Abstract: A moisture removing apparatus and method for making the moisture removing apparatus. A first material layer may be placed proximate to a second material layer. The first material layer may be wrapped around the second material layer to cover the second material layer with the first material layer. One or more edges of the first material layer may be secured to hold the second material layer within the first material layer. The apparatus, when placed in a container, may be configured to absorb moisture from the container, and may be further configured to use capillary action to remove the absorbed moisture from the container.

Abstract: The present invention provides an aluminum nitride wafer and a method for making the same. The method includes forming at least one alignment notch in or at least one flat alignment edge on a periphery of the aluminum nitride wafer. The alignment notch and the flat alignment edge can prevent the aluminum nitride wafer from being in a poor state during the semiconductor manufacturing process and makes it possible to position the aluminum nitride wafer precisely so that the fraction defective can be lowered. The aluminum nitride wafer of the present invention has advantages of effective insulation, efficient heat dissipation, and a high dielectric constant, and can be used in semiconductor manufacturing processes, electronic products, and semiconductor equipment.

Abstract: A semiconductor wafer which is disk-shaped as a whole, and which has a substantially flat face, a back substantially flat in at least a main portion thereof and substantially parallel to the face, and a side surface. The side surface is convex as a whole in a longitudinal sectional view. A means to be detected, which is composed of a local flat surface, is disposed in the side surface.

Abstract: The invention relates to a method for marking wafers, in particular wafers for solar cell production: The method comprises the steps of manufacturing a position line (21a, 21b, 21c) on a peripheral surface of a silicon ingot or column, the ingot or column extending in an axial direction and having a longitudinal axis in the axial direction, wherein the position line extends in the axial direction along substantially the whole ingot or column and is inclined with respect to the longitudinal axis. By this position line it is possible to determine the position of a wafer cut from the ingot or column within the ingot or column, respectively. Further, an individual identification pattern (20a, 20b, 20c) of lines on the peripheral surface of the silicon ingot or column is manufactured, the individual identification pattern of lines extending in axial direction over substantially the whole ingot or column and providing an individual coding which allows to identify the silicon ingot or column.

Abstract: A prosthetic limb heating apparatus for use with a prosthetic assembly includes a housing having a side wall that defines open upper and lower ends. The upper end is configured to receive an upper limb portion and prosthetic socket into the housing. The open lower end is configured to allow the upper limb portion to pass therethrough but not the prosthetic socket such that the prosthetic socket is nested in the interior area. An electrically conductive wire is situated on the housing and extends circuitously thereabout, the conductive wire having opposed first and second ends. A battery is coupled to the side wall of the housing and electrically connected to the first and second ends of the conductive wire so as to selectively energize the conductive wire. The conductive wire imparts heat to the prosthetic socket when the socket is nested within the housing and the conductive wire is energized.

Abstract: A semiconductor device of an embodiment includes, an n-type SiC substrate that has first and second faces, and contains a p-type impurity and an n-type impurity, the p-type impurity being an element A, the n-type impurity being an element D, the element A and the element D being a combination of Al (aluminum), Ga (gallium), or In (indium) and N (nitrogen), and/or a combination of B (boron) and P (phosphorus), the ratio of the concentration of the element A to the concentration of the element D in the combination(s) being higher than 0.40 but lower than 0.95, the concentration of the element D forming the combination(s) being not lower than 1×1018 cm?3 and not higher than 1×1022 cm?3, an SiC layer formed on the first face, a first electrode formed on the first face side, and a second electrode formed on the second face.

Abstract: Coloured glasses are provided that include a following composition in percent by weight, based on oxide of: P2O5 25-75? Al2O3 0.5-15?? MgO 0-10 CaO 0-10 BaO 0-35 SrO 0-16 Li2O 0-12 Na2O 0-12 K2O 0-12 CuO 1-20 F/F2 0-20 Sum RO (R = Mg, Ca, Sr, Ba) 0-40 Sum R2O (R = Li, Na, K) 0.5-20.

Abstract: Disclosed herein are cleaning discs for cleaning one or more elements of a semiconductor processing apparatus. In some embodiments, the disc may have a substantially circular upper surface, a substantially circular lower surface, a substantially circular edge joining the upper and lower surfaces, and a plurality of pores opening at the edge and having an interior extending into the interior of the disc. In some embodiments, the pores are dimensioned such that a cleaning agent may be retained in the interior of the pores by an adhesive force between the cleaning agent and the interior surface of the pores. Also disclosed herein are cleaning methods involving loading a cleaning agent into a plurality of pores of a cleaning disc, positioning the cleaning disc within a semiconductor processing apparatus, and releasing cleaning agent from the plurality of pores such that elements of the apparatus are contacted by the released cleaning agent.

Abstract: Methods are disclosed for determining mounting locations of ingots on a wire saw machine. The methods include measuring a test surface of a test wafer previously sliced by the wire saw machine from a test ingot to calibrate the system. A magnitude and a direction of an irregularity of the measured test surface of the test wafer is then determined. The mounting location is then determined for another ingot to be mounted on the ingot holder based on at least one of the magnitude and direction of the irregularity of the measured test surface of the test wafer.

Abstract: A handle wafer which prevents edge cracking during a thinning process and method of using the handle wafer for grinding processes are disclosed. The handle wafer includes a body portion with a bottom surface. A square edge portion is provided about a circumference of the bottom surface.

Abstract: In a repairing method for an electrostatic chuck device in which at least an adhesive layer and an attracting layer are provided on a metal base, a side surface of an eroded adhesive layer is wound with a string-like adhesive and thermal compression is performed thereafter. A repairing apparatus for an electrostatic chuck device, which is used in the repairing method, includes a rotatable table for rotating the electrostatic chuck device and a bobbin for supplying the adhesive to the adhesive layer.

Abstract: An article comprises a multi-directional textile of first reinforcing fiber tows extending in a first direction and second reinforcing fiber tows extending in a second direction. Filaments in the first fiber tows extend past a boundary of the textile and are spread. The tows are embedded in resin.

Abstract: A composite material component is described which comprises a core impregnated by and embedded within a matrix material to define a main portion and a radially outwardly extending bead encircling the main portion, the bead being separated from the main portion by a reduced thickness neck, wherein the neck is structurally weaker than the bead.

Abstract: Embodiments are directed to laser-based processes for forming features on the surface of a part. The feature may include a geometric element, a color element, and/or a surface finish element. In some cases, the laser-formed features are formed as a pattern of textured features that produce an aesthetic and/or tactile effect on the surface of the part. In some cases, the texture features may be sufficiently small that they may not be discerned by the unaided human eye. Also, in some cases, a multiple laser-based processes are combined to form a single feature or a finished part having a specific aesthetic and/or tactile effect.

Abstract: A structural component that experiences a changing magnetic field during use is described. The structural component can be a stator bore tube, a stator tooth or stator support, for example. A stator bore tube is made of a multi-layered composite material with layers of unidirectional carbon fibre reinforced polymer (CFRP). The eddy current direction is along the axis of the stator bore tube. The carbon fibres in the CFRP layers are orientated along the circumferential direction of the stator bore tube.

Abstract: In some embodiments, a target assembly, for use in a substrate processing chamber having a process shield, may include a backing plate having a first side and an opposing second side, wherein the second side comprises a first surface having a first diameter bounded by a first edge; a target material having a first side bonded to the first surface of the backing plate; wherein the first edge is an interface between the backing plate and the target material; a plurality of slots disposed along an outer periphery of the backing plate extending from the first side of the backing plate toward the second side of the backing plate, wherein the plurality of slots are configured to align the target assembly with respect to the process shield.

Abstract: The present invention comprises a rotating device which comprises two pairs of disks. Each pair has a first disk in a first plane and a second disk in a second plane rigidly joined to the first disk. The second plane is perpendicular to the first plane and the first disk in each pair are detachably attached to one another and the second disk in each pair are detachably attached to one another so that each pair connectedly rotates with respect to each other. Their respective circumferential edges are in contact with one another.

Abstract: A method for forming a glass substrate comprises the steps of forming a glass blank with opposing substantially planar surfaces and at least one edge, coating the glass blank in silica-alumina nanoparticles, the silica-alumina nanoparticles comprising an inner core of silica with an outer shell of alumina, annealing the coated glass blank to form a conformal coating of silica-alumina around the glass blank, and polishing the coated glass blank to remove the conformal coating of silica-alumina from the opposing substantially planar surfaces thereof.

Abstract: A microwave mat for removing items from a microwave oven includes a mat portion and a lip portion. The mat portion includes a plurality of ridges on the bottom side of the mat portion. The mat portion lays flat when the microwave mat is placed on a flat surface. The lip portion includes a plurality of ridges on the bottom side of the lip portion. The lip portion is raised from the flat surface when the microwave mat is placed on a flat surface. The mat portion and the lip portion are made from a single material and the material is a heat resistant material. The mat portion and the lip portion are flexible.

Abstract: A dielectric material layer is deposited on exposed surfaces of a bonded structure that includes a first substrate and a second substrate. The dielectric material layer is formed on an exposed planar surface of a second substrate and the entirety of peripheral sidewalls of the first and second substrates. The dielectric material layer can be formed by chemical vapor deposition, atomic layer deposition, or plasma induced deposition. Further, the dielectric material layer seals the entire periphery of the interface between the first and second substrates. If a planar portion of the dielectric material layer can be removed by planarization to facilitate thinning of the bonded structure, the remaining portion of the dielectric material layer can form a dielectric ring.

Abstract: Provided is a mosaic piece having a body contour inscribed within a circle, and being formed with at least one projection having a projection contour.

Abstract: The present invention is an improved corkboard consisting of a small, circular, moveable and removable tack landing pad which is designed to adhere to a flat surface such as a wall or computer by an adhesive strip or to a metal surface like a refrigerator or thing cabinet via a magnetic strip. This landing pad is designed to receive papers of various sizes, shapes, and stock through puncture with a standard push pin tack without damaging walls. The landing pad consists of two components—(1) an outer donut-shaped shell that is sealed at its base and is contoured inward to a narrowing angle at its tack receiving face and (2) an inner foam core. The outer shell operates to both enclose and compress the foam core. This core compression affords the foam greater tack gripping ability as well as enhanced durability by quickly regaining its original shape upon tack removal.

Abstract: A dielectric material layer is deposited on exposed surfaces of a bonded structure that includes a first substrate and a second substrate. The dielectric material layer is formed on an exposed planar surface of a second substrate and the entirety of peripheral sidewalls of the first and second substrates. The dielectric material layer can be formed by chemical vapor deposition, atomic layer deposition, or plasma induced deposition. Further, the dielectric material layer seals the entire periphery of the interface between the first and second substrates. If a planar portion of the dielectric material layer can be removed by planarization to facilitate thinning of the bonded structure, the remaining portion of the dielectric material layer can form a dielectric ring.

Abstract: The present invention consists of a method for imparting asymmetry to a truncated annular wafer by either rounding one corner of the orientation flat, or rounding one corner of a notch. This novel method of rounding corners impart a visual and/or tactile asymmetry which can be utilized by a person in order to differentiate between the two different sides of the wafer. This inventive wafer design and method for making an asymmetric wafer is especially useful in the field of semiconductor technology and may be used on sapphire crystal wafers or any other class of wafer.

Abstract: A layer of polymer material is applied on a peripheral region of at least one of the two substrates to be bonded prior to bonding. The bonded structure formed thereby includes a first substrate, a second substrate in direct contact with the first substrate, and a ring of the polymer material in direct contact with the first substrate at a first interface and in direct contact with the second substrate. The ring of polymer material laterally surrounds and seals the interface at which the first substrate contacts the second substrate. A ring-shaped cavity can be formed within the polymeric ring. Alternately, the first interface and the second interface can be contiguous without a ring-shaped cavity between the first and second substrates.

Abstract: An adhesive layer included in an adhesive-type optical film forms a portion located on the inside of a edge line of an optical film.

Abstract: The seamless edge-sealing method of fluorine resin coating comprises following steps: (I) Putting the raw material of fluorine resin into a mold to obtain a cylinder (1) through one of the below ways: First, pressure maintaining and demolding, finally sintering the mold formed casting; Second, mechanical injecting; Third, mechanical vulcanizing; (II) Cutting the cylinder (1) into rings (3) and cutting each ring (3) to form an annular slot (31) on the inner wall of each ring; (III) Cutting a piece of base fabric of fluorine resin coating (2) into the shape adapted for the ring (3), and then stuffing the edge of the cut fabric of fluorine resin coating into the slot (31) of the ring; (IV) After hot-pressing, obtaining a piece of fabric of fluorine resin coating (4).

Abstract: A method is used for producing an SiC volume monocrystal by sublimation growth. During growth, by sublimation of a powdery SiC source material and by transport of the sublimated gaseous components into the crystal growth region, an SiC growth gas phase is produced there. The SiC volume monocrystal grows by deposition from the SiC growth gas phase on the SiC seed crystal. The SiC seed crystal is bent during a heating phase before such that an SiC crystal structure with a non-homogeneous course of lattice planes is adjusted, the lattice planes at each point have an angle of inclination relative to the direction of the center longitudinal axis and peripheral angles of inclination at a radial edge of the SiC seed crystal differ in terms of amount by at least 0.05° and at most by 0.2° from a central angle of inclination at the site of the center longitudinal axis.

Abstract: In the case where a coating film is formed on a curved outer peripheral surface of a base body from a slurry through a wet process, when pseudoplasticity is imparted to the slurry, the slurry exhibits favorable film formability, and the coating film formed on the curved surface exhibits favorable shape stability. A solid film obtained through solidification of the coating film is formed such that the following relation is satisfied: tedge/tcenter?1.2 wherein tcenter represents the thickness of the center of the film in a specific direction along the outer peripheral surface, and tedge represents the thickness of the film at a position distant by 2tcenter from one end of the film in the specific direction.

Abstract: The present invention consists of a method for imparting asymmetry to a truncated annular wafer by either rounding one corner of the orientation flat, or rounding one corner of a notch. This novel method of rounding corners impart a visual and/or tactile asymmetry which can be utilized by a person in order to differentiate between the two different sides of the wafer. This inventive wafer design and method for making an asymmetric wafer is especially useful in the field of semiconductor technology and may be used on sapphire crystal wafers or any other class of wafer.

Abstract: The present invention comprises a rotating device which comprises two pairs of disks. Each pair has a first disk in a first plane and a second disk in a second plane rigidly joined to the first disk. The second plane is perpendicular to the first plane and the first disk in each pair are detachably attached to one another and the second disk in each pair are detachably attached to one another so that each pair connectedly rotates with respect to each other. Their respective circumferential edges are in contact with one another.

Abstract: A method for manufacturing a reticular contact body element includes the process of manufacturing a rotating circular reticulate contact body element 4 by cutting and processing a synthetic resin fiber block that is formed by gluing the intersections of fiber yarn formed in the shape of a three-dimensional reticulum, cutting the synthetic resin fiber block to form fan shapes, making through holes 20 in the fan-shaped reticulate contact body element precursor, forming compression sections 25 by compressing the periphery 21 of the reticulate contact body element precursor and the circumferences of the through holes 20 with a hot press machine, hot-pressing the whole face of the reticulate contact body element precursor except its periphery 21 and the circumferences of the through holes 20 with the hot press machine at temperatures of 90-140° C.

Abstract: A dielectric material layer is deposited on exposed surfaces of a bonded structure that includes a first substrate and a second substrate. The dielectric material layer is formed on an exposed planar surface of a second substrate and the entirety of peripheral sidewalls of the first and second substrates. The dielectric material layer can be formed by chemical vapor deposition, atomic layer deposition, or plasma induced deposition. Further, the dielectric material layer seals the entire periphery of the interface between the first and second substrates. If a planar portion of the dielectric material layer can be removed by planarization to facilitate thinning of the bonded structure, the remaining portion of the dielectric material layer can form a dielectric ring.

Abstract: A dental care system has a base, an oral hygiene instrument removably couplable to the base, and a hygiene pad. The hygiene pad has a top layer formed of a liquid absorbing material, a bottom layer configured to contact a surface on or adjacent the dental care system, and an inner layer adhered between the top and the bottom layers and containing a disinfectant. The hygiene pad is positionable and shaped so as to collect and absorb liquid residue dripping from an oral hygiene instrument.

Abstract: This invention refers to a weight-lightening disc for making light reinforced concrete structures such as slabs, prefabricated slabs, foundation slabs, partition walls and beams; to a mesh, specifically designed for this invention and to the construction method to make such structures. The method allows manufacturing the components that make it possible to construct buildings with light reinforced concrete structures. The field of application of the invention is construction in general, such as houses, buildings and bridges. The invention provides a solution to the problem of lightening of the structures, including a construction method that comprises a set of weight-lightening discs in combination with electro-welded meshes (specially designed for the each specific thickness of the slab) and the hooks that hold together the meshes. The compound of elements and the method allow lightening minimum-thickness slabs.

Abstract: A preform for making a prosthetic limb socket includes an injection molded disk of thermoplastics material, and a peripheral portion of the disk is supported by a rigid metal ring. The ring and the peripheral disk portion have an interfitting connection which permits the disk and ring to be heated in an oven. The ring and softened disk are then inverted and stretched downwardly over a positive model of a residual limb while a vacuum is introduced through holes within the model to form a plastic socket which conforms to the model. The interfitting connection may be peripherally spaced studs on the ring and projecting into corresponding holes in the disk or may be an annular rib or arcuate rib sections on the ring which project into an annular recess or arcuate cavities within the disk. After the plastic cools, the ring is separated for reuse.

Abstract: Wear-resistant coating systems suitable for protecting surfaces subjected to contact wear at high temperatures, such as surfaces of an assembly comprising high-temperature components of gas turbine engines. The components have surfaces in wear contact with each other. One of the surfaces has a wear-resistant coating system thereon so as to be in wear contact with the surface of the other component. The wear-resistant coating system contains alternating layers of TiAlN and CrN.

Abstract: An opaque, low resistivity silicon carbide and a method of making the opaque, low resistivity silicon carbide. The opaque, low resistivity silicon carbide is a free-standing bulk material that may be machined to form furniture used for holding semi-conductor wafers during processing of the wafers. The opaque, low resistivity silicon carbide is opaque at wavelengths of light where semi-conductor wafers are processed. Such opaqueness provides for improved semi-conductor wafer manufacturing. Edge rings fashioned from the opaque, low resistivity silicon carbide can be employed in RTP chambers.

Abstract: The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer.

Abstract: A method of forming a label includes providing a semi-opaque or transparent film, disposing an ink receptive coating on at least one side of the semi-opaque or transparent film, forming an adhesive track on a perimeter of the ink receptive coating, and masking the adhesive track with a release member configured to provide access to the ink receptive coating for image formation.

Abstract: Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations through use of wafer carriers. In an example situation, a wafer carrier can be configured as a plate to allow bonding of a wafer thereto to provide support for the wafer during some processing operations. Upon completion of such operations, the processed wafer can be separated from the support plate so as to allow further processing. Various devices and methodologies related to such wafer carriers for efficient handling of wafers are disclosed.

Abstract: Methods of forming a polycrystalline diamond compact for use in an earth-boring tool include forming a body of polycrystalline diamond material including a first material disposed in interstitial spaces between inter-bonded diamond crystals in the body, removing the first material from interstitial spaces in a portion of the body, selecting a second material promoting a higher rate of degradation of the polycrystalline diamond compact than the first material under similar elevated temperature conditions and providing the second material in interstitial spaces in the portion of the body. Methods of drilling include engaging at least one cutter with a formation and wearing a second region of polycrystalline diamond material comprising a second material faster than the first region of polycrystalline diamond material comprising a first material. Polycrystalline diamond compacts and earth-boring tools including such compacts are also disclosed.

Abstract: A device is provided to collect waste oil, grease or other liquids from skillets, pots, pans or other area of needs with a method to transporting the device without contaminating hands with waste oil, grease or other liquids collected by the device. The device is made of absorbent materials and has a circular shape with opposed tabs and slits through which the tabs are pulled to form handles.

Abstract: A target cylinder and a method for testing a superhard component thereon. The target cylinder includes a first end, a second end, and a sidewall extending from the first end to the second end. At least one of the second end and the sidewall is an exposed portion that makes contact with the superhard component to determine at least one property of the superhard component. The exposed portion comprises at least one synthetic material having at least one of a compressive strength raging from about 12 kpsi to about 30 kpsi, an abrasiveness ranging from about 1 Cerchars to about 6 Cerchars, and an iron content ranging from about 5 percent to about 10 percent. Optionally, the exposed portion further comprises a second material interveningly positioned between or within the synthetic material in a predetermined and repeatable pattern.

Abstract: A composite structure that includes front faces of the first and second substrates that are molecularly bonded to each other. The dimensions of the second substrate outline are larger than the first substrate outline, and a peripheral side of the second substrate substantially borders the second front face and is oriented generally perpendicularly with respect thereto. The front faces are molecularly bonded such that the outline of the first front face is disposed at least partially within the outline of the second front face. A peripheral ring extending around the first front face and facing the first substrate, in which bonding between the front faces is weak or absent, has a maximum width of less than about 0.5 mm.

Abstract: The present invention is a substrate for growing a single crystal diamond layer including: at least, a base material made of a single crystal diamond, and an iridium film or a rhodium film heteroepitaxially grown on a side of the base material where the single crystal diamond layer is to be grown; wherein a peripheral end portion of a surface of the base material on the side where the single crystal diamond layer is to be grown is chamfered with a curvature radius (r), the curvature radius satisfying (r)?50 ?m. As a result, there is provided a substrate for growing a single crystal diamond layer and a method for producing a single crystal diamond substrate, the substrate and the method in which a single crystal diamond having uniform and high crystallinity can be reproducibly produced at low cost.

Abstract: EMR-transmissive window assemblies comprising an EMR-transmissive substrate mounted in a substantially rigid framework structure and sealed to the metallic framework structure by means of a ceramic material having a partially amorphous and partially crystalline structure are disclosed. Methods for fabricating EMR-transmissive assemblies are also disclosed.

Abstract: A membrane 103 for an acoustic device 100 is provided, the membrane 103, wherein the membrane 103 comprises a central portion 212, an annular portion 105, and a corrugation 107, wherein the annular portion 105 is arranged around the central portion 212, wherein the annular portion 105 is adapted to be fixed to a coil 106, and wherein the corrugation 107 is arranged between the central portion 212 and the annular portion 105. Thus, the corrugation 107 may form an inner corrugation compared to an outer corrugation 104 which would be arranged farther away from the central portion 212 than the annular portion 105.

Abstract: A molding glass lens and a mold thereof are disclosed. The molding glass lens consists of an upper optical surface, a lower optical surface, two outers surrounding the optical surfaces and at least three grooves arranged in the form of a circle disposed on the lower outer and/or the upper outer. The disposition of the grooves has no affecting in original size of the outers as well as assembling with other mechanical parts in les group. The mold of the lens includes an upper molding unit and a lower molding unit. Cavity of each molding unit is composed of a central part for forming an optical surface of the lens and an outer circular part for forming outer of the lens. At least three protrudent parts with the same height are disposed in the form of a circle on the outer circular of the lower molding unit and/or the upper molding unit. Thus the air in the mold cavity is easy to exhaust through the gap formed by protrudent parts and glass preform.

Abstract: A method is used for producing a bulk SiC crystal having a resistivity of at least 1012 ?cm and a diameter of at least 7.62 cm. An SiC growth gas phase is generated in a crystal growth region. The bulk SiC crystal grows by deposition from the SiC growth gas phase. The SiC growth gas phase is fed from an SiC source material, which is contained in an SiC supply region inside the growing crucible. First dopants which have a flat dopant level at a distance of at most 350 meV from an SiC band edge, and second dopants which have a low-lying dopant level at a distance of at least 500 meV from the SiC band edge, are delivered in gaseous form to the crystal growth region. Bulk SiC crystals are thereby obtained, and large-area SiC substrates obtained therefrom whose resistivity is at least 1012 ?cm everywhere.