Abstract: A heat-treatment apparatus comprises a heat-treatment section for subjecting a heat-treatment to a wafer and a loading section for loading a wafer boat into and unloading it from the heat-treatment section. The loading section is connected to the heat-treatment section and includes in it a movable support member, a drive mechanism and a vertical base board as well as a load-lock chamber for maintaining the inside in vacuum. The movable support member supports a wafer boat. The movable support member is attached to a vertical base board so that it can move up and down. The drive mechanism is attached on the major surface of the vertical base board opposite to the surface facing the wafer boat. The drive mechanism drives the movable support to move up and down. The heat-treatment apparatus further comprises a wafer transfer section that includes an orientation flat alignment mechanism and a buffer stage disposed near the orientation flat alignment mechanism.
February 12, 1993
Date of Patent:
April 18, 1995
Tokyo Electron Limited, Tokyo Electron Sagami Limited, Kabushiki Kaisha Yaskawa Denki
Abstract: A piloting aid system for displaying symbols representative of determined characteristics of the flight of an aircraft and representative of its environment is disclosed. The symbols are displayed on the screen of a display unit which displays a symbol representing the aircraft near a predetermined point on the display screen and a rectangular window for guiding the flight path of the aircraft. The sides of the guidance window are parallel to mutually perpendicular axes provided on the screen. The abscissa and ordinate of the predetermined point are respectively proportional to the drift and to the slope relative to the ground of the aircraft flight path.