosed are methods for manufacturing electromagnetic interference shields for use in nonconductive housings of electronic equipment. In one embodiment, the shield may include an electrically nonconductive substrate, such as a thermoformable film, coated with an electrically conductive element, such as an extensible ink or a combination of conductive fibers with an extensible film. In one embodiment, a compressible conductive perimeter gap gasket may be formed by using a form in place process.

Abstract: The invention relates to a laminate of metal sheets and fiber-reinforced polymer layers connected thereto. The laminate comprises at least one thick metal sheet with a thickness of at least 1 mm that is connected to the rest of the laminate by means of at least one fiber-reinforced polymer layer, the fiber volume content of which is at most 45 volume-%. The invention also relates to a method for producing the laminate as well as skin sheets reinforced with the laminate for an aircraft or spacecraft.

Abstract: This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 ?m.

Abstract: A metal/fiber laminate has a plurality of adjacent layers. Each layer is porous and includes an arrangement of fibers. At least one of the layers has its fibers coated with a metal. A polymer matrix permeates each such arrangement.

Abstract: Corrosion and chip-resistant coatings for high tensile steel components, such as automotive coil springs, are formed from a coating composition comprising a substantially non-zinc containing primer and a topcoat. The primer includes an epoxy resin having an epoxy equivalent weight of about 860 to about 930, a polyhydroxyl functional phenolic curing agent having a hydroxyl equivalent weight of about 200 to about 500, and a filler material. The topcoat includes an epoxy resin having an epoxy equivalent weight of about 520 to about 930, an elastomer-modified epoxy resin having an epoxy equivalent weight of about 1000 to about 1600, a carboxyl functional polyester with an acid number of about 45 to about 75 mg KOH/g, a foaming agent and a reinforcing fiber.

Abstract: A hard armor composite includes a rigid facing and a ballistic fabric backing. The fabric backing is carried by the facing, and includes an array of bundled high-performance fibers. The fibers have a tensile strength greater than 7 grams per denier and a denier per filament ratio of less than 5.4.

Abstract: A workpiece boring/cutting operation aiding plate material comprising a rubber-containing styrene resin composition and an inorganic filler, wherein these are compounded in a weight ratio of 80:20 to 40:60; and a molding making use of the same.

Abstract: This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 ?m.

Abstract: This invention discloses a fiber-reinforced polymeric casing and a method for manufacturing the same. According to this invention, the casing includes a multi-layer structure, an intermedium film, and a structural part. The multi-layer structure is formed by shaping and stacking up a plurality of layers of fiber-reinforced polymeric mats. The intermedium film is disposed on a surface of the multi-layer structure. The structural part includes a polymer and is one-step molded on the intermedium film together with the multi-layer structure.

Abstract: A laminated body of the present invention includes a resin layer in which a core portion composed of a fiber base member having a thickness of 25 ?m or less is embedded, the resin layer having two surfaces, and the resin layer through which at least one via-hole is adapted to be formed, and a metal layer bonded to at least one of the two surfaces of the resin layer, and the metal layer having at least one opening portion provided so as to correspond to the via-hole to be formed. Further, a method of manufacturing a substrate of the present invention includes preparing the above laminated body, forming the via-hole so as to pass through the resin layer by irradiating a laser beam onto the resin layer, and removing the metal layer from the resin layer after the via-hole is formed. Further, a substrate of the present invention is manufactured by using the above method. Furthermore, a semiconductor device of the present invention includes the above substrate, and a semiconductor element mounted on the substrate.

Abstract: A method of fabricating a metal/composite hybrid laminate is provided. One or more layered arrangements are stacked on a solid base to form a layered structure. Each layered arrangement is defined by a fibrous material and a perforated metal sheet. A resin in its liquid state is introduced along a portion of the layered structure while a differential pressure is applied across the laminate structure until the resin permeates the fibrous material of each layered arrangement and fills perforations in each perforated metal sheet. The resin is cured thereby yielding a metal/composite hybrid laminate.

Abstract: A hard armor composite includes a rigid facing and a ballistic fabric backing. The fabric backing is carried by the facing, and includes an array of bundled high-performance fibers. The fibers have a tensile strength greater than 7 grams per denier and a denier per filament ratio of less than 5.4.

Abstract: This invention concerns a thermosetting resin system that is useful in the manufacture of high performance prepreg, laminate and composite materials as well as the prepregs, laminates and composites made from the thermosetting resin composition.

Abstract: Composites are provided having improved strength and rigidity, with respect to mass or volume, as compared to known polymeric composites or polymeric composites in combination with metal reinforcement. The composites of the present invention are metallic-polymeric composites and are comprised of polymeric composites and metallic composites. Such metallic-polymeric composites provide for composite parts having improved strength and/or rigidity, with respect to mass or volume, compared to other composite parts. The composite parts of the present invention have potential utility, for example, as aerospace craft leading edges, bodies, panels, and control surfaces.

Abstract: An adhesive as a heat resistant rubber-based adhesive is applied to a region (peripheral region) of integration of a metal sheet (Al sheet) and a resin and to a region (peripheral region) of integration of a fiber sheet (CF sheet) and a resin. The metal sheet and fiber sheet are temporarily fixed to dry the adhesive, then, the joined article is accommodated in an injection molding machine, a polycarbonate resin is injected, and the joined article (metal sheet and fiber sheet) is integrally molded with the polycarbonate resin.

Abstract: A metallic layer material includes at least two metal sheets. Each sheet has a thickness of less than 1.5 mm. Between the sheets, a plastic layer is disposed, which is bonded to the metal sheets. The plastic layer comprises a plastic material and basalt fibers, and the basalt fibers have a modulus of elasticity exceeding 50 GPa. The basalt fibers may constitute 35-75% of the volume of the plastic layer. and may be comprised of 35-55 weight % of SiO2, 10-25 weight % of Al2O3, and 3-10 weight % of MgO. In aerospace applications and other applications requiring good specific strength, stiffness and damage tolerance, the metal sheets may be made of a metal having a tensile strength exceeding 0.20 GPa.

Abstract: A damping structure which dispenses of the connection of a resistor used for a conventional damping structure and undergoes diverse molding processings with a simpler structure, and a laminate damping base material constituting such a damping structure. A laminate damping base material made of a piezoelectric ceramic material or piezoelectric polymer material and a conductive fiber-reinforced plastic (FRP) composition is prepared. One to a plurality of this base material are stacked to constitute a first damping structure. A second damping structure is constituted by stacking at least a layer of piezoelectric polymer film or piezoelectric ceramic thin film between a multilayer laminate that is a laminate of conductive laminate FRP base materials.

Abstract: The present invention is directed to a prepreg comprising a fiber base material impregnated with a resin composition which comprises a polyamide-imide resin and a thermosetting resin as essential components, and a metal-clad laminated sheet obtained by pressing the prepreg and a metal foil having a surface roughness: Rz?3.0 together while heating. In addition, the present invention provides a heat-resistant laminated sheet which is excellent in micro-wiring formation properties, thermal shock resistance, reflow resistance, and crack resistance.

Abstract: This invention concerns a thermosetting resin system that is useful in the manufacture of high performance prepreg, laminate and composite materials as well as the prepregs, laminates and composites made from the thermosetting resin composition.

Abstract: A resin molded component, comprising metal coating treatment being provided on the surface by a physical deposition method chosen from among sputtering, vacuum deposition, and ion plating after the surface is activated by plasma treatment, and is produced by forming a resin composition combined a base resin comprising of a thermoplastic resin or a thermosetting resin with a rubber-like elastic material.

Abstract: Ballistically resistant and fire resistant composite articles for aircraft interiors and other applications. Composite articles are provided having a flexural modulus of at least about 80,000 lbs/sq. in (552 MPa), a flexural strength at yield of at least about 800 lbs/sq. in. (5.52 MPa), an areal density of about 0.9 lb/ft2 (4.40 kg/m2) to about 1.5 lb/ft2 (5.86 kg/m2), a fire resistance meeting the requirements of §25.853 Title 14 of the United States Code, Jan. 1, 2002, and a V0 velocity of at least about 1430 ft/sec (427 m/s) when tested by United States Federal Aviation Administration Advisory Circular 25.795.2, 10 Jan. 2002, using .44 Magnum Jacketed Hollow Point (JHP) bullets of 240 grains (15.6 g) mass and using 9 mm Full Metal Jacketed, Round Nose (FMJ RN) bullets of 124 grains (8.0 g) mass.

Abstract: Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.

Abstract: A method of rendering a surface of a metal substrate substantially acid impervious. The method includes first placing the surface in a field of treatment, then depositing a mixture of a high-temperature resistant polymer particulate such as polyamide particulate and a curable powder adhesive on the surface, and finally subjecting the surface-coated metal substrate to a curing treatment sufficient to cure the powder adhesive and thereby adhere the polymer particulate as a film on the surface. A steel substrate coated in accord with the present methodology is particularly useful as a curing fixture upon which resin-impregnated fiber of polymer composite material is placed to thereby give molded parts made therefrom a desired shape. Production of a part is accomplished by vacuum bagging the composite material to the steel fixture and curing the so-produced part in place on the fixture in an autoclave at an elevated temperature.

Abstract: The present invention discloses a seating system that includes a seat back (20) with one or more plastic panels (22) that extend across a lateral distance of the seat back (20). The seat back (20) preferably includes one or more reinforcements (30) attached to the plastic panels (22).