Including Metal Or Compound Thereof Or Natural Rubber Patents (Class 428/356)
  • Patent number: 8202622
    Abstract: The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 ?m or greater but less than 10 ?m and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.
    Type: Grant
    Filed: September 10, 2009
    Date of Patent: June 19, 2012
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Motohiro Arifuku, Itsuo Watanabe, Yasushi Gotou, Kouji Kobayashi, Kazuyoshi Kojima
  • Patent number: 8187706
    Abstract: An adhesive composition is provided which is capable of providing good adhesion strength to the polyimide surface of a flexible circuit board that is exposed on the metal wiring surface and between the traces even when the polyimide surface is relatively smooth. The adhesive composition contains a thermoplastic resin, a polyfunctional acrylate, and a radical polymerization initiator and further contains a monofunctional urethane acrylate having a urethane residue at its terminal end. The monofunctional urethane acrylate is represented by the formula (1): CH2?CR0—COO—R1—NHCOO—R2??(1) wherein R0 is a hydrogen atom or a methyl group, R1 is a divalent hydrocarbon group, and R2 is an optionally substituted lower alkyl group.
    Type: Grant
    Filed: June 9, 2008
    Date of Patent: May 29, 2012
    Assignee: Sony Chemical & Information Device Corporation
    Inventors: Yasushi Akutsu, Yasunobu Yamada, Kouichi Miyauchi
  • Patent number: 8153251
    Abstract: An object of the present invention is to provide an electrostatic pressure-sensitive adhesive composition which is excellent in antistatic property of pressure-sensitive adhesive sheets upon peeling, and has reduced stainability in an adherend (subject to be protected) and is excellent in adhesion reliance, and electrification preventing pressure-sensitive adhesive sheets and a surface protecting film using the same. There is provided a pressure-sensitive adhesive composition, which comprises a (meth)acryl-based polymer containing, as a monomer component, 15 to 100% by weight of a (meth)acrylic acid alkylene oxide adduct, 0 to 85% by weight of a (meth)acryl-based monomer having an alkyl group of a carbon number of 1 to 14 other than the adduct, and 0 to 85% by weight of other polymerizable monomer, and an alkali metal salt.
    Type: Grant
    Filed: April 28, 2005
    Date of Patent: April 10, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Natsuki Kobayashi, Tatsumi Amano, Masahiko Ando
  • Patent number: 8133412
    Abstract: An anisotropic conductive film 2 contains electrically conductive particles 6 dispersed in an adhesive agent 30 for electrode connection, the adhesive agent containing an epoxy resin, which is an insulating thermosetting resin, as a main component, a phenoxy resin having a molecular weight of 30,000 or more, a latent hardener, a polyvinyl butyral resin having a glass-transition temperature of 100° C. or higher, and a polyvinyl butyral resin having a glass-transition temperature of 90° C. or lower. There is provided the high-heat-resistant anisotropic conductive film which suppresses a reduction in repairability and which can be used for electrodes having a finer pitch, i.e., having a minimum pitch of 150 ?m or less, when electrodes are connected with the anisotropic conductive film.
    Type: Grant
    Filed: September 18, 2009
    Date of Patent: March 13, 2012
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Masamichi Yamamoto, Yasuhiro Okuda
  • Patent number: 8124226
    Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.
    Type: Grant
    Filed: April 1, 2011
    Date of Patent: February 28, 2012
    Assignee: SRI International
    Inventors: Sunity Sharma, Jaspreet Singh Dhau
  • Publication number: 20120040151
    Abstract: The present invention generally relates to rust-resistant tape formulations and/or structures. In one embodiment, the present invention relates to a rust-resistant tape that comprises a polymer base material layer, an adhesive layer and a rust-resistant component. In one embodiment, the adhesive layer adhered to one side of the layer of polymer base material. In another embodiment, the rust-resistant component comprises at least one volatile, or vapor-phase, corrosion inhibitor (VCI) that is placed into the matrix of the polymer base material or the adhesive layer. In still another embodiment, the at least one volatile, or vapor-phase, corrosion inhibitor (VCI) component of the present invention is contained within a discrete layer. In one instance, a rust-resistant tape in accordance with the present invention can be directly applied to a metal surface to be protected.
    Type: Application
    Filed: October 21, 2011
    Publication date: February 16, 2012
    Applicant: NORTHERN TECHNOLOGIES INTERNATIONAL CORPORATION
    Inventors: Efim Ya Lyublinski, Keiji Uemura, Yefim Vaks
  • Patent number: 8110612
    Abstract: A process for preparing a pressure sensitive adhesive using a modified planetary roller extruder is described. The process in accordance with one aspect of the invention includes introducing primary raw materials including a non-thermoplastic elastomer into a feeding section of the modified planetary roller extruder, conveying the raw materials from the feeding section to a compounding section of the modified planetary roller extruder, continuously mixing the primary raw materials in the compounding section to produce a homogeneous adhesive composition. The adhesive composition may be applied to a web-form material. The compounding section of the modified planetary roller extruder includes a main spindle surrounded by and intermeshed with a plurality of planetary spindles at least one of which is a double transversal mixing spindle having a plurality of back-cut helical flights.
    Type: Grant
    Filed: February 5, 2007
    Date of Patent: February 7, 2012
    Assignee: Intertape Polymer Corp.
    Inventors: John Kinch Tynan, Jr., Richard Walter St. Coeur, David Michael Kovach, Thomas Lombardo
  • Patent number: 8110254
    Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.
    Type: Grant
    Filed: September 12, 2007
    Date of Patent: February 7, 2012
    Assignee: SRI International
    Inventors: Sunity Sharma, Jaspreet Singh Dhau
  • Patent number: 8105689
    Abstract: The present invention relates to polymerizable N-substituted acrylamide phosphorus-containing monomers, organic polymers formed from the same. Incorporation of said monomers into adhesives, pigment dispersants, coatings or films for polar surfaces or particles gives improved adhesive, anti-corrosive, and flame retardant properties.
    Type: Grant
    Filed: June 29, 2006
    Date of Patent: January 31, 2012
    Assignee: BASF SE
    Inventors: Liliana Craciun, Orest Polishchuk, George William Schriver, Gabriele Baisch, Reinhold Öhrlein
  • Patent number: 8105687
    Abstract: An electroconductive bonding material contains a thermosetting resin, a low-melting-point metal powder which is melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin, a high-melting-point metal powder which is not melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin and which reacts with the low-melting-point metal powder to form a reaction product having a high melting point of 300° C. or higher during heat-hardening of the thermosetting resin, and a reducing substance which removes an oxide formed on the surface of the high-melting-point metal powder. The total content of the low-melting-point metal powder and the high-melting-point metal powder is 75% to 88% by weight, and the particle size ratio D1/D2 of the average particle size D1 of the low-melting-point metal powder to the average particle size D2 of the high-melting-point metal powder is 0.5 to 6.0.
    Type: Grant
    Filed: December 3, 2010
    Date of Patent: January 31, 2012
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Akihiro Nomura, Hidekiyo Takaoka, Kosuke Nakano
  • Publication number: 20110311810
    Abstract: Provided is a pressure-sensitive adhesive composition that makes it possible to prevent electrification of a non-antistatic protected material during peeling, is reduced in the risk of staining the protected material, and has good removability, and to provide a pressure-sensitive adhesive layer, a pressure-sensitive adhesive sheet. Specifically provided is a pressure-sensitive adhesive composition which comprises: a (meth)acryl-based polymer including, as a main component, a (meth)acryl-based monomer component having an alkyl group of 1 to 14 carbon atoms; an alkali metal salt; and an organopolysiloxane having a polyoxyalkylene side chain, wherein the (meth)acryl-based polymer has an acid value of 1.0 or less, and the total amount of the alkali metal salt and the organopolysiloxane is from 0.15 to 4 parts by weight, based on 100 parts by weight of the (meth)acryl-based polymer.
    Type: Application
    Filed: February 23, 2010
    Publication date: December 22, 2011
    Inventors: Masato Yamagata, Natsuki Ukei, Junko Nakano
  • Patent number: 8071200
    Abstract: The present invention generally relates to rust-resistant tape formulations and/or structures. In one embodiment, the present invention relates to a rust-resistant tape that comprises a polymer base material layer, an adhesive layer and a rust-resistant component. In one embodiment, the adhesive layer adhered to one side of the layer of polymer base material. In another embodiment, the rust-resistant component comprises at least one volatile, or vapor-phase, corrosion inhibitor (VCI) that is placed into the matrix of the polymer base material or the adhesive layer. In still another embodiment, the at least one volatile, or vapor-phase, corrosion inhibitor (VCI) component of the present invention is contained within a discrete layer. In one instance, a rust-resistant tape in accordance with the present invention can be directly applied to a metal surface to be protected.
    Type: Grant
    Filed: October 3, 2007
    Date of Patent: December 6, 2011
    Assignee: Northern Technologies International Corporation
    Inventors: Efim Ya Lyublinski, Keiji Uemura, Yefim Vaks
  • Patent number: 8067475
    Abstract: Disclosed herein are an adhesive sheet comprising a cured acrylic polymer, hollow polymeric microspheres dispersed and ruptured in the cured acrylic polymer, and hollow parts formed by rupturing the hollow polymeric microspheres dispersed in the cured acrylic polymer, and a preparation method thereof.
    Type: Grant
    Filed: June 10, 2005
    Date of Patent: November 29, 2011
    Assignee: LG Chem, Ltd.
    Inventors: Jang Soon Kim, Woo Ha Kim, Jae Gwan Lee, Suk Ky Chang, Wook Kim, Geun Hee Lee, Byoung Soo Lee, Byeong Gyu Cho, Seung Min Yoo
  • Patent number: 8043709
    Abstract: The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 ?m or greater but less than 10 ?m and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.
    Type: Grant
    Filed: June 24, 2004
    Date of Patent: October 25, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Motohiro Arifuku, Itsuo Watanabe, Yasushi Gotou, Kouji Kobayashi, Kazuyoshi Kojima
  • Publication number: 20110256395
    Abstract: A pressure-sensitive adhesive consisting of a homogeneous mixture of at least one natural rubber component and at least one polyacrylate component displays significantly improved properties in cohesion and aging and weathering resistance compared to the individual components. Particularly good properties are achieved when the adhesive contains x% by weight of at least one natural rubber component, y% by weight of at least one polyacrylate component, v% by weight of at least one adhesive resin component and w% by weight of additives, where 10?×x?80, 10?y<95, 0?v?50, 0?w?10 and x+y+v+w=100. A single- or double-sided adhesive tape consisting of at least one support and at least one layer of such a pressure-sensitive adhesive therefore likewise has good cohesion and aging resistance properties.
    Type: Application
    Filed: December 7, 2009
    Publication date: October 20, 2011
    Applicant: TESA SE
    Inventors: Franziska Zmarsly, Sabine Thormeier, Christian Kreft, Axel Burmeister, Stephan Bunz
  • Patent number: 8034447
    Abstract: The invention intends to provide an electronic component mounting adhesive that can inhibit cracks and peelings in an electronic component mounting structure obtained by joining electronic components each other from occurring and an electronic component mounting structure obtained by joining electronic components with such an electronic component mounting adhesive. In an electronic component mounting structure, a first circuit board and a second circuit board are bonded with an electronic component mounting adhesive. Here, the electronic component mounting adhesive is obtained by dispersing metal particles having the melting temperature Mp lower than the glass transition temperature Tg of a cured material of a thermosetting resin in the thermosetting resin.
    Type: Grant
    Filed: September 13, 2007
    Date of Patent: October 11, 2011
    Assignee: Panasonic Corporation
    Inventors: Tadahiko Sakai, Hideki Eifuku, Kouji Motomura
  • Publication number: 20110187970
    Abstract: The present invention relates to an acrylic pressure-sensitive adhesive composition, and more particularly, to an acrylic pressure-sensitive adhesive composition capable of showing an excellent anti-static performance, and solving a transferring problem of additives and a problem concerning a balance of low-rate and high-rate peel strength, by comprising a) an acrylic copolymer including a monomer having a functional group capable of chelating with a metal salt, and a hydrophobic monomer and b) a metal salt.
    Type: Application
    Filed: January 13, 2009
    Publication date: August 4, 2011
    Applicant: LG CHEM, LTD.
    Inventors: No Ma Kim, Jae Gwan Lee, An Na Lee
  • Patent number: 7981508
    Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.
    Type: Grant
    Filed: September 12, 2007
    Date of Patent: July 19, 2011
    Assignee: SRI International
    Inventors: Sunity Sharma, Jaspreet Singh Dhau
  • Publication number: 20110151168
    Abstract: Multi-layer articles are disclosed which include, a polypropylene-based film, and a layer on at least one surface of the polypropylene-based film including an ethylene-based material containing a copolymer of ethylene and at least one alpha-olefin comomoner with a density of no greater than 0.90 g/cm3 and a polydispersity index of between 1 and 4, wherein the multi-layer article is biaxially stretched. In some embodiments the multi-layer article exhibits desirable optical properties.
    Type: Application
    Filed: July 16, 2009
    Publication date: June 23, 2011
    Inventors: Scott R. Meyer, Audrey A. Sherman, Kevin R. Schaffer
  • Publication number: 20110108094
    Abstract: Provided is a laminated sheet for solar cell having a back sheet base material including a fluoro-resin or a polyester resin, and a sealing material layer which includes an ethylene copolymer composition containing a copolymer of an ethylene and a polar monomer which has a polar group selected from a group consist of a carboxylic acid group and a group derived from a carboxylate and a dialkoxysilane having an amino group is laminated on a surface of the back sheet base material where a chemical treatment or a physical treatment for improving adhesiveness has been applied, by a melt extrusion lamination method. Thereby, a laminated sheet having excellent productivity and excellent interlayer adhesion strength between the back sheet and the sealing material is obtained.
    Type: Application
    Filed: June 26, 2009
    Publication date: May 12, 2011
    Applicant: DU PONT-MITSUI POLYCHEMICALS CO., LTD.
    Inventors: Koichi Nishijima, Yasuki Shibata, Masanobu Sato
  • Publication number: 20110088756
    Abstract: An adhesive seal material for an end portion a solar cell panel is an adhesive seal material which is bonded to an end portion of a solar cell panel. The adhesive seal material includes a rubber-based adhesive layer, and a non-adhesive layer partially covering a surface of the rubber-based adhesive layer.
    Type: Application
    Filed: October 7, 2010
    Publication date: April 21, 2011
    Applicant: Nitto Denko Corporation
    Inventors: Hiroki Fujii, Masahiko Kosuga, Masayuki Ishikawa
  • Publication number: 20110086186
    Abstract: Disclosed are an anti-static adhesive composition, and a polarizing plate and/or a surface protective film fabricated using the same. More particularly, an anti-static adhesive composition for imparting enhanced anti-static properties, including a metal salt represented by Formula 1 as an anti-static agent so as to sufficiently inhibit generation of static electricity while not deteriorating inherent physical properties of an adhesive such as adhesiveness, durability and reliability, etc., is provided. In addition, a polarizing plate and and/or a surface protective film fabricated using the foregoing anti-static adhesive composition are provided.
    Type: Application
    Filed: April 15, 2009
    Publication date: April 14, 2011
    Applicant: DONG-WOO FINE-CHEM CO., LTD.
    Inventors: Sung-min Kim, Han-young Choi, Young-sik Choi
  • Publication number: 20110030756
    Abstract: A pressure-sensitive adhesive sheet for a solar panel according to the present invention is a pressure-sensitive adhesive sheet for use to seal silicon cells and includes a fluorine-containing resin film base and, on at least one side thereof, a pressure-sensitive adhesive layer. The pressure-sensitive adhesive sheet for a solar panel according to the present invention, when used to seal silicon cells, enables the manufacture of a solar panel with improved productivity and workability, while avoiding problems caused by vacuum hot pressing, such as damage to the wiring and process contamination due to squeezing out of the sealing resin.
    Type: Application
    Filed: April 16, 2009
    Publication date: February 10, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Makoto Honda, Kazuhisa Maeda
  • Publication number: 20100323191
    Abstract: A pressure-sensitive adhesive tape, which has a pressure-sensitive adhesive layer with its storage modulus controlled within an adequate range, and which suitably prevents resin leakage during a sealing step in the production of a semiconductor device using a metal lead frame. The pressure-sensitive adhesive tape includes, on a base sheet, a pressure-sensitive adhesive layer containing a silicone-based pressure-sensitive adhesive composition and a lipophilic layered clay mineral dispersed in the silicone-based pressure-sensitive adhesive composition.
    Type: Application
    Filed: January 24, 2008
    Publication date: December 23, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yuki Sugo, Yoshio Terada, Hiroyuki Kondou, Hitoshi Takano
  • Patent number: 7829606
    Abstract: High durable polarized film comprising a radiation curable PSA layer for lamination in TFT/LCD applications have high humidity and heat resistance. In one embodiment, the adhesive comprises a UV curable acrylic polymer, a compatible tackifier, a multifunction unsaturated oligomer, and a long chain alkyl acrylate monomer.
    Type: Grant
    Filed: May 7, 2009
    Date of Patent: November 9, 2010
    Assignee: Henkel AG & Co. KGaA
    Inventors: Ming Chang Lu, Peter D. Palasz
  • Patent number: 7795325
    Abstract: An adhesive composition containing: (a) a thermoplastic resin; (b) a radical-polymerizable compound including two or more (meth)acryloyl groups; (c) a curing agent that generates a radical by photoirradiation of 150 to 750 nm and/or heating at 80 to 200° C.; and (d) a liquid rubber having a viscosity of 10 to 1000 Pa·s at 25° C.
    Type: Grant
    Filed: June 26, 2009
    Date of Patent: September 14, 2010
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Shigeki Katogi, Hoko Suto, Masami Yusa
  • Patent number: 7785708
    Abstract: The present invention provides an adhesive film for circuit connection which is to be interposed between circuit electrodes facing each other and used for electrically connecting the circuit electrodes to each other, which comprises a curing agent to generate free radicals with heating, a radically polymerizable substance, and a film-forming polymer, and in which a temporary fixing power to a flexible substrate having the circuit electrode is 40-180 N/m.
    Type: Grant
    Filed: January 6, 2005
    Date of Patent: August 31, 2010
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Takashi Tatsuzawa, Itsuo Watanabe, Naoki Fukushima, Masahide Kume
  • Patent number: 7776438
    Abstract: The present invention provides an adhesive film for circuit connection which is to be interposed between circuit electrodes facing each other and used for electrically connecting the circuit electrodes to each other, which comprises a curing agent to generate free radicals with heating, a radically polymerizable substance, and a film-forming polymer, and in which a temporary fixing power to a flexible substrate having the circuit electrode is 40-180 N/m.
    Type: Grant
    Filed: October 25, 2007
    Date of Patent: August 17, 2010
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Takashi Tatsuzawa, Itsuo Watanabe, Naoki Fukushima, Masahide Kume
  • Publication number: 20100143664
    Abstract: The present invention generally relates to rust-resistant tape formulations and/or structures. In one embodiment, the present invention relates to a rust-resistant tape that comprises a polymer base material layer, an adhesive layer and a rust-resistant component. In one embodiment, the adhesive layer adhered to one side of the layer of polymer base material. In another embodiment, the rust-resistant component comprises at least one volatile, or vapor-phase, corrosion inhibitor (VCI) that is placed into the matrix of the polymer base material or the adhesive layer. In still another embodiment, the at least one volatile, or vapor-phase, corrosion inhibitor (VCI) component of the present invention is contained within a discrete layer. In one instance, a rust-resistant tape in accordance with the present invention can be directly applied to a metal surface to be protected.
    Type: Application
    Filed: October 3, 2007
    Publication date: June 10, 2010
    Applicant: NORTHERN TECHNOLOGIES INTERNATIONAL CORPORATION
    Inventors: Efim Lyublinski, Keiji Uemura, Yefim Vaks
  • Publication number: 20100140222
    Abstract: A filled polymer composition having improved plasma resistance is disclosed. The composition includes a particle filler dispersed in a polymer matrix. The particle filler can be Nb2O5, YF3, AlN, SiC or Si3N4 and rare earth oxides. In an embodiment, the composition is utilized as a bonding adhesive for electrostatic chuck, bonding adhesive for shower head, bonding adhesive for liner, sealing material, O-ring, or plastic component.
    Type: Application
    Filed: December 7, 2009
    Publication date: June 10, 2010
    Inventors: Jennifer Y. Sun, Ren-Guan Duan, Senh Thach, Li Xu
  • Patent number: 7728232
    Abstract: An exemplary adhesive layer includes an adhesive main body having a first adhesive surface and a second adhesive surface on an opposite side of the adhesive main body to the first adhesive surface. The adhesive main body defines a number of through-holes between the first adhesive surface and the second adhesive surface therein. The through-holes are filled with an inner adhesive that has a higher adhesion than the adhesive main body. Adhesiveness of the first adhesive surface and the second adhesive surface of the adhesive main body can be improved, thereby preventing a printed circuit board having the adhesive layer from distortion.
    Type: Grant
    Filed: December 26, 2007
    Date of Patent: June 1, 2010
    Assignees: FuKui Precision Component (Shenzhen) Co., Ltd., Foxconn Advanced Technology Inc.
    Inventors: Feng-Yan Huang, Shing-Tza Liou
  • Patent number: 7722950
    Abstract: An adhesive for a circuit material, comprises a blend of a cure system; and a solid epoxy resin and a nitrile rubber functionalized with epoxy-reactive groups, wherein the solid epoxy resin and the nitrile rubber are reacted to form an adduct prior to blending with the cure system. The adhesive has low dendritic growth and improved solder resistance.
    Type: Grant
    Filed: November 14, 2006
    Date of Patent: May 25, 2010
    Assignee: World Properties, Inc.
    Inventors: David Guo, Carlos L. Barton
  • Patent number: 7721502
    Abstract: Connectors for joining adjacent modular floor covering units. The connectors include a film and an adhesive layer coated on one side of the film. To install tiles using the connectors, a first tile is placed on the floor and a connector is positioned so that the adhesive layer faces upward and does not contact the floor. The connector is typically positioned so that only a portion of the adhesive layer adheres to the underside of the tile, leaving the remainder of the connector extending from the underside of the tile. Tiles are then positioned adjacent the first tile so that a portion of the connector adheres to the adjacent tiles. In this way, the connectors span adjacent tile edges. The tiles are assembled on a underlying flooring surface without the need to attach them to the floor surface. Rather, the tiles are linked to each other with the connectors, so that the tiles create a floor covering that “floats” on the underlying floor surface.
    Type: Grant
    Filed: October 17, 2005
    Date of Patent: May 25, 2010
    Assignee: Interface, Inc.
    Inventors: Graham A. H. Scott, David D. Oakey, John P. Bradford, Keith N. Gray, Craig Cochran
  • Publication number: 20100092773
    Abstract: A pressure-sensitive adhesive is constituted at least by one or two kinds or more of a polymer and a tackifier, the polymer is selected from the polymer obtained by polymerizing olefin unsaturated-group containing polymerizable monomer by an ordinary method, a copolymer obtained by copolymerizing a monomer mixture containing two or more types of olefin unsaturated-group containing polymerizable monomer by an ordinary method, and natural rubber, wherein the pressure-sensitive adhesive for available affixation has substantially no initial tack value and exerts adhesion by pressurization processing.
    Type: Application
    Filed: September 28, 2006
    Publication date: April 15, 2010
    Inventors: Hiroyuki Kasahara, Kazushige Kawashita, Koji Kishimoto, Yoshiaki Urahama
  • Publication number: 20100028672
    Abstract: [Problem] To provide a conductive adhesive composition capable of preventing conductivity from decreasing by corrosion of metal particles even after it is used or stored at high temperatures and high humidities for a long period of time, without impairing the conductivity of the metal powder. [Means for Solving the Problem] Provided is a conductive adhesive composition including a metal powder dispersed in an adhesive resin, the adhesive resin containing a volatile corrosion-inhibitor, wherein the volatile corrosion-inhibitor is preferably at least one member selected from the group including dicyclohexylammonium cyclohexanecarboxylate, monoethanolamine benzoate, and cyclohexylamine benzoate.
    Type: Application
    Filed: February 15, 2008
    Publication date: February 4, 2010
    Applicant: Diatex Co., Ltd.
    Inventors: Takashi Yoshioka, Yuchang Wang
  • Publication number: 20090305036
    Abstract: A silicone pressure-sensitive adhesive composition exhibiting powerful adhesive strength to silicone rubbers. The composition includes (A) a polydiorganosiloxane composed of components (A1) and (A2) described below and having a mass ratio of (A1)/(A2) within a range from 100/0 to 10/90, (A1) a linear polydiorganosiloxane having two or more alkenyl groups within each molecule, (A2) a linear polydiorganosiloxane having SiOH groups at the terminals and having no alkenyl groups, (B) a polyorganosiloxane containing R33SiO0.5 units, SiO2 units and silanol groups and having a molar ratio of R33SiO0.5 units/SiO2 units within a range from 0.5 to 0.9, (C) a polyorganohydrogensiloxane containing three or more SiH groups, (D) a reaction retarder, (E) a platinum group metal-based catalyst, and (F) at least one metal compound having a formula MYx wherein M represents a metal element having an atomic valence of 3 or 4 such as aluminum, x represents a number equal to the atomic valence of M, and Y represents a ligand.
    Type: Application
    Filed: June 3, 2009
    Publication date: December 10, 2009
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventor: Shunji AOKI
  • Publication number: 20090291291
    Abstract: A flame retardant adhesive pressure sensitive adhesive containing a blend of flame retardants is provided. The flame retardant blend comprises (a) at least one metal oxide; (b) at least one metal hydrate; (c) at least one halogenated material; and (d) a liquid phosphorous-bromine containing composition comprising a triaryl phosphate ester having low triphenyl phosphate content.
    Type: Application
    Filed: March 29, 2007
    Publication date: November 26, 2009
    Applicant: AVERY DENNISON CORPORATION
    Inventor: Thomas C. Epple
  • Patent number: 7595352
    Abstract: A photo-curable adhesive composition includes oligourethane acrylate in a range of about 11 to about 23% by weight, reactive monomer-diluent in a range of about 11 to about 24% by weight, silicate filler in a range of about 50 to about 65% by weight, photoinitiator in a range of about 2.5 to about 5.0% by weight, organic peroxide in a range of about 0.1 to about 0.5% by weight, thixotropic agent in a range of about 0.5 to about 3.5% by weight, antioxidant in a range of about 0.005 to about 0.02% by weight, silane finishing agent in a range of about 0.1 to about 2.5% by weight, and oxalic acid in a range of about 0.5 to about 1.5% by weight, based on the total weight of the composition.
    Type: Grant
    Filed: May 24, 2006
    Date of Patent: September 29, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-se Choi, Hyung-tae Kim, Do-hoan Nam, Soo-han Park, Dovid Azrielevich Aronovich, Valentin Vasilievich Guzeev, Vladimir Borisovich Mozzhukhin, Alexandr Petrovich Sineokov, Natalya Alexandrovna Ustyuzhantseva, Zyakia Saibasakhovna Khamidulova
  • Publication number: 20090220740
    Abstract: The present invention is generally directed to tapes or laminates designed for use in conjunction with lighter-than-air vehicles, platforms or other inflated structures. In one embodiment, the present invention is directed to tapes or laminates designed for use in logos and/or identification numbers that can be, for example, used on a lighter-than-air vehicle, platform or other inflated structure. In another embodiment, the present invention is directed to tapes or laminates that include, among other layers, at least one dichroic layer designed to produce a logo, letter and/or number that can be, for example, used on a lighter-than-air vehicle, platform or other inflated.
    Type: Application
    Filed: February 29, 2008
    Publication date: September 3, 2009
    Applicant: LOCKHEED MARTIN CORPORATION
    Inventor: Paul E. LIGGETT
  • Patent number: 7576141
    Abstract: An adhesive composition containing: (a) a thermoplastic resin; (b) a radical-polymerizable compound including two or more (meth)acryloyl groups; (c) a curing agent that generates a radical by photoirradiation of 150 to 750 nm and/or heating at 80 to 200° C.; and (d) a liquid rubber having a viscosity of 10 to 1000 Pa·s at 25° C.
    Type: Grant
    Filed: May 27, 2005
    Date of Patent: August 18, 2009
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Shigeki Katogi, Hoko Suto, Masami Yusa
  • Publication number: 20090202804
    Abstract: A masking film having improved wetting of substrates has an adhesion layer, a second layer, and optionally a core layer interposed between the adhesion layer and the second layer, wherein the adhesion layer comprises a blend of a metallocene polyolefin and a low density polyethylene and wherein the second layer provides increased stiffness, strength or mechanical properties to the film. The film may also include antistatic agents in at least one film layer.
    Type: Application
    Filed: February 2, 2009
    Publication date: August 13, 2009
    Applicant: Tredegar Film Products Corporation
    Inventors: Gary Michael Balakoff, Richard Graham Austin, Bankim Desai, Shailesh Patel
  • Patent number: 7540979
    Abstract: An electrode providing electrical contact with a patient's skin includes a conductive member adapted for connection to an external electrical apparatus and a non-liquid water containing film for electrically interfacing to said patient's skin, the non-liquid film being electrically and mechanically connected to said conductive member. The non-liquid water containing film includes an electrically conductive organic polymer plasticized with a polyhydric alcohol with said organic polymer being derived from a monomeric mixture comprising from about 2 to 30 pph acrylic acid, 2 to 30 pph of a glycolvinylether and 0.01 to 1.5 pph of a crosslinking agent. Preferably the polyhydric alcohol is glycerol.
    Type: Grant
    Filed: July 3, 2007
    Date of Patent: June 2, 2009
    Assignee: Axelgaard Manufacturing Company, Ltd.
    Inventors: James J. Perrault, Solomon E. Shenkute, Steve Heard
  • Publication number: 20090104444
    Abstract: Flame retardant adhesives and adhesive tape articles include a halogen-free flame retardant composition comprising a phosphinate or phosphinate salt. The halogen-free flame retardant compositions can also include additional materials, such as alumina trihydrate and magnesium hydroxide, that are substantially free of halogenated compounds or materials.
    Type: Application
    Filed: October 19, 2007
    Publication date: April 23, 2009
    Inventors: Rafael Garcia-Ramirez, Eumi Pyun, Ralph Su, Emily Liao
  • Patent number: 7498071
    Abstract: It is an object of the present invention to provide a laminated member with an recorded information code, having a high reading accuracy, which do not detract from product design and which do not require a special reading apparatus. A laminated member 10 of the present invention comprises a transparent material layer 12 on which an information code is recorded, and a reflection-reduction layer 14 provided at the opposite side from a side where the information code is observed. The transparent layer 12 comprises low-reflectance portions 18 and high-reflectance portions 16 having a higher reflectance than the low-reflectance portions 18. The information code is recorded as a distributed pattern of the high-reflectance portions 16. The reflection-reduction layer 14 reduces reflected light advancing to the transparent material layer 12.
    Type: Grant
    Filed: January 16, 2004
    Date of Patent: March 3, 2009
    Assignee: Shiseido Co., Ltd.
    Inventors: Kenichi Sakuma, Masayoshi Wada, Asa Kimura
  • Publication number: 20080311395
    Abstract: Disclosed is a pressure sensitive adhesive composition comprising a (meth)acrylic polymer comprising, as a monomer component, 0.1 to 4.9% by weight of a reactive monomer having an alkylene oxide group, wherein the reactive monomer has an average number of moles of an oxyalkylene unit added to the reactive monomer falls within the range from 3 to 40, and a pressure sensitive adhesive composition comprising an alkali metal salt. The present invention provides a pressure sensitive adhesive composition which is excellent in antistatic property of a no-electrification-prevented adherend upon peeling, and has reduced staining of an adherend and is excellent in adhesion reliance. Also disclosed is an antistatic pressure sensitive adhesive sheet or surface-protecting film prepared using the composition.
    Type: Application
    Filed: September 4, 2006
    Publication date: December 18, 2008
    Inventors: Natsuki Ukei, Tatsumi Amano, Masahiko Ando
  • Patent number: 7465493
    Abstract: The present invention concerns solvent-based acrylic pressure sensitive adhesives and hot melt (or solvent-less) acrylic pressure sensitive adhesives comprising a solution or misible blend of a. at least one hydrophobic (meth) acrylic polymer, b. at least one substantially water insoluble polyol having a number average molecular weight of from 1,000 to 20,000 and selected from the group consisting of polyester polyols, acrylic polyols, polycarbonate polyols and polyether polyols, c. at least one transition metal complex as cross-linking agent, d. optionally one or more tackifying resins, g. optionally one or more solvents, h. optionally one or more of plasticizers, adhesion promoters, pigments, fillers, antioxidants and UV stabilizers. It employs polyols which are substantially insoluble in water and miscible with the acrylic polymer used in the adhesive composition.
    Type: Grant
    Filed: July 9, 2003
    Date of Patent: December 16, 2008
    Assignee: Cytec Surface Specialties, S.A.
    Inventor: Xinya Lu
  • Patent number: 7464510
    Abstract: Connectors for joining adjacent modular floor covering units. The connectors include a film and an adhesive layer coated on one side of the film. To install tiles using the connectors, a first tile is placed on the floor and a connector is positioned so that the adhesive layer faces upward and does not contact the floor. The connector is typically positioned so that only a portion of the adhesive layer adheres to the underside of the tile, leaving the remainder of the connector extending from the underside of the tile. Tiles are then positioned adjacent the first tile so that a portion of the connector adheres to the adjacent tiles. In this way, the connectors span adjacent tile edges. The tiles are assembled on a underlying flooring surface without the need to attach them to the floor surface. Rather, the tiles are linked to each other with the connectors, so that the tiles create a floor covering that “floats” on the under lying floor surface.
    Type: Grant
    Filed: December 21, 2004
    Date of Patent: December 16, 2008
    Assignee: Interface, Inc.
    Inventors: Graham A. H. Scott, David D. Oakey, John P. Bradford, Keith N. Gray
  • Publication number: 20080292880
    Abstract: An insulating facing tape material that can be used for covering exposed insulation surfaces to protect them from moisture and other environmental factors. The material typically includes a first layer of metal-containing foil, a second layer of metal-containing foil, a polymeric layer that is disposed between the first and second layers of metal-containing foil, and a pressure-sensitive adhesive connected to one of the layers of metal-containing foil and exposable for securing the tape material to a substrate. The polymeric layer is a laminate of multiple sub-layers of different principal polymer orientations. The pressure-sensitive adhesive layer may be covered with a release liner prior to application.
    Type: Application
    Filed: May 22, 2007
    Publication date: November 27, 2008
    Applicant: American Biltrite, Inc.
    Inventor: Anne Hansen
  • Patent number: 7361391
    Abstract: Multilayered laminate films for food packaging applications which comprise at least: (a) a layer of oriented or nonoriented polyester terephthalate or oriented or nonoriented polypropylene, (b) a layer comprising at least one metal, and (c) a layer comprising at least one additive suitable for incidental food contact which provides protection against corrosion to a layer containing at least one metal is described.
    Type: Grant
    Filed: October 2, 2002
    Date of Patent: April 22, 2008
    Assignee: Milprint, Inc.
    Inventors: Mahmood Reza Rassouli, Michael Scott Hartman
  • Patent number: 7294396
    Abstract: A self-adhesive tape comprising an oriented polyolefin film, one side of which is coated with an adhesive layer formed from a mixture of 30-65 wt. % of a natural rubber latex and 35-70 wt. % of an aqueous dispersion of a hydrocarbon resin, and the opposite side of which has no surface treatment.
    Type: Grant
    Filed: July 27, 2001
    Date of Patent: November 13, 2007
    Assignee: tesa AG
    Inventors: Andre Galle, Bernhard Müssig, Stefan Röber, Herbert Sinnen, Dieter Wenninger