Next To Polyester, Polyamide Or Polyimide (e.g., Alkyd, Glue, Or Nylon, Etc.) Patents (Class 428/458)
  • Patent number: 10717830
    Abstract: Provided is a polyamide resin composition for a slide fastener that includes at least one polyamide resin and reinforcing fibers, wherein a total mass of the polyamide resin and the reinforcing fibers accounts for 90% by mass or more of the composition; wherein poly(m-xylylene adipamide) (MXD 6) accounts for 60% by mass or more of the polyamide resin; wherein reinforcing fibers account for 45 to 70% by mass of the total mass of the polyamide resin and the reinforcing fibers; wherein both first reinforcing fibers having a fiber diameter of from 5 to 7 ?m and second reinforcing fibers having a fiber diameter larger than that of the first reinforcing fibers by more than 2 ?m account for 90% by mass or more of the reinforcing fibers; and wherein the first reinforcing fibers account for 20% by mass or more and less than 50% by mass of the reinforcing fibers.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: July 21, 2020
    Assignee: YKK Corporation
    Inventors: Kazuya Mizumoto, Hironobu Wakasa, Yasuhiro Yokogoshi, Norihide Ozaki
  • Patent number: 10710348
    Abstract: Methods and apparatus to increase fire resistance and fracture toughness of a composite structure are described. An example apparatus includes a composite structure formed by an innermost ply and a fire-resistant ply including a first additive to increase a flammability resistance of the structure, where the fire-resistant ply is an inner ply of the composite structure.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: July 14, 2020
    Assignee: The Boeing Company
    Inventors: Andrew L. Bauer, Mark E. Rogalski
  • Patent number: 10706998
    Abstract: An electrical steel sheet has an insulation coating on a steel sheet surface. The insulation coating includes: a binder consisting of 100 parts by mass of a metal phosphate and 1 to 50 parts by mass of an organic resin having an average particle size of 0.05 to 0.50 ?m; and a carboxylic acid-containing compound with a carbon number of 2 to 50 in an amount of 0.1 to 10.0 parts by mass based on 100 parts by mass of solids content of the binder. The organic resin is at least one selected from the group consisting of acrylic resins, epoxy resins, and polyester resins. The insulation coating of this electrical steel sheet shows good edge corrosion resistance after blanking.
    Type: Grant
    Filed: February 15, 2016
    Date of Patent: July 7, 2020
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Kazutoshi Takeda, Hiroyasu Fujii, Masaru Takahashi, Shuichi Yamazaki, Hiroki Hori
  • Patent number: 10707491
    Abstract: An object of the present invention is to provide a binder composition for a secondary battery for achieving improved charge-discharge efficiency and good cycle characteristics at the same time. The binder composition for a secondary battery according to the present invention is characterized in comprising a polyamic acid comprising a repeating unit consisting of a skeleton based on an aromatic tetracarboxylic acid dianhydride and a skeleton based on an alicyclic diamine represented by structural formula: NH2—(CH2)n—R2—(CH2)m—NH2, wherein R2 represents alicyclic group, and n and m each independently represent the number of repeating units selected from 1 to 5; and/or a polyamic acid comprising a repeating unit consisting of a skeleton based on an alicyclic tetracarboxylic acid dianhydride and a skeleton based on an aromatic diamine.
    Type: Grant
    Filed: February 9, 2017
    Date of Patent: July 7, 2020
    Assignee: NEC CORPORATION
    Inventor: Shin Serizawa
  • Patent number: 10675821
    Abstract: An installation tool and method are provided to apply a patch to a structure while controlling the porosity in the bond line. An installation tool is provided that includes a frame defining an internal cavity. The installation tool also includes a flexible membrane that divides the internal cavity into a first chamber proximate the surface and a second chamber separated from the surface by the first chamber and the flexible membrane. The flexible membrane is releasably attached to the patch such that the patch faces the surface. The frame includes first and second vacuum ports into the first and second chambers, respectively, such that pressure therewithin is separately controllable. The pressure within the first and second chambers is controlled such that the adhesive is degassed while the patch remains spaced from the surface and the flexible membrane is thereafter caused to be stretched to urge the patch toward the surface.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: June 9, 2020
    Assignee: The Boeing Company
    Inventors: Daniel J. Perron, Michael W. Evens, Jeffrey H. Olberg
  • Patent number: 10676579
    Abstract: It is intended to provide a resin composition that serves as a raw material for a printed circuit board excellent in heat resistance after moisture absorption and is excellent in moldability. The resin composition of the present invention contains a maleimide compound, a silane compound having a carbon-carbon unsaturated bond and a hydrolyzable group or a hydroxy group, a silane compound having an epoxy skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.
    Type: Grant
    Filed: July 4, 2016
    Date of Patent: June 9, 2020
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Katsuya Tomizawa, Yoichi Takano, Meguru Ito, Eisuke Shiga
  • Patent number: 10654222
    Abstract: Provided are a manufacturing device and a manufacturing method, for a one-side metal-clad laminated sheet (E), enabling: manufacturing a one-side metal-clad laminated sheet (E) without a thermoplastic resin layer (B) surface, on the side on which metal foil (D) is not laminated, being fused with a metal roller or a protective film even if the thermoplastic resin layers (B) are provided on both sides of a heat-resisting film (A) that is a core layer; and inexpensively and easily obtaining a one-side metal laminated sheet in which warpage is inhibited from occurring.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: May 19, 2020
    Assignee: KANEKA CORPORATION
    Inventor: Tomohiro Yamaoka
  • Patent number: 10654969
    Abstract: A thin film is provided, which includes a polymer formed by reacting (a) p-hydroxybenzoic acid, (b) 6-hydroxy 2-naphthoic acid and (c) branched-monomer. (c) branched-monomer is or a combination thereof, wherein R is aryl group, heteroaryl group, or cycloalkyl group, and each of R1 is independently —OH, —NH2, or —COOH. The molar ratio of (a) p-hydroxybenzoic acid over (b) 6-hydroxy 2-naphthoic acid is between 50:50 and 90:10. The molar ratio of (c) branched-monomer over the sum of (a) p-hydroxybenzoic acid and (b) 6-hydroxy 2-naphthoic acid is between 0.25:100 and 0.5:100. The polymer has an intrinsic viscosity of 4 dL/g to 6 dL/g.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: May 19, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Meng-Hsin Chen, Chih-Hsiang Lin, Jen-Chun Chiu
  • Patent number: 10645805
    Abstract: Provided are a multi-layer flexible metal-clad laminate, and a manufacturing method thereof, and more particularly, a multi-layer flexible metal-clad laminate in which at the time of manufacturing a multi-layer polyimide film on a surface of a metal-clad having a predetermined surface roughness value (Rz, Ra) and having roughening particles having a predetermined size or less attached thereon, a multi-coating scheme is used to form each polyimide mixed layer, such that a light reflection on a surface of the polyimide film and a light reflection generated at an interlayer interface of the polyimide in the multi-layer polyimide film are decreased to have an improved light transmittance of a polyimide laminate film after the metal-clad is removed, and a manufacturing method thereof.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: May 5, 2020
    Assignee: NEXFLEX CO., LTD.
    Inventors: Ho Sub Kim, Byoung Wook Jo, Young Do Kim, Weon Jung Choi, Dae Nyoun Kim, Seung Jeong Kook
  • Patent number: 10638976
    Abstract: A method of constructing an inflatable electrode assembly configured for irrigation, comprises: providing a flex circuit having a substrate with a pre-formed aperture, the substrate constructed of a material having a greater heat resistance or a first melting temperature; providing a balloon member with a membrane, the membrane constructed of a material having a lesser heat resistance or a second melting temperature lower than the first melting temperature of the substrate; affixing the substrate to the membrane wherein a surrounding portion of the substrate around the pre-formed aperture masks a surrounding portion of the membrane so as to expose a target portion of the membrane; and applying heat to the target portion of the membrane through the pre-formed aperture of the substrate, wherein the heat applied, without melting the substrate, melts the target portion of the membrane in forming an aperture in the membrane.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: May 5, 2020
    Assignee: BIOSENSE WEBSTER (ISRAEL) LTD
    Inventors: Christopher Thomas Beeckler, Joseph Thomas Keyes, Assaf Govari
  • Patent number: 10636734
    Abstract: A method to produce a substrate suitable for diffusion bonding is described. A flexible dielectric substrate is provided. An alkaline modification is applied to the dielectric substrate to form a polyamic acid (PAA) anchoring layer on a surface of the dielectric substrate. A Ni—P seed layer is elecrolessly plated on the PAA layer. Copper traces are plated within a photoresist pattern on the Ni—P seed layer. A surface finishing layer is electrolytically plated on the copper traces. The photoresist pattern and Ni—P seed layer not covered by the copper traces are removed to complete the substrate suitable for diffusion bonding.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: April 28, 2020
    Assignee: Compass Technology Company, Ltd.
    Inventors: Kelvin Po Leung Pun, Chee Wah Cheung
  • Patent number: 10573548
    Abstract: A method for manufacturing a semiconductor device according to the present invention includes at least the following four steps: (A) a step of preparing a structure (100) including an adhesive laminate film (50) having a heat-resistant resin layer (10), a flexible resin layer (20) and an adhesive resin layer (30) in this order, and one or two or more semiconductor chips (70) adhered to the adhesive resin layer (30); (B) a step of confirming an operation of the semiconductor chips (70) in a state of being adhered to the adhesive resin layer (30); (C) a step of, after the step (B), peeling the heat-resistant resin layer (10) from the adhesive laminate film (50); and (D) a step of, after the step (C), picking up the semiconductor chips (70) from the adhesive resin layer (30).
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: February 25, 2020
    Assignee: MITSUI CHEMICALS TOHCELLO, INC.
    Inventor: Eiji Hayashishita
  • Patent number: 10494766
    Abstract: The instant invention pertains to a method for the production of brilliant glossy metal coatings on paper substrates. Further aspects of the invention are a paper product obtainable using the method and the use of such a paper for decorative or packaging purposes.
    Type: Grant
    Filed: October 1, 2014
    Date of Patent: December 3, 2019
    Assignee: BASF SE
    Inventors: Michelle Richert, Thomas Bolle, Roland Fleury
  • Patent number: 10472463
    Abstract: The present invention relates to an alkyd resin comprising the condensation product of at least the following components (A) a polybasic acid, (B) a polyhydric alcohol, and (C) a linear C12-C60 hydrocarbo monocarboxylic acid, and optionally (D) at least one component other than any of components A to C characterized in that at least a part of the polybasic acid (A) is a (optionally hydrogenated) Diels Alder adduct of citraconic acid with C4-C14 conjugated diene, a (optionally hydrogenated) Diels Alder adduct of citraconic anhydride with C4-C14 conjugated diene, a half ester of such a Diels Alder adduct and/or a diester of such a Diels Alder adduct.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: November 12, 2019
    Assignee: DSM IP ASSETS B.V.
    Inventors: Johannes Wilhelmus Maria Hendriks, Cornelis Eme Koning, Adrianus Jozephus Hendricus Lansbergen, Alwin Papegaaij
  • Patent number: 10459582
    Abstract: A touch sensor includes a plurality of electrode patterns, an optical adjusting layer interposed between the electrode patterns, and an insulation layer at least partially covering the electrode patterns and the optical adjusting layer. The insulation layer may have a refractive index less than that of the optical adjusting layer.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: October 29, 2019
    Assignee: DONGWOO FINE-CHEM CO., LTD.
    Inventors: Sang Kook Kim, Sung Hoon Cho, Min Hyuk Park, Seung June Park
  • Patent number: 10454062
    Abstract: The present invention provides a functional material, its preparation method, and an organic light emitting diode display panel, which belongs to the display technical field and can solve the pollution problem in current organic light emitting diode display panels.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: October 22, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Jiuxia Yang, Feng Bai, Zhenpeng Guo, Jing Su, Jiantao Liu, Hongbo Feng
  • Patent number: 10418635
    Abstract: An electrolytic copper foil for a lithium secondary battery, which is applied as a negative electrode current collector of a lithium secondary battery, wherein after a thermal treatment at 300° C. for 30 minutes, the electrolytic copper foil for a lithium secondary battery has an elongation of 5% to 30%.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: September 17, 2019
    Assignee: KCF TECHNOLOGIES CO., LTD.
    Inventors: Seung-Min Kim, Soo-Yeol Kim, Dae-Young Kim, Jeong-Gil Lee
  • Patent number: 10385244
    Abstract: The present invention comprises a single-component binder for heat-sealing applications which can be used for the sealing of polyester foils, in particular of polyethylene terephthalate foils (PET foils) with respect to containers made of polystyrene, of PVC, and of polyester. These polyesters can in particular be polyethylene terephthalate (PET) or polylactic acid (PLA). The binders here feature not only good seal seam strengths but also in particular good transparency and excellent application properties. A substantive aspect of the invention is that the sealing can be achieved without addition of adhesion promoters, in particular without addition of adhesion promoters based on polyvinyl chloride (PVC) or on polyester, and that barrier properties and sealing properties achieved in respect of containers made of PS and of PET are nevertheless at least comparable with, and sometimes better than, those achieved with heat-sealing systems already marketed.
    Type: Grant
    Filed: May 7, 2015
    Date of Patent: August 20, 2019
    Assignee: Evonik Roehm GmbH
    Inventors: Andre Hennig, Thomas Arnold, Michael Wicke, Juergen Hartmann, Bruno Keller, Guenter Schmitt, Michael Waldhaus
  • Patent number: 10375836
    Abstract: A film and a flexible metal-clad laminate obtained with the film. The laminate is improved in post-moisture absorption solderability. The film comprises a heat-resistant polyimide film and, disposed on at least one side thereof, an adhesive layer containing a thermoplastic polyimide. It is characterized in that the thermoplastic polyimide contained in the adhesive layer has crystallinity and that the film, when analyzed with a differential scanning calorimeter, has an endothermic peak attributable to the melting of the crystalline thermoplastic polyimide, the absolute value of the area of the peak being 4.0 mJ/mg or larger. The flexible metal-clad laminate is characterized by comprising the film and a metal layer disposed thereon.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: August 6, 2019
    Assignee: KANEKA CORPORATION
    Inventors: Takashi Kikuchi, Yasutaka Kondo
  • Patent number: 10360825
    Abstract: A flexible electronic device is provided and includes a supporting substrate, a first flexible substrate disposed on the supporting substrate, a first oxide layer or a conductive layer disposed between the first flexible substrate and the supporting substrate, a second oxide layer directly on the first flexible substrate opposite to the first oxide layer, and an electronic structure disposed on the second oxide layer. The first thickness of the first oxide layer or the conductive layer is greater than a second thickness of the second oxide layer.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: July 23, 2019
    Assignee: InnoLux Corporation
    Inventor: Yuan-Lin Wu
  • Patent number: 10308838
    Abstract: A moisture curable composition comprises: (A) a polymer containing reactive hydroxyl or hydrolysable groups bonded to silicon which groups are reactive in the presence of moisture; (B) a crosslinking agent comprising at least two groups reactive with the silicon-bonded hydroxyl or hydrolysable groups of polymer (A); (C) one or more reinforcing and/or non-reinforcing fillers; and (D) a silane having the structure (R1)m(Y1)3-mSi—Z1-G1-Z2—Si(R2)q(Y2)3-q. R1 and R2 are alkoxy groups containing from 1 to 6 carbons, Y1 and Y2 are alkyl groups containing from 1 to 8 carbons, Z1 and Z2 are alkylene groups having from 1 to 12 carbons, G1 is a chemical group containing a heteroatom with a lone pair of electrons, and m and q are independently 1, 2 or 3. Silane (D) is present in an amount of from 15 to 30% by weight of the composition and functions as a cure catalyst.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: June 4, 2019
    Assignee: Dow Silicones Corporation
    Inventors: Frederic Gubbels, David M. Hagan, Angela L. Stringer
  • Patent number: 10308830
    Abstract: The invention pertains to a fluoropolymer composition comprising: —at least one fluoropolymer [polymer (A)]; —at least one benzoxazine compound [compound (B)] of formula (I), wherein each of Ra, equal to or different at each occurrence, is H or a C1-C12 alkyl group; Rb is a C1-C36 hydrocarbon group, possibly comprising heteroatoms, optionally comprising at least one benzoxazine group; j is zero or an integer of 1 to 4; each of Rc, equal or different at each occurrence, is a halogen or a C1-C36 hydrocarbon group, possibly comprising heteroatoms, optionally comprising at least one benzoxazine group; —at least one aromatic polyimide polymer [polymer (PI)]; —at least one organic solvent [solvent (S)], and to a method for coating a surface, specifically a metal surface, with a fluoropolymer, using said fluoropolymer composition.
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: June 4, 2019
    Assignee: SOLVAY SPECIALTY POLYMERS ITALY S.P.A.
    Inventors: Fabio Polastri, Valeriy Kapelyushko, Pasqua Colaianna
  • Patent number: 10299367
    Abstract: A circuit board includes a flexible board, a composite film, and a copper layer. The composite film is formed on the flexible board and defines at least one through hole. The composite film includes a base layer having an active surface, and a conductive layer formed by coated a conductive polymer on the active surface. The conductive polymer is made by a mixture comprising liquid crystal monomers, a silver complex, an initiator, and a catalytic agent, and a solvent, the mixture is heated to undergo atom transfer radical polymerization. The copper layer covers the conductive layer and an inner wall of each of the at least one through hole. The copper layer is electrically connected to the flexible substrate by the through hole.
    Type: Grant
    Filed: September 27, 2017
    Date of Patent: May 21, 2019
    Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
    Inventors: Ming-Jaan Ho, Hsiao-Ting Hsu
  • Patent number: 10260491
    Abstract: Provided is a sliding member, method for manufacturing sliding member, and compressor swash plate using sliding member in which adhesion between the substrate and the resin is enhanced, and which has the excellent durability whereby peeling of the resin film from the substrate does not occur due to prolonged sliding even under harsh load conditions. The sliding member provides a substrate irradiated laser light with energy intensity per unit area of 0.053 J/mm2 or more and configured an uneven part formed toward a vertical direction by the irradiated laser light and a melted and solidified portion on the uneven part and a resin film including solid lubricant and a binder resin on the substrate.
    Type: Grant
    Filed: February 5, 2014
    Date of Patent: April 16, 2019
    Assignee: TAIHO KOGYO CO., LTD.
    Inventors: Masatomo Kato, Masato Shibata, Shingo Goto, Eiji Yoshida, Keigo Ota
  • Patent number: 10252497
    Abstract: A multilayer composition for packaging comprising a first polymer film, a second film, at least one print layer between the films and a 1 K isocyanate prepolymer adhesive layer between the at least one print layer and one of the films, where the print layer contains a hyperbranched polyester binder containing functional groups selected from the group consisting of —OH, —COOH and —COOR, where R is methyl, ethyl, vinyl, isopropyl, n-propyl, n-butyl, isobutyl, sec-butyl or tert-butyl provides packaging laminates with excellent adhesion. The hyperbranched polyester is for example a polymer of trimethyolpropane and hexahydrophthalic anhydride and optionally a cycloaliphatic diol.
    Type: Grant
    Filed: July 23, 2014
    Date of Patent: April 9, 2019
    Assignee: BASF SE
    Inventors: Chien Hsu, Marco Balbo Block, Andre Kamm
  • Patent number: 10213950
    Abstract: Flexible packaging materials with electrophotographically printed images or information, and processes for preparing such flexible packaging materials are disclosed.
    Type: Grant
    Filed: November 12, 2014
    Date of Patent: February 26, 2019
    Assignee: HP Indigo B.V.
    Inventors: Asaf Salant, David Idan, Raia Slivniak, Albert Teishev, Amnon Levi
  • Patent number: 10217975
    Abstract: A packaging material for a power storage device, the packaging material including, in order from a first surface of a metal foil, a first corrosion protection layer and a coating layer, and, in order from a second surface of the metal foil, a second corrosion protection layer, an adhesive layer, and a sealant layer. In the packaging material, the coating layer contains at least one selected from a group consisting of fluorine resins and amorphous polyester resins.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: February 26, 2019
    Assignee: TOPPAN PRINTING CO., LTD.
    Inventors: Hiroshi Dai, Yuki Muroi
  • Patent number: 10187999
    Abstract: The present invention discloses a method for manufacturing a printed circuit board having an ultra-thin metal layer. The method discharges alkaline aliphatic amine gas and the nitrogen bubbled in the cupric sulfate solution via capacitive coupling in a vacuum, to generate low temperature plasma. The polyimide film and the epoxy resin board coated with fiberglass cloth are etched and the surface is treated to graft active groups, so as to increase the surface roughness and chemical activity. Subsequently, sputtering copper plating or chemical copper plating is directly conducted. The electroplating is conducted to thicken the copper film to a required thickness. The method of the invention not only does not need adhesive (adhesive free), but also has a high peeling strength. It can be used for the preparation of the flexible PCB, the rigid PCB, the multi-layer PCB, and rigid-flex PCB, having an ultra-thin metal layer.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: January 22, 2019
    Assignees: SUZHOU WEIPENG ELECTRICAL TECHNOLOGY CO., LTD., CHANGSHU MUTUAL-TEK CO., LTD.
    Inventors: Yuedong Meng, Futang Fang, Peng Chang
  • Patent number: 10182501
    Abstract: A method for preparing an adhesive-free polyimide flexible printed circuit board is provided. The method includes the following steps: 1) placing a polyimide thin film into a low vacuum environment, and treating the polyimide thin film using plasma produced by capacitively coupled discharge of an organic amine; 2) placing the polyimide thin film obtained in step 1) into a low vacuum environment, and pretreating the polyimide thin film using plasma formed by capacitively coupled discharge of a nitrogen gas bubbled through a metal salt solution; 3) pre-plating the polyimide thin film obtained in step 2) using vacuum sputtering or chemical plating so as to obtain a dense copper film with a thickness of less than 100 nm; and 4) thickening the copper film to a required thickness by means of an electroplating method.
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: January 15, 2019
    Assignee: SUZHOU WEIPENG ELECTRICAL TECHNOLOGY CO., LTD.
    Inventors: Yuedong Meng, Peng Chang, Gangqiang Cai
  • Patent number: 10174167
    Abstract: A polyimide resin containing a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), a content ratio of the repeating structural unit of formula (1) with respect to the total of the repeating structural unit of formula (1) and the repeating structural unit of formula (2) being 20 to 70 mol %, and the polyimide resin having a chain aliphatic group having from 5 to 14 carbon atoms at an end thereof: wherein R1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R2 represents a divalent chain aliphatic group having from 5 to 16 carbon atoms; and X1 and X2 each independently represent a tetravalent group having from 6 to 22 carbon atoms containing at least one aromatic ring.
    Type: Grant
    Filed: March 10, 2016
    Date of Patent: January 8, 2019
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventor: Yuuki Sato
  • Patent number: 10144166
    Abstract: This sheet manufacturing apparatus is provided with: a nozzle for extruding a heated resin sheet; a main roll with a surface on which microstructures are formed; a follower roll disposed at a distance from the main roll; and an electricity-supplying mechanism. The electricity-supplying mechanism heats an electrically conductive section of the main roll by supplying electricity to the electrically conductive section from both edges of the main roll.
    Type: Grant
    Filed: January 14, 2015
    Date of Patent: December 4, 2018
    Assignees: MITSUBISHI GAS CHEMICAL COMPANY, INC., MGC FILSHEET CO., LTD.
    Inventor: Reiki Akita
  • Patent number: 10086595
    Abstract: The present invention relates to a method for forming a packaging material used to produce a product package having at least partly a print layer visible from the outside of the product package. The method comprises the following steps, a first film having a base layer is provided whereby the print layer is printed on one side of the base layer by reverse digital printing. A second film having at least the following two layers, a base layer whereby a core layer is coated on one side of the base layer by extrusion coating. The first and the second film are then thermally laminated.
    Type: Grant
    Filed: March 3, 2015
    Date of Patent: October 2, 2018
    Assignee: AMCOR FLEXIBLES UK LIMITED
    Inventor: Paul Blackman
  • Patent number: 10040981
    Abstract: The invention discloses a hot melt composition comprising a block copolymer consisting of at least two blocks as reaction product of a polyamide having a molecular weight of 5000 g/mol to 100000 g/mol and a modified olefin copolymer having a molecular weight of 3000 to 100000 g/mol and containing covalently bound organic acid anhydride groups to the polymer chain, wherein the polyamide has an amine number from 0.2 to 10 and the olefin copolymer has an acid number from 1 to 100.
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: August 7, 2018
    Assignee: HENKEL AG & CO. KGAA
    Inventors: Luca Marchese, Fabio Ticozzelli, Ruediger Butterbach, Judith Siepenkothen, Juergen Foell, Fabio Spada
  • Patent number: 9993998
    Abstract: Provided is a resin-coated metal sheet for containers having a resin layer (A) on a side of the metal sheet, the side being a side that will serve as a container inner surface when the metal sheet is formed into a container. The resin layer (A) has a polyester-based multilayer structure. The resin layer (A) contains 85 mol % or more of terephthalic acid. The resin layer (A) includes at least two layers, and an uppermost resin layer (a1), which is to be in contact with contends, contains 0.10 to 2.0 mass % of a wax compound with respect to the uppermost resin layer (a1). The maximum value of the Raman band intensity ratio (I1720/I1615) when measured for the cross section of the uppermost resin layer (a1) by using a laser polarization plane parallel to the surface of the resin layer (a1) is in the range of 0.45 or more and 0.80 or less. The uppermost resin layer (a1) has a thickness of 0.5 ?m or more and 10 ?m or less.
    Type: Grant
    Filed: February 17, 2015
    Date of Patent: June 12, 2018
    Assignee: JFE STEEL CORPORATION
    Inventors: Yoichiro Yamanaka, Junichi Kitagawa, Hiroki Nakamaru
  • Patent number: 9902848
    Abstract: The invention relates to a vinyl chloride resin composition and a vinyl chloride resin molded article obtained by molding the vinyl chloride resin composition, wherein the vinyl chloride resin composition contains a vinyl chloride resin (A), a stabilizer (B) as a compound containing at least one of calcium and zinc, and a processing auxiliary (C). The processing auxiliary (C) is a copolymer containing 19 mass % to 95 mass % of a methyl methacrylate monomer (c1) unit and 5 mass % to 81 mass % of an alkyl methacrylate monomer (c2) unit having a C3-C5 alkyl group.
    Type: Grant
    Filed: January 15, 2015
    Date of Patent: February 27, 2018
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Hiroyuki Nishii, Shinya Hirai, Mitsufumi Nodono
  • Patent number: 9900994
    Abstract: A film and a flexible metal-clad laminate obtained with the film. The laminate is improved in post-moisture absorption solderability. The film comprises a heat-resistant polyimide film and, disposed on at least one side thereof, an adhesive layer containing a thermoplastic polyimide. It is characterized in that the thermoplastic polyimide contained in the adhesive layer has crystallinity and that the film, when analyzed with a differential scanning calorimeter, has an endothermic peak attributable to the melting of the crystalline thermoplastic polyimide, the absolute value of the area of the peak being 4.0 mJ/mg or larger. The flexible metal-clad laminate is characterized by comprising the film and a metal layer disposed thereon.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: February 20, 2018
    Assignee: KANEKA CORPORATION
    Inventors: Takashi Kikuchi, Yasutaka Kondo
  • Patent number: 9873539
    Abstract: Provided is a resin-coated metal sheet for a container having a resin layer (A) having a multi-layer structure containing polyester as a main component on an inner-surface side of the container when the metal sheet is formed into the container. The resin layer (A) contains terephthalic acid in an amount of 85 mol % or more, the resin layer (A) has at least two layers including an uppermost resin layer (a1) which comes into contact with contents and contains wax compounds in an amount of 0.10 mass % or more and 2.0 mass % or less with respect to the uppermost resin layer (a1), with respect to a Raman band of 1615 cm?1 determined by performing Raman spectroscopy on the uppermost resin layer (a1), the maximum value of the peak intensity ratio (IMD/IND) of peak intensity in a longitudinal direction to peak intensity in a thickness direction is 1.0 or more and 4.0 or less, a thickness of the uppermost resin layer (a1) is 0.
    Type: Grant
    Filed: February 17, 2015
    Date of Patent: January 23, 2018
    Assignee: JFE Steel Corporation
    Inventors: Yoichiro Yamanaka, Junichi Kitagawa, Hiroki Nakamaru
  • Patent number: 9850346
    Abstract: Provided is a polyimide excellent in heat resistance and colorless transparency and also excellent in flexibility and ultraviolet ray transmittance. The polyimide includes a structural unit represented by Formula (1a) and a structural unit represented by Formula (1b) wherein R is a specific aromatic group.
    Type: Grant
    Filed: May 9, 2014
    Date of Patent: December 26, 2017
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Kenichi Fukukawa, Masaki Okazaki, Yoshihiro Sakata, Tatsuhiro Urakami, Atsushi Okubo
  • Patent number: 9833973
    Abstract: A metal laminate comprising a metal layer and an insulating layer is provided. The insulating layer is disposed on the metal layer and directly contacts the metal layer. The insulating layer is made of a polyimide resin, and the polyimide resin is derived from at least two dianhydrides and at least two diamines. The dianhydride monomers are selected from the group consisting of p-phenylenebis (trimellitate anhydride), 4,4?-(hexafluoroisopropylidene)-diphthalic anhydride, 4,4?-(4,4?-isopropylidenediphenoxy)bis(phthalic anhydride) and the combination thereof. One of the diamine monomers is 2,2?-bis(trifluoromethyl)benzidine, and the other diamine monomers are selected from the group consisting of 2,2-bis[4-(4-aminophenoxy)phenyl, 1,3-bis(4-aminophenoxy)benzene, p-phenylenediamine, 4,4?-oxydianiline, 4,4?-methylenedianiline, 4,4?-diaminobenzanilide, 4,4?-diaminodiphenyl-sulfone, m-tolidine, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane and the combination thereof.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: December 5, 2017
    Assignee: Microcosm Technology Co, Ltd.
    Inventors: Tang-Chieh Huang, Sih-Ci Jheng, Chin-Te Yen
  • Patent number: 9687051
    Abstract: Provided is a polyamide resin slider for a slide fastener which provides both strength and durability. The slider material is a polyamide resin composition that includes an aliphatic polyamide having a melting point of 220° C. to 310° C., an aromatic polyamide having a melting point of 230° C. to 310° C., and reinforced fiber; wherein the ratio of the aromatic polyamide present in the summed mass of the aliphatic polyamide and the aromatic polyamide is greater than or equal to 10% by weight and less than or equal to 50% by weight.
    Type: Grant
    Filed: October 2, 2013
    Date of Patent: June 27, 2017
    Assignee: YKK Corporation
    Inventors: Kazuya Mizumoto, Tatsurou Nara
  • Patent number: 9650539
    Abstract: A thermosetting composition having: I) an unsaturated curable polyester comprising the residues of an ?,?-unsaturated polycarboxylic acid compound, said ?,?-unsaturated polycarboxylic acid compound having at least two carboxylic acid groups or at least one anhydride group, and having at least one unsaturation in a position that is ?,? relative to a carbonyl group and not located on an aromatic ring; and II) a phenolic resin having at least one methylol group. The unsaturated curable polyester resin can be dispersed in water or dissolved in a solvent and is suitable for waterborne or solventborne coating compositions. Phenolic based crosslinking coating compositions that contain these unsaturated curable polyester resins are curable at elevated temperatures.
    Type: Grant
    Filed: October 27, 2014
    Date of Patent: May 16, 2017
    Assignee: Eastman Chemical Company
    Inventors: Thauming Kuo, Phillip Bryan Hall
  • Patent number: 9598602
    Abstract: A thermosetting composition having: I. a curable polyester resin containing beta-ketoacetate moieties without vinyl unsaturations; and II. a phenolic resin having at least one methylol group. The curable polyester resin can be made by reacting a polyester resin with a compound containing a beta-ketoacetate moiety that does not contain a vinyl unsaturation such as alkyl acetoacetate compounds or diketene compounds. The curable polyester resin can be dispersed in water or dissolved in a solvent and is suitable for waterborne or solventborne coating compositions. Phenolic based crosslinking coating compositions that contain these curable polyester resins cure well with phenolic resin crosslinking compounds.
    Type: Grant
    Filed: November 13, 2014
    Date of Patent: March 21, 2017
    Assignee: Eastman Chemical Company
    Inventors: Thauming Kuo, Phillip Bryan Hall
  • Patent number: 9511071
    Abstract: The disclosure relates to compounds and compositions for forming bone and methods related thereto. In one embodiment, the disclosure relates to a composition comprising a compound disclosed herein, such as 2,4-diamino-1,3,5-triazine derivatives or salts thereof, for use in bone growth processes. In a typical embodiment, a bone graft composition is implanted in a subject at a site of desired bone growth or enhancement.
    Type: Grant
    Filed: August 18, 2011
    Date of Patent: December 6, 2016
    Assignees: Emory University, The United States of America as represented by the Department of Veterans Affairs
    Inventors: Scott D. Boden, Sreedhara Sangadala
  • Patent number: 9498935
    Abstract: A molding packaging material 1 of this invention contains a biaxially stretched polyamide film layer 2 as an outer layer, a thermoplastic resin layer 3 as an inner layer, and a metal foil layer 4 disposed between the both layers 2 and 3, in which a biaxially stretched polyamide film in which when the fracture strength of the film is defined as “X” and the fracture strain of the film is defined as “Y”, the X/Y value is 230 MPa to 360 MPa is used as the biaxially stretched polyamide film 2. The molding packaging material can secure excellent moldability even when the molding packaging material is not coated with a slipperiness imparting component.
    Type: Grant
    Filed: March 4, 2014
    Date of Patent: November 22, 2016
    Assignee: SHOWA DENKO PACKAGING CO.
    Inventors: Yuuji Minamibori, Tetsunobu Kuramoto
  • Patent number: 9468114
    Abstract: A housing includes a substrate and a decorative layer deposited on the substrate. The decorative layer includes chromium, iron, aluminum, chromium oxide, ferric oxide, and aluminum oxide. The chromium oxide, ferric oxide, and aluminum oxide distribute evenly among the chromium, iron, and aluminum respectively, such that the chromium, iron, and aluminum atoms are separated from each other. The decorative layer is electrically non-conductive and electromagnetically transmissive and gives the housing a mirror-like black and metallic appearance. An electronic device using the housing is also described.
    Type: Grant
    Filed: July 10, 2013
    Date of Patent: October 11, 2016
    Assignee: FIH (Hong Kong) Limited
    Inventors: Chwan-Hwa Chiang, Chieh-Hsiang Wang
  • Patent number: 9437790
    Abstract: The polyester resin composition of the present invention is characterized by comprising: (A) 100 parts by weight of a high heat resistant polyester resin having a main chain formed by a structure derived from aromatic dicarboxylic acid and alicyclic diol, wherein the melting point of the high heat resistant polyester resin is 200° C. or more; (B) 0.1 to 80 parts by weight of white pigment; and (C) 1 to 40 parts by weight of polyolefin copolymer. The resin composition of the present invention further comprises 1 to 40 parts by weight of a high stiffness polyester resin having a main chain comprising a structure derived from aromatic dicarboxylic acid and aliphathic diol. The molding foam, which is obtained from the polyester resin composition and the manufactured polyester resin composition, has good flexibility, heat resistance, and yellowing resistance and can be used for an LED reflecting plate due to having improved impact strength.
    Type: Grant
    Filed: December 26, 2012
    Date of Patent: September 6, 2016
    Assignee: Cheil Industries Inc.
    Inventors: Pil Ho Kim, In Sik Shim, Jong Cheol Lim, Sun Ho Song, Sang Hwa Lee
  • Patent number: 9406416
    Abstract: A method of producing an extremely thick insulation coating on a surface of an electrical steel, comprises the following steps: 1) preparing a coating liquid—stirring sufficiently the coating liquid for 0.1˜4 hours, with the viscosity of the coating liquid being within 10˜80 S; 2) coating a strip steel—using a double-roller or a tri-roller coating machine, wherein the film thickness and evenness can be controlled by adjusting different parameters; 3) baking the coating—using three sections, that is, a drying section, a baking section and a cooling section, to bake the coating, wherein the temperature in the drying section is 100˜400° C., the temperature in the baking section is 200˜370° C.
    Type: Grant
    Filed: December 14, 2011
    Date of Patent: August 2, 2016
    Assignee: BAOSHAN IRON & STEEL CO., LTD
    Inventors: Yongqiang Lu, Chunguo Lv, Zhicheng Wang, Bin Chen, Xiao Chen, Shishu Xie
  • Patent number: 9393404
    Abstract: A lead for use in neural stimulation comprises a core section having a proximal end and a distal end. A plurality of electrodes is coupled to the core section proximate the distal end. At least one contact is coupled to the core section proximate the proximal end. At least one thin film is wound around the core section from the proximal end to the distal end and electrically coupling the at least one contact and the plurality of electrodes. The at least one thin film forms a curved substantially planar shape in a relaxed state before being wound around the core section.
    Type: Grant
    Filed: April 18, 2013
    Date of Patent: July 19, 2016
    Assignee: MEDTRONIC BAKKEN RESEARCH CENTER B.V.
    Inventors: Michel Marcel Jose Decré, Edward Willem Albert Young, Jacobus Adrianus Johanna Maria Deckers, Dirk van Pijkeren, Ke Wang, Vincent Adrianus Henneken
  • Patent number: 9358587
    Abstract: A substrate treating apparatus includes a loading section 1, a treating tank 2, a rinsing tank 4, a drying tank 5, an unloading section 6, and a pair of endless belt members 7 for transporting substrates successively through the loading section 1, treating tank 2, rinsing tank 4, drying tank 5 and unloading section 6. The substrate treating apparatus further includes a fixing mechanism for fixing a pair of side edges of each substrate parallel to a transport direction of the substrate to the endless belt members 7. In the loading section 1, a plurality of substrates are fixed, each with the pair of edges thereof parallel to the transport direction fixed at constant intervals to the pair of endless belt members 7. The substrates having undergone the treatment are removed from the pair of endless belt members 7 in the unloading section 6.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: June 7, 2016
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Yukio Tomifuji, Shigeki Minami, Kazuo Jodai, Norio Yoshikawa
  • Patent number: RE47195
    Abstract: A copper foil for producing graphene, having 60 degree gloss of 500% or more in a rolling direction and a direction transverse to the rolling direction, and an average crystal grain size of 200 ?m or more after heating at 1000° C. for 1 hour in an atmosphere containing 20% by volume or more of hydrogen and balance argon.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: January 8, 2019
    Assignee: JX Nippon Mining & Metals Corporation
    Inventor: Yoshihiro Chiba