Abstract: An adhesive backed article, method for its manufacture and a kit including such an article are provided. The article of the invention is provided as an antislip product comprised of a backing and an oil resistant adhesive applied to a major surface of the backing. In one aspect of the invention, an article is provided comprising: a backing having a first and second major surfaces, the first major surface being textured to provide a slip resistant surface; and a pressure sensitive adhesive disposed on the second major surface of the backing, the adhesive formulated to be resistant to peel in use when exposed to oily environments, the adhesive comprising the polymerized reaction product of (a) acrylic acid; (b) at least one N-vinyl containing monomer; (c) at least one acrylate selected from the group consisting of isooctyl acrylate, 2-ethylhexyl acrylate, and combinations thereof; (d) optionally, less than about 20 weight % fluoroalkyl siloxane; and (e) optionally, a cross linking agent.

Abstract: An adhesive tape for electronic parts which comprises a metal substrate and an adhesive layer A and an adhesive layer B laminated in order on at least one side of said metal substrate, wherein said adhesive A comprises a polyimide consisting of 100 -20% by mol of the repeating unit represented by the following formula (1a) and 0-80% by mol of the repeating unit represented by the following formula (1b), said adhesive B comprises a polyimide consisting of 100-40% by mol of the repeating unit represented by the following formula (1a) and 0-60% by mol of the repeating unit represented by the following formula (2), and the adhesive layer A and the adhesive layer B have each a different glass transition temperature: ##STR1## wherein Ar represents a divalent group selected from the specified structures containing aromatic rings, R is an alkylene group having 1 to 10 carbon atoms or --CH.sub.2 OC.sub.6 H.sub.4 --, the methylene group of which attaches to Si, and n means an integer of 1 to 20.

Abstract: Disclosed are (1) an adhesive sheet for printing comprising a layer to be printed having no release coat, and at least an adhesive layer having an adhesive strength of 1 to 5000 gf/50 mm to the layer to be printed, and (2) a label having a heat transfer pattern comprising a heat fixing ink comprising a polyolefin and a colorant on the layer to be printed of the adhesive sheet for printing.

Abstract: A thermally conductive conformable interface layer for use in mounting electronic devices such as transistors or the like onto the surface of a chassis or heat sink. The thermally conductive interface material forms a highly conductive thermal bridge or transfer medium between the external surfaces of the electronic device and the heat sink. The thermally conductive material comprises a multi-layer laminate, typically a polymeric thermally conductive layer along with a film of adhesive bonded thereto. The polymeric layer is preferably a silicone resin, such as polydimethylsiloxane blended with a thermoplastic adhesive such as linear saturated polyester. The polydimethylsiloxane may be filled with a thermally conductive material such as graphite with an adhesive layer being utilized to attach the polymeric layer onto the device and heat sink.

Abstract: A thermosetting resin composition for a fixing treatment of electronic parts, which is able to adhere in short time at low temperature, has a heat resistance, is lowly hygroscopic, and hardly produces package cracks, etc.The thermosetting resin composition comprises polycarbodiimide which is soluble in organic solvents and silicone-modified polyimide which is soluble in organic solvents, which are compounded.

Abstract: This invention provide an adhesive tape and a liquid adhesive for electronic parts having sufficient thermal resistance and reliability. The adhesive tape comprises adhesive layers composed of at least a polyimide comprising the repeating units represented by the formulas (1) and (2) on both sides of the substrate, one of said adhesive layer having a higher glass transition temperature than that of the other adhesive layer: ##STR1## wherein X is --SO.sub.2 -- and/or --C(.dbd.O)--OCH.sub.2 CH.sub.2 O--C(.dbd.O)--,Ar is a divalent group containing aromatic rings, and R is an alkylene group having 1 to 10 carbon atoms or --CH.sub.2 OC.sub.6 H.sub.4 --, and n means an integer of 1 to 20.The stustrate may be a resin layer composed of the above mentioned polyimide.

Abstract: A composite film for forming a resinous coating film on a surface of a to-be-coated material. The composite film has at least one water-soluble resinous coating film, at least one of which is formed on a surface of the composite film which is brought into contact with the surface of the to-be-coated material closely, and a base sheet to which the water-soluble resinous coating film adheres and transmits light therethrough. The water-soluble resinous coating film formed on the surface of the composite film which is brought into contact with the surface of the to-be-coated material closely is hardened in close contact with the to-be-coated material, with water interposed between the water-soluble resinous coating film and the to-be-coated material and adheres to the to-be-coated material to form a water-insoluble coating film. It is preferable that the application amount of the water is in a range of 1.5 g/m.sup.2 -10 g/m.sup.2.

Abstract: A water sensitive hot melt adhesive composition based on polyalkyleneimine copolymers for use with articles such as paper products, disposable nonwoven products, tapes, labels and packaging materials. By varying the amount of copolymer included in the composition as well as by varying the chain structure and the ratio of soluble versus insoluble repeating units in the copolymer, an adhesive may be formulated to modify the degree of solubility from 100% to 0% soluble in water and/or other performance characteristics. The adhesive composition includes about 10% to about 70%, by weight, of a polyalkyleneimine copolymer or a blend of one or more polyalkyleneimine copolymers; about 0% to about 70%, by weight, of a tackifying resin; about 10% to about 70%, by weight, of a compatible plasticizer; and about 0.1% to about 3% by weight of one or more antioxidant.

Abstract: A multi-cycle refastenable contact responsive non-tacky fastener system and method of use with a field of a contact responsive fastening layer having essentially no surface tack. The fastening layer is multiply releasable and refastenable against a non-tacky target surface, and has substantially constant 90.degree. peel strength of less than about 5 kN/m when in contact with the target surface. A mounting layer comprises a field of a pressure sensitive adhesive onto which the field of the contact responsive layer is directly attached.

Abstract: An adhesive tape for TAB having an organic insulating film, an adhesive layer formed on the organic insulating film and a protection layer formed on the adhesive layer, the adhesive layer being any one of a layer containing a polyamide resin having an amine value of at least 3 and an epoxy resin, a layer containing a polyamide resin and a powdery inorganic filler, a layer containing an epoxy resin having a siloxane structure in its main chain, and a layer containing at least one maleimide compound.

Abstract: A multiple wire printed circuit board including printed conductor circuit layers, adhesive layers with wires having insulating coating embedded and fixed therein, insulating layers, and connecting through-holes formed at locations where connections will be made, wherein the conductor circuit layers are insulated from other circuit conductors, and the difference in glass transition point between each adhesive layer and the adjoining insulating layer is within the range of 60.degree. C., remains free of peel and voids despite heat history applied to the board, and is capable of high-density wiring, multiplication of circuit layers and a reduction of the number of the manufacturing steps.

Abstract: This invention provide an adhesive tape and a liquid adhesive for electronic parts having sufficient thermal resistance and reliability. The adhesive tape comprises an adhesive layer composed of at least a polyimide comprising the repeating units represented by the formulas (1) and (2), provided on surface of a heat resistance film or a release film: ##STR1## wherein X is --SO.sub.2 -- and/or --C(.dbd.O)--OCH.sub.2 CH.sub.2 O--C(.dbd.O)--, Ar is a divalent group containing aromatic rings, and R is an alkylene group having 1 to 10 carbon atoms or --CH.sub.2 OC.sub.6 H.sub.4 --, and n means an integer of 1 to 20.

Abstract: Articles comprising a substrate, preferably a retroreflective sheeting, having a coating of a pressure-sensitive adhesive composition, and articles wherein the adhesive adheres the substrate to a highly monomericly plasticized PVC component, preferably a PVC coated fabric. The adhesive comprises a crosslinked copolymer of a first monofunctional acrylate ester of a non-tertiary alcohol having as a homopolymer a glass transition temperature of less than -25.degree. C., a nitrogen containing moderately basic monomer copolymerizable therewith selected from the group consisting of N,N-dialkyl substituted amides, an optional copolymerizable acidic monomer, an optional second monofunctional acrylate ester of a non-tertiary alcohol having as a homopolymer a glass transition temperature -25.degree. C. or greater, and a crosslinking agent. A method of bonding a highly monomericly plasticized PVC component to a substrate, preferably a retroreflective sheeting, using the adhesive.

Abstract: An adhesive resin composition comprising a polycarbodiimde resin and a bisalkenyl-substituted nadimide and an adhesive sheet using the resin composition.The adhesive resin composition can adhere in a short time even at low temperature, has a high heat resistance, has a low hygroscopic property, and is hard to cause package crackings, etc.

Abstract: TPE's which comprise A blocks or B blocks or both A blocks and B blocks, which are crystalline and in which at least a part of the crystallinity result from the presence of crystallizable side chains. Such crystalline blocks are referred to as SCC blocks. TPE's containing SCC A blocks are novel and as such form part of the present invention. The invention also includes processes, compositions, shaped articles and assemblies which make use of TPE's containing SCC A blocks.

Abstract: A pressure sensitive adhesive that includes:(a) the polymerization product of:(i) 25-98 parts by weight of an acrylic acid ester of a monohydric alcohol whose homopolymer has a T.sub.g less than 0.degree. C.;(ii) 2-75 parts by weight of a non-polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of no greater than 10.50 and a T.sub.g greater than 15.degree. C.; and(iii) 0-5 parts by weight of a polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of greater than 10.50 and a T.sub.g greater than 15.degree. C.; and(b) at least one tackifier that is miscible in the polymerization product at room temperature.

Abstract: A radiation-cured adhesive film having differential adhesion on opposing surfaces of the adhesive layer is provided. The film comprises a backing layer having coated thereon a radiation-cured adhesive copolymer layer, said copolymer comprised of one or more urethane oligomers A, optionally one or more B monomers, and a macromer C defined by the formula X--(Y).sub.

Abstract: A laminate comprising a substrate, a continuous layer of a release coating on one surface thereof, and a layer of a silicone pressure sensitive adhesive on the surface of said release coating, said release coating being a mixture of a resin having perfluoro side chains and a film forming resin which binds said resin having said perfluoro side chains to said substrate, wherein said film forming resin is selected from the group consisting of polyester, polyamides, functionalized polyolefins, and nitrile polymers and copolymers.

Abstract: The present invention is a bonding anchor coating agent and a laminated film having an anchor coating layer which provides a high anti-static performance on a film surface without having to mix the anti-static agent into the basic material of the film. The bonding anchor coating agent contains polyethylene imine and a bridge formation polymer having the ability to prevent electrostatic induction. The laminated film contains the anchor coating agent in the basic material of the film.

Abstract: This invention provide an adhesive tape by which adhesion to a metal spreader is not required and a cutting process is not necessary. The adhesive tape comprises an adhesive layer provided on at least one surface of metal sheet, said adhesive layer being semi-cured into a B-stage and comprised of: (a) a piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer of the formula (I): ##STR1## wherein, k, m, and n are molar ratios and taking n as l, k is a number of 3-175, and m is a number of 0.3 to 93; and (b) a compound having at least two maleimide groups, the ratio of component (b) based on 100 parts by weight of component (a) being in a range of 10 to 900 parts by weight, and said adhesive layer being composed of at least two semi-cured layers having each a different status of semi-cure.

Abstract: Two opaque sheets made from the same electrically conductive polymer material have adjoining edges. Each sheet is carbon loaded, electrically conductive, opaque black polymer on a first broad side thereof. The sheets are joined along a seam region by means of an opaque, electrically conductive adhesive tape. The electrically conductive adhesive tape includes an elongated opaque sheet of electrically conductive polymer material of the same kind as that of the two opaque sheets which the tape joins. The opaque, electrically conductive adhesive tape also includes a layer of electrically conductive adhesive, which is connected to the electrically conductive polymer material. In a particular embodiment of the invention, the polymer material is polyimide. In a preferred embodiment, the two opaque sheets are thermal coverings for a spacecraft, and each includes a sheet of opaque polyimide, carbon loaded which is electrically conductive, on the exterior of the thermal coverings.

Abstract: Adhesive tapes which can be adhered and cured at a relatively low temperature, keeps enough electric insulation in case of adhering to the leadframe of semiconductor devices. The adhesive tape comprises a releasing film and an adhesive layer provided on a surface of said releasing film, said adhesive layer being semi-cured into a B-stage and composed of:(a) a piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer having a weight average molecular weight of 10,000-200,000, an acrylonitrile content of 5-50% by weight and an amino equivalent of 500-10,000, represented by the formula (I): ##STR1## wherein, k, m, and n are molar ratios and taking n as 1, k is a number of 3-175, and m is a number of 0.