Abstract: A composite material, the composite material comprising at least one prepreg, said prepreg comprising at least one polymeric resin and at least one fibrous reinforcement; and conducting particles dispersed in the polymeric resin.

Abstract: A composite material, the composite material comprising at least one prepreg, said prepreg comprising at least one polymeric resin and at least one fibrous reinforcement; and conducting particles dispersed in the polymeric resin.

Abstract: A composite material, the composite material comprising at least one prepreg, said prepreg comprising at least one polymeric resin and at least one fibrous reinforcement; and conducting particles dispersed in the polymeric resin.

Abstract: A composite material, the composite material comprising at least one prepreg, said prepreg comprising at least one polymeric resin and at least one fibrous reinforcement; and conducting particles dispersed in the polymeric resin.

Abstract: The present invention provides a composition for preparing porous dielectric thin films containing pore-generating material, said composition comprising gemini detergent, and/or a quaternary alkyl ammonium salt, a thermo-stable organic or inorganic matrix precursor, and solvent for dissolving the two solid components. There is also provided an interlayer insulating film having good mechanical properties such as hardness, modulus and hydroscopicity, which is required for semiconductor devices.

Abstract: A conductive and weldable anti-corrosion composition for coating metal surfaces which contains: (a) 5 to 40 wt. % of an organic binder containing: (aa) at least one epoxide resin (ab) at least one hardener selected from cyanoguanidine, benzoguanamine and plasticised urea resin (ac) at least one amine adduct selected from polyoxyalkylenetriamine and epoxide resin/amine adducts (b) 0 to 15 wt. % of an anti-corrosion pigment (c) 40 to 70 wt. % of a conductive pigment selected from powdered zinc, aluminum, graphite, molybdenum sulfide, carbon black and iron phosphide (d) 0 to 45 wt. % of a solvent; and a lacquered metal structural part which has a conductive organic layer.

Abstract: A method for improving the electrical conductivity of a substrate of metal, metal alloy or metal oxide comprising depositing a small or minor amount of metal or metals from Group VIIIA metals (Fe, Ru, Os, Co, Rh, Ir, Ni, Pd, Pt) or from Group IA metals (Cu, Ag, Au) on a substrate of metal, metal alloys and/or metal oxide from Group IVA metals (Ti, Zr, Hf), Group VA metals (V, Nb, Ta), Group VIA metals (Cr, Mo, W) and Al, Mn, Ni and Cu and then directing a high energy beam onto the substrate to cause an intermixing of the deposited material with the native oxide of the substrate metal or metal alloy. The native oxide layer is changed from electrically insulating to electrically conductive. The step of depositing can be carried out, for example, by ion beam assisted deposition, electron beam deposition, chemical vapor deposition, physical vapor deposition, plasma assisted, low pressure plasma and plasma spray deposition and the like.

Abstract: About 0.001 to 5 parts by weight of a hindered phenol-series compound, about 0.01 to 5 parts by weight of a weather (light)-resistant stabilizer, and about 0.001 to 10 parts by weight of a spiro-compound having a triazine ring are added to 100 parts by weight of a polyacetal resin. The spiro-compound may be a compound represented by the following formula (1). The polyacetal resin composition may further comprise a coloring agent, a processing stabilizer, a heat stabilizer, and others. wherein R1 and R2 are the same or different, each representing an alkylene group, an arylene group, or an aralkylene group.

Abstract: A hillock-free wiring layer and method of forming the same are provided. The wiring layer includes at least two aluminum (Al) layers formed on a substrate, and each of the Al layers includes Al crystal particles. For any two Al layers of the wring layer, the one closer to the substrate is called the lower layer and the other one is called the higher layer. Besides, the Al crystal particles of the higher Al layer are larger and denser than that of the lower Al layer, and the lower Al layer has a higher resistance than that of the higher Al layer. By the invention, a wiring layer using either pure Al or an Al-based alloy is capable of preventing the occurrence of hillocks and reducing manufacturing cost.

Abstract: A bias transfer member or bias charging member for a xerographic device includes a support substrate, and a multi-layer conductive surface coating over the support substrate. The multi-layer coating includes a base layer of metal-containing particles in a polymer binder, an intermediate layer of conductive particles in a polymer binder, and a top layer of conductive particles in a polymer binder, wherein the amount of the conductive particles in the top layer is greater than the amount of the conductive particles in the intermediate layer. The multi-layer coating exhibits ideal electrical and abrasion resistance performance for use in bias charging or transfer members.

Abstract: A molded plastic article having improved electromagnetic interference (EMI) shielding properties. The article includes a plastic layer and an outer film layer over the plastic layer. The outer film layer has an inner surface adjacent to and bonded to the plastic layer and an outer surface opposed to the inner surface. The plastic layer and outer layer are electrically conductive. Preferably the outer layer has higher conductivity than the plastic layer.

Abstract: There is provided a copper-base alloy useful for coinage that has a golden visual appearance. The material has a transverse electrical conductivity substantially similar to that of copper alloy C713 and when clad to a copper alloy C110 core, a transverse electrical conductivity substantially similar to both sides of a Susan B. Anthony United States dollar coin. The copper-base alloy is a copper-manganese-zinc-nickel alloy.

Abstract: A method by which a conventional circuit trace (14) is modified with a layer (16) of high-conductivity solder alloy to yield a high-current circuit trace (12) for high-current routing on a substrate (10). The method generally entails the use of a solder composition that contains a dispersion of metal particles (18) in a solder alloy (20). The metal particles (18) are selected on the basis of having a higher electrical conductivity than the solder alloy (20), and are present in sufficient amounts so that the electrical conductivity of the solder composition is significantly higher than that of the solder alloy (20). The solder composition is deposited on a conductor (14), and then reflowed to form a conductive layer (16) on the conductor (14). The metal particles (18) remain as a discrete dispersion within the conductive layer (16) in order to suitably promote the conductivity of the layer (16).

Abstract: An electrically conductive floor coating comprising a ferroalloy containing layer including particles of ferroalloy interspersed with a resinous binder.

Abstract: A high critical temperature superconducting Josephson device includes a bicrystal substrate formed of a first single crystal substrate and a second single crystal substrate, with end faces of the first and second single crystal substrates having different crystal orientations and being joined to each other. A first superconducting electrode formed of a first film of a high critical temperature superconductor material is located on the first single crystal substrate, whereas a second superconducting electrode formed of a second film of a high critical temperature superconductor material is located on the second single crystal substrate. A bridge is formed of a third film of a high critical temperature superconductor material and located on the bicrystal substrate across a joint between said first and said second single crystal substrates.

Abstract: This invention relates to the magnetic recording medium, its manufacturing method and the magnetic disk apparatus, in which the ferromagnetic thin film is formed on the substrate board, and the protective layer is provided on that. A Magnetic recording medium of the has at least one layer of the protective layer on the magnetic surface, which is characterized in that the surface of the protective layer is provided with the high noncontinuous large resistance layer, and the density of the surface of the protective layer is higher than other regions other than the said surface.The magnetic recording medium has the surface of the protective layer which contains at least one kind or more of the element of the inert gas element, the halogen element and hydrogen.Therefore, when making a lower flying height of the magnetic head is achieved, the slide durability over the long term is improved, particularly, the slide durability of the magnetic disk apparatus using the MR head can be improved.

Abstract: An intermediate workpiece includes a first strip of laminated material exhibiting high thermal conductivity and which is subject to bowing in response to thermal cycling. A second strip of copper material is welded to the first strip along a longitudinal abutting edge of each strip. The first strip is partitioned into smaller heatspreader sections each for having a semiconductor die soldered thereto. Thermal manufacturing cycles will not cause a bowing of the second strip or of the heatspreader sections attached thereto.

Abstract: This invention is directed to lithium and lithium alloy metal substrates, coated with a polymeric layer containing dispersed lithium or lithium alloy metal particles. The coated metal finds use as anode material in solid electrochemical cells.

Abstract: Disclosed herein is a fiber-reinforced plastic composite material for fastening pallets to be used to transfer printed circuit boards for automatic soldering. The composite material is composed of a thermosetting resin, reinforcing long fibers, and a light-colored electrically conductive filler. The pallets are formed from the composite material by heating and pressing. The pallets have high electrical conductivity to prevent static build-up, a light color which permits coloring, and good mechanical properties.

Abstract: An electromagnetic-attenuating coating having fibers uniformly dispersed in a lightly loaded dielectric matrix material. The fibers are metal-coated dielectric or semi-conductive fibers such as graphite fibers and the fibers are provided in an amount of less than 1 weight % of the coating. The dielectric matrix material is a resin material such as silicone. The fiber lengths and diameters, the material of the fibers and metal coating, the thickness and tolerance range of the metal coating and the loading of the metal coated fibers in the matrix material can be adjusted depending on the frequency range to be attenuated.

Abstract: A porous film comprising a composition of 10 to 90% by weight of polypropylene and 10 to 90% by weight of polyethylene having an Mw/Mn ratio, as determined by high-temperature gel-permeation chromatography, of 10 or less is disclosed. The porous film has a high tensile modulus, a satisfactory appearance, and a uniform thickness. A battery separator comprising the porous film performs a shut-down function (an increase in resistance) in case of a temperature rise due to an abnormal current.

Abstract: Method and product resulting therefrom of controlling the residual resistivity of an electrolessly deposited metal by first, calculating the mathematical relationship between the residual resistivity of the deposited metal and its rate of deposition and second, depositing said metal at a rate to produce a predetermined residual resistivity.

Abstract: A static dissipative laminate consistently having an internal resistance less than 2.times.10.sup.6 and a resistance to ground measurement of about 5.times.10.sup.6 and a surface resistance in the static dissipative range even at a very low humidities is produced by the use of an ionic salt and an humectant in the overlay and further by the use of a special top core sheet containing 0.6-1.0% by weight of carbon fibers.

Abstract: A composite structure is manufactured by joining a first material, preferably made of a magnetically permeable material and having a first joining surface in which a recess having an overhang surface is formed, to a second material, preferably made of an electrically conductive material and having a second joining surface to be joined to the first joining surface of the first material. On the second joining surface is integrally formed a protrusion having an outer configuration substantially corresponding to the inner shape of the recess. The first and second materials are firmly mechanically joined to each other by, for example, a casting method, a rolling method, a pressing method, or a method utilizing plastic flow of the second material.

Abstract: The present invention provides a molded article for holding wafers which is made of a thermoplastic resin reinforced with whiskers. The present invention provides wafer holding molded articles, such as transport baskets, storage cases and carriers, for use in handling wafers and glass plates for liquid crystal televisions. These articles are useful for cleaning, drying, transporting or storing semiconductor wafers free of contamination.

Abstract: A palladium alloy of the form Pd.sub.x M.sub.y M'.sub.z where M is at least one element selected from the group consisting of silicon, iron, nickel, copper, chromium, cobalt, boron and aluminum and M' is at least one element selected from the group consisting of titanium, vanadium, chromium, zirconium, niobium, molybdenum, hafnium, tantalum and tungsten is provided. The alloys exhibit oxidation resistance and low electrical contact resistance and are particularly suited for electrical applications such as coatings for electrical contacts or connectors. In a preferred embodiment, the alloy is palladium/niobium containing from about 5 to about 10 atomic percent niobium.

Abstract: A copper-clad aluminum composite wire has a core that is made of an Al-Mg alloy and circumferentially clad with copper or a copper alloy. The aluminum alloy is composed of 1.5 to 10.0 percent by weight of Mg, additives such as Cr and Mn, ordinary impurities, and aluminum whose content is such as to form the rest of the alloy composition. The copper or the copper alloy forms 20 to 40% of the cross-sectional area of the copper-clad aluminum composite wire. Such core material is drawn to reduce the cross-sectional area by 20% or more using a die whose half angle .alpha. is from 15 to 30 degrees to obtain an cladding wire; the cladding wire is further drawn to reduce the cross-sectional area by 70% or more using a drawing die whose half angle .alpha. is from 4 to 15 degrees at least once; and the thus drawn wire is subjected to annealing at temperatures from 200.degree. to 400.degree. C. for from one minute to 24 hours.

Abstract: A semi-insulating coating or surface layer is applied over insulating materials such as a circuit board or wiring harness or feedthrough insulator. The paint is electrically fixed to ground and as a result leaks away charge buildup before large pulse discharges occur. For example, pure tin oxide particles in phenoxy resin binder forms a paintable application for the invention.

Abstract: A palladium alloy of the form PdNbM where M is at least one element selected from the group consisting of silicon, iron, nickel, copper, cobalt, boron and aluminum is provided. The alloys exhibit oxidation resistance and electrical contact resistance and are particularly suited for electrical applications such as coatings for electrical contacts or connectors. In a preferred embodiment, the alloy contains from about 5 to about 10 atomic percent niobium.

Abstract: A heat-conductive composite material usable as a substrate (heat sink) for mounting a semiconductor thereon or a lead frame is provided, which comprises a core sheet and metal foil layers as welded to the both surfaces of the core sheet. The core sheet is composed of a metal sheet of high thermal expansion as sandwiched between two metal sheets of low thermal expansion each having a number of through-holes in the direction of the thickness, and the three layers are laminated and integrated so that a part of the metal sheet of high thermal expansion is exposed out to the metal surfaces of low thermal expansion through the through-holes of the metal sheets of low thermal expansion. The metal foil layers each are made of a metal of high thermal expansion, which are same as or different from the metal of high thermal expansion of constituting the core sheet.

Abstract: A resistor device includes a thick-film resistor which includes a mixture of electrical conductive material and glass, and which has the electrical conductive material at a surface portion exposed; and electrodes which are deposited on the thick-film resistor to be connected to the exposed electrical conductive material.

Abstract: A composite structure and a method of producing said composite structure from a combination of copper and a low coefficient of thermal expansion nickel-iron alloy is disclosed wherein the copper clads the nickel-iron sheet and is interposed through the central nickel-iron sheet in such a fashion as to provide a substantially isotropic heat transfer path.

Abstract: Coating of crystalline metals (Ag, Au, Cu, Al) are formed on amorphous melic alloys (glassy metals) by cathode magnetron sputtering. The process can be used to produce new products such as copper coated amorphous metallic alloy wires for torpedo controls, shielding materials for electromagnetic waves, and anticorrosion coatings for Fe-metalloid magnetostrictive elements.

Abstract: A composite metal spring material, and formed electrically conductive contact spring members made from the material, comprise metallurgically bonded layers of copper and stainless steel of selected compositions which are subjected to a novel sequence of heat-treating steps for providing the spring materials and members with spring characteristics of improved strength and stability.

Abstract: The present invention relates to composites having excellent combinations of bending strength, electrical conductivity, stress relaxation in bending and bend formability and having particular utility in electrical connector applications. The composites of the present invention have a core formed from a copper base alloy having an electrical conductivity of at least about 80% IACS and a clad formed from a copper-nickel alloy containing more than about 30% by weight nickel. Preferred composites are triclad composites formed from copper alloy C151 and MONEL 400 and having clad layer thicknesses of at least about 10%, most preferably at least about 20%, of the overall composite thickness.

Abstract: Starting mixture for an insulating composition, silk-screening ink comprising such a mixture, and the use of said ink for the manufacture of hybrid microcircuits on colaminated sustrates.The invention relates to the formulation of a starting mixture for an insulating composition, comprising a vitreous phase and several ceramic phases in the respective ratios by volume for the vitreous phase between 85 and 60% and for the ceramic phases between 15 and 40%, the vitreous phase being a silicate of zinc and alkaline earth.According to an embodiment of the invention the starting mixture is remarkable in that the vitreous phase is constituted by the molar ratios of the following oxides:30 to 55% of silicon (SiO.sub.2), 15 to 30% of zinc oxide (ZnO), 0 to 20% of boric anhydride (B.sub.2 O.sub.3), 0 to 10% of alumina (Al.sub.2 O.sub.3), 15 to 40% of barium oxide (BaO), and in that the ceramic phases are constituted by the ratios by volume of the following oxides: 0 to 10% of cobalt oxide (Co.sub.3 O.sub.

Abstract: A conductive element having a metallization paste screen printed on its surface is made using a paste containing 65 to 97% by weight gold and 3 to 25% by weight cadmium/antimony alloy dispersed in an inert liquid vehicle.

Abstract: A conductive element having a metallization paste screen printed on its surface is made using a paste containing 65 to 95% by weight silver and 5 to 35% by weight cadmium/antimony alloy dispersed in a liquid vehicle.

Abstract: This invention describes a transparent chair mat having anti-static qualities. The chair mat is substantially transparent thereby permitting the carpet thereunder to be readily seen. The chair mat can be gounded or not, as desired. This anti-static chair mat enables castered chairs to roll over it without the person sitting in the chair generating excess static-electricity.

Abstract: A novel laminate adapted for use in the manufacture of capacitors comprising layers of microthin pin-hole free electroformed copper bonded together by a thin layer of hardened dielectric material, said bonded surfaces of said microthin copper having first been treated to form thereon a superficial coating of cupric oxide, bonded to the outer surfaces of said microthin copper, layers of self-sustaining copper foil, the bonded surfaces of said copper foil having been passivated under reducing or cathodic conditions in an aqueous solution of chromic oxide to passivate the surface thereof and to render said copper foil peelably removable from said microthin copper.

Abstract: An electric current regulating junction that can be electrically activated to a low resistance state in which it is capable of passing a relatively low reading current. The junction is capable of being activated electrically so as to be switched between low resistance and relatively high resistance states and vice versa. To switch from the low resistance to the high resistance state, one may apply relatively low currents (at least 10 times the magnitude of the reading current) in the form of a current-limited pulse, the pulse being regulated so that it will decay rapidly at the end. The junction comprises a normally insulative, electrically activatable composition having an electrical resistance greater than 10.sup.8 ohms through a layer 0.1-2,540 microns thick.

Abstract: A coating composition useful in forming conductive layers comprises a latex having water as a continuous phase and, as a dispersed phase, hydrophobic polymer particles having associated therewith a polyaniline salt semiconductor. The coating composition can be coated on a variety of supports to produce conductive elements. The coating compositions are particularly useful in forming antistatic layers for photographic elements or conducting layers for electrophotographic and electrographic elements. Also disclosed is a preferred process for preparing a latex coating composition comprising the steps of loading polymer particles with the polyaniline component of the polyaniline acid addition salt semiconductor and then acidifying the latex to form a polyaniline salt coating composition.

Abstract: A multilayered thin film structure comprising layers of resistive and conductive materials on a substrate, said layers including tantalum nitride, palladium and gold. A layer of titanium nitride, is used between the tantalum nitride and palladium layers to act as an adhesive layer, to prevent undercutting during etching, and to allow all metal depositing to be performed during one step.

Abstract: A fine magnetically shielded conductor wire comprising a core and a metallic sheath metallurgically secured thereto. The sheath is a magnetically soft alloy having low conductivity and comprising about 75 to 85 percent nickel and about 15 to 25 percent iron.

Abstract: The high-expansion layer of a metallic multilayer thermostatic material is composed of a high-resistance alloy, known as alloy P, which comprises approximately 72% manganese, 18% copper, and 10% nickel. This alloy is used when high flexivity is desired with high resistance in a bimetal or like thermostat. This layer, as an outside layer of the composite, is provided with a thin cladding of a material such as copper, nickel, a cupronickel alloy or the like, on its outside which is to be exposed when the alloy layer is combined in various combinations by solid-phase bonding with other comparatively low-expansion layers to form multilayer thermostats.