Abstract: The present invention relates to a vehicle charging cable having a selective and controllable shape-memory. Selective shape memory cables of the present disclosure can advantageously adopt a different shape and/or forget a passively inherent thermoset shape, for example a spiral. Such selective shape memory cables have particular application for charging EVs and plug-in HEVs and may comprise a body; one or more primary wires accommodated by the body; a first means for biasing a region of the body (such as a thermosetting bias); and a second means for biasing all or part of said region of the body. The second means being responsive to an external stimulus, such as an electric current so that the second biasing means can be actively operated.

Abstract: An electrical contact and a connector assembly for housing the contact. The electrical contact has a first mating section, a transition section, a securing section. The first mating section extends in a plane which is substantially parallel to a plane of the securing section. The transition section extends in a plane which is substantially perpendicular to the plane of the first mounting section. The first mating section has a mating contact engaging portion and a seal receiving portion. A seal retention projection extends from the seal receiving portion. A peripheral seal is provided on the seal receiving portion of the first mating section of the electrical contact. The housing includes a contact receiving area and a connector mating area. A wall is provided between the contact receiving area and the connector mating area. The wall has a contact receiving opening which extends through the wall.

Abstract: A method of forming a metal silicide nanowire network that includes multiple metal silicide nanowires fused together in a disorderly arrangement on a substrate. The metal silicide nanowire network can be formed by applying a solution that contains silicon nanowires onto the substrate, forming a metal layer on the silicon nanowires, and performing a silicidation anneal such that the metal silicide nanowires are fused together in a disorderly arrangement, forming a mesh. After the silicidation anneal is performed, any unreacted silicon or metal can be selectively removed.

Abstract: A terminal metal fitting includes a tubular box portion receiving a counterpart terminal; a terminal spring extending from an inner wall surface of the box portion to press and contact the counterpart terminal; and a deformation restriction portion restricting deformation of the terminal spring within a preset range when the terminal spring contacts the counterpart terminal. The deformation restriction portion has a chamfered portion to contact the terminal spring.

Abstract: The invention relates to an alarming system of a wiper, which comprises: a first connecting member, comprising a first body and a first number of first contacts which are insulated to each other and disposed at the first body; a second connecting member, comprising a second body and a first number of second contacts which are electrically connected to each other and disposed at the second body; and control member; any one of the first connecting member or the second connecting member is connected to a wiper arm; the other one of the first connecting member or the second connecting member is connected to a wiper blade; the first number is equal to or larger than two; when the wiper blade is properly mounted to the wiper arm, the first connecting member is connected to the second connecting member, such that each of the first contacts is in contact with corresponding one of the second contacts, and thereby the first contacts are electrically connected to each other through the second contacts; the control membe

Abstract: A method and apparatus (“utility”) for securing an electrical connection formed by a mating structure including prongs of a male assembly and receptacles of a female assembly are provided. The utility includes a clamping mechanism whereby the very forces that would otherwise tend to pull the connection apart serve to actuate the clamping mechanism, thereby securing the mated pair. The apparatus may be integrated into a standard receptacle, or retrofitted to work with existing devices. In one embodiment, the clamping mechanism acts solely on the ground prong of a standard plug assembly, so that it is unnecessary to consider electrical potentials applied to the clamped prong in relation to the design of the clamping mechanism. Further, the withdrawing movement of the prongs of a plug may cause elongate clamping surfaces of the clamping mechanism to frictionally engage opposing surfaces of the clamped prong.

Abstract: The invention discloses the internal structures and processes to synthesize the structure of self-healing materials, especially metallic materials, metal matrix micro and nanocomposites. Self-healing is imparted by incorporation of macro, micro or nanosize hollow reinforcements including nanotubes, filled with low melting healing material or incorporation of healing material in pockets within the metallic matrix; the healing material melts and fills the crack. In another concept, macro, micro and nanosize solid reinforcements including ceramic and metallic particles, and shape memory alloys are incorporated into alloy matrices, specially nanostructured alloy matrices, to impart self healing by applying compressive stresses on the crack or diffusing material into voids to fill them.

Abstract: A method of forming a metal silicide nanowire network that includes multiple metal silicide nanowires fused together in a disorderly arrangement on a substrate. The metal silicide nanowire network can be formed by applying a solution that contains silicon nanowires onto the substrate, forming a metal layer on the silicon nanowires, and performing a silicidation anneal such that the metal silicide nanowires are fused together in a disorderly arrangement, forming a mesh. After the silicidation anneal is performed, any unreacted silicon or metal can be selectively removed.

Abstract: A fixture for electronic devices includes a substantially planar receptacle, and a mounting framework arranged at least partially at the surrounding edges of the receptacle, the mounting framework having at least one framework component made from a shape memory material and/or an electro-active polymer, wherein the framework component exhibits a relaxed state and a triggered state in which the framework component is moved or flexed inwardly into the area of the receptacle.

Abstract: A waterproof connector (1) includes: a first shell (2) having an approximately tubular form, formed of metal and disposed on a plug insertion side; a second shell (3) having an approximately tubular form, formed of metal and engaged with a rear portion of the first shell (2); an outer sealing member (4) provided on an outer circumference of the first shell (2) so as to abut on a front surface portion (31) of the second shell (3) positioned on an outer side of the first shell (2); a supporting portion (5) accommodated in a wall form in a rear portion of an engagement assembly of the first shell (2) and the second shell (3) in a state in which water does not enter toward a rear side from a space between the engagement assembly and the supporting portion; and contact terminals (6) supported by the supporting portion (5). At least one of the first shell (2) and the second shell (3) is seamless.

Abstract: A cable end termination is for a coaxial cable that includes inner and outer conductors and a dielectric layer therebetween that is subject to outgassing in a vacuum environment. The cable end termination may include a tubular bi-metallic body that includes a first longitudinal portion including a first metal and a second longitudinal portion joined with the first longitudinal portion and that includes a second metal having a different coefficient of thermal expansion (CTE) than the first metal. The tubular bi-metallic body may have a first end receiving the coaxial cable and a second end opposite the first end that carries a dielectric body to define a hermetic seal for the dielectric layer in the vacuum environment. A center pin contact may extend through the dielectric body, and a center conductor contact may couple the center pin contact to the inner conductor.

Abstract: A connector and an electronic device for connecting an electronic component and a testing apparatus are provided. The connector includes a substrate and a plurality of conductive resilient sheets. The substrate includes a surface and a plurality of recesses disposed on the surface. Each of the conductive resilient sheets is disposed on the surface and has an end portion sunk in the recess. And the electronic device includes the aforesaid connector and an electronic component, which is disposed on the connector and has a plurality of bumps disposed on a surface of the electronic component. The bumps touch the end portions of the conductive resilient sheets and partially sunk in the recesses. Therefore, the touching connection between the electronic component and the conductive resilient sheets can be more stable.

Abstract: A semiconductor IC structure includes a semiconductor substrate, a multi-layered dielectric structure disposed on the semiconductor substrate, a first conductive layer disposed in the multi-layered dielectric structure, and a second conductive layer disposed on the multi-layered dielectric structure. The multi-layered dielectric structure further includes a first dielectric layer disposed on the semiconductor substrate, and a second dielectric layer disposed on the first dielectric layer. A coefficient of thermal expansion (CTE) of the first dielectric layer is larger than zero, and a CTE of the second dielectric layer is smaller than zero.

Abstract: A method of making an array of integral terminals on a circuit assembly. The method includes the steps of depositing at least a first liquid dielectric layer on the first surface of a first circuit member, imaged to include a plurality of first recesses corresponding to the array of integral terminals. The selected surfaces of the first recesses are processed to accept electro-less conductive plating deposition. Electro-lessly plating is applied to the selected surfaces of the first recesses to create a plurality of first conductive structures electrically coupled to, and extending generally perpendicular to, the first circuitry layer. Electro-plating is applied to the electro-less plating to substantially first recesses with a conductive material. The steps of depositing, processing, electro-less plating, and electro-plating are repeated to form the integral terminals of a desired shape. The dielectric layers are removed to expose the terminals.

Abstract: Edge portions are formed on a shell fixing portion, disposed in upper and lower positions on the shell fixing portion and formed extending horizontally. Crimp pieces are continuously formed on the edge portions, and the crimp pieces are folded back at the edge portions therealong so as to extend towards a distal end of a cylindrical shell portion. The crimp pieces each have a rectangular flat plate-like shape and disposed facing oppositely corresponding external flat surface portions of the cylindrical shell portion with a predetermined space defined therebetween. The crimp pieces are formed as a crimping applied portion and the cylindrical shell portion is formed as a crimping bearing portion.

Abstract: An electrical connection device for a gas control valve. In one embodiment the device has a first electrical insulation member with an aperture extending between top and bottom surfaces and a second electrical insulation member having a top face and a bottom face and situated in the aperture of the first electrical insulation member so that the top face resides in the aperture and the bottom face resides outside the aperture. A joint member connects the first and second electrical insulation members. The device also includes first and second electrical terminals that are electrically insulated from one another and wherein each extends from the second electrical insulation member through the joint member to a location outside the first electrical insulation member.

Abstract: An electrical connection device for a slide type portable terminal including a main body and a slide body performing an opening and closing operation with respect to the main body electrically connects a main board of the main body to a sub-board of the slide body, and has one end extendingly connected to a side of the main board and the other end extendingly connected to a side of the sub-board so as to extend and contract at one side or both sides of the terminal according to the opening/closing operation of the slide body.

Abstract: A gas-tight electrical connection comprises a conductive substrate with at least one socket for receiving an associated wire, at least one slot in the conductive substrate that penetrates each socket and at least one SMA force ring that slides over the conductive substrate near each slot to clamp the electrical connection when heated to its austenitic state.

Abstract: Disclosed is a semiconductor package structure that incorporates the use of conductive pins to electrically and mechanically connect a semiconductor module and a substrate (e.g., printed wiring board). Specifically, one or both ends of the pins are hooked and are adapted to allow a press-fit connection with the walls of the plated through holes of either one or both of the semiconductor module and the substrate. The hook-shaped ends of the pins may have one or more hooks to establish the connection. Additionally, the pins may be formed of a temperature induced shape change material that bends to allow engaging and/or disengaging of the hook-shaped ends from the walls of the plated through holes.

Abstract: A shape memory actuator device, comprising of a shape memory cable assembled through a sheath and susceptible of being supplied with an electric current to cause it to heat up. The sheath is placed in such a way to allow a manual activation of the controlled mechanism, acting as a transmission element, alternatively to the electric activation through the shape memory cable. Means are foreseen to detect the stop end position of the shape memory cable following its heating up in order to disconnect the electricity supply to such cable and to protect it from the risk of overheating. It is possible to foresee more shape memory cables placed parallel between them.

Abstract: An assembly for a computer system is mountable on a circuit board of a computer system. The assembly includes a base portion for engaging with an electronic component mounted on the circuit board. The assembly also includes a spring formed of memory metal. The spring is operable to urge the base portion against the electronic component to urge the electronic component towards the circuit board. The spring is configured to provide a greater spring force for urging the base portion against the electronic component when the spring is above a predetermined temperature than when it is below said predetermined temperature.

Abstract: A connector has a connector body, at least one contact and at least one bimetal stripe. One end of the contact is fixed to the connector body and another end of each contact extends from a surface of the connector body forming a springy contact. One end of the bimetal stripe is fixed in the connector body and another end of the bimetal stripe extends from the surface of the connector body. The bimetal stripe is arranged for moving the contact in a first or second position depending on the temperature of the bimetal stripe.

Abstract: A deflection element operating under control of selectively applied energy is used to achieve low insertion loss between mating elements. Once the elements are in proper relationship the deflection element is allowed to settle to its stable position thereby serving to lock the elements together.

Abstract: A flexible medium voltage interconnection adapted to electrically interconnect receiving connectors of “bushings” of equipment stations. The interconnection comprises a conductive core including a metal conductor with, at each end thereof, an electrical connector adapted to mate the receiving connector of the bushing, and a flexible tube having at least an insulating layer of elastomeric material and covering the whole conductive core. The elastomeric material of the tube is preferably a synthetic terpolymer of ethylene, propylene and diene [EPDM] to increase the flexibility of the whole. In the method, the tube is expanded over the metal core of which the ends are foreseen with locking rings mating grooves of the tube in order to prevent a relative movement of the core with respect to the tube.

Abstract: The present invention relates to apparatus and methods for minimizing open electrical connections between carrier substrates and components connected thereto that occur due to sag in the substrate incurred due to exposure to an increasing heat profile encountered to secure the component to the substrate. A zero insertion force heat activated retention pin expands or bends during the temperature increase, creating an upward force on the printed circuit board. This upward force counters the downward sag forces and enables the carrier substrate to maintain a coplanar relationship with the component being connected.

Abstract: A connector, and an associated method, for connecting an electrical circuit component to a substrate, such as a printed circuit board. The connector is formed of one of more pin members formed of an electrically-conductive material which exhibits physical-memory characteristics. The pin member is initially configured into a memory configuration and thereafter reconfigured into an alternate reconfiguration. The alternate configuration is selected to facilitate mounting of the circuit component upon the substrate. Thereafter, the pin member is heated to beyond a deformation threshold temperature. When at such temperature, the pin member becomes reconfigured into the memory configuration. Through appropriate selection of the memory configuration, heating of the pin member causes connection of the circuit component with the substrate.

Abstract: A compliant pin contact and assembly utilizing same in which the contact is comprised of two layers, each of a different material and coefficient of thermal expansion (CTE) than the other, to enable insertion within an opening in either a “cold” or “hot” state to thereby expand and positively engage the opening's walls, thereby securedly holding the pin in position. Representative materials include Invar and aluminum.

Abstract: The invention solves the task of creating a temperature-controlled wire holder that enables a reliable and controlled release. This task is solved by the invention in that the wire holder (1) is produced from a shape memory material, and that the wire (14) is clamped in an aperture (2) of the wire holder (1) by compression of the aperture (2), and that the compressed aperture (2) opens by itself when the wire holder (1) is heated to a specific operating temperature, thus releasing the wire. The invention may be used in a temperature-controlled wire holder that releases a secured wire (14) under mechanical tension when a specific operating temperature is achieved.

Abstract: A bi-metallic pin socket for receiving the pins of a lamp is provided with two curved apertures each having a narrow end and a wide end. An elongated bi-metallic element of uniform thickness having a curvature matching the curvature of the aperture is disposed in each aperture for engagement with a respective lamp pin. The socket is provided with an angled recess at the narrow end of each aperture and each bi-metallic element has an angled end portion secured in a respective recess.

Abstract: In a heat-shrinkable tube (1) having a tubular member which is shrinkable in response to heat and has a cylindrical surface, a thin film is formed on at least a part of the cylindrical surface. The thin film is made of a magnetic loss material which has a high magnetic loss characteristic. The thin film has a first phase comprising a first one of Fe, Co, and Ni and has a second phase comprising an insulator containing at least one element other than Fe, Co, and Ni.

Abstract: A socket device for receiving a connection pin is disclosed, the socket device including a substrate having an upper surface. The socket device includes a connection pad disposed on the upper surface and a first layer disposed on the upper surface and on the connection pad. The first layer includes material having an overall positive coefficient of thermal expansion. The socket device includes a second layer disposed on the first layer. The second layer includes material having an overall negative coefficient of thermal expansion. The socket device also includes a contact hole formed in the first and second layers exposing a portion of the connection pad.

Abstract: A socket device for receiving a connection pin is disclosed, the socket device including a substrate having an upper surface. The socket device includes a connection pad disposed on the upper surface and a first layer disposed on the upper surface and on the connection pad. The first layer includes material having an overall positive coefficient of thermal expansion. The socket device includes a second layer disposed on the first layer. The second layer includes material having an overall negative coefficient of thermal expansion. The socket device also includes a contact hole formed in the first and second layers exposing a portion of the connection pad.

Abstract: A socket device for receiving a connection pin is disclosed, the socket device including a substrate having an upper surface. The socket device includes a connection pad disposed on the upper surface and a first layer disposed on the upper surface and on the connection pad. The first layer includes material having an overall positive coefficient of thermal expansion. The socket device includes a second layer disposed on the first layer. The second layer includes material having an overall negative coefficient of thermal expansion. The socket device also includes a contact hole formed in the first and second layers exposing a portion of the connection pad.

Abstract: A mechanism for ejecting an electronic card inserted into a card connector is driven by applying an electrical current to a memory alloy wire to cause the wire to retract and the mechanism to move from a first position to a second position. Immediately after the mechanism reaches the second position, another card can be inserted into the connector without waiting for the wire to resume its original length.

Abstract: An underwater electrical connector includes a plug shell, a receptacle shell, and removeable inserts. A substantially water tight seal is provided between the plug and receptacle shells when engaged, and preferably the plug shell and the socket shell have a maximum diameter of less than approximately 0.75 inches. In some embodiments, the plug and receptacle inserts are held in place with retaining rings comprising a shape-memory alloy. A low profile key having one portion flush with a shell surface may be provided, as well as an optional insert mounted oil valve.

Abstract: A plurality of electrostatic discharge protection devices are disclosed for use with semiconductor chip packages of a type having a top surface, a bottom surface, and disposed between the top surface and the bottom surface a plurality of lateral surface with extending therefrom a plurality of connector pins disposed thereon. The electrostatic discharge protection devices disclosed herein are heat sensitive in that they automatically withdraw from electrical contact with the connecting pins upon introduction of sufficient heat such as that of soldering. In addition, disclosed herein is a electrostatic discharge protection device for manual withdrawal should the electrostatic discharge protection be required after the soldering process has been terminated.

Abstract: A plurality of electrostatic discharge protection devices are disclosed for use with semiconductor chip packages of a type having a top surface, a bottom surface, and disposed between the top surface and the bottom surface a plurality of lateral surface with extending therefrom a plurality of connector pins disposed thereon. The electrostatic discharge protection devices disclosed herein are heat sensitive in that they automatically withdraw from electrical contact with the connecting pins upon introduction of sufficient heat such as that of soldering. In addition, disclosed herein is a electrostatic discharge protection device for manual withdrawal should the electrostatic discharge protection be required after the soldering process has been terminated.

Abstract: A termination arrangement for a coaxial cable comprises a dimensionally heat-recoverable sleeve that encloses a connecting element for the screen of the cable and a quantity of solder for forming a permanent electrical connection between the connecting element and the cable screen. The connecting element has a generally cylindrical portion whose diameter is capable of changing and which is held in a state of larger diameter by the solder and/or the sleeve, the element changing to a smaller diameter state when the sleeve is recovered. In use, the arrangement is positioned over a coaxial cable which has been prepared so as to expose an appropriate length of the central conductor, dielectric and screen. when the sleeve is recovered, the solder fuses and the connecting element contracts around the screen.

Abstract: An electrical connector, particularly an insulation-displacement connector of split-beam design, comprising a metal that at constant temperature has an elasticity of at least 0.8%. This allows the connector to be used with conductors over a large diameter range.

Abstract: This invention discloses a novel form of socket for integrated circuits to be mounted on printed circuit boards. The socket uses a novel contact which is fabricated out of a bimetallic strip with a shape which makes the end of the strip move laterally as temperature changes. The end of the strip forms a barb which digs into an integrated circuit lead at normal temperatures and holds it firmly in the contact, preventing loosening and open circuits from vibration. By cooling the contact containing the bimetallic strip the barb end can be made to release so that the integrated circuit lead can be removed from the socket without damage either to the lead or to the socket components.

Abstract: A heated roller for use in a fixing device has a heating portion and hollow shaft portions integrally molded from the same material. Conducting terminals capable of elastically expanding and contracting in the radial direction are closely fitted into the hollow shaft portions at both ends of the molded member. This ensures power supply from the conducting terminals, which are metallic parts, to the ceramic heating portion.

Abstract: A contact device for an electrical component, particularly a connector, comprising at least one contact element, said contact element having a first contact portion located within said component and second contact portion projecting downwardly beyond said component and adapted to be connected to a conductor, in particular a conductor of a printed circuit board, by soldering, wherein the first contact portion consists of a resilient metallic material and the second contact portion consists of a shape memory alloy, the alloy having a transformation temperature which is significantly higher than the operation temperature of the contact device, the contact device being located or oriented such that it deforms towards said conductor above said transformation temperature.

Abstract: The method of repairing in situ a damaged or malfunctioning electrical connector (10) of a safety related nuclear reactor instrument (14) and its associated sheathed cable (18) wherein the damaged or malfunctioning connector portion (20) is cut from its associated cable (18) and replaced by a new connector portion. The wires of the cut cable are connected with the replacement connector portion and are suitably insulated. The cut cable and new connector portion are then secured together by a special alloy coupling (34) which is positioned in spanning relation with the cut cable (18) and the replacement connector portion (20). This special alloy has the property that it can be expanded within limits and upon being heated above a critical temperature will return to its original dimension. The tubular coupling accordingly has an expanded diameter slightly larger than that of the replacement connector portion and the sheath of the cut cable but an original inner diameter slightly smaller.

Abstract: A burn-in socket for integrated circuit chips has a clamping means actuated by a thermally-reactive resilient means, operative during the burn-in cycle itself, such that the chip frames are retained and good electrical contact with the chip leads is maintained during burn-in.

Abstract: A two-piece electrical receptacle terminal for receiving a male terminal. The receptacle terminal includes a spring, having a predetermined shape, which is confined within an integrally formed housing. During insertion of the male terminal into the housing, the spring is deflected from the predetermined shape. The spring is constructed of a metal which exhibits a memory, evoked by heating, predisposing the deflected spring into its predetermined shape. Heating can be accomplished by ohmic self-heating.

Abstract: A pivotal electrical connector for connecting a shape memory alloy element in the form of a coil spring to a fixed member, the connector including a strip of electrically conductive material having a clip or a pair of legs for securing the connector to one of the coils of the element. A pair of holes may be provided in the strip through which the coil is threaded. A rotational connector is provided in the strip for engaging the fixed member.

Abstract: The invention comprises a plurality of stacked planar processing circuit boards surrounded on at least one side by a plurality of memory boards located substantially perpendicular to the planar processing boards, the processing and memory boards connected by orthogonal interconnect modules. The orthogonal interconnect modules allow closely-spaced orthogonal connection of the processing boards to the memory boards. The memory boards are of a densely packed design having a plurality of removeable memory chip stacks located on the memory boards.

Abstract: A connection device consisting basically of a socket member (1) exhibiting a termination area (2) for the connection of an electric cable and a contact area (4) joined to it by means of a base (1a), the contact area being in the form of tines and intended to receive and hold a mating pin (3), and of a separate driver member (5) in the form of a closed ring which is preferably manufactured of heat recoverable material. In order to create an electrical connection device where the driver member being retained against the contact area, creates both a mechanical force and keyed-in connection between the socket member and the mating pin when in its second functional position, a recess which is at least partial formed into the mating pin, and the tines and driver member are formed and positioned relative to each other in such a way that the driver element partially fits into the recess when in its second functional position.

Abstract: An integrated DC/RF stripline flexprint module edge connector comprises a stripline RF transmission line that operates at microwave frequencies. The connector mates and clamps DC and signal conductors in a flat flexible circuit and an RF conductor located in an RF signal stripline with a matching pattern of conductors on an edge of a module mating plug. The Rf conductor is sandwiched between two equally spaced ground planes and forms a lapjoint connection with the mating plug. The engagement of the connector to the edge of the mating plug is accomplished by a zero inserting force clamp. The clamp secures the connector comprising the DC and signal conductors and the more rigid RF signal stripline adjacent to the flexprint.

Abstract: An actuator including a shape-memory flexible cable with a flexible sheath can be used, by controlling it both electrically and mechanically using the sheath as element for applying a mechanical tensile force. The shape-memory flexible cable is provided with a coating made of synthetic or elastomer material moulded thereon and adherent thereto, which favors rapid return of the shape-memory cable into its resting configuration after its activation both on account of its elastic return and owing to the fact that it favors cooling of the cable. Preferably, the coating is obtained by means of a process of co-extrusion with the shape-memory cable.