Including Metal Or Compound Thereof Or Natural Rubber Patents (Class 428/356)
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Patent number: 8202622Abstract: The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 ?m or greater but less than 10 ?m and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.Type: GrantFiled: September 10, 2009Date of Patent: June 19, 2012Assignee: Hitachi Chemical Co., Ltd.Inventors: Motohiro Arifuku, Itsuo Watanabe, Yasushi Gotou, Kouji Kobayashi, Kazuyoshi Kojima
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Patent number: 8187706Abstract: An adhesive composition is provided which is capable of providing good adhesion strength to the polyimide surface of a flexible circuit board that is exposed on the metal wiring surface and between the traces even when the polyimide surface is relatively smooth. The adhesive composition contains a thermoplastic resin, a polyfunctional acrylate, and a radical polymerization initiator and further contains a monofunctional urethane acrylate having a urethane residue at its terminal end. The monofunctional urethane acrylate is represented by the formula (1): CH2?CR0—COO—R1—NHCOO—R2??(1) wherein R0 is a hydrogen atom or a methyl group, R1 is a divalent hydrocarbon group, and R2 is an optionally substituted lower alkyl group.Type: GrantFiled: June 9, 2008Date of Patent: May 29, 2012Assignee: Sony Chemical & Information Device CorporationInventors: Yasushi Akutsu, Yasunobu Yamada, Kouichi Miyauchi
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Patent number: 8153251Abstract: An object of the present invention is to provide an electrostatic pressure-sensitive adhesive composition which is excellent in antistatic property of pressure-sensitive adhesive sheets upon peeling, and has reduced stainability in an adherend (subject to be protected) and is excellent in adhesion reliance, and electrification preventing pressure-sensitive adhesive sheets and a surface protecting film using the same. There is provided a pressure-sensitive adhesive composition, which comprises a (meth)acryl-based polymer containing, as a monomer component, 15 to 100% by weight of a (meth)acrylic acid alkylene oxide adduct, 0 to 85% by weight of a (meth)acryl-based monomer having an alkyl group of a carbon number of 1 to 14 other than the adduct, and 0 to 85% by weight of other polymerizable monomer, and an alkali metal salt.Type: GrantFiled: April 28, 2005Date of Patent: April 10, 2012Assignee: Nitto Denko CorporationInventors: Natsuki Kobayashi, Tatsumi Amano, Masahiko Ando
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Patent number: 8133412Abstract: An anisotropic conductive film 2 contains electrically conductive particles 6 dispersed in an adhesive agent 30 for electrode connection, the adhesive agent containing an epoxy resin, which is an insulating thermosetting resin, as a main component, a phenoxy resin having a molecular weight of 30,000 or more, a latent hardener, a polyvinyl butyral resin having a glass-transition temperature of 100° C. or higher, and a polyvinyl butyral resin having a glass-transition temperature of 90° C. or lower. There is provided the high-heat-resistant anisotropic conductive film which suppresses a reduction in repairability and which can be used for electrodes having a finer pitch, i.e., having a minimum pitch of 150 ?m or less, when electrodes are connected with the anisotropic conductive film.Type: GrantFiled: September 18, 2009Date of Patent: March 13, 2012Assignee: Sumitomo Electric Industries, Ltd.Inventors: Masamichi Yamamoto, Yasuhiro Okuda
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Patent number: 8124226Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.Type: GrantFiled: April 1, 2011Date of Patent: February 28, 2012Assignee: SRI InternationalInventors: Sunity Sharma, Jaspreet Singh Dhau
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Publication number: 20120040151Abstract: The present invention generally relates to rust-resistant tape formulations and/or structures. In one embodiment, the present invention relates to a rust-resistant tape that comprises a polymer base material layer, an adhesive layer and a rust-resistant component. In one embodiment, the adhesive layer adhered to one side of the layer of polymer base material. In another embodiment, the rust-resistant component comprises at least one volatile, or vapor-phase, corrosion inhibitor (VCI) that is placed into the matrix of the polymer base material or the adhesive layer. In still another embodiment, the at least one volatile, or vapor-phase, corrosion inhibitor (VCI) component of the present invention is contained within a discrete layer. In one instance, a rust-resistant tape in accordance with the present invention can be directly applied to a metal surface to be protected.Type: ApplicationFiled: October 21, 2011Publication date: February 16, 2012Applicant: NORTHERN TECHNOLOGIES INTERNATIONAL CORPORATIONInventors: Efim Ya Lyublinski, Keiji Uemura, Yefim Vaks
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Patent number: 8110612Abstract: A process for preparing a pressure sensitive adhesive using a modified planetary roller extruder is described. The process in accordance with one aspect of the invention includes introducing primary raw materials including a non-thermoplastic elastomer into a feeding section of the modified planetary roller extruder, conveying the raw materials from the feeding section to a compounding section of the modified planetary roller extruder, continuously mixing the primary raw materials in the compounding section to produce a homogeneous adhesive composition. The adhesive composition may be applied to a web-form material. The compounding section of the modified planetary roller extruder includes a main spindle surrounded by and intermeshed with a plurality of planetary spindles at least one of which is a double transversal mixing spindle having a plurality of back-cut helical flights.Type: GrantFiled: February 5, 2007Date of Patent: February 7, 2012Assignee: Intertape Polymer Corp.Inventors: John Kinch Tynan, Jr., Richard Walter St. Coeur, David Michael Kovach, Thomas Lombardo
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Patent number: 8110254Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.Type: GrantFiled: September 12, 2007Date of Patent: February 7, 2012Assignee: SRI InternationalInventors: Sunity Sharma, Jaspreet Singh Dhau
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Patent number: 8105689Abstract: The present invention relates to polymerizable N-substituted acrylamide phosphorus-containing monomers, organic polymers formed from the same. Incorporation of said monomers into adhesives, pigment dispersants, coatings or films for polar surfaces or particles gives improved adhesive, anti-corrosive, and flame retardant properties.Type: GrantFiled: June 29, 2006Date of Patent: January 31, 2012Assignee: BASF SEInventors: Liliana Craciun, Orest Polishchuk, George William Schriver, Gabriele Baisch, Reinhold Öhrlein
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Patent number: 8105687Abstract: An electroconductive bonding material contains a thermosetting resin, a low-melting-point metal powder which is melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin, a high-melting-point metal powder which is not melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin and which reacts with the low-melting-point metal powder to form a reaction product having a high melting point of 300° C. or higher during heat-hardening of the thermosetting resin, and a reducing substance which removes an oxide formed on the surface of the high-melting-point metal powder. The total content of the low-melting-point metal powder and the high-melting-point metal powder is 75% to 88% by weight, and the particle size ratio D1/D2 of the average particle size D1 of the low-melting-point metal powder to the average particle size D2 of the high-melting-point metal powder is 0.5 to 6.0.Type: GrantFiled: December 3, 2010Date of Patent: January 31, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Akihiro Nomura, Hidekiyo Takaoka, Kosuke Nakano
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Publication number: 20110311810Abstract: Provided is a pressure-sensitive adhesive composition that makes it possible to prevent electrification of a non-antistatic protected material during peeling, is reduced in the risk of staining the protected material, and has good removability, and to provide a pressure-sensitive adhesive layer, a pressure-sensitive adhesive sheet. Specifically provided is a pressure-sensitive adhesive composition which comprises: a (meth)acryl-based polymer including, as a main component, a (meth)acryl-based monomer component having an alkyl group of 1 to 14 carbon atoms; an alkali metal salt; and an organopolysiloxane having a polyoxyalkylene side chain, wherein the (meth)acryl-based polymer has an acid value of 1.0 or less, and the total amount of the alkali metal salt and the organopolysiloxane is from 0.15 to 4 parts by weight, based on 100 parts by weight of the (meth)acryl-based polymer.Type: ApplicationFiled: February 23, 2010Publication date: December 22, 2011Inventors: Masato Yamagata, Natsuki Ukei, Junko Nakano
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Patent number: 8071200Abstract: The present invention generally relates to rust-resistant tape formulations and/or structures. In one embodiment, the present invention relates to a rust-resistant tape that comprises a polymer base material layer, an adhesive layer and a rust-resistant component. In one embodiment, the adhesive layer adhered to one side of the layer of polymer base material. In another embodiment, the rust-resistant component comprises at least one volatile, or vapor-phase, corrosion inhibitor (VCI) that is placed into the matrix of the polymer base material or the adhesive layer. In still another embodiment, the at least one volatile, or vapor-phase, corrosion inhibitor (VCI) component of the present invention is contained within a discrete layer. In one instance, a rust-resistant tape in accordance with the present invention can be directly applied to a metal surface to be protected.Type: GrantFiled: October 3, 2007Date of Patent: December 6, 2011Assignee: Northern Technologies International CorporationInventors: Efim Ya Lyublinski, Keiji Uemura, Yefim Vaks
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Patent number: 8067475Abstract: Disclosed herein are an adhesive sheet comprising a cured acrylic polymer, hollow polymeric microspheres dispersed and ruptured in the cured acrylic polymer, and hollow parts formed by rupturing the hollow polymeric microspheres dispersed in the cured acrylic polymer, and a preparation method thereof.Type: GrantFiled: June 10, 2005Date of Patent: November 29, 2011Assignee: LG Chem, Ltd.Inventors: Jang Soon Kim, Woo Ha Kim, Jae Gwan Lee, Suk Ky Chang, Wook Kim, Geun Hee Lee, Byoung Soo Lee, Byeong Gyu Cho, Seung Min Yoo
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Patent number: 8043709Abstract: The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 ?m or greater but less than 10 ?m and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.Type: GrantFiled: June 24, 2004Date of Patent: October 25, 2011Assignee: Hitachi Chemical Co., Ltd.Inventors: Motohiro Arifuku, Itsuo Watanabe, Yasushi Gotou, Kouji Kobayashi, Kazuyoshi Kojima
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Publication number: 20110256395Abstract: A pressure-sensitive adhesive consisting of a homogeneous mixture of at least one natural rubber component and at least one polyacrylate component displays significantly improved properties in cohesion and aging and weathering resistance compared to the individual components. Particularly good properties are achieved when the adhesive contains x% by weight of at least one natural rubber component, y% by weight of at least one polyacrylate component, v% by weight of at least one adhesive resin component and w% by weight of additives, where 10?×x?80, 10?y<95, 0?v?50, 0?w?10 and x+y+v+w=100. A single- or double-sided adhesive tape consisting of at least one support and at least one layer of such a pressure-sensitive adhesive therefore likewise has good cohesion and aging resistance properties.Type: ApplicationFiled: December 7, 2009Publication date: October 20, 2011Applicant: TESA SEInventors: Franziska Zmarsly, Sabine Thormeier, Christian Kreft, Axel Burmeister, Stephan Bunz
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Patent number: 8034447Abstract: The invention intends to provide an electronic component mounting adhesive that can inhibit cracks and peelings in an electronic component mounting structure obtained by joining electronic components each other from occurring and an electronic component mounting structure obtained by joining electronic components with such an electronic component mounting adhesive. In an electronic component mounting structure, a first circuit board and a second circuit board are bonded with an electronic component mounting adhesive. Here, the electronic component mounting adhesive is obtained by dispersing metal particles having the melting temperature Mp lower than the glass transition temperature Tg of a cured material of a thermosetting resin in the thermosetting resin.Type: GrantFiled: September 13, 2007Date of Patent: October 11, 2011Assignee: Panasonic CorporationInventors: Tadahiko Sakai, Hideki Eifuku, Kouji Motomura
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Publication number: 20110187970Abstract: The present invention relates to an acrylic pressure-sensitive adhesive composition, and more particularly, to an acrylic pressure-sensitive adhesive composition capable of showing an excellent anti-static performance, and solving a transferring problem of additives and a problem concerning a balance of low-rate and high-rate peel strength, by comprising a) an acrylic copolymer including a monomer having a functional group capable of chelating with a metal salt, and a hydrophobic monomer and b) a metal salt.Type: ApplicationFiled: January 13, 2009Publication date: August 4, 2011Applicant: LG CHEM, LTD.Inventors: No Ma Kim, Jae Gwan Lee, An Na Lee
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Patent number: 7981508Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.Type: GrantFiled: September 12, 2007Date of Patent: July 19, 2011Assignee: SRI InternationalInventors: Sunity Sharma, Jaspreet Singh Dhau
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Publication number: 20110151168Abstract: Multi-layer articles are disclosed which include, a polypropylene-based film, and a layer on at least one surface of the polypropylene-based film including an ethylene-based material containing a copolymer of ethylene and at least one alpha-olefin comomoner with a density of no greater than 0.90 g/cm3 and a polydispersity index of between 1 and 4, wherein the multi-layer article is biaxially stretched. In some embodiments the multi-layer article exhibits desirable optical properties.Type: ApplicationFiled: July 16, 2009Publication date: June 23, 2011Inventors: Scott R. Meyer, Audrey A. Sherman, Kevin R. Schaffer
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Publication number: 20110108094Abstract: Provided is a laminated sheet for solar cell having a back sheet base material including a fluoro-resin or a polyester resin, and a sealing material layer which includes an ethylene copolymer composition containing a copolymer of an ethylene and a polar monomer which has a polar group selected from a group consist of a carboxylic acid group and a group derived from a carboxylate and a dialkoxysilane having an amino group is laminated on a surface of the back sheet base material where a chemical treatment or a physical treatment for improving adhesiveness has been applied, by a melt extrusion lamination method. Thereby, a laminated sheet having excellent productivity and excellent interlayer adhesion strength between the back sheet and the sealing material is obtained.Type: ApplicationFiled: June 26, 2009Publication date: May 12, 2011Applicant: DU PONT-MITSUI POLYCHEMICALS CO., LTD.Inventors: Koichi Nishijima, Yasuki Shibata, Masanobu Sato
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Publication number: 20110088756Abstract: An adhesive seal material for an end portion a solar cell panel is an adhesive seal material which is bonded to an end portion of a solar cell panel. The adhesive seal material includes a rubber-based adhesive layer, and a non-adhesive layer partially covering a surface of the rubber-based adhesive layer.Type: ApplicationFiled: October 7, 2010Publication date: April 21, 2011Applicant: Nitto Denko CorporationInventors: Hiroki Fujii, Masahiko Kosuga, Masayuki Ishikawa
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Publication number: 20110086186Abstract: Disclosed are an anti-static adhesive composition, and a polarizing plate and/or a surface protective film fabricated using the same. More particularly, an anti-static adhesive composition for imparting enhanced anti-static properties, including a metal salt represented by Formula 1 as an anti-static agent so as to sufficiently inhibit generation of static electricity while not deteriorating inherent physical properties of an adhesive such as adhesiveness, durability and reliability, etc., is provided. In addition, a polarizing plate and and/or a surface protective film fabricated using the foregoing anti-static adhesive composition are provided.Type: ApplicationFiled: April 15, 2009Publication date: April 14, 2011Applicant: DONG-WOO FINE-CHEM CO., LTD.Inventors: Sung-min Kim, Han-young Choi, Young-sik Choi
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Publication number: 20110030756Abstract: A pressure-sensitive adhesive sheet for a solar panel according to the present invention is a pressure-sensitive adhesive sheet for use to seal silicon cells and includes a fluorine-containing resin film base and, on at least one side thereof, a pressure-sensitive adhesive layer. The pressure-sensitive adhesive sheet for a solar panel according to the present invention, when used to seal silicon cells, enables the manufacture of a solar panel with improved productivity and workability, while avoiding problems caused by vacuum hot pressing, such as damage to the wiring and process contamination due to squeezing out of the sealing resin.Type: ApplicationFiled: April 16, 2009Publication date: February 10, 2011Applicant: NITTO DENKO CORPORATIONInventors: Makoto Honda, Kazuhisa Maeda
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Publication number: 20100323191Abstract: A pressure-sensitive adhesive tape, which has a pressure-sensitive adhesive layer with its storage modulus controlled within an adequate range, and which suitably prevents resin leakage during a sealing step in the production of a semiconductor device using a metal lead frame. The pressure-sensitive adhesive tape includes, on a base sheet, a pressure-sensitive adhesive layer containing a silicone-based pressure-sensitive adhesive composition and a lipophilic layered clay mineral dispersed in the silicone-based pressure-sensitive adhesive composition.Type: ApplicationFiled: January 24, 2008Publication date: December 23, 2010Applicant: NITTO DENKO CORPORATIONInventors: Yuki Sugo, Yoshio Terada, Hiroyuki Kondou, Hitoshi Takano
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Patent number: 7829606Abstract: High durable polarized film comprising a radiation curable PSA layer for lamination in TFT/LCD applications have high humidity and heat resistance. In one embodiment, the adhesive comprises a UV curable acrylic polymer, a compatible tackifier, a multifunction unsaturated oligomer, and a long chain alkyl acrylate monomer.Type: GrantFiled: May 7, 2009Date of Patent: November 9, 2010Assignee: Henkel AG & Co. KGaAInventors: Ming Chang Lu, Peter D. Palasz
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Patent number: 7795325Abstract: An adhesive composition containing: (a) a thermoplastic resin; (b) a radical-polymerizable compound including two or more (meth)acryloyl groups; (c) a curing agent that generates a radical by photoirradiation of 150 to 750 nm and/or heating at 80 to 200° C.; and (d) a liquid rubber having a viscosity of 10 to 1000 Pa·s at 25° C.Type: GrantFiled: June 26, 2009Date of Patent: September 14, 2010Assignee: Hitachi Chemical Co., Ltd.Inventors: Shigeki Katogi, Hoko Suto, Masami Yusa
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Patent number: 7785708Abstract: The present invention provides an adhesive film for circuit connection which is to be interposed between circuit electrodes facing each other and used for electrically connecting the circuit electrodes to each other, which comprises a curing agent to generate free radicals with heating, a radically polymerizable substance, and a film-forming polymer, and in which a temporary fixing power to a flexible substrate having the circuit electrode is 40-180 N/m.Type: GrantFiled: January 6, 2005Date of Patent: August 31, 2010Assignee: Hitachi Chemical Co., Ltd.Inventors: Takashi Tatsuzawa, Itsuo Watanabe, Naoki Fukushima, Masahide Kume
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Patent number: 7776438Abstract: The present invention provides an adhesive film for circuit connection which is to be interposed between circuit electrodes facing each other and used for electrically connecting the circuit electrodes to each other, which comprises a curing agent to generate free radicals with heating, a radically polymerizable substance, and a film-forming polymer, and in which a temporary fixing power to a flexible substrate having the circuit electrode is 40-180 N/m.Type: GrantFiled: October 25, 2007Date of Patent: August 17, 2010Assignee: Hitachi Chemical Co., Ltd.Inventors: Takashi Tatsuzawa, Itsuo Watanabe, Naoki Fukushima, Masahide Kume
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Publication number: 20100143664Abstract: The present invention generally relates to rust-resistant tape formulations and/or structures. In one embodiment, the present invention relates to a rust-resistant tape that comprises a polymer base material layer, an adhesive layer and a rust-resistant component. In one embodiment, the adhesive layer adhered to one side of the layer of polymer base material. In another embodiment, the rust-resistant component comprises at least one volatile, or vapor-phase, corrosion inhibitor (VCI) that is placed into the matrix of the polymer base material or the adhesive layer. In still another embodiment, the at least one volatile, or vapor-phase, corrosion inhibitor (VCI) component of the present invention is contained within a discrete layer. In one instance, a rust-resistant tape in accordance with the present invention can be directly applied to a metal surface to be protected.Type: ApplicationFiled: October 3, 2007Publication date: June 10, 2010Applicant: NORTHERN TECHNOLOGIES INTERNATIONAL CORPORATIONInventors: Efim Lyublinski, Keiji Uemura, Yefim Vaks
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Publication number: 20100140222Abstract: A filled polymer composition having improved plasma resistance is disclosed. The composition includes a particle filler dispersed in a polymer matrix. The particle filler can be Nb2O5, YF3, AlN, SiC or Si3N4 and rare earth oxides. In an embodiment, the composition is utilized as a bonding adhesive for electrostatic chuck, bonding adhesive for shower head, bonding adhesive for liner, sealing material, O-ring, or plastic component.Type: ApplicationFiled: December 7, 2009Publication date: June 10, 2010Inventors: Jennifer Y. Sun, Ren-Guan Duan, Senh Thach, Li Xu
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Patent number: 7728232Abstract: An exemplary adhesive layer includes an adhesive main body having a first adhesive surface and a second adhesive surface on an opposite side of the adhesive main body to the first adhesive surface. The adhesive main body defines a number of through-holes between the first adhesive surface and the second adhesive surface therein. The through-holes are filled with an inner adhesive that has a higher adhesion than the adhesive main body. Adhesiveness of the first adhesive surface and the second adhesive surface of the adhesive main body can be improved, thereby preventing a printed circuit board having the adhesive layer from distortion.Type: GrantFiled: December 26, 2007Date of Patent: June 1, 2010Assignees: FuKui Precision Component (Shenzhen) Co., Ltd., Foxconn Advanced Technology Inc.Inventors: Feng-Yan Huang, Shing-Tza Liou
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Patent number: 7722950Abstract: An adhesive for a circuit material, comprises a blend of a cure system; and a solid epoxy resin and a nitrile rubber functionalized with epoxy-reactive groups, wherein the solid epoxy resin and the nitrile rubber are reacted to form an adduct prior to blending with the cure system. The adhesive has low dendritic growth and improved solder resistance.Type: GrantFiled: November 14, 2006Date of Patent: May 25, 2010Assignee: World Properties, Inc.Inventors: David Guo, Carlos L. Barton
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Patent number: 7721502Abstract: Connectors for joining adjacent modular floor covering units. The connectors include a film and an adhesive layer coated on one side of the film. To install tiles using the connectors, a first tile is placed on the floor and a connector is positioned so that the adhesive layer faces upward and does not contact the floor. The connector is typically positioned so that only a portion of the adhesive layer adheres to the underside of the tile, leaving the remainder of the connector extending from the underside of the tile. Tiles are then positioned adjacent the first tile so that a portion of the connector adheres to the adjacent tiles. In this way, the connectors span adjacent tile edges. The tiles are assembled on a underlying flooring surface without the need to attach them to the floor surface. Rather, the tiles are linked to each other with the connectors, so that the tiles create a floor covering that “floats” on the underlying floor surface.Type: GrantFiled: October 17, 2005Date of Patent: May 25, 2010Assignee: Interface, Inc.Inventors: Graham A. H. Scott, David D. Oakey, John P. Bradford, Keith N. Gray, Craig Cochran
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Publication number: 20100092773Abstract: A pressure-sensitive adhesive is constituted at least by one or two kinds or more of a polymer and a tackifier, the polymer is selected from the polymer obtained by polymerizing olefin unsaturated-group containing polymerizable monomer by an ordinary method, a copolymer obtained by copolymerizing a monomer mixture containing two or more types of olefin unsaturated-group containing polymerizable monomer by an ordinary method, and natural rubber, wherein the pressure-sensitive adhesive for available affixation has substantially no initial tack value and exerts adhesion by pressurization processing.Type: ApplicationFiled: September 28, 2006Publication date: April 15, 2010Inventors: Hiroyuki Kasahara, Kazushige Kawashita, Koji Kishimoto, Yoshiaki Urahama
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Publication number: 20100028672Abstract: [Problem] To provide a conductive adhesive composition capable of preventing conductivity from decreasing by corrosion of metal particles even after it is used or stored at high temperatures and high humidities for a long period of time, without impairing the conductivity of the metal powder. [Means for Solving the Problem] Provided is a conductive adhesive composition including a metal powder dispersed in an adhesive resin, the adhesive resin containing a volatile corrosion-inhibitor, wherein the volatile corrosion-inhibitor is preferably at least one member selected from the group including dicyclohexylammonium cyclohexanecarboxylate, monoethanolamine benzoate, and cyclohexylamine benzoate.Type: ApplicationFiled: February 15, 2008Publication date: February 4, 2010Applicant: Diatex Co., Ltd.Inventors: Takashi Yoshioka, Yuchang Wang
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Publication number: 20090305036Abstract: A silicone pressure-sensitive adhesive composition exhibiting powerful adhesive strength to silicone rubbers. The composition includes (A) a polydiorganosiloxane composed of components (A1) and (A2) described below and having a mass ratio of (A1)/(A2) within a range from 100/0 to 10/90, (A1) a linear polydiorganosiloxane having two or more alkenyl groups within each molecule, (A2) a linear polydiorganosiloxane having SiOH groups at the terminals and having no alkenyl groups, (B) a polyorganosiloxane containing R33SiO0.5 units, SiO2 units and silanol groups and having a molar ratio of R33SiO0.5 units/SiO2 units within a range from 0.5 to 0.9, (C) a polyorganohydrogensiloxane containing three or more SiH groups, (D) a reaction retarder, (E) a platinum group metal-based catalyst, and (F) at least one metal compound having a formula MYx wherein M represents a metal element having an atomic valence of 3 or 4 such as aluminum, x represents a number equal to the atomic valence of M, and Y represents a ligand.Type: ApplicationFiled: June 3, 2009Publication date: December 10, 2009Applicant: Shin-Etsu Chemical Co., Ltd.Inventor: Shunji AOKI
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Publication number: 20090291291Abstract: A flame retardant adhesive pressure sensitive adhesive containing a blend of flame retardants is provided. The flame retardant blend comprises (a) at least one metal oxide; (b) at least one metal hydrate; (c) at least one halogenated material; and (d) a liquid phosphorous-bromine containing composition comprising a triaryl phosphate ester having low triphenyl phosphate content.Type: ApplicationFiled: March 29, 2007Publication date: November 26, 2009Applicant: AVERY DENNISON CORPORATIONInventor: Thomas C. Epple
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Patent number: 7595352Abstract: A photo-curable adhesive composition includes oligourethane acrylate in a range of about 11 to about 23% by weight, reactive monomer-diluent in a range of about 11 to about 24% by weight, silicate filler in a range of about 50 to about 65% by weight, photoinitiator in a range of about 2.5 to about 5.0% by weight, organic peroxide in a range of about 0.1 to about 0.5% by weight, thixotropic agent in a range of about 0.5 to about 3.5% by weight, antioxidant in a range of about 0.005 to about 0.02% by weight, silane finishing agent in a range of about 0.1 to about 2.5% by weight, and oxalic acid in a range of about 0.5 to about 1.5% by weight, based on the total weight of the composition.Type: GrantFiled: May 24, 2006Date of Patent: September 29, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: Young-se Choi, Hyung-tae Kim, Do-hoan Nam, Soo-han Park, Dovid Azrielevich Aronovich, Valentin Vasilievich Guzeev, Vladimir Borisovich Mozzhukhin, Alexandr Petrovich Sineokov, Natalya Alexandrovna Ustyuzhantseva, Zyakia Saibasakhovna Khamidulova
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Publication number: 20090220740Abstract: The present invention is generally directed to tapes or laminates designed for use in conjunction with lighter-than-air vehicles, platforms or other inflated structures. In one embodiment, the present invention is directed to tapes or laminates designed for use in logos and/or identification numbers that can be, for example, used on a lighter-than-air vehicle, platform or other inflated structure. In another embodiment, the present invention is directed to tapes or laminates that include, among other layers, at least one dichroic layer designed to produce a logo, letter and/or number that can be, for example, used on a lighter-than-air vehicle, platform or other inflated.Type: ApplicationFiled: February 29, 2008Publication date: September 3, 2009Applicant: LOCKHEED MARTIN CORPORATIONInventor: Paul E. LIGGETT
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Patent number: 7576141Abstract: An adhesive composition containing: (a) a thermoplastic resin; (b) a radical-polymerizable compound including two or more (meth)acryloyl groups; (c) a curing agent that generates a radical by photoirradiation of 150 to 750 nm and/or heating at 80 to 200° C.; and (d) a liquid rubber having a viscosity of 10 to 1000 Pa·s at 25° C.Type: GrantFiled: May 27, 2005Date of Patent: August 18, 2009Assignee: Hitachi Chemical Co., Ltd.Inventors: Shigeki Katogi, Hoko Suto, Masami Yusa
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Publication number: 20090202804Abstract: A masking film having improved wetting of substrates has an adhesion layer, a second layer, and optionally a core layer interposed between the adhesion layer and the second layer, wherein the adhesion layer comprises a blend of a metallocene polyolefin and a low density polyethylene and wherein the second layer provides increased stiffness, strength or mechanical properties to the film. The film may also include antistatic agents in at least one film layer.Type: ApplicationFiled: February 2, 2009Publication date: August 13, 2009Applicant: Tredegar Film Products CorporationInventors: Gary Michael Balakoff, Richard Graham Austin, Bankim Desai, Shailesh Patel
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Patent number: 7540979Abstract: An electrode providing electrical contact with a patient's skin includes a conductive member adapted for connection to an external electrical apparatus and a non-liquid water containing film for electrically interfacing to said patient's skin, the non-liquid film being electrically and mechanically connected to said conductive member. The non-liquid water containing film includes an electrically conductive organic polymer plasticized with a polyhydric alcohol with said organic polymer being derived from a monomeric mixture comprising from about 2 to 30 pph acrylic acid, 2 to 30 pph of a glycolvinylether and 0.01 to 1.5 pph of a crosslinking agent. Preferably the polyhydric alcohol is glycerol.Type: GrantFiled: July 3, 2007Date of Patent: June 2, 2009Assignee: Axelgaard Manufacturing Company, Ltd.Inventors: James J. Perrault, Solomon E. Shenkute, Steve Heard
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Publication number: 20090104444Abstract: Flame retardant adhesives and adhesive tape articles include a halogen-free flame retardant composition comprising a phosphinate or phosphinate salt. The halogen-free flame retardant compositions can also include additional materials, such as alumina trihydrate and magnesium hydroxide, that are substantially free of halogenated compounds or materials.Type: ApplicationFiled: October 19, 2007Publication date: April 23, 2009Inventors: Rafael Garcia-Ramirez, Eumi Pyun, Ralph Su, Emily Liao
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Patent number: 7498071Abstract: It is an object of the present invention to provide a laminated member with an recorded information code, having a high reading accuracy, which do not detract from product design and which do not require a special reading apparatus. A laminated member 10 of the present invention comprises a transparent material layer 12 on which an information code is recorded, and a reflection-reduction layer 14 provided at the opposite side from a side where the information code is observed. The transparent layer 12 comprises low-reflectance portions 18 and high-reflectance portions 16 having a higher reflectance than the low-reflectance portions 18. The information code is recorded as a distributed pattern of the high-reflectance portions 16. The reflection-reduction layer 14 reduces reflected light advancing to the transparent material layer 12.Type: GrantFiled: January 16, 2004Date of Patent: March 3, 2009Assignee: Shiseido Co., Ltd.Inventors: Kenichi Sakuma, Masayoshi Wada, Asa Kimura
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Publication number: 20080311395Abstract: Disclosed is a pressure sensitive adhesive composition comprising a (meth)acrylic polymer comprising, as a monomer component, 0.1 to 4.9% by weight of a reactive monomer having an alkylene oxide group, wherein the reactive monomer has an average number of moles of an oxyalkylene unit added to the reactive monomer falls within the range from 3 to 40, and a pressure sensitive adhesive composition comprising an alkali metal salt. The present invention provides a pressure sensitive adhesive composition which is excellent in antistatic property of a no-electrification-prevented adherend upon peeling, and has reduced staining of an adherend and is excellent in adhesion reliance. Also disclosed is an antistatic pressure sensitive adhesive sheet or surface-protecting film prepared using the composition.Type: ApplicationFiled: September 4, 2006Publication date: December 18, 2008Inventors: Natsuki Ukei, Tatsumi Amano, Masahiko Ando
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Patent number: 7465493Abstract: The present invention concerns solvent-based acrylic pressure sensitive adhesives and hot melt (or solvent-less) acrylic pressure sensitive adhesives comprising a solution or misible blend of a. at least one hydrophobic (meth) acrylic polymer, b. at least one substantially water insoluble polyol having a number average molecular weight of from 1,000 to 20,000 and selected from the group consisting of polyester polyols, acrylic polyols, polycarbonate polyols and polyether polyols, c. at least one transition metal complex as cross-linking agent, d. optionally one or more tackifying resins, g. optionally one or more solvents, h. optionally one or more of plasticizers, adhesion promoters, pigments, fillers, antioxidants and UV stabilizers. It employs polyols which are substantially insoluble in water and miscible with the acrylic polymer used in the adhesive composition.Type: GrantFiled: July 9, 2003Date of Patent: December 16, 2008Assignee: Cytec Surface Specialties, S.A.Inventor: Xinya Lu
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Patent number: 7464510Abstract: Connectors for joining adjacent modular floor covering units. The connectors include a film and an adhesive layer coated on one side of the film. To install tiles using the connectors, a first tile is placed on the floor and a connector is positioned so that the adhesive layer faces upward and does not contact the floor. The connector is typically positioned so that only a portion of the adhesive layer adheres to the underside of the tile, leaving the remainder of the connector extending from the underside of the tile. Tiles are then positioned adjacent the first tile so that a portion of the connector adheres to the adjacent tiles. In this way, the connectors span adjacent tile edges. The tiles are assembled on a underlying flooring surface without the need to attach them to the floor surface. Rather, the tiles are linked to each other with the connectors, so that the tiles create a floor covering that “floats” on the under lying floor surface.Type: GrantFiled: December 21, 2004Date of Patent: December 16, 2008Assignee: Interface, Inc.Inventors: Graham A. H. Scott, David D. Oakey, John P. Bradford, Keith N. Gray
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Publication number: 20080292880Abstract: An insulating facing tape material that can be used for covering exposed insulation surfaces to protect them from moisture and other environmental factors. The material typically includes a first layer of metal-containing foil, a second layer of metal-containing foil, a polymeric layer that is disposed between the first and second layers of metal-containing foil, and a pressure-sensitive adhesive connected to one of the layers of metal-containing foil and exposable for securing the tape material to a substrate. The polymeric layer is a laminate of multiple sub-layers of different principal polymer orientations. The pressure-sensitive adhesive layer may be covered with a release liner prior to application.Type: ApplicationFiled: May 22, 2007Publication date: November 27, 2008Applicant: American Biltrite, Inc.Inventor: Anne Hansen
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Patent number: 7361391Abstract: Multilayered laminate films for food packaging applications which comprise at least: (a) a layer of oriented or nonoriented polyester terephthalate or oriented or nonoriented polypropylene, (b) a layer comprising at least one metal, and (c) a layer comprising at least one additive suitable for incidental food contact which provides protection against corrosion to a layer containing at least one metal is described.Type: GrantFiled: October 2, 2002Date of Patent: April 22, 2008Assignee: Milprint, Inc.Inventors: Mahmood Reza Rassouli, Michael Scott Hartman
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Adhesive tape having one side coated with an adhesive, and no surface treatment on the opposite side
Patent number: 7294396Abstract: A self-adhesive tape comprising an oriented polyolefin film, one side of which is coated with an adhesive layer formed from a mixture of 30-65 wt. % of a natural rubber latex and 35-70 wt. % of an aqueous dispersion of a hydrocarbon resin, and the opposite side of which has no surface treatment.Type: GrantFiled: July 27, 2001Date of Patent: November 13, 2007Assignee: tesa AGInventors: Andre Galle, Bernhard Müssig, Stefan Röber, Herbert Sinnen, Dieter Wenninger