Abstract: A method of forming a pattern in a photoresist includes forming a photoresist layer over a substrate, and selectively exposing the photoresist layer to actinic radiation to form a latent pattern. The latent pattern is developed by applying a developer composition to the selectively exposed photoresist layer to form a pattern. The developer composition includes a first solvent having Hansen solubility parameters of 15<?d<25, 10<?p<25, and 6<?h<30; an acid having an acid dissociation constant, pKa, of ?15<pKa<5, or a base having a pKa of 40>pKa>9.5; and a second solvent having a dielectric constant greater than 18. The first solvent and the second solvent are different solvents.

Abstract: A substrate processing method is a method of processing a substrate on which a metal-containing liquid for a film below a resist is applied, wherein prior to a heating process of performing a heat treatment on the substrate applied with the metal-containing liquid, the substrate processing method includes: a deprotection promoting process of promoting deprotection of functional groups in a material for the film included in the substrate on which the metal-containing liquid has been applied; a solvent removing process of removing a solvent included in the metal-containing liquid on the substrate; and a moisture absorbing process of bringing a surface of the substrate into contact with moisture.

Abstract: A method for TEM/STEM sample preparation and analysis that can be used in a FIB-electron microscope system without a flip stage. The method allows a dual beam FIB electron microscope system with a typical tilt stage having a maximum tilt of approximately 60° to be used to extract a TEM/STEM sample to from a substrate, mount the sample onto a sample holder, thin the sample using FIB milling, and rotate the sample so that the sample face is perpendicular to a vertical electron beam column for TEM/STEM imaging.

Abstract: It is disclosed an over-coating agent for forming fine patterns which is applied to cover a substrate having photoresist patterns thereon and allowed to shrink under heat so that the spacing between adjacent photoresist patterns is lessened, with the applied film of the over-coating agent being removed to form fine patterns, further characterized by comprising a water-soluble polymer which contains a monomeric component and a dimeric component, wherein the total content of the monomeric component and the dimeric component in the water-soluble polymer is reduced to 10 mass % or less, and a method of forming fine patterns using the same. By the present invention, even in reducing the pattern size on a substrate having thereon patterns having different pitches, the heat shrinkage of the over-coating agent can be controlled, irrespective whether the pitch is dense or isolate, thus achieving the pattern size reduction.

Abstract: A reticle manufacturing method of the present invention comprises the steps of holding a reference mask blank by a reference chuck to measure a surface shape of the reference mask blank as a first surface shape, holding the reference mask blank by a reticle chuck of the exposure apparatus to measure a surface shape of the reference mask blank as a second surface shape, holding the electron beam drawing mask blank by the reference chuck to measure a surface shape of the electron beam drawing mask blank as a third surface shape, calculating a difference between the measurement values of the first surface shape and the second surface shape as a first deference value, calculating, as a forth surface shape, a surface shape of the electron beam drawing mask blank held by the reticle chuck on the basis of the first deference value and the measurement value of the third surface shape, and drawing the pattern on the electron beam drawing mask blank on the basis of the forth surface shape.

Abstract: This disclosure provides systems, methods and apparatus for providing illumination by using a light guide to distribute light. In one aspect, the light guide includes a light turning film over an optically transmissive supporting layer. The light turning film may be formed of a material deposited in the liquid state. The light turning film may be formed of a photodefinable material, which may be glass, such a spin-on glass, or may be a polymer. In some other implementations, the glass is not photodefinable. The light turning film may have indentations that define light turning features and a protective layer may be formed over those indentations. The protective layer may also be formed of a glass material, such as spin-on glass. The light turning features in the light guide film may be configured to redirect light out of the light guide, for example, to illuminate a display.

Abstract: The present invention relates to a mold, a manufacturing method of the mold, and a method of forming patterns using the mold. The mold may include a main body having a convex portion and a recess portion, and a polymer layer formed over the main body by processing a surface of the main body with a high molecular weight material through a surface treatment.

Abstract: A method of patterning a target layer on a substrate is described. A patterned photoresist layer is formed over the target layer, wherein the patterned photoresist layer has unexposed parts as separate islands and each unexposed part has a low proton concentration at least in its sidewalls. Acid-crosslinked polymer layers are formed only on the sidewalls of each unexposed part. A flood exposure step is performed to the substrate. A baking step is performed to the patterned photoresist layer. A development step is performed to remove the previously unexposed parts. The target layer is etched with the acid-crosslinked polymer layers as a mask.

Abstract: A method for determining the anti-reflective coating (or bottom anti-reflective coating) over-etch time adjust with real-time process feedback is presented. The critical dimension CDresist of the patterned photoresist is measured and a first wafer with median values chosen (101) from a lot. A first time t* is found (102) and used to form the desired structure. Using the measured critical dimension of the formed structure on the first wafer a second time tlot is found (104). Finally, an over-etch time t(x) is found and used to etch the remaining wafers in the lot (106).

Abstract: A method for determining the anti-reflective coating (or bottom anti-reflective coating) over-etch time adjust with real-time process feedback is presented. The critical dimension CDresist of the patterned photoresist is measured and a first wafer with median values chosen (101) from a lot. A first time t* is found (102) and used to form the desired structure. Using the measured critical dimension of the formed structure on the first wafer a second time tlot is found (104). Finally, an over-etch time t(x) is found and used to etch the remaining wafers in the lot (106).

Abstract: A method for forming a conductive layer is disclosed, which has the following steps. First, a substrate is provided, and then a patterned photoresist layer having an undercut is formed on the substrate. After that, at least one conductive layer is deposited on the substrate. Finally, the patterned photoresist layer is lifted off; wherein the shape of the conductive layer remaining on the substrate is complementary to that of the patterned photoresist layer.

Abstract: This invention provides cycloaliphatic polyimide having the following formula (I): wherein 1 and n are integers from 4 to 7; m is an integer from 0 to 2; p is an integer from 1 to 8; polycyclic aliphatic compound R reprents C1-8 cycloalkyl, cycloalkenyl, cycloalkynyl, norbornenyl, decalinyl, adamantanyl, or cubanyl. That cycloaliphatic polyimide can be a through transparent film, their thermal stability is over 430° C. and dielectric constant is about 2.7.

Abstract: In one aspect, the invention includes a method of patterning a substrate. A film is formed over a substrate and comprises a plurality of individual molecules. The individual molecules comprise two ends with one of the two ends being directed toward the substrate and the other of the two ends being directed away from the substrate. Particle-adhering groups are bound to said other of the two ends of at least some of the individual molecules and a plurality of particles are adhered to the particle-adhering groups to form a mask over the substrate. The substrate is etched while the mask protects portions of the substrate. In another aspect, the invention encompasses a method of forming a field emission display. A material having a surface of exposed nitrogen-containing groups is formed over the substrate. At least one portion of the material is exposed to radiation while at least one other portion of the material is not exposed.

Abstract: Substrates are patterned with antibodies attached thereto at discrete locations from which absorption resistant coating is removed by selectively controlled mechanical scribing contact to avoid chemical removal so as to decrease fabrication costs and increase fabrication speed.

Abstract: Focus and exposure parameters may be controlled in a lithographic process for manufacturing microelectronics by creating a complementary tone pattern of shapes and spaces in a resist film on a substrate. Corresponding dimensions of the resist shape and space are measured and the adequacy of focus or exposure dose are determined as a function of the measured dimensions. Etching parameters may also be controlled by creating a complementary tone pattern of etched shapes and spaces on a substrate. Corresponding dimensions of the etched shape and space are measured and the adequacy of etching parameters are determined as a function of the measured dimensions.

Abstract: Disclosed herein is a pattern forming process comprising the steps of coating a substrate with a photosensitive resin composition comprising a polyamic compound having, at each terminal thereof, an actinic ray-sensitive functional group which has substituent groups each having a photopolymerizable carbon-carbon double bond, a photosensitive auxiliary having a photopolymerizable functional group, a photopolymerization initiator, and a solvent to form a film; subjecting the film to pattering exposure; and then developing the thus-exposed film with an alkaline developer or alkaline aqueous solution.

Abstract: A patterned multiple antibody substrate for use in biosensors or immunosensors is produced by (1) coating an antibody-adsorbent substrate with a material that resists antibody adsorption, (2) using ion beam sputtering, laser ablation, or mechanical scribing to remove the coating at specific sites on the substrate, and then (3) adsorbing specific antibodies at the sites. The substrate is capable of detecting multiple chemical species simultaneously.

Abstract: A method of printing an image on a substrate by applying to the substrate a film which is chemically activated by heat, and scanning the film by a beam of radiation according to the image to be printed, to chemically activate the film by heat and thereby to produce a pattern in the film according to the image scanned. The film includes a reagent capable of undergoing a redox reaction when heated in the presence of another reagent present with the film when scanned by the beam, to produce the redox reaction between the two reagents.

Abstract: The method of manufacturing an optical diffraction grating element of the present invention is characterized in adopting an ion beam made from a gas chemically reacting with a glass substrate when forming a diffraction grating having a serrated profile upon the glass substrate through an ion beam etching method. Also, when manufacturing an optical diffraction grating element that is divided into a plurality of regions whereon diffraction gratings having different diffraction angles with respect to an incident light are provided, the method of the present invention is characterized in forming slits into a resist film disposed upon a transparent substrate such as a glass substrate, in accordance with the patterns of the diffraction gratings, such that the width of the slits is constant irrespectively of the regions.

Abstract: Nonamic acidic functionalized diamines and dianhydrides are condensed to produce abnormal acid functionalized polyamic acid/imide resins which surprisingly afford effective lift-off, by alkaline media, even after higher imidization.

Abstract: A lift-off process for forming patterned films of particular use for films of metals that need to be deposited in a non-directional fashion. The process features a lift-off mask that includes a thin coating of Brewer Science ARC.RTM. PN-2 as an assisting layer under a photoresist layer.

Abstract: A method of manufacturing surface relief patterns of variable depth in solid materials is disclosed, which patterns, when seen in cross-section, are of variable geometry.

Abstract: Unwanted distortion of the planar configuration of a carbon-based X-ray lithography mask, that would otherwise occur during selective etching of the (silicon) support substrate, is prevented by incorporating a compensation layer of inorganic material that effectively offsets the internal compressive stress characteristic of the carbon. For this purpose, on a top, planar surface of a silicon substrate, a multiple layer structure containing a first layer of carbon having an internal compressive stress characteristic and a second layer of inorganic material having an internal tensile stress characteristic, is plasma-deposited. The tensile stress characteristic of the inorganic layer compensates for the compressive stress characteristic of the carbon layer and causes the composite structure to retain its substantially planar configuration after the underlying silicon substrate has been etched in the course of obtaining a rim structure on which the X-ray transmissive structure is supported.

Abstract: The present invention provides a novel approach to forming a RIE etch barrier in processes where thermally stable polymeric materials containing free carboxyl groups, such as polyamic acid polymers, are present as masking layers in the electrical device to be fabricated. The present process takes advantage of the discovery that polyamic acids complex with certain metallic cations under slightly acidic conditions to form polyamic acid salts. These salts can be made to further react with a variety of etching gases to form a non-volatile salt or oxide which imparts etch barrier properties to that portion of the polyamic acid layer exposed to the metallic cations.

Abstract: To mold artificial leather provided with real leather like feeling or touch on the surface thereof, a leather wrinkle pattern is formed on the artificial leather in such a way that the ridge portions are glazed and the furrow portions are matted. For the purpose of molding the above-mentioned artificial leather, the inner surface of the metallic mold is contrary formed in such a way that the ridge portions are matted but the furrow portions are glazed.

Abstract: A light absorbing medium to be interposed under photosensitive layers, such as a photo-resist for integrated circuit "chips" to eliminate defects caused by reflected light, has a polymer vehicle which can penetrate into small depressions of a substrate and form a thin, smooth and uniform coating. The coating includes a light absorbing dye. This light absorbing layer is imageable in the process. The light absorbing material eliminates many of the defects caused by reflected light resulting in increased sharpness of the images in the photo-resist. The material reduces the losses due to defects and increases the yield of useable product.

Abstract: Disclosed is a pattern forming method using contrast enhanced material for enhancing the resolution and contrast when forming patterns in fabrication of semiconductors or the like. This pattern forming method comprises a step of applying a contrast enhanced material for pattern forming on a photoresist, a step of exposing and a step of developing.The contrast enhanced material is a water-soluble material using a novel diazo compound so that the coefficient A of the contrast may be 10 or more, and when it is combined with g-line exposure to be used in pattern formation, a pattern of 0.5 .mu.m or less may be formed.

Abstract: The surfaces of solid ionic substrates are etched by a radiation-driven chemical reaction. The process involves exposing an ionic substrate coated with a layer of a reactant material on its surface to radiation, e.g. a laser, to induce localized melting of the substrate which results in the occurrance of a fusion reaction between the substrate and coating material. The resultant reaction product and excess reactant salt are then removed from the surface of the substrate with a solvent which is relatively inert towards the substrate. The laser-driven chemical etching process is especially suitable for etching ionic salt substrates, e.g., a solid inorganic salt such as LiNbO.sub.3, such as used in electro-optical/acousto-optic devices. It is also suitable for applications wherein the etching process is required to produce an etched ionic substrate having a smooth surface morphology or when a very rapid etching rate is desired.

Abstract: A method is disclosed for manufacturing a diffraction grating formed by corrugations reversed in phase between a first region and a second region through use of two kinds of photoresists of opposite photosensitive characteristics. An isolation film is introduced for preventing the photoresists from getting mixed with each other, permitting the combined use of any photoresists. A step may be further included in which the isolation film is deposited on one of two kinds of photoresist films in at least one of a first region and a second region, is subjected to two-beam interference exposure, is removed and then a degraded layer, which is formed in the surface of the above said one kind of photoresist film during the deposition of the isolation film, is removed.

Abstract: A method is disclosed for forming an alumina film on a selected region of a surface without forming the film on an adjacent region. An ink film composed of aluminum caboxylate compound is applied to the surface and heated to partially decompose the compound. A positive photoresist layer is preferably applied to the partially decomposed layer and selectively irradiated to define a mask overlying the selected region. Unwanted photoresist material is dissolved from the adjacent region using an aqueous alkaline solution. It is found that the solution concurrently dissolves the underlying partially decomposed aluminum compound, without dissolving the compound protected by the mask. Thereafter, the mask is stripped, and the underlying aluminum compound is heated and further decomposed to produce the desired alumina film.

Abstract: A method of forming any film pattern on an arbitrary substrate, more particularly, a pattern forming method which comprises selectively forming a film on an arbitrary substrate, by use of chemical reaction, and further, a method of forming a pattern of an organic film by selectively removing the organic film at a lower layer, with the pattern of the Langmuir-Blodgett's film containing Si as a mask.

Abstract: The present invention is concerned with methods of converting a single resist layer into a multilayered resist.The upper portion of the single resist layer can be converted into a dry-etch resistant form. The conversion can be a blanket conversion of the upper portion of the resist layer or can be a patterned conversion of areas within the upper portion of the layer. A patternwise-converted resist can be oxygen plasma developed.The upper portion of the single resist layer can be patternwise converted into a chemically different composition or structure having altered absorptivity toward radiation. The difference in radiation absorptivity within the patterned upper portion of the resist enables subsequent use of blanket irradiation of the resist surface to create differences in chemical solubility between areas having the altered absorptivity toward radiation and non-altered areas. The difference in chemical solubility enables wet development of the patterned resist.

Abstract: Dry-film, negative-acting photoresist layers are used in the formation of many articles such as circuit boards, printing plates and the like. Laminable monolayers of photoresist can suffer from slow speeds, brittleness, variable adhesive characteristics, and narrow processing latitude during development and exposure. The use of a crosslinked or crosslinkable integral thermoplastic adhesive laer on the dry-film, negative-acting photoresist layer improves the properties and performance of the photoresist.

Abstract: A method of forming any film pattern on an arbitrary substrate, more particularly, a pattern forming method which comprises selectively forming a film on an arbitrary substrate, by use of chemical reaction, and further, a method of forming a pattern of an organic film by selectively removing the organic film at a lower layer, with the pattern of the Langmuir-Blodgett's film containing Si as a mask.

Abstract: A radiation-sensitive, imageable article comprises in sequence a substrate, a vapor-deposited colorant layer capable of providing a reflection optical density of at least 0.6 to a 10 nm band of the electromagnetic spectrum between 280 and 900 nm, a vapor-deposited metal or metalloid layer of uniform composition, and a photosensitive resist layer which is non-integral with said colorant layer, the ratio of the thickness of said colorant layer to said metal or metalloid layer being at least 7:1.

Abstract: A pattern is formed by providing a reaction field in which a photo-induced reaction proceeds when a substrate is irradiated with light so as to form a pattern on the substrate, and setting, in the reaction field, conditions for establishing a nonlinear relationship between the intensity of the light and the rate of the photo-induced reaction. The substrate is selectively irradiated with light in the reaction field under the conditions set therein so as to selectively form a pattern in the irradiated portion of the substrate in accordance with the selective irradiation.

Abstract: A method for manufacturing diffraction grating, in which after forming, on a substrate, one of a negative type photoresist film (an N film) and a positive type photoresist film (a P film) to cover a first region A and the other of the negative type photoresist film and the positive type photoresist film, or the latter film on the former one to cover a second region B, the first region and the second region are subjected to two-beam interference exposure, thereby forming a diffraction grating in which corrugations in the first region and the second region are reverse in phase to each other, through utilization of characteristics of the negative type photoresist film and the positive type photoresist film.

Abstract: A dual alloy cooled turbine is manufactured by casting a hollow cylinder of first nickel-base alloy material with high creep resistance to produce directionally oriented grain boundaries. A preform of a second nickel-base alloy material with high tensile strength and high low-cycle-fatigue strength is diffusion bonded into the bore of the hollow cylinder by subjecting the cylinder and preform to hot isostatic pressing. The resulting cylindrical block is cut into thin precisely flat wafers. A plurality of alignable holes for forming fluid cooling passages are photochemically etched into the individual wafers. The wafers then are laminated by vacuum diffusion bonding techniques, with the holes aligned to form fluid cooling passages. The resulting laminated block is machined to produce the turbine wheel with turbine blades through which the cooling passages extend.

Abstract: In the development of exposed light-sensitive reproduction layers using an aqueous electrolyte developer the parts of the layer corresponding to the non-image areas are removed by electrochemical treatment. An electrolyte is used which has a pH in the range from 2.0 to 10.0 and contains at least one salt in a concentration of 0.1 weight percent up to the saturation limit of the solution for the particular salt. The electrolyte may also contain 0.1 to 5 weight percent surfactant.

Abstract: There is disclosed a process for forming a metallic image which comprises treating a composite material for forming a metallic image in the presence of a metal chelating agent. Also disclosed is a composite material for use in the process containing a support, a metallic thin layer and a light-sensitive resin layer, wherein a metal chelating agent is included in at least one layer on the support, and a treating solution for the same wherein the metal chelating agent is included therein.According to the invention, it is possible to obtain a metallic image having highly sharp edges in the etched portions.

Abstract: A method for Te pattern formation in the manufacture of a thin-film transistor having a semiconductor layer of Te. Developing and etching of the substrate having the Te layer and a resist layer overlaying the Te layer are simultaneously carried out by the use of a developing and etching solution after having been exposed to rays of UV-light.

Abstract: Relief structures comprised of double lacquer layers on substrates already having relief structures for integrated semiconductor circuits are produced by applying a lower lacquer layer onto such substrate and which is composed of a material which does not cross-link or decompose due to radiation energy and which has only relatively slight sensitivity at the radiation energy dosage range utilized for structuring; applying an upper lacquer layer onto the lower lacquer layer and which upper layer is thinner relative to the thickness of the lower layer by a factor of at least 2 and is composed of a highly sensitive negative lacquer material; generating desired relief structures in the upper lacquer layer and removing those portions of the lower lacquer which are not covered by the upper negative lacquer layer.

Abstract: A structure, and method, for producing images such as microform, particularly, microfilm. The structure in its preferred form comprises a flexible substrate having a film, layer or coating of a metal, or metal-like, image forming material on at least one surface thereof. The image forming material, in turn, is provided with a film, layer or coating of an energy sensitive material. The structure is characterized in that it can be exposed to actinic radiation, for example, and developed in a fraction of a second to provide a dry microform having high acuity, contrast and resolution, excellent archival properties, and, significantly, in the case of positive working energy sensitive materials, unique add-on capabilities. The structure and method also have utility in the graphic arts field.

Abstract: In forming a fluorescent screen of a black matrix type color picture tube, a light absorptive film is first formed on the inner surface of a face plate of the color picture tube. Formed on the light absorptive film is a light-hardenable photosensitive resin film which in turn is exposed to light through a shadow mask at portions corresponding to phosphor applying portions. The unexposed portion of the light-hardenable photosensitive film is then developed. Finally, the exposed portion of the light-hardenable photosensitive film and portion of the light absorptive film therebeneath are removed to partly perforate the light absorptive film so that in the light absorptive film, openings are formed into which the phosphor is applied.

Abstract: An image-forming method is described using a light-sensitive material comprising a support and a light-sensitive layer on the support, said light-sensitive layer containing an o-quinonediazide compound as a first component and a basic carbonium dye as a second component; according to this method images can be obtained both by positive working and negative working techniques. Furthermore, images which are free from yellow light fogging can be obtained by use of a laser beam.

Abstract: A method for producing a multilayer printing plate comprising image-wise exposing and developing a light-sensitive printing plate material which comprises a support having an oleophilic surface having a hydrophilic metal layer thereon, the hydrophilic metal layer having thereon at least one silver halide emulsion layer either directly or on at least one subbing layer on the hydrophilic metal layer, to form a silver image resist image corresponding to the image-wise exposure by subjecting the printing plate material to a process including baking, removing the hydrophilic metal layer at non-resist image areas to uncover the oleophilic surface thereunder, and removing the resist image, or a method for producing a multilayer printing plate comprising image-wise exposing and developing a light-sensitive printing plate material which comprises a support having a hydrophilic surface having thereon at least one silver halide emulsion layer either directly or on at least one subbing layer on the hydrophilic surface to

Abstract: A device for dry development of photoresists, etching of semiconductor devices, fabrication of photomasks and removal of photoresist materials is described. The device includes a reaction chamber, a means for evacuating the reaction chamber, a supply of and means for introducing one or more reactive gases to the reaction chamber, a controllable relatively low-voltage direct-current power supply to generate a gas plasma in the reaction chamber, planar electrodes to confine the plasma energy to specific target areas in the chamber, means for defining and controlling the temperature of targets to be processed in the chamber and means for modifying and controlling the temperature of the plasma generating gas. The device and the manner of using the same are described.

Abstract: A photosensitive image forming material comprising a tin sulfide image forming layer on a base and a photosensitive resin composition layer on said layer is disclosed. An image forming process using said material is also disclosed comprising imagewise exposing the same and then simultaneously developing the photosensitive resin composition layer and etching the exposed tin sulfide image forming layer. Alternatively, development and etching can be conducted as two separate steps.

Abstract: Disclosed is a liquid composition for treating photosensitive laminates having an alcohol-soluble polyamide layer, which comprises 12 to 70 parts by weight of an aromatic neutral salt, 0.01 to 10 parts by weight of an alkali, 1 to 15 parts by weight of an alcohol and 84 to 100 parts by weight of water.

Abstract: A photosensitive image forming material which comprises a transparent support having thereon, in order, a poly(vinyl alcohol) layer, an alcohol soluble polyamide layer and a photosensitive resin composition layer with at least one of the poly(vinyl alcohol) layer and the photosensitive resin composition layer containing a colorant therein; and an image forming method using the image-forming material. Such a layer structure ensures sufficiently layer good adhesion as well as strippability of the developed image on demand.