Next To Polyamide Or Polyimide Patents (Class 428/435)
  • Patent number: 5151322
    Abstract: A thermoplastic composite plate material having a quasi isotropy comprises a thermoplastic resin having a melt viscosity of 1,000-15,000 poise and strip pieces each constructed of unidirectionally orientated reinforcing fibers and each having the specific dimensions of the thickness, the width, the length and the ratio of the width and the length thereof. The strip pieces are randomly distributed in plane parallel to a surface of the composite plate material. Since the composite plate material has good quasi-isotropic and high mechanical properties such as flexural strength, flexural modulus and impact strength, a composite product having good quasi-isotropic and high mechanical properties can be obtained by using the composite plate materials. Moreover, since the composite plate material has a good fittability, a composite product having a complicated shape can be easily molded.
    Type: Grant
    Filed: November 22, 1989
    Date of Patent: September 29, 1992
    Assignee: Toray Industries, Inc.
    Inventors: Yukitane Kimoto, Kohzou Murata, Toshio Muraki
  • Patent number: 5122226
    Abstract: A process for fabricating a composite article is disclosed. A surface of a preconsolidated fiber reinforced glass matrix composite structure is pretreated to promote adhesion to the surface, a mass of fiber-containing uncured resin is molded in contact with the pretreated surface and the resin is cured to consolidate a fiber reinforced resin matrix composite structure and simultaneously bond the resin matrix composite structure to the glass matrix composite structure. A composite article fabricated by the above process is also disclosed.
    Type: Grant
    Filed: August 12, 1987
    Date of Patent: June 16, 1992
    Assignee: United Technologies Corporation
    Inventors: Eric Minford, Karl M. Prewo, Robert J. Miller
  • Patent number: 5116673
    Abstract: A high-temperature resistant stacking support is composed of a, preferably self-supporting, core which at least partially is surrounded by a high-temperature resistant fiber composite made of polyimide fibers of the general formula ##STR1## wherein n is an integer larger than 1 and A represents a four-valent aromatic group.The stacking support can be produced by shrinking a polyimide fiber nonwoven consisting of polyimide fibers of the general formula (I) onto the core under heat exposure.These stacking supports are particularly useful for stacking heated aluminum sections.
    Type: Grant
    Filed: March 23, 1990
    Date of Patent: May 26, 1992
    Assignee: Lenzing AG
    Inventors: Robert Vodiunig, Gerhard Reiter, Klaus Weinrotter
  • Patent number: 5111003
    Abstract: A multilayer wiring substrate which includes a glass ceramic section, a wiring layer section having a plurality of wiring layers electrically insulated from each other by a polyimide material, and an intermediate layer made of an inorganic material and arranged between the ceramic section and the wiring layer section.
    Type: Grant
    Filed: March 6, 1991
    Date of Patent: May 5, 1992
    Assignee: NEC Corporation
    Inventor: Kohji Kimbara
  • Patent number: 5108819
    Abstract: A biocompatible thin film electrical component is configured for use in a human body or other ionic liquid environment. A polyimide substrate is bonded to a glass carrier plate sized for handling by automatic equipment and a multiple-layer metal conductor is deposited on the substrate and patterned to define an electrical circuit or biosensor. The polyimide and the glass establish a bond therebetween that withstands handling yet is know using biocompatible releasing agents and techniques. The polyimide substrate and glass carrier plate preferably have similar thermal expansion properties to reduce the likelihood of fracture and delamination problems during release of the substrate from the carrier plate. An insulation layer covers the metal conductor and, in one embodiment, is made of polyimide having a cure temperature lower than the temperature at which interediffusion occurrs in the metal layers in the conductor.
    Type: Grant
    Filed: February 14, 1990
    Date of Patent: April 28, 1992
    Assignee: Eli Lilly and Company
    Inventors: James W. Heller, David Lipson, Kirk W. Johnson
  • Patent number: 5098767
    Abstract: A high efficiency air filter is described which comprises a depth filter sheet that has been formed with micropleats stabilized by application of a strip of a thermoplastic adhesive across the peaks of the micropleats and then formed into a macropleated structure with the axes of the micropleats and the macropleats being essentially parallel. The micropleats preferably have a bending radius of less than about 0.01 inch.
    Type: Grant
    Filed: March 18, 1991
    Date of Patent: March 24, 1992
    Assignee: Pall Corporation
    Inventor: Staffan B. Linnersten
  • Patent number: 5049421
    Abstract: A polyimide adhesive is applied in liquid form between surfaces of a pressure transducer glass surface and a glass pedestal tube and maintained at room temperature, or below, for a period of 10-15 hours to allow the adhesive solvent to evaporate. After such time, the temperature of the transducer and attached pedestal tube is elevated over a period of time to about 320.degree. C. to completely imidize the polyimide adhesive. The pedestal is then fixed within an opening in a base portion of a case, and electrical conductors are connected between pins in the case and transducer contacts. A cover is hermetically sealed to the case to thereby encase the transducer.
    Type: Grant
    Filed: January 30, 1989
    Date of Patent: September 17, 1991
    Assignee: Dresser Industries, Inc.
    Inventor: William S. Kosh
  • Patent number: 5037701
    Abstract: The invention relates to articles with a non-stick coating. It relates in particular to an article consisting of a substrate whose surface has -OH groups, and of at least one non-stick polymer layer, said article having also, applied between said substrate and said non-stick polymer layer, a layer which is obtained by making an appropriate bifunctional organosilane react with a polyamic-acid precursor of polyamide-imide and with -OH groups of the substrate surface, then drying and converting said polyamic-acid into a polyamide-imide by heating at an appropriately high temperature. The invention also provides processes and compositions to make non-stick glass and glass-ceramic cookware having clear, vivid, brilliant, attractive colors and stable and durable decorating patterns. Said coloring is achieved by precoating the substrate surface with a polyimide resin containing colored pigment, and preferably, an organosilane.
    Type: Grant
    Filed: July 27, 1990
    Date of Patent: August 6, 1991
    Assignee: Corning Incorporated
    Inventors: Alain R. E. Carre, Francoise M. M. Roger
  • Patent number: 5024850
    Abstract: A method of manufacturing a polarization filter, in which a mixture of a liquid crystalline diacrylate monomer or dimethacrylate monomer and a dichroic colorant is provided on a substrate, oriented and polymerized by exposing it to radiation, as well as a polarization filter which is manufactured according to the above method, and a display comprising the polarization filter.
    Type: Grant
    Filed: December 6, 1989
    Date of Patent: June 18, 1991
    Assignee: U.S. Philips Corporation
    Inventors: Dirk J. Broer, Jan Van Der Veen
  • Patent number: 5004775
    Abstract: A thermosetting resin is comprised of (a) a bisimide, particularly a bismaleimide, (b) a polyphenol, particularly a bisphenol, and (c) dicyandiamide. The polyphenol may be styrene-terminated (i.e. a vinyl benzyl ether of a bisphenol). Flame retardance is improved by the addition of octabromodiphenyl oxide.
    Type: Grant
    Filed: September 28, 1989
    Date of Patent: April 2, 1991
    Assignee: Allied-Signal Inc.
    Inventors: Larry D. Olson, Jeffrey R. Kamla
  • Patent number: 5001010
    Abstract: Compositions comprising a polyepoxy compound (preferably bisphenol A diglycidyl ether) and a polyphenylene ether which has been melt processed (e.g., by extrusion) at a temperature in the range of about 230.degree.-390.degree. C., are cured at temperatures in the range of about 190.degree.-250.degree. C. by various epoxy cure catalysts. They may be used in the preparation of laminates with excellent dielectric properties, solvent resistance and solder resistance, useful in printed circuit board production.
    Type: Grant
    Filed: October 11, 1988
    Date of Patent: March 19, 1991
    Assignee: General Electric Company
    Inventors: Herbert S. Chao, Jana M. Whalen
  • Patent number: 5001009
    Abstract: The lubricious hydrophilic coatings of the invention include a hydrophilic polyolefin such as polyvinyl-pyrrolidone and a water-insoluble stabilizing polymer such as a cellulose ester. The coatings may also include an adherent polymer and a plasticizing agent. The coatings are significantly more lubricious when wet than when dry, are adherent to a variety of substrates, and are resistant to removal by wet abrasion. The coating method of the invention involves preparing a solution of the stabilizing polymer and a solution of the hydrophilic polyolefin, and coating the substrate first in one then the other. Alternatively, both the insolubilizing and hydrophilic polymers may be dissolved in a single solvent system and applied to the substrate in a single step. The solutions of the invention are stable, non-reactive, and non-hazardous. The coatings of the invention may be applied to biomedical devices and implants such as catheters, condoms, and nasogastric and endotracheal tubes.
    Type: Grant
    Filed: September 2, 1987
    Date of Patent: March 19, 1991
    Assignee: Sterilization Technical Services, Inc.
    Inventor: Richard J. Whitbourne
  • Patent number: 4999215
    Abstract: A method of manufacturing a polyimide thin film is disclosed which comprises supplying vapors of a polyimide starting material comprising a plurality of polyimide forming monomers into a plasma atmosphere, transferring the ionized polyimide starting material, under an electric field, to the surface of a glass or metallic substrate and depositing the material thereon, and heating the same during or after deposition, thereby forming a polyimide thin film as an orientation film on the substrate.
    Type: Grant
    Filed: December 29, 1989
    Date of Patent: March 12, 1991
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Yoshiro Akagi, Mariko Ishino, Atsuhisa Inoue, Shigeru Kaminishi, Hiroshi Taniguchi
  • Patent number: 4983463
    Abstract: A process for fabricating a composite article is disclosed. A surface of a preconsolidated fiber reinforced glass matrix composite structure is pretreated to promote adhesion to the surface, a mass of fiber-containing uncured resin is molded in contact with the pretreated surface and the resin is cured to consolidate a fiber reinforced resin matrix composite structure and simultaneously bond the resin matrix composite structure to the glass matrix composite structure. An external flap for a gas turbine engine fabricated by the above process is also disclosed.
    Type: Grant
    Filed: October 13, 1988
    Date of Patent: January 8, 1991
    Assignee: United Technologies Corporation
    Inventors: Eric Minford, Karl M. Prewo, Robert J. Miller
  • Patent number: 4961996
    Abstract: Articles with a non-stick coating. An article consisting of a substrate whose surface has --OH groups, and of at least one non-stick polymer layer, said article having also, applied between said substrate and said non-stick polymer layer, a layer which is obtained by making an appropriate bifunctional organo-silane react with a polyamic-acid precursor of polyamide-imide and with --OH groups of the substrate surface, then drying and converting said polyamic-acid into a polyamide-imide by heating at an appropriately high temperature.
    Type: Grant
    Filed: December 22, 1988
    Date of Patent: October 9, 1990
    Assignee: Corning Incorporated
    Inventors: Alain R. E. Carre, Francoise M. M. Roger
  • Patent number: 4942078
    Abstract: An electrically conductive structural composite which can be heated by application of an electrical current. The structural composite includes a plurality of layers of structural fabric which have been treated and prepreged with a laminating resin and cured into a laminate structure. At least one of the layers of fabric is rendered conductive by being treated with conductive polymer produced by the steps of contacting an electrically insulating porous structural fabric with a liquid pyrrole; contacting the electrically insulating porous structural fabric with a solution of a strong oxidant capable of oxidizing pyrrole to a pyrrole polymer; and, oxidizing the pyrrole by the strong oxidant in the presence of a substantially non-nucleophilic anion and precipitating a conductive pyrrole polymer in the pores of the structural fabric. Electrical conducting means in electrical contact with the conductive layer are utilized for providing passage of electrical current for joule heating of the structural composite.
    Type: Grant
    Filed: September 30, 1988
    Date of Patent: July 17, 1990
    Assignee: Rockwell International Corporation
    Inventors: Paul R. Newman, Patricia H. Cunningham
  • Patent number: 4915998
    Abstract: The thermal insulation blanket can be used to reduce heat loss from a device both in an ambient air environment, and in the vacuum environment of space. The blanket includes a plurality of goldized film layers with interleaved ceramic fiberglass cloth layers, which provide insulation against radiated heat loss in the space environment. Adjacent to the goldized layer is a felt or foam mat which provides insulation against conduction or convection heat loss in the ambient environment. The film and mat components are enclosed in a PTFE-coated fiber glass cloth envelope.
    Type: Grant
    Filed: August 24, 1988
    Date of Patent: April 10, 1990
    Assignee: International Fuel Cells Corporation
    Inventors: Edmund K. Parenti, Jr., George T. Suljak
  • Patent number: 4916259
    Abstract: The disclosure describes a technique whereby the electrical characteristics of an electrical circuit in a package may be adjusted to a predetermined value by changes in the dielectric structure between two levels of circuitry.This adjustment in the composite dielectric structure is accomplished by changes in the electrical properties of the composite dielectric material, one level being preset to a value and the other level being adjusted by alterations of predetermined amounts that depend upon the performance desired.
    Type: Grant
    Filed: July 3, 1989
    Date of Patent: April 10, 1990
    Assignee: International Business Machines Corporation
    Inventors: Ronald S. Charsky, Leonard T. Olson, David P. Pagnani
  • Patent number: 4895760
    Abstract: Covering a rigid but pliable, smooth surface with a one-sided matte embossed polyethylene film, where the non-embossed smooth side of the film is in direct contact with the smooth surface being covered. Adhesion of the smooth side of the film to the smooth surface to which it is applied is effected much like a vacuum adhesion as seen when a drop of water is placed between two sheets of glass. The embossed side of the film forms microscopic air pockets when rolled upon itself which prevents blocking. This feature allows the non-embossed side to be made as smooth as possible without the need for an anti-blocking agent.
    Type: Grant
    Filed: October 9, 1987
    Date of Patent: January 23, 1990
    Assignee: Tredegar Industries, Inc.
    Inventor: Dennis D. Barger
  • Patent number: 4868050
    Abstract: Disclosed is an interleaf-containing, fiber-reinforced epoxy resin prepreg, which comprises a fiber-reinforced epoxy resin matrix and an interleaf composed of a polyimide film subjected to a corona discharge treatment and/or a matting treatment.This prepreg is suitable for the production of a composite material which is excellent in mechanical strength characteristics such as interlaminar shear strength and flexural breaking strength and having a high toughness.
    Type: Grant
    Filed: February 26, 1988
    Date of Patent: September 19, 1989
    Assignee: Ube Industries, Ltd.
    Inventors: Hideho Tanaka, Kazuyoshi Fujii, Kazuo Nishimura
  • Patent number: 4861650
    Abstract: Polyimide laminates are prepared from solutions of maleimide resins comprising a mixture of maleimides and maleamic acids, e.g., greater than about 45% bismaleimide and up to about 40% bis-maleamic acid and a stabilizing amount of polyamine. The bismaleimide is preferably derived from 2,2-bis[4-(4-aminophenoxy)phenyl] propane.
    Type: Grant
    Filed: December 14, 1988
    Date of Patent: August 29, 1989
    Assignee: Monsanto Company
    Inventor: Ronald H. Dahms
  • Patent number: 4856101
    Abstract: A method and an apparatus for reducing of and diverting radiation from all kinds of radiation emitting surfaces like viewing screens, TV screens, chassis, apparatus boxes etc. whereby an elecrically conducting current diverting means (11), for instance a coil of stainless steel, is applied in direct contact with the radiation emitting surface (9) and is connected to earth (12), and whereby a fluid layer containing film or foil or a mass is applied directly to the radiation emitting surface (9) and the diverting means (11), said fluid layer or mass comprising a salt of electrolytic type, and in which the mass is of the type which forms a surface skin or becomes dried right through when being exposed to air, and said layer or mass being electrically conducting even in such dried state, and whereby the apparatus is ready for being used when said mass has formed a skin or has become dried. The current diverting means can be applied after the application of the electrolytic layer or mass.
    Type: Grant
    Filed: December 17, 1987
    Date of Patent: August 8, 1989
    Assignee: Jonson Teknik KB
    Inventors: Sven Jonsson, Anders Hagman
  • Patent number: 4836769
    Abstract: Disclosed is a water-cooled winding for an electromagnetic stirrer, which comprises a coil including a plurality of wound flat type wires having a wire-insulating turn insulation, and a porous polyamide fiber having an air permeation rate not higher than 25 seconds/100 cm.sup.3 of air covering the periphery of the coil, which is impregnated with an epoxy resin composition. In this water-cooled winding, the polyamide fiber is sufficiently impregnated with the epoxy resin composition and this epoxy resin composition is cured stably and assuredly. Accordingly, the mechanical rigidity of the winding is sufficiently high, and the water resistance of the winding is highly improved and is maintained for a long time, with the result that the life of the winding is greatly prolonged.
    Type: Grant
    Filed: August 1, 1986
    Date of Patent: June 6, 1989
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Tadashi Iwabuchi, Takeshi Kawakami
  • Patent number: 4832996
    Abstract: A semiconductor die for plastic encapsulation having an adhesion promoter selectively disposed on an outer surface enabling better adhesion between the semiconductor die and a plastic encapsulation. The improved adhesion allows for less relative motion between the semiconductor die and the plastic encapsulation. The reduction of relative motion significantly decreases the delamination progression throughout the semiconductor device and allows for an increased semiconductor device lifetime.
    Type: Grant
    Filed: February 24, 1988
    Date of Patent: May 23, 1989
    Assignee: Motorola, Inc.
    Inventors: Israel A. Lesk, Ronald E. Thomas, George W. Hawkins
  • Patent number: 4792476
    Abstract: A resin material comprising a polyamide having as chemical structural unit at least one aromatic ring which can rotate around its molecular axis but has no flexibility at another direction, said polyimide being oriented at least at a uniaxial direction, has a low thermal expansion coefficient and can be shaped together with an inorganic material into one body to give a composite shaped article.
    Type: Grant
    Filed: July 24, 1987
    Date of Patent: December 20, 1988
    Assignees: Hitachi, Ltd., Hitachi Chemical Co.
    Inventors: Shun-ichi Numata, Koji Fujisaki, Noriyuki Kinjo, Junichi Imaizumi, Yoshikatsu Mikami
  • Patent number: 4783372
    Abstract: Homopolymers and copolymers which have an average molecular weight of at least 2,000 and which contain at least 5 mol %, relative to the polymer, of at least one structural element of the formula I or II ##STR1## in which R and R' are independently alkylene, cycloalkylene, aralkylene or arylene, R.sup.1 is halogen, nitro, alkyl, alkoxy, alkylthio, phenyl or aralkyl, R.sup.2 is a direct bond, --O--, --S--, methylene, carbonyl or alkylidene, R.sup.3 is hydrogen, aroyl or defined as R.sup.1, and as integers a is 0 to 3, b is 0 to 4, c is 0 to 5, d is 0 to 5 and q is 0 or 1.The polymers are sensitive to radiation and can be used for the production of protective coatings or photographic relief images.
    Type: Grant
    Filed: April 22, 1987
    Date of Patent: November 8, 1988
    Assignee: Ciba-Geigy Corporation
    Inventor: Josef Pfeifer
  • Patent number: 4770922
    Abstract: A base material for use in making printed circuit boards is provided wherein minute fragments of expanded, porous polytetrafluoroethylene are uniformly mixed into another resin, and the mixture is compressed to form a composite board. In use, the board has an electrically conductive circuit affixed to at least one surface. The other resin may be epoxy, polyester or other similar resin. Laminates of such base board material affixed to a glass cloth or paper sheet may be prepared. The preferred fragment size range is 0.1 to 5 mm average diameter, and the preferred volume ratio of fragments to resin is 0.5 to 2.0.
    Type: Grant
    Filed: April 13, 1987
    Date of Patent: September 13, 1988
    Assignee: Japan Gore-Tex, Inc.
    Inventors: Minoru Hatakeyama, Kosuke Moriya, Ichiro Komada
  • Patent number: 4767656
    Abstract: A load-bearing composite material structure (2, 2') has a plurality of layers of composite material. Each layer includes a matrix material (4) that maintains its structural integrity at 1200.degree. F. for at least five minutes. Preferred matrix materials are polyimide resins. Outer layers that will be directly exposed to a fire are reinforced with a woven fabric (8) that is sufficiently flame resistant and has a sufficiently fine weave to prevent flame penetration at 2000.degree. F. for at least fifteen minutes. The woven fabric (8) is preferably ceramic. The rest of the layers are reinforced with a fibrous material (6) to provide the necessary structural strength. The layers may be laminate cured together to form a single, integral structure (2) or such laminates adhesively bonded to a honeycomb (12).
    Type: Grant
    Filed: January 9, 1984
    Date of Patent: August 30, 1988
    Assignee: The Boeing Company
    Inventors: Wan T. Chee, Douglas McLaren, Keith E. Therrien
  • Patent number: 4743489
    Abstract: A multilayer wiring substrate for mounting a plurality of electronic circuit elements wherein individual wiring layers are separately by insulating layers of an organic material. A plurality of contact pads are formed on the uppermost insulating layer and are connected to wiring members by pressure bonding at least one ceramic buffer member is provided beneath the contact pads to prevent pressure applied during bonding from affecting the wiring layers.
    Type: Grant
    Filed: November 5, 1986
    Date of Patent: May 10, 1988
    Assignee: NEC Corporation
    Inventor: Shinichi Hasegawa
  • Patent number: 4680195
    Abstract: Homopolymers and copolymers which have an average molecular weight of at least 2000 and which contain at least 5 mole %, relative to the polymer, of at least one structural element of the formula I or II ##STR1## in which and R' are independently alkylene, cycloalkylene, aralkylene or arylene, R.sup.1 is halogen, nitro, alkyl, alkoxy, alkylthio, phenyl or aralkyl, R.sup.2 is a direct bond, --O--, --S--, methylene, carbonyl or alkylidene, R.sup.3 is hydrogen, aroyl or defined as R.sup.1, and as integers a is 0 to 3, b is 0 to 4, c is 0 to 5, d is 0 to 5 and q is 0 or 1The polymers are sensitive to radiation and can be used for the production of protective coatings or photographic relief images.
    Type: Grant
    Filed: May 10, 1985
    Date of Patent: July 14, 1987
    Assignee: Ciba-Geigy Corporation
    Inventor: Josef Pfeifer
  • Patent number: 4602058
    Abstract: The compatibility and thermal stability of blends of polyamides/carboxyl-containing ethylene polymers is improved by adding thereto an organic carboxylic acid compound, especially di-basic acids such as sebacic acid or tartaric acid. The blends may also contain free-radical scavengers and/or antioxidants. These blends are useful as heat-plasticized adhesives or bonding agents.
    Type: Grant
    Filed: July 2, 1984
    Date of Patent: July 22, 1986
    Assignee: The Dow Chemical Company
    Inventors: Stephen L. Graham, Laura A. Kelly
  • Patent number: 4600617
    Abstract: A process for incorporating continuous graphite fiber reinforcement impregnated with polyamide-imide polymer onto injection molded polyamide-imide parts. These impregnated parts are useful as automotive parts such as push rods or rocker arms, and for aircraft parts such as fittings and secondary structural parts.
    Type: Grant
    Filed: April 27, 1984
    Date of Patent: July 15, 1986
    Assignee: Standard Oil Company (Indiana)
    Inventor: Bill W. Cole
  • Patent number: 4548869
    Abstract: An element for electrophoresis comprising the following three-layer structure laminated in the order:(I) a support layer;(II) an adhesive layer comprising a polymer having at least one specifically selected repeating unit; and(III) a medium layer for electrophoresis comprising an aqueous polyacrylamide gel formed by crosslinking polymerization of an acrylamide compound and a crosslinking agent in the presence of water, and a compound containing at least one carbamoyl group (modifier).
    Type: Grant
    Filed: March 12, 1984
    Date of Patent: October 22, 1985
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Masashi Ogawa, Hisashi Shiraishi, Teppei Ikeda
  • Patent number: 4548870
    Abstract: An element for electrophoresis comprising the following three-layer structure laminated in the order:(I) a support layer;(II) an adhesive layer comprising a polymer having at least one specifically selected repeating unit;and(III) a medium layer for electrophoresis comprising an aqueous polyacrylamide gel formed by crosslinking polymerization of an acrylamide compound and a crosslinking agent in the presence of water.
    Type: Grant
    Filed: March 12, 1984
    Date of Patent: October 22, 1985
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Masashi Ogawa, Hisashi Shiraishi, Teppei Ikeda
  • Patent number: 4520075
    Abstract: A siloxane-modified polyimide precursor which can be converted into a polyimide having excellent adhesion and moisture resistance is produced by simultaneously polymerizing a diaminosiloxane and a diamine containing no silicon atoms in its molecule with 3,3',4,4'-biphenyltetracarboxylic dianhydride, wherein the diaminosiloxane is used in an amount of 1 to 4 mole % per mole of the total diamino compounds and such that the silicon content in the final reaction product is 0.5 wt % or less. The thus obtained precursor solution is further heat aged to reduce the molecular weight of the precursor so that solution viscosity is decreased to a proper level suitable for coating operation.
    Type: Grant
    Filed: September 25, 1984
    Date of Patent: May 28, 1985
    Assignee: Nitto Electric Industrial Co., Ltd.
    Inventors: Kazumasa Igarashi, Katsuhiko Yamaguchi, Kazuo Iko, Kazuyuki Miki
  • Patent number: 4517241
    Abstract: A support material comprised of a substrate and a coating bound to the substrate made up of a polymer containing succinimide units or derivatives thereof. A method for preparing a support material comprising reacting a polymer containing succinimide units with surface amine groups on a substrate.
    Type: Grant
    Filed: December 2, 1982
    Date of Patent: May 14, 1985
    Inventor: Andrew J. Alpert
  • Patent number: 4500603
    Abstract: Disclosed is a novel filled continuous thermoplastic sheet material highly suitable for use in electrical applications, such as in the production of printed circuit boards. This material comprises an extruded sheet of a thermoplastic polymer, preferably poly(1,4-butylene terephthalate), containing from about 5 to 60% by weight of reinforcing filler material such as glass fibers, and having a polymer-rich surface, a gloss value of at least 15, and a maximum roughness of about 150 microinches.
    Type: Grant
    Filed: February 2, 1981
    Date of Patent: February 19, 1985
    Assignee: Celanese Corporation
    Inventor: Richard A. Freundlich
  • Patent number: 4479552
    Abstract: An improved pile driving cap block cushion is the subject of this invention. The material is a glass filled thermoplastic characterized by a melting point of 125.degree. C. or higher, a secant modulus of elasticity of from 50,000 to 800,000 p.s.i. and a coefficient of restitution of from 0.4 to 0.9. A number of thermoplastics are suitable for forming the material of the invention and include polyamides, polyesters, polyolefins, polycarbonates, polyimides, polyamide-imide copolymers, acetal homopolymers, acetal copolymers, fluoroplastics, polyphenyl oxides, copolyesters, polyetherimides, polystyrenes, polyvinyls, and polysulfones. A particularly useful group of materials is poly(ethylene terephthalate), poly(butylene terephthalate) nylon 6 and nylon 66. Additives such as antioxidants, heat stabilizers, reinforcers and colorants may also be added.
    Type: Grant
    Filed: March 8, 1983
    Date of Patent: October 30, 1984
    Assignee: Conmaco, Inc.
    Inventors: Cecil C. Chappelow, Jr., Thomas J. Byerley
  • Patent number: 4478782
    Abstract: Provided is an erasable recording medium and a method for recording and erasing same. The erasable recording medium comprises a thermally stable substrate and a polymeric layer deposited on the substrate comprised of a dimer acid polyamide. Such a recording medium has an excellent dimensional and mechanical stability on storage, readily and easily records information, and has an ability to be easily and completely erased when erasure is desired.
    Type: Grant
    Filed: September 14, 1983
    Date of Patent: October 23, 1984
    Assignee: Celanese Corporation
    Inventors: James E. Kuder, Anthony J. East
  • Patent number: 4456657
    Abstract: A metallized, laminated substrate well adapted for the production of printed circuits is comprised of:(A) an electrically insulating support element which comprises (a) a central core member comprising a major proportion by weight of a cellulosic or mica filler and a minor proportion by weight of a thermosetting resin, and (b) and (b') a pair of skin laminae coextensively secured to each face surface, respectively, of said central core (a) each of said skin laminae comprising a fibrous glass, asbestos or heat-stable synthetic polymer reinforcing filler, and a thermosetting resin impregnant, which thermosetting resin may either be the same as or different from the thermosetting resin comprising said central core member (a); and(B) an electrically conducting metal foil (c) coextensively adhered to the exposed face surface of one or the other of said skin laminae (b) or (b').
    Type: Grant
    Filed: October 22, 1981
    Date of Patent: June 26, 1984
    Assignee: Rhone-Poulenc Industries
    Inventors: Robert Cassat, Bruno Vignando
  • Patent number: 4448835
    Abstract: Window weather stripping for sealing a gap between a movable glass and a window frame having less frictional sliding resistance and longer life time at relatively lower manufacturing cost. The window weather stripping according to the present invention comprises at least one microscopically rough surface on which the window glass slides, the rough surface being formed by applying a colloidal paint thereon. The colloidal paint is prepared by mixing a synthetic resin paint with a solvent the solubility of which is smaller than that of the synthetic resin or by mixing the colloidal paint obtained as described above with a non-colloidal paint. The synthetic resin is vinyl chloride, urethane-based resin, acryl-based resin, nylon-based resin, polyolefine chlorination-based resin, etc., and the poor solvent is isopropyl alcohol or methanol.
    Type: Grant
    Filed: July 15, 1982
    Date of Patent: May 15, 1984
    Assignee: Kinugawa Rubber Industrial Co., Ltd.
    Inventor: Toshiaki Yamaguchi
  • Patent number: 4447493
    Abstract: A constrained-layer construction comprising a stiff layer or substrate and a layer of a viscoelastic polymer which is the reaction product of (a) 25 to 75 weight percent of an acryloyl or methacryloyl derivative of at least one oligomer, said oligomer having a glass transition temperature of less than 25.degree. C. and a molecular weight per oligomer of 600 to 20,000, and (b) 75 to 25 weight percent of a copolymerizable monomer whose homopolymer has a glass transition temperature of at least 50.degree. C., the copolymer being suitable for damping vibrations at relatively high temperatures, e.g., 50.degree.-150.degree. C., is disclosed. Also included is a process for damping vibrations in component parts of devices used in automotive, aerospace, and computer industries.
    Type: Grant
    Filed: July 26, 1982
    Date of Patent: May 8, 1984
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: William A. Driscoll, Steven M. Heilmann, Jerald K. Rasmussen
  • Patent number: 4443507
    Abstract: A heat-moldable laminate comprising at least one thermoplastic resin layer, at least one fiber reinforced cured thermosetting resin layer, and at least one slippage layer interposed therebetween and bonding the resin layers, said slippage layer comprising a thermoplastic resin and said slippage layer being capable of being molten at lower temperatures than the moldable temperature of the thermoplastic resin layer, and a process for molding the heat-moldable laminate to produce a molded article having excellent strength and rigidity is disclosed.
    Type: Grant
    Filed: August 30, 1982
    Date of Patent: April 17, 1984
    Assignee: Toho Beslon Co., Ltd.
    Inventors: Kozo Yamada, Takayuki Tanaka
  • Patent number: 4433016
    Abstract: A multiple glazed unit wherein glass sheets are bonded together and held in spaced relationship by means of a fiber-reinforced alkali silicate based cement composition is disclosed.
    Type: Grant
    Filed: June 14, 1982
    Date of Patent: February 21, 1984
    Assignee: PPG Industries, Inc.
    Inventor: James E. Neely, Jr.
  • Patent number: 4403075
    Abstract: Highly fire resistant composites or laminates particularly applicable as structural components in aircraft, e.g. in the engine nacelle, as part of the acoustic panel-fire wall structure, and capable of withstanding a 2,000.degree. F. flame temperature, comprising incorporating an additive in the form of a polymeric phosphorylated amide, into a resin, e.g., a polyimide or an epoxy resin, such additive being soluble in the resin. The resulting resin containing the additive is then applied to or impregnated into a substrate such as glass fiber cloth or graphite fiber, to form a composite structure which is then cured. The resulting cured composite when subjected to high temperatures of the order of, e.g., a 2,000.degree. F. flame temperature, forms a resin char of reduced thermal conductivity which holds the fibers of the laminate together and maintains the structural stability and integrity of the laminate.
    Type: Grant
    Filed: September 25, 1980
    Date of Patent: September 6, 1983
    Assignee: McDonnell Douglas Corporation
    Inventors: Norman R. Byrd, Daniel C. Peek
  • Patent number: 4400439
    Abstract: A recording medium is described comprising a recording layer having provided on a support, wherein the recording layer contains at least one chemically modified thermally coagulatable proteinaceous compound containing therein no intermolecular cross-linking bond.
    Type: Grant
    Filed: February 9, 1981
    Date of Patent: August 23, 1983
    Assignee: Process Shizai Co., Ltd.
    Inventors: Takashi Kashiwagi, Nobuyuki Inoue
  • Patent number: 4378411
    Abstract: A composition comprising a radiation-curable polymer, said polymer being crosslinkable and having pendant ethylenically unsaturated peptide groups is disclosed. Such polymers are useful in the field of graphic arts.
    Type: Grant
    Filed: May 26, 1981
    Date of Patent: March 29, 1983
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Steven M. Heilmann, Frederick J. Palensky, Jerald K. Rasmussen
  • Patent number: 4358329
    Abstract: A process for producing a safety laminate comprising at least two plates bonded to each other through an adhesive interlayer, which comprises(1) applying an adhesiveness-imparting agent being liquid at ambient temperature and substantially non-adhesive to said plates to at least one of (a) the surface of each of said plates and (b) each surface to be bonded to said surface (a) of a sheet-like adhesive material which is substantially non-adhesive, and only latently adhesive, to said plates, said adhesiveness-imparting agent being capable of developing the latent adhesiveness of said sheet-like adhesive material; and(2) sandwiching said sheet-like adhesive material as an interlayer between two of said plates to bond said plates through the interlayer of said sheet-like adhesive material having its adhesiveness developed; and a safety laminate produced by aforesaid process.
    Type: Grant
    Filed: August 25, 1980
    Date of Patent: November 9, 1982
    Assignee: Sekisui Kagaku Kogyo Kabushiki Kaisha
    Inventor: Eisuke Masuda
  • Patent number: 4337110
    Abstract: The applicants have provided laminates prepared by (a) impregnating a glass fabric with an N-methyl-2-pyrrolidone solution of a compound having the structure of Formula A shown in FIG. 1 of the drawings, (b) heating the impregnated glass fabric to remove solvent therefrom and to covert the amic acid groups to imide groups, and (c) assembling a plurality of the impregnated glass fabrics from (b) and heating the assembly under pressure to a temperature in the range of 177.degree.-260.degree. C.
    Type: Grant
    Filed: April 27, 1978
    Date of Patent: June 29, 1982
    Assignee: Gulf Oil Corporation
    Inventors: Patricia A. Antonoplos, William J. Heilman
  • Patent number: 4332929
    Abstract: Copolymers of etherimides and amides have been found to be useful in the coating and molding arts.
    Type: Grant
    Filed: March 16, 1981
    Date of Patent: June 1, 1982
    Assignee: General Electric Company
    Inventors: Fred F. Holub, Gary A. Mellinger