Abstract: An inspection device for wiring of integrated circuit includes a base seat and an inspection cover, wherein the top end of the base seat is provided with cavity of appropriate depth and having supporting rib, and the two lateral sides of the cavity are provided with protruded edge a little higher than the cavity; the inspection cover having two side blocks is provided with an extended frame stripe such that the two side blocks and the two frame stripes are formed into a frame body, and corresponding stripes are formed between the two side blocks such that the corresponding stripes divides the frame body into a plurality of observation region, and each observation region is adapted for an inspection plate made from a transparent material, and the two side withholding seat of the inspection plate are located at the end face of the two side blocks, and the inspection plate moves along the end face of the two side blocks, whereby the base plate of the IC is positioned at the withholding protruded edge of the base

Abstract: A plastic molding which on one side has on its surface electrical conductor tracks into which contact pins are inserted, part of these contact pins protruding from the surface with the electrical conductor tracks and part of the contact pins penetrating through the layer of plastic and protruding out on the other, opposite side as well as a subassembly comprising a housing of at least one thermoplastic material or plastic blend, which has at a selected location on its inner side on the surface electrical conductor tracks, into which contact pins are inserted, part of these contact pins protruding from the surface with the electrical conductor tracks and part of the contact pins penetrating through the layer of plastic of the housing and protruding out exclusively or additionally on the opposite outer side, as well as at least one electrical or electronic device.

Abstract: Second connectors 61x are fixed symmetrically with respect to a steering shaft 10 on a steering post 20 in such a manner that these second connectors are slightly movable, and a steering unit 30 is moved parallel to the axis of the steering shaft 10, thereby connecting two first connectors 62x, fixedly mounted on the steering unit 30, to the second connectors 61x, respectively. Lever-type connectors, having the function of reducing a load exerted during the connecting operation, are used as the first and second connectors 62x and 61x, respectively.

Abstract: A socket such as IC socket for an electrical part such as IC package is provided with a socket body having a mount portion on which an electrical part is mounted, a plurality of contact pins are disposed to the socket body so as to be contacted to or separated from terminals of the electrical part. A movable plate is disposed to the socket body to be movable, and when the movable plate is moved, contact portions of each of the contact pins are displaced so as to be contacted to or separated from the terminal of the electrical part. Each of the contact pins is formed with an elastic piece having an end portion to which the contact portions are formed, and the contact portions are contacted to a side surface portion of the terminal to thereby establish an electrical connection therebetween and the contact portions each is formed with an inclining surface inclining, in a plan view in a use of the socket, with respect to a direction normal to the displacement direction of the contact portion.

Abstract: A socket comprising an electrically conductive element, the element situated within a well such that a first end of the element extends above a first surface of the socket, the element capable of flexing to exert a first force on a pin inserted into the well upon application of a second force by a descending surface to the first end of the element.

Abstract: A test socket for testing an optical IC device in a dead bug orientation includes a socket body with a device under test cavity (DUT cavity) for receiving an optical IC device under test (optical DUT) in a contact-up or dead bug orientation. The DUT cavity has a bottom wall with at least one aperture through which the photoactive side of the optical DUT held in the cavity can be illuminated. An outer array of axial contact elements arranged about the DUT cavity provides conductive paths through the socket body. The test socket further includes a plunger assembly insertable into the DUT cavity of the socket body having an inner array of axial contact elements which extend through the plunger assembly and which are configured to provide contact with the contacts on the contact side of the optical DUT.

Abstract: A socket assembly for accomodating an IC chip or package (IC) provided with a socket body having a generally rectangular configuration. A plurality of flat plate-like contact pins are arranged forming rows in parallel with each other so as to form rows along four sides of the socket body, respectively. Each contact pin has a base portion and an arm which extends curved upward from the base portion. An upward contact portion for coming into contact with a terminal of an IC is formed on one end of the base portion of the contact pin, and a connecting portion for the connection to the printed circuit board is formed on the other end of the base portion. Four sliders are arranged along the four sides of the socket body, respectively.

Abstract: The present invention provides a connector that can adjust the strength of the connection between the pins of a plug and the contacts of a jack by converting the horizontal motion of a member integrated into the jack or the plug into the vertical motion of an actuator disposed so as to adjust the strength of the contact between the pins and the contacts, thereby eliminating the need for a connector tool to accomplish the adjustment and thus both reducing the load surface area of the connector and eliminating the need for space in which to insert and remove plugs.

Abstract: An IC socket includes a contact pin having a plate-like shape. The IC package has a solder ball, and the side surface of the contact portion is separated from the side surface of the solder ball. The contact portion is thinned at its central portion as compared with the edge portions, and the inclined surfaces contact but are separate from the solder ball. Normal lines of the contact points of both the inclined surfaces are directed to the center of the solder ball. The solder ball is received in the thinned portion thereof. In this way, a location space is narrowed in comparison with a flat plate contact pin. The solder ball is also guided by a pair of inclined surfaces to locate it in the predetermined position, and form a wiping effect.

Abstract: A socket assembly for accommodating an IC chip or package (IC) provided with a socket body having a generally rectangular configuration. A plurality of flat plate-like contact pins are arranged forming rows in parallel with each other so as to form rows along four sides of the socket body, respectively. Each contact pin has a base portion and an arm which extends curved upward from the base portion. An upward contact portion for coming into contact with a terminal of an IC is formed on one end of the base portion of the contact pin, and a connecting portion for the connection to the printed circuit board is formed on the other end of the base portion. Four sliders are arranged along the four sides of the socket body, respectively.

Abstract: A diode holder with spring clamped heat sink includes a unitary holder having spaced apart pockets for the diodes, a heat sink plate, a compression coil spring and connector such as a rivet for clamping the holder and plate with the diodes engaging the plate with the clamping force being applied through the spring.

Abstract: An IC socket includes a cover member vertically movable; a mounting device for placing an IC package; a slide member having a plurality of contact pins inserted therein, horizontally movable; an operating member reciprocating in accordance with the vertical movement of the cover member; and a position control device coming in contact with the slide member to press and move the slide member in a direction perpendicular to the contact surface and to enable the slide member to regain its original position. Thus, the connecting terminals of the IC package are wiped at a moderate contact pressure, and the IC socket having excellent conducting properties can be provided.

Abstract: A reusable socket adapted for use in making an electrical connection between an integrated circuit of a ball grid array (BGA) type package and a circuit board or test fixture. In one embodiment, the socket includes a return member for reshaping the socket. In a further embodiment, a socket assembly includes a plurality of spaced sockets. In an alternative embodiment, a socket assembly further includes a base member. In another embodiment, a socket is formed from a temperature dependent smart memory material. In a further embodiment, a socket assembly includes a plurality of sockets formed from a shape memory material. In an alternative embodiment, a zero insertion force (ZIF) or a low insertion force (LIF) socket assembly for a BGA package includes a plurality of sockets and a lever adapted for frictionally engaging respective BGA contact balls.

Abstract: A socket assembly for accommodating an IC chip or package (IC) provided with a socket body having a generally rectangular configuration. A plurality of flat plate-like contact pins are arranged forming rows in parallel with each other so as to form rows along four sides of the socket body, respectively. Each contact pin has a base portion and an arm which extends curved upward from the base portion. An upward contact portion for coming into contact with a terminal of an IC is formed on one end of the base portion of the contact pin, and a connecting portion for the connection to the printed circuit board is formed on the other end of the base portion. Four sliders are arranged along the four sides of the socket body, respectively.

Abstract: A printed circuit board assembly that has a first electronic package which is coupled to a printed circuit board and a second electronic package that is plugged into the first electronic package. The first electronic package can be coupled to the printed circuit board by leads, pins that plug into corresponding sockets mounted to the circuit board, or a SMT socket adapter that is mounted to the board. The first package also has a plurality of pins that extend through an opening in the printed circuit board. The second package has a plurality of sockets that can be plugged onto the pins of the first package to couple the second package to the first package.

Abstract: An interconnect system (8') for providing electrical connection to bond pads on a semiconductor device (21) includes a socket (12) having a plurality of conductors (46) and a carrier assembly (40) mounted on the socket (12) for carrying a semiconductor device (21). The carrier assembly (40) includes a substrate (17) having a compliant membrane (20b) and a plurality of contact bumps (24) on a top surface of the compliant membrane (20b) for contacting bond pads on the semiconductor device (21) and a force applying mechanism (63). Compliant membrane (20b) is part of a thin film interconnect (20). Contact bumps (24) are connected electrically with conductors (46) by conductive traces (19) and contact pads (18) formed on the thin film interconnect (20). The force applying mechanism (63') applies pressure in making temporary electrical connection between contact bumps (24) and the bond pads of semiconductor device (21).

Abstract: A test clip, or test adapter, is provided for connecting leads of a tester to terminals on a packaged integrated circuit. Spacers on the test clip, which act to precisely separate the contact pins, are formed separately using a stamping process. Spacers may be formed having a thickness which can be controlled to approximately one mil. Each of the individual spacers is sandwiched between two contact pins to provide precise spacing of the contact pins. A bar is inserted through a hole in each of the spacers and contact pins to form a linear array of contact pins and spacers. Two or four (as appropriate) of the linear arrays of contact pins/spacers are then mounted on a test clip body sized for a specific integrated circuit package. Each of the spacers may include an L-shaped extension which is urged under the integrated circuit package when the test clip is pressed onto the package so as to firmly secure the test clip to the package.

Abstract: A burn-in socket is shown including a latch member (60) capable of moving leads (101) of an IC package (100) received on a seat (200) on a base member (20), biasing the leads into engagement with movable contact arms (212) of contacts (21) mounted in the base member. A linking mechanism (50), movable in dependence upon the vertical movement of a cover member (30), transmits the cover member movement to latch member (60). Linking mechanism (50) has an arm (52) pivotably connected at one end to the cover member (30) and at an opposite end to a lever body (54) intermediate opposite ends thereof. The lever body has one end pivotably connected to base member (20) and its opposite end connected to latch member (60). A return spring (40) places a bias on the cover to maintain it normally separated from the base member and provides a selected contact force. The socket can be used with a wide variety of IC package types either before or after leads extending from the IC package have been formed.

Abstract: An interconnect system (8) for providing electrical connection to bond pads on a semiconductor device (21) includes a socket (12) having a plurality of conductors (46) with retractable contact portions (14) and a carrier assembly (40) mounted on the socket (12) for carrying a semiconductor device (21). The carrier assembly (40) includes a substrate (17) having a compliant membrane (20b), a plurality of contact bumps (24) containing oxide-penetrating particles on a top surface of the compliant membrane (20b) for contacting bond pads on the semiconductor device (21), a fence (30) attached to the top surface of the compliant membrane (20b) for positioning the semiconductor device (21) so that the bond pads on the semiconductor device (21) are aligned with the contact bumps (24). Compliant membrane (20b) is part of a thin film interconnect (20). Contact bumps (24) are connected electrically with conductors (46) by conductive traces (19) and contact pads (18) formed on the thin film interconnect (20).

Abstract: An interconnect system (8') for providing electrical connection to bond pads on a semiconductor device (21) includes a socket (12) having a plurality of conductors (46) and a carrier assembly (40) mounted on the socket (12) for carrying a semiconductor device (21). The carrier assembly (40) includes a substrate (17) having a compliant membrane (20b) and a plurality of contact bumps (24) on a top surface of the compliant membrane (20b) for contacting bond pads on the semiconductor device (21) and a force applying mechanism (63). Compliant membrane (20b) is part of a thin film interconnect (20). Contact bumps (24) are connected electrically with conductors (46) by conductive traces (19) and contact pads (18) formed on the thin film interconnect (20). The force applying mechanism (63') applies pressure in making temporary electrical connection between contact bumps (24) and the bond pads of semiconductor device (21).

Abstract: An improved zero insertion force socket suitable for engaging with terminals of an integrated circuit such as a CPU of a personal computer. The terminals are permitted to be inserted into and withdrawn from the socket with very little or even zero insertion and withdrawal force. The socket includes multiple contacts and multiple insertion holes each of which has a relatively wide first insertion space for receiving the contacts and a relatively narrow second insertion space for receiving the terminals. Two locating walls are formed at an adjoining portion between the first and second insertion spaces and the each contact has an elastic engaging portion formed with two stopping portions, whereby when the contact is inserted into the first insertion space, the two stopping portion abut against the two locating walls to bias and pre-load the elastic engaging portion of the contact and accurately locate the same at its true position.

Abstract: Generally U-shaped contact elements (11) mounted in a socket body (2) each has a flexible portion (13), a generally U-shaped bent portion (14) which bends approximately 180.degree. and a contact portion (15). A head (31) which supports an IC package (21) moves toward the main socket body (2) to mount the IC package (21) in socket (1). Immediately before reaching the mounting position of the IC package, an arm (9) of a lever (7), rotatably journaled in the socket body (2), is pushed by head (31) rotating lever (7). Arm (10) of lever (7), sandwiched between the contact flexible portion (13) and the lower end of the contact portion (15), rotates therewith pressing contact portions (15) against leads (26) of the IC package, thereby effecting an electric connection between the two.

Abstract: An interconnect system (8') for providing electrical connection to bond pads on a semiconductor device (21) includes a socket (12) having a plurality of conductors (46) and a carrier assembly (40) mounted on the socket (12) for carrying a semiconductor device (21). The carrier assembly (40) includes a substrate (17) having a compliant membrane (20b) and a plurality of contact bumps (24) on a top surface of the compliant membrane (20b) for contacting bond pads on the semiconductor device (21) and a force applying mechanism (63). Compliant membrane (20b) is part of a thin film interconnect (20). Contact bumps (24) are connected electrically with conductors (46) by conductive traces (19) and contact pads (18) formed on the thin film interconnect (20). The force applying mechanism (63') applies pressure in making temporary electrical connection between contact bumps (24) and the bond pads of semiconductor device (21).

Abstract: To remove a contact condition between a contact and a lead of an IC package, a movable plate is moved forwardly from a control position to a release position by pivoting a crank lever, which includes a crank shaft portion having an eccentric shaft portion, from a starting point to a terminal point. The starting point of the forward pivotal movement of the eccentric shaft portion of the crank shaft portion is set in a third or fourth quadrant of a rectangular coordinate system with its origin at the rotation axis of the crank shaft portion (i.e. the starting point of the central axis of the eccentric shaft portion is disposed below the rotation axis of the crank shaft portion).

Abstract: A socket for carrying an integrated circuit (IC) chip. The socket includes a plurality of opposed contacts which have upper and lower integral beams. The socket also includes a spring-biased movable top with inclined inner side walls to urge the contacts into a latched position with the upper beam contacting a lead or a pod on the IC to establish electrical contact. As the top is pushed down, the resilient nature of the contacts allows the lower beam to ride up the inclined side wall into an unlatched position wherein the IC may be removed from the socket.

Abstract: A socket for testing a plug-in type semiconductor having two rows of flat pins includes an elongated base having two rows of resilient conductive clamps positioned on the base and an elongated cover mounted on the base and having rows of openings correspondingly formed in the cover with respect to the conductive clamps. A push member is movably mounted between the cover and the base. A camming rod member is mounted between the cover and base for actuating the push member to depress the resilient conductive clamps, urging the resilient conductive clamps to contact the flat pins of the semiconductors when the flat pins are plugged into the socket. Each of the resilient conductive clamps has clamping faces parallel to the contacting faces of the flat pins of the semiconductor.

Abstract: A socket-like structure with contact terminals for testing IC pieces is set at a specified position and a vertically movable block is set above this socket-like structure. A frame surrounding this block is provided with a lock screw by which a pin press can be pressed between the block and the frame either tightly or loosely. The pin press has downwardly protruding edges which are patterned according to the pins of the IC pieces to be tested. The pin press is lowered while it is only loosely pressed between the block and the frame and thereby adjusts its position according to the socket-like structure placed below. The lock screw is tightened thereupon to fasten the pin pressed at this adjusted position. With the pin press thus fastened at the adjusted position, IC pieces to be tested are delivered onto the socket-like structure one at a time and the pin press is lowered to thereby correctly press the pins of the IC piece to be tested against the terminals for the testing device.

Abstract: An electrical connector (2) is disclosed which includes an insulating housing (4) which includes a plurality of electrical terminals (100). The connector (2) also includes an actuator (50) which is moveable relative to the housing (4) to open the contact portion (128) for a zero insertion force entry of a stripped conductor of a multiple conductor cable (150). When the actuator is moved vertically downwards, the actuator bottom edge (61) engages an actuator arm (122) which allows the contacts to open and accept the conductor (152).

Abstract: An apparatus for carrying out connection and disconnection of circuit member to an electrical connector has an inner frame for regulating a space for a circuit to be mounted, an outer frame, disposed outside the inner frame, for supporting the inner frame in such a manner as to move the inner frame in a predetermined direction only, a wedge member which is disposed between the outer frame and the inner frame in such a fashion as to be movable in a direction normal to the predetermined direction, and which moves the inner frame in the predetermined direction when the wedge member is moved, and a drive apparatus for externally driving the wedge member.

Abstract: A contact for insertion into a socket of an electric part and for receiving a terminal.

Abstract: For facilitating an electrical connection of a conductive connection pin (7) to a conductive contact (11) held to a base insulator (13), an electrical connector includes a preload pin (23) which is for carrying out beforehand displacement of a contact portion (21) of the conductive contact at a first position. The preload pin is held to a slider (19) which is placed between the base insulator and a cover insulator (17) and which is movable in a predetermined direction. The cover insulator and the slider have guide and elongated holes (15, 25), respectively, for passing the connection pin therethrough. The elongated hole is greater than the connection pin in a size of the predetermined direction. Therefore, it is possible without movement of the connection pin to move the preload pin in the predetermined direction to a second position at which the preload pin does not carry out the displacement of the contact portion.

Abstract: A socket for an electric part comprises a socket body for connecting an electric part, a movable plate having a plurality of terminal insertion holes formed therein and being adapted to move along an upper surface of the socket body, a plurality of contacts in the socket body, and a no-load insertion space formed alongside each contact and adapted to facilitate a no-load insertion of a terminal of the electric part. The terminal of the electric part can be inserted into the no-load insertion space through the terminal insertion hole formed in the movable plate. The terminal can then be brought to a position in which it contacts the contact from the no-load insertion space by causing the movable plate to move laterally in one direction. Likewise, the terminal can be moved into the no-load insertion space from the contacting position by causing lateral movement of the movable plate in the other direction, in order to realize a no-load insertion and withdrawal of the electric part.

Abstract: An IC socket includes a socket body having a plurality of contacts arranged in such a manner as to contact terminal members of an IC package. A contact shutter member is vertically movably mounted on the socket body and adapted, when lowering, to push the contacts against their elastic property so that the contacts will be displaced backward and downward to remove the contact relation.

Abstract: A test clip is provided which has multiple contacts that can engage the leads of a surface mount integrated circuit device whose leads are very closely spaced, while being reliably held down to the circuit device during a test procedure. The test clip has a housing with a recess (72, FIG. 10) that very closely recieves the top of the body of the circuit device (12) to align the clip with the circuit device, the clip being devoid of engagement with the lower part of the device. Instead, the test clip relies solely on frictional engagement of its contacts (24) with the circuit device leads (64) to hold down the test clip. Each contact has a first part (80) that initially lies against a contact-locating outer surface (82) of the housing. Each contact also has a second part (84) that extends below the contact-locating outer surface and that is positioned to be outwardly deflected slightly as it wipes across a circuit device lead, as the test clip is moved directly downwardly against the circuit device.

Abstract: A controlled impedance testsite for the testing of integrated circuits, including matched impedance cables. Decoupling capacitors are used in the matched impedance cables in test situations where high frequency decoupling is required. The testsite includes a socket style ejector and a spring return. The contacts are a flat wire style affixed to the flexible Kapton matched impedance cables. A contact board and BUS board are positioned for decoupling purposes at one end of each cable adjacent to the contact area of the testsite and the integrated circuit to be tested. A hard PWB with connection pins affixed is used as a termination contact point, and is positioned at the opposing end of each flexible cable.

Abstract: A contact leaf bank for an electrical contactor preferably etched from a single uniform sheet of resiliently flexible, electrically conductive material comprises a ground sheet defining a plurality of uniformly-spaced, elongated, parallel slots in which are singularly disposed a plurality of resiliently flexible, elongated leaves each having and end portion adapted to be a contact finger, the tip of each contact finger preferably being rhodium-plated for hardness.

Abstract: A contactor assembly for testing electronic devices that are packaged with a dual-in-line pin array has an insulating base that mounts two rows of contacts, each adapted to flex into electrical connection with a pin of the device, and a pair of flexible ground planes each spaced closely from an associated one row of said contacts. A flexible, insulating spacer maintains the ground planes and their associated row of contacts with a substantially fixed spacing there between during the flexural movement of said contacts. In the preferred form, the upper edge of the ground planes adjacent the pins includes an arrangement for securing a chip electronic device, a capacitor or a resistor. The other end of the chip mounts a contact tip that makes electrical connection with an associated pin when the associated contact also connects with the pin. The signal path provided by the holder, chip and tip is extremely short, preferably less than 0.150 inch.

Abstract: An environmentally sealed chip carrier housing for mounting on a printed circuit board. The housing is formed of a dielectric material and comprises a base and an upstanding circular side wall, one surface of which is threadably configured for receipt of a cover member. The base is further provided with plural slots for receiving a like plurality of elongated elastomeric compressive type connectors, and support means for receiving a chip carrier thereon. A cover member is provided for threadably engaging the housing. The cover member is characterized by a top having a peripheral wall thereabout, where the top has a uniformly convex configuration such that the center portion is thicker than the outer portions thereof.

Abstract: An IC tester socket comprises a spring for keeping the socket body and the spacer frame in their state of being spaced apart from each other with a predetermined interval; and contacting pins each having a spring portion shaped in a pair of arcuate forms, in order to ensure the contact between the lead terminals of an IC requiring testing and the contacting pins to be realized positively and stably and to make it possible for the socket to stand its use for a prolonged period of time. The arm of each contacting pin which is brought into contact with the side face to its mating lead terminal of the IC is adapted to contact the side face of the lead terminal, and is so shaped as to be able to lock the IC package at the position of contact of this arm.

Abstract: An IC socket has an IC supporting means which can be moved between an upper and a lower positions with an IC mounted on it, a first spring means for energizing the IC supporting means so that the IC supporting means is pushed up to the upper position, a contact for contacting with a lead of the IC when the IC supporting means is moved to the lower position against the force of the first spring means, an IC vertical movement operating means which can be moved between the upper and lower positions and adapted to push down the IC supporting means against the first spring means, a second spring means for energizing the IC vertical movement operating means so as to push up the same to the upper position, and a lock means for retaining the IC supporting means to the lower position against the force of the first spring means by the vertical movement operation of the IC vertical movement operating means against the force of the second spring means or in accordance with the force of the second spring so that the IC is

Abstract: A contact leaf bank for an electrical contactor preferably etched from a single uniform sheet of resiliently flexible, electrically conductive material comprises a ground sheet defining a plurality of uniformly-spaced, elongated, parallel slots in which are singularly disposed a plurality of resiliently flexible, elongated leaves each having and end portion adapted to be a contact finger, the tip of each contact finger preferably being rhodium-plated for hardness.

Abstract: A socket is described having not only contactors secured to the socket body and electrically connected in an elastically pressed condition of these contactors to a given electrical part mounted but a slide cover slidably fitted to the socket body wherein tapered surfaces are formed in sliding contact areas of such contactors to the slide cover in such a manner that as the slide cover slides a force may be generated to elastically deform and release these contactors from electrical connection to such electrical part.

Abstract: An IC tester socket comprises a spring for keeping the socket body and the spacer frame in their state of being spaced apart from each other with a predetermined interval; and contacting pins each having a spring portion shaped in a pair of arcuate forms, in order to ensure the contact between the lead terminals of an IC requiring testing and the contacting pins to be realized positively and stably and to make it possible for the socket to stand its use for a prolonged period of time. The arm of each contacting pin which is brought into contact with the side face to its mating lead terminal of the IC is adapted to contact the side face of the lead terminal, and is so shaped as to be able to lock the IC package at the position of contact of this arm.

Abstract: A test adapter is provided for connection to a SOIC (small outline integrated circuit) carrier which can be locked to the carrier during test, has a relatively low profile thereby increasing the adapter's stability, and is very simple in construction. The adapter includes a one piece integral frame having two slots in which a pair of contact housings are mounted. The sidewalls of the frame running along the slots are resilient so that they will deform when the contact housings are mounted into the slots. A cam device is mounted on the housings above the frame. When the cam device is actuated, it pivots the housings to bring the contacts thereon into firm engagement with the leads of the carrier.

Abstract: There is disclosed a socket for an IC package in which many IC lead wires project from the IC package and are arranged in vertical rows Y and lateral rows X, and the respective IC lead wires are arranged at equal pitches on the vertical rows Y and the lateral rows X. The socket, has a base plate having contacts and an IC mounting cover for moving the IC package between a contact engaging position and a release position. The cover is cross movably overlapped on the base plate. The IC mounting cover has many IC insertion holes arranged in a lattice shape. The respective rows X and Y of the IC lead wire insertion hole groups are inclined at the same angles with respect to respective sides of the cover. The diagonal lines W of the lattice shaped arrangement are arranged in parallel with two sets of opposite sides of the cover respectively. The repective rows X and Y of the contact groups are inclined at same angles with respect to the respective sides of the socket base plate.

Abstract: A connector with a base having a plurality of contacts that are operable and which can be closed, with opposing sides resiliently forced against device terminals which force can be supplemented by further force provided by an actuator.

Abstract: A test adapter is provided for connection to a PLCC (Plastic Leaded Clip Carrier), hereinafter referred to as a carrier, which assures accurate alignment with the carrier, which can be locked to the carrier during a test, which has a width only slightly greater than that of the carrier to enable testing of closely mounted carriers, and which can be simply constructed. The adapter includes an inner housing that bears against the top of the carrier and four contact frames pivotally mounted on the housing and carrying contacts that engage leads of the carrier. Each contact frame has separators between the contacts, the separators passing between the leads of the carrier to directly engage the sides of the carrier housing. The lower surface portions of the separators are slightly angled from the vertical so when they press against angled surfaces on the carrier housing sides, the adapter is locked to the carrier.

Abstract: A plug connector (2) for an IC module (30) comprises clamping means (6), which act like a toggle joint and are adapted to clamp contact tabs (28) of the IC module (30) in a connector body (4). To define the depth to which the IC module (30) can be inserted and to position the IC module in parallel alignment with the connector body (4), backing elements (36, 46, 48, 50, 52) are provided and the clamping means (6) are so designed adjacent to their pivotal connection (20) that a plane (64) which is parallel to the connector body (4) is defined by at least two edges. Besides, the pivotal connection between the two clamping plates which constitute the clamping means consists of a positive hinge.

Abstract: Chip carrier connector comprises a housing having a base and walls extending normally therefrom. The housing is movable relative to terminals between a first position and a second position. When the housing is moved to the second position, the terminals are moved inwardly thereby pressing the contact portions of the terminals against contact pads on the chip carrier. As this occurs, the terminals provide a wiping action on the contact pad to ensure that positive electrical contact is effected. The housing may also cam the terminals outwardly to permit placement of the chip carrier in the recess under zero insertion force conditions.

Abstract: Testsite system for use in an integrated circuit handler, the testsite system for testing plastic leaded chip carriers (PLCC), leadless chip carriers (LCC) and other IC packages. The testsite system utilizes a pocket in a socket which is moveable in a frame between a insert position for the IC and a test position for the IC. The testsite includes an ejector which operates against a first spring constant and a moveable pocket assembly which operates against a second spring constant. The moveable pocket in the socket provides for alignment between the IC package and the contact wires insuring positive electrical integrity. The spring action provides for ejection of an IC after test from the pocket by a spring actuated ejector, as well as the socket assembly returning to a home position while carrying the ejector and IC at the same time through the second spring action.