Three Or More Layers Patents (Class 428/354)
  • Patent number: 11135614
    Abstract: Methods of applying a polymeric coating to a rear face surface of golf club heads with variable face thickness are disclosed herein. The coating, which preferably comprises polyurea, improves the durability of the face and reduces the hits to failure ratio of the golf club head. The coating improves the performance of the golf club head because it allows for reduction in overall face thickness and easy post-process manipulation to allow for fine-tuning of mass properties after production. The reduction in thickness leads to overall weight reduction, because the polymer is roughly a quarter of the density of titanium or stainless steel, and also reinforces the face, thereby increasing the lifespan of the club.
    Type: Grant
    Filed: July 3, 2020
    Date of Patent: October 5, 2021
    Assignee: Callaway Golf Company
    Inventors: Nathan Samuel Reed, Denver Holt
  • Patent number: 11119533
    Abstract: An electronic device includes a device screen having an active region where the screen can provide output to a user or receive input from the user. A screen outer layer, such as a removable screen protector, is positionable between the device screen and the user and capable of passing the output or the input therethrough. The screen outer layer includes an active region that corresponds to the active region of the device screen, and the screen outer layer has an etched marking in the active region of the screen outer layer. In one version, the etched marking is provided on the inner surface. A method of using an electronic device includes installing on a device screen a screen outer layer, wherein the screen outer layer includes an active region that corresponds to the active region of the device screen, and wherein the screen outer layer has an etched marking in the active region of the screen outer layer.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: September 14, 2021
    Inventor: Courtney Harris
  • Patent number: 11118088
    Abstract: An adhesive article including: a flexible backing; a first cushion layer permanently bonded to a first surface of the flexible backing, wherein the first cushion layer: has an average thickness of at least 10 micrometers; and includes an acrylate pressure-sensitive adhesive having a Fox Tg of up to ?30° C., wherein the acrylate pressure-sensitive adhesive includes a (meth)acrylate copolymer; and a first continuous shell layer adjacent the first cushion layer, wherein: the first continuous shell layer has an average thickness of up to 25 micrometers; the ratio of the first cushion layer average thickness to the first shell layer average thickness is at least 2:1; the first continuous shell layer includes an adhesive having a Fox Tg of ?20° C. to +50° C.; and the first continuous shell layer adhesive includes a copolymer having a weight average molecular weight of at least 100,000 Daltons.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: September 14, 2021
    Assignee: 3M Innovative Properties Company
    Inventors: David J. Yarusso, Ross E. Behling, Peter M. Simone, Chaodi Li, Zhong Chen, Sharon Wang, Jingjing Ma, Eric D. Shockey
  • Patent number: 11060654
    Abstract: A multilayer tape assembly is described which can be used with insulation jacketing and particularly for self sealing lap (SSL) applications. The tape assembly includes two adhesive layers with associated carrier and release layers in conjunction with a differential release system. Various methods of use are also described.
    Type: Grant
    Filed: May 12, 2016
    Date of Patent: July 13, 2021
    Assignee: Avery Dennison Corporation
    Inventor: David J. Shuey
  • Patent number: 11029772
    Abstract: A transparent conductive laminated structure and touch panel are disclosed. The transparent conductive laminated structure comprises a first conductive film including a first surface and a second surface opposing the first surface. A first adhesive layer is disposed on the first surface of the first conductive film, and a protective film is disposed on the first adhesive layer. A peeling strength between the first adhesive layer and the first conductive film is greater than a peeling strength between the first adhesive layer and the protective film.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: June 8, 2021
    Assignee: Cambrios Film Solutions Corporation
    Inventors: Yung-Cheng Chang, Chia-Sheng Liao, Chung-Chin Hsiao
  • Patent number: 11031565
    Abstract: A display device and a method of manufacturing a display device are provided. A manufacturing method of a display device includes: forming a display module including a first area defined therein, the display module including a display panel including a lower surface and an upper surface opposite the lower surface, a first film under the lower surface of the display panel, a second film on the upper surface of the display panel, and an adhesive layer between the lower surface of the display panel and the first film; and irradiating a laser beam in an upper direction extending from the lower surface of the display panel to the upper surface of the display panel to cut the first film and the adhesive layer along an edge of the first area, the laser beam provided to the display panel having a laser power equal to or less than about 1 W.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: June 8, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventors: Kyoungil Min, Taehyun Sung, Hyungu Lee, Junshik Park
  • Patent number: 10983377
    Abstract: Provided is a PSA sheet that can be processed with excellent precision while providing excellent light-blocking properties in an in-plane direction and in the thickness direction in an embodiment where the support substrate has a limited thickness. The PSA sheet has a support substrate having a thickness less than 75 ?m and a PSA layer placed at least on one face of the support substrate. The PSA sheet has light transmittances of 0.04% or lower in XY and Z directions thereof.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: April 20, 2021
    Assignee: NITTO DENKO CORPORATION
    Inventors: Masataka Nishiwaki, Kazuki Minoura, Kenta Jozuka, Naohiro Kato
  • Patent number: 10950481
    Abstract: A method for manufacturing a thin substrate uses a temporary adhesive film for substrate processing for temporarily adhesion of a substrate to a support on a surface of the substrate opposite to a surface to be processed, the temporary adhesive film for substrate processing containing a siloxane bond-containing polymer having a weight average molecular weight of 3,000 to 500,000 in an amount of 10 parts by mass or more and 100 parts by mass or less relative to 100 parts by mass; and includes: (a) laminating the temporary adhesive film for substrate processing onto the support and/or the surface of the substrate opposite to the surface to be processed; (b) bonding thereof under reduced pressure; (c) processing the substrate by grinding or polishing; (d) treating the substrate with acid or base; (e) other processing; (f) separating the processed substrate from the support; and (g) cleaning the substrate.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: March 16, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Masahito Tanabe, Michihiro Sugo
  • Patent number: 10947326
    Abstract: An adhesive composition comprising (a) a (meth)acrylic polymer, (b) a compound having at least two (meth)acryloyl groups, (c) a polymerization initiator and (d) a filler.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: March 16, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Sadaaki Katou, Takuya Komine, Shinjiro Fujii
  • Patent number: 10918588
    Abstract: Described herein are block copolymers having hydrophobic blocks and hydrophilic blocks which are effective in binding to the surface of hard tissue; compositions comprising the same, as well as methods of making and using the same.
    Type: Grant
    Filed: November 8, 2013
    Date of Patent: February 16, 2021
    Assignees: Colgate-Palmolive Company, Howard University
    Inventors: Tongxin Wang, Yanda Lei, James W. Mitchell, Lynette Zaidel, Jian-hong Qiu, Mahmoud Hassan
  • Patent number: 10920114
    Abstract: A label having a silicone-free (water-based) release coating and compatible adhesive patch is provided. The label includes a thermally coated substrate having a silicone-free substrate overlaid thereon of a first surface. A second surface includes a microsphere adhesive layer.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: February 16, 2021
    Assignee: Iconex LLC
    Inventors: Martha Patricia Wild, Marcus Eugene Wilker, Tuan Anh Nguyen Le, Jessica Darlene Watkins
  • Patent number: 10908458
    Abstract: A backlight module includes: a light guide plate, having a light incoming side and a light outgoing face; a rubber frame, arranged at four edges of the light guide plate; an optical film, arranged on the light outgoing face of the light guide plate and having four edges, where at least a portion of at least one edge among the four edges of the optical film exceeds an edge of the light guide plate and is placed on the rubber frame such that the rubber frame supports the optical film; and a spacer, where the spacer is located on the portion of the at least one edge of the optical film that is placed on the rubber frame and are located on a surface of the optical film away from the rubber frame, and the spacer is used to support a display panel on the backlight module.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: February 2, 2021
    Assignees: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Hui Wang, Xiaoming Meng
  • Patent number: 10886153
    Abstract: Micro pick-and-bond heads, assembly methods, and device assemblies. In, embodiments, micro pick-and-bond heads transfer micro device elements, such as (micro) LEDs, en masse from a source substrate to a target substrate, such as a LED display substrate. Anchor and release structures on the source substrate enable device elements to be separated from a source substrate, while pressure sensitive adhesive (PSA) enables device elements to be temporarily affixed to pedestals of a micro pick-and bond head. Once the device elements are permanently affixed to a target substrate, the PSA interface may be defeated through peeling and/or thermal decomposition of an interface layer.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: January 5, 2021
    Assignee: Intel Corporation
    Inventors: Peter L. Chang, Chytra Pawashe, Michael C. Mayberry, Jia-Hung Tseng
  • Patent number: 10852463
    Abstract: The invention provides a reflection film in which generation of side lobes derived from a cholesteric liquid crystalline layer is suppressed. A reflection film of the invention includes: a first cholesteric liquid crystalline layer which is formed of a composition including a first liquid crystal compound; and a second cholesteric liquid crystalline layer which is disposed at least on one surface of the first cholesteric liquid crystalline layer and formed of a composition including a second liquid crystal compound, in which a helical pitch length of the first cholesteric liquid crystalline layer is constant, a birefringence ?n2 of the second liquid crystal compound is smaller than a birefringence ?n1 of the first liquid crystal compound, and a helical pitch number of the second cholesteric liquid crystalline layer is a half or less of a helical pitch number of the first cholesteric liquid crystalline layer.
    Type: Grant
    Filed: January 19, 2020
    Date of Patent: December 1, 2020
    Assignee: FUJIFILM Corporation
    Inventor: Shigeaki Nimura
  • Patent number: 10752388
    Abstract: An edge folding apparatus. The edge folding apparatus includes a fixed base having a horizontal track. A fixed guide block includes either a channel or a peg. The channel includes a horizontal portion leading to a vertical portion. A sliding base is slidably coupled to a horizontal track. The sliding base includes a vertical track. A tool mount block is slidably coupled to the vertical track. The tool mount block includes the other of the channel or the peg. The peg slides along and is guided by the channel. A first linear actuator pushes the sliding base along the horizontal track and a second linear actuator pushes the tool mount block along the vertical track.
    Type: Grant
    Filed: February 22, 2018
    Date of Patent: August 25, 2020
    Inventors: Richard H. Rahm, Stephen H. Rahm
  • Patent number: 10696880
    Abstract: Provided are a polyester-based pressure-sensitive adhesive composition having high wetting ability and superior adherability and light peelability, and a pressure-sensitive adhesive sheet produced with such a pressure-sensitive adhesive composition. The polyester-based pressure-sensitive adhesive composition includes a polyester obtained by polycondensation of a difunctional or polyfunctional carboxylic acid and a diol; a fatty acid ester; and a crosslinking agent, wherein the polyester has a weight average molecular weight of 8,500 to 50,000, and the fatty acid ester has no additional functional group and has a molecular weight of 200 to 700. The polyester-based pressure-sensitive adhesive composition contains 10 to 150 parts by weight of the fatty acid ester based on 100 parts by weight of the polyester.
    Type: Grant
    Filed: January 16, 2015
    Date of Patent: June 30, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Satomi Yoshie, Shigeki Ishiguro, Akiko Tanaka
  • Patent number: 10640672
    Abstract: The invention relates to an acrylic layer (in the form of a coating, film or sheet) useful as part of a photovoltaic module backsheet. The acrylic layer contains at least 40 percent of one or more acrylic polymers, including an acrylic polymer matrix and optionally acrylic impact modifiers. The acrylic polymer is preferably a polymer, copolymer, or terpolymer containing at least 50 weight percent of methylmethacrylate monomer units. The acrylic layer is flexible and optionally contains high levels of white pigment. It may also contain fluoropolymers such as polyvinylidene fluoride to improve weathering, processibility and film formation. The acrylic layer adheres to a polymer support layer such as polyethylene terephthalate (PET). A preferred substrate is PET that is pre-treated to improve adhesion, but unprimed PET can also be used. The backsheet provides excellent weatherability, environmental stability and reflectivity as part of a photovoltaic module.
    Type: Grant
    Filed: March 1, 2010
    Date of Patent: May 5, 2020
    Assignee: Arkema France
    Inventors: Jiaxin Jason Ge, Rong Maria Hu, Mark A. Aubart, Robert A. Wanat
  • Patent number: 10558071
    Abstract: The present invention is directed to an optical bonding apparatus with multiple layer structure including a pressure sensitive bonding layer and a thermal flow pressure sensitive bonding layer. The thermal flow pressure sensitive bonding layer is used for bonding to a rough surface of an object and superposing on the pressure sensitive bonding layer.
    Type: Grant
    Filed: September 7, 2010
    Date of Patent: February 11, 2020
    Assignee: TPK TOUCH SOLUTIONS (XIAMEN) INC.
    Inventors: Yuhwen Lee, Xianbin Xu, Qiong Yuan, Fengming Lin
  • Patent number: 10556409
    Abstract: Provided is a polyethylene film showing more excellent blocking resistance in unwinding from the film roll state and more excellent blocking resistance between sealants after lamination with a base material, and having transparency and excellent heat sealing property even at low temperatures. A polyethylene film wherein in at least either face, a ratio between an arithmetic mean roughness in a machine direction of film (Ra(MD)), and an arithmetic mean roughness in a direction perpendicular to the machine direction (Ra(TD)) satisfies the following formula (1): 1.2?Ra(TD)/Ra(MD)?3.6??(1) (Ra(MD): arithmetic mean roughness [?m] measured in the machine direction of film, and Ra(TD): arithmetic mean roughness [?m] measured in the direction perpendicular to the machine direction of film).
    Type: Grant
    Filed: March 22, 2016
    Date of Patent: February 11, 2020
    Assignee: TOYOBO CO., LTD.
    Inventors: Wakato Tomatsu, Hirokazu Ogi, Akira Matsuda
  • Patent number: 10556407
    Abstract: Provided is a polyethylene film that is more excellent in blocking in unwinding the film in the film roll state, and more excellent in blocking between sealants after lamination with a base material, and also having transparency and excellent heat sealing property even at low temperatures. A polyethylene film wherein in at least either face, a ratio between an arithmetic mean inclination angle in a machine direction of film (R?a (MD) [°]), and an arithmetic mean inclination angle in a direction perpendicular to the machine direction (R?a (TD) [°]) satisfies the following formula (1): 1.2?R?a(TD)/R?a(MD)?3.6??(1) (R?a (MD): arithmetic mean inclination angle measured in the machine direction of film, and R?a (TD): arithmetic mean inclination angle measured in the direction perpendicular to the machine direction of film).
    Type: Grant
    Filed: March 22, 2016
    Date of Patent: February 11, 2020
    Assignee: TOYOBO CO., LTD.
    Inventors: Wakato Tomatsu, Hirokazu Ogi, Akira Matsuda
  • Patent number: 10526513
    Abstract: There are provided a composition for forming an adhesive layer of a dicing film, including: a polymer additive including at least one polymer selected from the group consisting of a polymer containing a (meth)acrylate-based functional group and a non-polar functional group, a (meth)acrylate-based polymer containing at least one fluorine, and a silicon-modified (meth)acrylate-based polymer containing a reactive functional group; an adhesive binder; and a photoinitiator, wherein a weight ratio of the polymer additive to the adhesive binder is 0.01% to 4.5%, a dicing film including an adhesive layer including the composition, a dicing die bonding film including the dicing film, and a method for dicing a semiconductor wafer using the dicing die bonding film.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: January 7, 2020
    Assignee: LG CHEM, LTD.
    Inventors: Young Kook Kim, Hee Jung Kim, Se Ra Kim, Jung Ho Jo, Jung Hak Kim, Seung Hee Nam, Kwang Joo Lee
  • Patent number: 10487246
    Abstract: The adhesive sheet for bonding an unvulcanized rubber to a metal, including, a release film, which includes a first film layer made of polypropylene and a second film layer made of polyethylene terephthalate, and which is formed as an integrated film, an upper adhesive layer obtained by applying a solvent dispersed type vulcanization adhesive having reactivity with the unvulcanized rubber to a side of the first film layer of the release film and drying the solvent dispersed type vulcanization adhesive, and a lower adhesive layer obtained by, after drying the upper adhesive layer, applying an adhesive having reactivity with the metal onto the upper adhesive layer, and by drying the adhesive.
    Type: Grant
    Filed: March 11, 2015
    Date of Patent: November 26, 2019
    Assignee: NAKASHIMA RUBBER INDUSTRY CO., LTD.
    Inventors: Mikio Nakashima, Yoshikuni Takata, Takemi Yoshizumi, Rikito Eguchi
  • Patent number: 10479133
    Abstract: A film for molding has an annular olefin-based resin as the main component thereof and is characterized by an X surface and a Y surface both having a surface glossiness of no more than 50%, when one surface is the X surface and the other surface is the Y surface. The film has excellent winding properties during processing, has high design properties and excellent fingerprint wipe-off properties for the surface of product members (molded members after molding and decoration) when the film is used as a transfer foil for molding.
    Type: Grant
    Filed: June 24, 2015
    Date of Patent: November 19, 2019
    Assignee: Toray Industries, Inc.
    Inventors: Yutaka Kitamura, Hisataka Tabata
  • Patent number: 10479912
    Abstract: The embodiment examples of the present invention relate to a double-sided adhesive sheet and a display device for a touch panel including the same. The double-sided adhesive sheet, according to the embodiment examples of the present invention, comprises a transparent acryl-based resin layer as a substrate, can provide a double-sided adhesive sheet which can be detached and recycled after attaching to the touch panel and a display device module, by means of the adhesive agent layers that are formed on both sides having different detaching force, can improve visibility of the display device by being coupled between the touch panel and the display device module for eliminating an air gap, and can minimize the difference in the bending rate of each layer of the double-sided adhesive sheet for eliminating visibility exhaustion as much as possible.
    Type: Grant
    Filed: November 11, 2011
    Date of Patent: November 19, 2019
    Assignee: LG Chem, Ltd.
    Inventors: Jang-Soon Kim, James Jung, Sang-Hun Choi, Young-Myung Gee, Hyung-Min Cha, No-Woong Park, Se-Hee Park, Hyun-Ju Cho
  • Patent number: 10428243
    Abstract: A method of assembling a door on a vehicle begins by identifying critical fit areas between the door seal and the door frame. Pressure indicator tape is adhered to the seal in critical fit areas and the door is closed against the seal to produce a marking on the pressure indicator tape. Intensity of the marking is visually compared to a reference pressure intensity scale to establish an observed pressure intensity level. The observed pressure intensity level may be recorded, correlated to a specific critical fit area and analyzed to make operational and design improvements to the door, door frame or seal.
    Type: Grant
    Filed: December 6, 2016
    Date of Patent: October 1, 2019
    Assignee: FORD MOTOR COMPANY
    Inventors: Hossein Jacob Sadri, Stephen Juszczyk
  • Patent number: 10421889
    Abstract: A pressure-sensitive adhesive comprising at least 60 wt % of a polymer blend, where the polymer blend consists of a first polymer component A, a second polymer component B, and optionally one or more further polymer components (C, D, . . . ), where the first polymer component A is present at not less than x wt % in the polymer blend, where 90?x?99, and where the second polymer component B and any further polymer components C, D, . . . present are present in total at y wt % in the polymer blend, where y=100?x, where each polymer component (A, B, C, . . . ) derives to an extent of at least 60 wt % from (meth)acrylic monomers, wherein none of the polymer components (A, B, C, . . . ) is homogeneously miscible at room temperature with any of the other polymer components (A, B, C, . . . ), and so a multi-phase system is present.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: September 24, 2019
    Assignee: TESA SE
    Inventors: Benjamin Pütz, Nils Thebud, Lisa Wieghardt
  • Patent number: 10403819
    Abstract: A pixel define layer and manufacturing method thereof and the related light emitting display are disclosed. The pixel define layer is arranged on a conductive layer of a substrate and comprises a base film layer. The base film layer has a plurality of openings each of which corresponds to a light-emitting region of a sub-pixel unit. A spacing base body is formed between the adjacent openings. An upper surface of each spacing base body is coated with a hydrophobic quantum dot material and a side wall of each opening is coated with a hydrophilic quantum dot material. With the pixel define layer and manufacturing method thereof and the related light emitting display according to embodiments of the disclosure, the ink within the sub-pixel would not ooze to the outside of the sub-pixel to result in color mixture between the adjacent sub-pixels, and the light emitting region within the pixel would not be decreased. By selecting suitable quantum dot materials, the photochromic efficiency can be improved.
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: September 3, 2019
    Assignee: BOE Technology Group Co., Ltd.
    Inventors: Hsiao-Wen Hung, Hao-Chih Hung
  • Patent number: 10351736
    Abstract: Provided are an adhesive composition and an organic electronic device (OED) including the same, and particularly, an adhesive composition, which may form a structure effectively blocking moisture or oxygen flowing into an OED from the outside, realize a top-emission OED and exhibit excellent handleability and processability, and an OED including the same.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: July 16, 2019
    Assignee: LG Chem, Ltd.
    Inventors: So Young Kim, Seung Min Lee, Jung Sup Shim, Se Woo Yang
  • Patent number: 10344192
    Abstract: A thermo-reversible adhesive composition containing a base resin, methyl acetoacetate, and a metal-organic complex compound having the formula M(X)n(R)o, wherein: M is a metal selected from the group consisting of aluminum, iron, and nickel, X is acetylacetonate, R is H2O, n is an integer equal to 2 or 3, and o is an integer greater than or equal to 0 and less than or equal to 2, such that n+o is equal to 3 or 4.
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: July 9, 2019
    Assignees: Samsung Electronics Co., Ltd., GUARDNEC Co., Ltd.
    Inventors: Yongbeom Kim, Kiho Park, Bowon Jung, Bugon Kim, Jaeik Song, Wonseok Choi
  • Patent number: 10287465
    Abstract: The purpose of the present invention is to provide: a polyester-based pressure-sensitive adhesive layer, for which a pressure-sensitive adhesive composition (pressure-sensitive adhesive solution) without any acrylic pressure-sensitive adhesive or the like which needs a large amount of an organic solvent and is difficult to apply thickly; to provide a polyester-based pressure-sensitive adhesive layer that is friendly to the global environment, can be applied thickly, has a high level of cost effectiveness and workability, and also has a high level of adhesion, retention, and repulsion resistance; and to provide a pressure-sensitive adhesive tape or double-sided pressure-sensitive adhesive tape having such a pressure-sensitive adhesive layer.
    Type: Grant
    Filed: March 4, 2014
    Date of Patent: May 14, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Akiko Tanaka, Shigeki Ishiguro, Satomi Yoshie
  • Patent number: 10253218
    Abstract: An adhesive tape includes: a sheet-like base; an undercoat layer that is laminated on the base and contains an acid modified compound; and an adhesive agent layer that is laminated on the undercoat layer and contains butyl rubber, an alicyclic saturated hydrocarbon resin and a multifunctional epoxy-based compound.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: April 9, 2019
    Assignee: MAXELL HOLDINGS, LTD.
    Inventors: Tadahiko Nakagawa, Masahiro Saigo, Akiyoshi Masuda
  • Patent number: 10241250
    Abstract: An adhesive composition for polarizing plates includes a (meth)acrylic copolymer prepared by copolymerization of a monomer mixture and a curing agent. The monomer mixture includes a hydroxyl group-containing (meth)acrylic monomer, a tertiary amine group-containing (meth)acrylic monomer and a monomer having a glass transition temperature (Tg) of about 100° C. or greater. The adhesive composition has a gel fraction of about 50% or greater after aging for 12 hours. An adhesive film is formed from the adhesive composition. An optical display includes the adhesive film.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: March 26, 2019
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Irina Nam, Inga Tuzovskaya, Young Jong Kim, Il Jin Kim, Hwan Sung Cheon
  • Patent number: 10203420
    Abstract: A cathode conductive strip can be attached to a semiconductor radiation sensor by using a double sided dual adhesive electrically conductive tape in a sensor assembly or a detector module to provide reliable electrical connection between the semiconductor radiation sensor and the cathode conductive strip. The double sided dual adhesive electrically conductive tape includes an electrically conductive backing with two different adhesion strength adhesives on both sides. The high adhesion strength side is bonded to the cathode electrode of the semiconductor radiation sensor. The lower adhesion strength side is bonded to the conductive face of the cathode conductive strip.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: February 12, 2019
    Assignee: REDLEN TECHNOLOGIES, INC.
    Inventors: Pinghe Lu, Michael Ayukawa, Christopher Read, Robert Crestani, Jeffrey Walton
  • Patent number: 10174224
    Abstract: Provided is a urethane adhesive composition for a touch panel having a glass transition temperature between ?20° C. to ?50° C., and which, as a cured composition, has an elasticity of 50,000 Pa to 70,000 Pa at 60° C. to 80° C.
    Type: Grant
    Filed: August 7, 2013
    Date of Patent: January 8, 2019
    Assignee: LG Chem, Ltd.
    Inventors: Chan Oh Yoon, Eun Kyung Park, Jaegwan Lee, Jang Soon Kim, Bu Gi Jung, Sung Chan Park, Won Ho Kim
  • Patent number: 10174229
    Abstract: An adhesive bonding method that includes bonding a handling wafer to a front side surface of a device wafer with an adhesive comprising N-substituted maleimide copolymers. The device wafer may then be thinned from the backside surface of the device wafer while the device wafer is adhesively engaged to the handling wafer. The adhesive can then be removed by laser debonding, wherein the device wafer is separated from the handling wafer.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: January 8, 2019
    Assignee: International Business Machines Corporation
    Inventors: Robert D. Allen, Jeffrey Gelorme, Li-Wen Hung, Ratnam Sooriyakumaran, Linda K. Sundberg
  • Patent number: 10131178
    Abstract: The present invention relates to a layer structure having improved properties for laser engraving, to particular embodiments of said layer structures in the form of co-extrusion films, and to security documents, preferably identification documents having said layer structures.
    Type: Grant
    Filed: January 23, 2010
    Date of Patent: November 20, 2018
    Assignee: Covestro Deutschland AG
    Inventors: Heinz Pudleiner, Mehmet-Cengiz Yesildag, Georgios Tziovaras, Joerg Nickel, Klaus Meyer
  • Patent number: 10106713
    Abstract: A wafer processing laminate including a support, a temporary adhesive material layer formed on the support, and a wafer, having a circuit-forming front surface and back surface to be processed, laminated on the temporary adhesive material layer, in which the temporary adhesive material layer is composed of a complex temporary adhesive material layer having a three-layered structure including a first temporary adhesive layer composed of a thermoplastic organopolysiloxane polymer layer releasably adhering to the front surface of the wafer, second temporary adhesive layer composed of thermosetting siloxane-modified polymer layer releasably laminated on the first temporary adhesive layer, and third temporary adhesive layer composed of thermosetting siloxane polymer layer releasably laminated on the second temporary adhesive layer and releasably adhering to the support.
    Type: Grant
    Filed: January 21, 2015
    Date of Patent: October 23, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Shohei Tagami, Michihiro Sugo
  • Patent number: 10105930
    Abstract: A laminated film can be easily used by general users and can prevent entry of foreign substances and air bubbles between the attached surfaces even when the film is manually attached in a typical room environment in which foreign substances such as dust are floating. A film attachment method using such a laminated film is also disclosed. In an embodiment, the laminated film includes: a first surface protective film; a foreign-substance-removing adhesive layer; a foreign-substance-removing film; an integrating adhesive layer; a second surface protective film; a substrate-attaching adhesive layer; and a functional film, the substrate-attaching adhesive layer exhibiting a higher bond strength with the functional film than with the second surface protective film.
    Type: Grant
    Filed: February 18, 2015
    Date of Patent: October 23, 2018
    Assignee: SHARP KABUSHIKI KAISHA
    Inventor: Nobuaki Yamada
  • Patent number: 10093840
    Abstract: The present invention provides an adhesive composition comprising a tertiary amine group-containing acrylic copolymer and a sulfonate group-containing acrylic copolymer, a polarizing plate and a liquid crystal display device comprising the adhesive composition. The adhesive composition of the present invention comprises a tertiary amine group-containing acrylic copolymer and a sulfonate group-containing acrylic copolymer wherein an ionic functional group can be introduced by cross-linking reaction thereof, thereby exhibiting good antistatic properties and excellent durability.
    Type: Grant
    Filed: June 4, 2015
    Date of Patent: October 9, 2018
    Assignee: DONGWOO FINE-CHEM CO., LTD.
    Inventor: Han Young Choi
  • Patent number: 10046541
    Abstract: A surface with selectable adhesion is achieved by a shape memory alloy that is at least partly coated with a polymer forming a surface structure, thus allowing the adhesion force of the surface to be controlled.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: August 14, 2018
    Assignee: Leibniz-Institut fuer Neue Materialien gemeinnuetzige GmbH
    Inventors: Andreas Simon Schneider, Elmar Kroner, Jessica Kaiser, Mareike Frensemeier, Eduard Arzt
  • Patent number: 10043996
    Abstract: Provided are a resin composition for element encapsulation for organic electronic devices which is transparent, has excellent flexibility, water vapor barrier properties, and adhesive force, and can suppress the generation of dark spots, a resin sheet for element encapsulation for organic electronic devices, an organic electroluminescent element, and an image display device. This adhesive resin composition for element encapsulation for organic electronic devices is used to seal an element for organic electronic devices, and is characterized by containing a diene polymer and a softening agent, in which the content of the softening agent is from 5% by mass to 30% by mass of the total mass.
    Type: Grant
    Filed: September 28, 2015
    Date of Patent: August 7, 2018
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Masami Aoyama, Tetsuya Mieda, Keiji Saito, Kunihiko Ishiguro, Toshimitsu Nakamura, Naoaki Mihara, Takumi Asanuma
  • Patent number: 10005304
    Abstract: A microencapsulated pigment including a leuco dye system is incorporated as one or more layers in a roll of adhesive tape. The tape is applied and may be rubbed by hand or another object to induce a color change. The change may serve as an indicator that the tape is well adhered for masking purposes in a painting operation, or to present a design where only selected portions of the tape are rubbed to induce the color change. The microencapsulated pigment may be constructed so that the color change is irreversible or reversible.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: June 26, 2018
    Assignee: Chromatic Technologies, Inc.
    Inventors: Terrill Scott Clayton, Timothy J. Owen, Patrick Edson
  • Patent number: 9941145
    Abstract: A temporary bonding arrangement for wafer processing is provided comprising a first temporary bond layer (A) of thermoplastic resin, a second temporary bond layer (B) of thermosetting siloxane polymer, and a third temporary bond layer (C) of thermosetting polymer. Layer (B) is cured with a curing catalyst contained in layer (A) which is laid contiguous to layer (B). An adhesive layer of uniform thickness is formed without insufficient step coverage and other failures.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: April 10, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Masahito Tanabe, Michihiro Sugo, Hiroyuki Yasuda
  • Patent number: 9887118
    Abstract: A wafer processing laminate including a support, a temporary adhesive material layer formed on the support, and a wafer laminated on the temporary adhesive material layer, the wafer having a circuit-forming front surface and back surface to be processed, wherein the temporary adhesive material layer includes a complex temporary adhesive material layer having two-layered structure including a first temporary adhesive layer composed of a thermoplastic organopolysiloxane polymer layer (A) having a film thickness of less than 100 nm and a second temporary adhesive layer composed of a thermosetting siloxane-modified polymer layer (B), the first temporary adhesive layer being releasably laminated to the front surface of the wafer, the second temporary adhesive layer being releasably laminated to the first temporary adhesive layer and the support. A temporary adhesive material for a wafer processing which withstand a thermal process at high temperature exceeding 300° C.
    Type: Grant
    Filed: September 8, 2015
    Date of Patent: February 6, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Shohei Tagami, Michihiro Sugo, Masahito Tanabe, Hideto Kato
  • Patent number: 9850406
    Abstract: An adhesive bonding method that includes bonding a handling wafer to a front side surface of a device wafer with an adhesive comprising N-substituted maleimide copolymers. The device wafer may then be thinned from the backside surface of the device wafer while the device wafer is adhesively engaged to the handling wafer. The adhesive can then be removed by laser debonding, wherein the device wafer is separated from the handling wafer.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: December 26, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Robert D. Allen, Jeffrey Gelorme, Li-Wen Hung, Ratnam Sooriyakumaran, Linda K. Sundberg
  • Patent number: 9829731
    Abstract: A liquid crystal display and a double sided tape therefor are provided. The liquid crystal display comprises: a liquid crystal panel; a backlight unit comprising a back plate, a set of optical films, and a frame; and a double sided tape comprising a first surface coated with a first adhesive and connected to the liquid crystal panel through the first adhesive, and a second surface coated with a second adhesive and connected to the back plate and the set of optical films respectively through the second adhesive. The adhesion strength of the first adhesive on the liquid crystal panel is lower than that of the second adhesive on the set of optical films. After the backlight unit is separated from the liquid crystal panel, the double sided tape can be left on the optical films and the frame. Therefore, the position relationship among the films within the set of optical films would not be damaged, ensuring that the reassembled liquid crystal display can work normally.
    Type: Grant
    Filed: December 24, 2014
    Date of Patent: November 28, 2017
    Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Gege Zhou
  • Patent number: 9745494
    Abstract: A pressure-sensitive adhesive composition for an optical film, a method of preparing a pressure-sensitive adhesive for an optical film, a polarizing plate and a liquid crystal display are provided. The pressure-sensitive adhesive composition may be effectively coated even when a coating solid content is controlled to be high. Therefore, productivity in formation of a pressure-sensitive adhesive or manufacture of an optical film such as a polarizing plate may be significantly increased, and excellent durability and reliability and re-workability may be exhibited after the pressure-sensitive adhesive is prepared.
    Type: Grant
    Filed: September 19, 2013
    Date of Patent: August 29, 2017
    Assignee: LG CHEM, LTD.
    Inventors: No Ma Kim, In Ho Hwang, In Kyu Park, Sung Soo Yoon, Min Ki Lee
  • Patent number: 9731665
    Abstract: A protector and wire harness according to which, if human labor is used to place a group of electrical lines on a flat plate and wrap adhesive tape around the group of electrical lines and tape fixing portions, it is possible to enclose and protect the group of electrical lines with the flat plate without depending on human labor. The protector is made of a shape-memory polymer sheet with Tg set to a temperature higher than the high temperature reached in summer, and is constituted by a tube-forming flat surface portion and tape fixing portions. The tube-forming flat surface portion is formed with a rectangular shape having a width for folding into a tube shape that allows a group of electrical lines to be inserted and concealed therein, and is shaped as a flat plate with a tape fixing portion extending from at least one end in the lengthwise direction.
    Type: Grant
    Filed: June 6, 2016
    Date of Patent: August 15, 2017
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Masataka Wakabayashi, Minoru Fukuda
  • Patent number: 9657200
    Abstract: The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: May 23, 2017
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Tianjian Huang, Kristina Thompson, Daniel Waski, John Meccia
  • Patent number: 9646868
    Abstract: A method for temporarily bonding a wafer to a support via a temporary bonding arrangement is provided. The arrangement is a composite temporary adhesive layer consisting of a non-silicone thermoplastic resin layer (A) which is releasably bonded to the wafer, a thermosetting siloxane polymer layer (B) laid thereon, and a thermosetting siloxane-modified polymer layer (C) releasably bonded to the support. The method comprises the steps of providing a wafer laminate having a thermosetting silicone composition layer (B?) formed on the resin layer (A) which has been formed on the wafer, providing a support laminate having a siloxane-containing composition layer (C?) formed on the support, joining and heating layer (B?) and layer (C?) in vacuum for bonding and curing the layers together.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: May 9, 2017
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hiroyuki Yasuda, Michihiro Sugo, Shohei Tagami, Masahito Tanabe