Movement-actuating Or Retaining Means Comprises Cover Press Patents (Class 439/331)
  • Patent number: 10466273
    Abstract: Disclosed is a socket device for testing an IC, the socket device including: a base on which an integrated circuit (IC) is mounted; a contact module having multiple contacts; a floating hinge block elastically supported on a side of the base in a vertical direction; a lid configured to rotate with the floating hinge block and having a pressing portion on a bottom surface thereof; a floating latch elastically supported on a side of the base to be parallel to the floating hinge block such that the lid is fixed; a first camshaft installed by penetrating the base and the floating hinge block and adjusting a height of the floating hinge block; a second camshaft installed by penetrating the base and the floating latch and adjusting a height of the floating latch; a lever; a handle; and a link connected to the lever and the handle respectively to rotate independently.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: November 5, 2019
    Inventors: Dong Weon Hwang, Logan Jae Hwang, Jae Baek Hwang
  • Patent number: 10382659
    Abstract: A surveillance camera system includes a camera portion; a base portion supporting the camera portion to be rotatable, and including a main circuit board; a flexible printed circuit board (FPCB) connecting the camera portion to the main circuit board, and including a first end portion connected to the camera portion, a second end portion connected to the main circuit board, and a conductive line extension portion disposed between the first end portion and the second end portion, wherein a plurality of slits are arranged in the conductive line extension portion; and a first binding member and a second binding member respectively surrounding a part of the conductive line extension portion and being spaced apart from each other.
    Type: Grant
    Filed: May 12, 2017
    Date of Patent: August 13, 2019
    Assignee: HANWHA TECHWIN CO., LTD.
    Inventors: Youn Sik Choi, Chang Bok Lee, Mee Jee Jeong
  • Patent number: 10320103
    Abstract: An electrical connector includes a body, having a bottom wall and first and second side walls extending upward from the bottom wall. The bottom wall is provided with an accommodating hole, and a first supporting portion extending upward from the bottom wall to support a chip module. Multiple terminals are correspondingly accommodated in the body. One of the terminals is accommodated in the accommodating hole. A first protruding block and a second protruding block are respectively connected to the first and second side walls and extend toward each other, and each has an arc-shaped surface. The first supporting portion is connected to the first protruding block. The first supporting portion and the accommodating hole are located at two opposite sides of the first protruding block. An extending line of the second protruding block in an extending direction thereof passes above the accommodating hole.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: June 11, 2019
    Assignee: LOTES CO., LTD
    Inventor: Xiao Guang Gui
  • Patent number: 10281489
    Abstract: For electrically connecting an integrated circuit under test to a test circuit board, a test signals conduction device includes a contact member and a spring member. The contact member has a main portion, a contact portion and an extension portion. When the contact portion is pressed by the integrated circuit, the contact portion and the extension portion rotate about the main portion in a first direction, thereby causing the spring member to deform and switch to an energy storing state from a normal state. When the integrated circuit board is moved away from the contact portion, the spring member returns from the energy storing state to the normal state and causes the extension portion and the contact portion to rotate in a second direction.
    Type: Grant
    Filed: January 4, 2018
    Date of Patent: May 7, 2019
    Assignee: WINWAY TECHNOLOGY CO., LTD.
    Inventors: Chyi-Lang Lai, Hong-Chi Hung
  • Patent number: 10236606
    Abstract: An electrical connector assembly for connecting a CPU to a printed circuit board, includes an insulative housing, a fixing device and a retainer. The fixing device is located by one end side, and the retainer is used to load the CPU into the housing. The fixing device includes a stationary part and a moveable insertion part wherein the retainer with the CPU therein is retained to the insertion part to commonly rotate about the stationary part for positioning the retainer with the CPU therein within the housing.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: March 19, 2019
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventor: Fang-Jwu Liao
  • Patent number: 10212831
    Abstract: An electronic control unit having a housing containing a circuit board. The housing includes a base and a cover between which the circuit board is located, and the unit being characterized in that the base and the cover are connected to one another via interference fit interengagement around at least a major part of a peripheral edge of the cover.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: February 19, 2019
    Assignee: VEONEER SWEDEN AB
    Inventors: Norbert Karszt, Sebastian Hetzel
  • Patent number: 10163742
    Abstract: A method of forming a custom module lid. The method may include placing a multichip module (MCM) between a module base and a temporary lid, target components are exposed through viewing windows in the temporary lid, a top surface of the target components is measured and mapped to create a target profile, the target profile is used to form custom pockets in a custom lid, and the custom pockets correspond to the target components.
    Type: Grant
    Filed: August 25, 2015
    Date of Patent: December 25, 2018
    Assignee: International Business Machines Corporation
    Inventors: Amilcar R. Arvelo, Michael J. Ellsworth, Eric J. McKeever, Thong N. Nguyen, Edward J. Seminaro
  • Patent number: 10103463
    Abstract: An atomtronic (e.g., ultra-cold-matter physics or ion-trap) system includes a vacuum-cell structure, an integrated-circuit package with a pin-grid array, and a socket for interfacing the integrated-circuit package with external control and monitoring systems. After pins of the pin-grid array are inserted into holes of plates in the socket, the plates are moved in opposite directions so that contacts within the holes clamp in place the pins, providing electrical connections. The in-place clamping avoids stress at the seal between the integrated circuit package and the vacuum cell structure; thus, stress that could otherwise compromise the vacuum seal is avoided so as to yield a more reliable vacuum.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: October 16, 2018
    Assignee: ColdQuanta, Inc.
    Inventor: Steven Michael Hughes
  • Patent number: 10062994
    Abstract: An electrical connector used for bearing a chip module includes an insulating body, terminals arranged in the insulating body, a carrying member, for carrying the chip module to the insulating body, disposed at one side of the insulating body and contacting with the terminals, a pressing plate for pressing the carrying member or the chip module, and an elastic member having at least two limiting portions. The pressing plate and the carrying member are separately disposed at two adjacent sides on the periphery of the insulating body. The two limiting portions define a pivoting space, and the carrying member is pivotally connected to the pivoting space. The elastic member and the carrying member are disposed at the same side of the insulating body, the elastic member has a buffer portion, and the buffer portion abuts against the carrying member and is disposed between the insulating body and the carrying member.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: August 28, 2018
    Assignee: LOTES CO., LTD
    Inventors: Jian Min Peng, Ming Jui Tsai
  • Patent number: 10038258
    Abstract: A pressing member is used for downwardly pressing on a chip module. The pressing member has a main body and a central opening going through the main body. The main body has an upper surface and a lower surface opposite to the upper surface. The central opening is provided for a part portion of the chip module going through. The pressing member has a pressing portion protrudes upwardly from the upper surface and provided for an external device pressing downwardly on to make the main body press downwardly on the chip module so as to prevent the chip module from warping.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: July 31, 2018
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Qin-Yao Xiao, Heng-Kang Wu, Fu-Jin Peng, Tzu-Li Chu
  • Patent number: 10028411
    Abstract: An electronic controller having a housing, and a lower sub-assembly connected to a housing through the use of a laser weld, eliminating the use of a gasket and fasteners. The laser weld provides a sealed connection between the housing and the lower sub-assembly, preventing debris, moisture, oils, ATF, and chemicals from entering the housing, which protects the electrical components located inside the housing. The elimination of the gasket and fasteners also reduces the cost of the electronic controller. Depending upon the application, the electrical components may be mounted directly to the lower sub-assembly, or the electrical components may be mounted on a metal core. The metal core is used to provide heat dissipation and function as an electrical conductor. The lower sub-assembly may either be overmolded around the metal core, or the metal core may be attached to the lower sub-assembly after the lower sub-assembly has been formed.
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: July 17, 2018
    Assignee: Continental Automotive Systems, Inc.
    Inventors: Anthony J Polak, Jared Yagoda, Gerry Bianco
  • Patent number: 9989832
    Abstract: An optical unit may include a movable module holding an optical element having an optical axis; a fixed body comprising; a support mechanism swingably supporting the movable module; a drive mechanism structured to swing the movable module; and a flexible circuit board connected with the movable module and fixed body. The flexible circuit board may include a leading-out part extending from the movable module on a first side of the optical axis; a first extended part extending from the leading-out part to a second side of the optical axis; a first curved part which is curved from a tip end side of the first extended part toward a rear side; a second extended part extending from the first curved part toward the first side; and a fixed part of the second extended part connected with the fixed body on the first side of optical axis.
    Type: Grant
    Filed: September 5, 2014
    Date of Patent: June 5, 2018
    Assignee: NIDEC SANKYO CORPORATION
    Inventors: Shinji Minamisawa, Toshiyuki Karasawa, Shinroku Asakawa, Yoshihiro Hamada, Takeshi Sue
  • Patent number: 9960513
    Abstract: An electrical connector used for carrying a chip module includes an insulating body having terminals arranged in the insulating body and used for contacting the chip module, a carrying member used for carrying the chip module to the insulating body, a pressing plate used for pressing the carrying member or the chip module, and a positioning member pivoted to the carrying member through a pivoting device. The pivoting device includes a pivoting shaft and at least one elastic portion. The elastic portion includes a first elastic section and at least two limiting portions being elastic and enclosing a pivoting space. The pivoting shaft is pivoted to the pivoting space. When the electrical connector is opened, the first elastic section springs back to remove the chip module from the insulating body without damaging the terminals, so as to align and contact the chip module with the terminals without tool.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: May 1, 2018
    Assignee: LOTES CO., LTD
    Inventors: Jian Min Peng, Ming Jui Tsai
  • Patent number: 9917383
    Abstract: Examples herein relate to printed circuit assemblies (PCA's). In one example, a PCA comprises a printed circuit board (PCB) having an elongated cut-out, the cut-out defining a first and a second opposite elongated edges on the PCB, a movable bracket having a standoff established on a surface of the movable bracket, the movable bracket connecting to the first and the second opposite elongated edges and a platform connector established on the PCB.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: March 13, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventor: Jui Lin Chen
  • Patent number: 9871332
    Abstract: An electrical connector connecting with a chip module includes a base with a receiving space and a cover covering on the base. The cover includes a first edge, a second edge, a third edge and a fourth edge. The four edges connect with each other to form four engaging portions, and a rectangular opening surrounded therein. The first edge is pivotally connected to the base. The cover includes an extending portion extending from the second edge. The cover includes four pressing portions located at four inner corners of the cover.
    Type: Grant
    Filed: May 8, 2017
    Date of Patent: January 16, 2018
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventor: Fang-Jwu Liao
  • Patent number: 9853380
    Abstract: An IC socket includes: a socket main body having an accommodating part for accommodating an IC package; a socket cover having a one-side end portion pivotally supported by the socket main body, and the other-side end portion which is located opposite to the one-side end portion and lockable to the socket main body; and a heat dissipating member mounted on the socket cover and caused to press the IC package. The socket cover includes a metal plate extending from the one-side end portion to the other-side end portion so that the thickness direction of the metal plate is parallel to the direction in which the socket cover faces the accommodating part when the other-side end portion is locked to the socket main body. The metal plate has a depression formed by bending the metal plate.
    Type: Grant
    Filed: December 24, 2014
    Date of Patent: December 26, 2017
    Assignee: ENPLAS CORPORATION
    Inventor: Keiichi Narumi
  • Patent number: 9818667
    Abstract: A package for a multi-chip module includes a top cold plate and a bottom plate whose perimeters are in thermal communication so the plates together completely encase the module except for a connector passing through the bottom plate. The cold plate has copper tubing pressed into a groove formed in a serpentine pattern. The perimeter of the cold plate has thermal conduction fins which mate with thermal conduction slots in the perimeter of the bottom plate. Thermal interface material is disposed in gaps between the plates and chips on the module, the gaps having dimensions controlled by support ribs of plates which abut the module substrate. The cold plate is used on the hottest side of the module, e.g., the side having computationally-intensive chips such as ASICs. A densely packed array of these packages can be used in a central electronic complex drawer with a shared coolant circulation system.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: November 14, 2017
    Assignee: International Business Machines Corporation
    Inventors: Amilcar R. Arvelo, Michael J. Ellsworth, Eric J. McKeever, Thong N. Nguyen, Edward J. Seminaro
  • Patent number: 9781821
    Abstract: A thermoelectric cooling module includes a first circuit board, a second circuit board, first conducting members, second conducting members and TED chips. The first circuit board includes first circuit regions, each having a first conducting layer and first penetrating holes; the second circuit board includes second circuit regions, each having a second conducting layer and second penetrating holes; each first conducting member is passed and fixed into each respective first penetrating hole; each second conducting member is passed and fixed into each respective second penetrating hole; each TED chip is clamped between the first circuit board and the second circuit board, and each first conducting member has an end attached to the TED chip and the other end attached to the first conducting layer, and each second conducting member has an end attached to the TED chip and the other end attached to the second conducting layer.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: October 3, 2017
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Lee-Lung Chen, Ching-Shun Wang, Jin-Hong Cai
  • Patent number: 9755387
    Abstract: A socket for electrical component capable of pressing and fixing an electrical component. A pressing part includes a first cam rotatably supported by the body part, and a second cam supported by the first cam. An elevating part includes a cam locking part provided on a rotational orbit of the second cam. A tip of the second cam is formed such that the tip of the second cam passes over the cam locking part when the elevating part is moved down by making the tip of the second cam abut against the elevating part and rotate, and the tip of the second cam is locked by the cam locking part so as to prevent the rotation when an attempt is made to perform the rotation in the opposite direction. The rotation in the opposite direction is enabled by moving the second cam in the radial direction of the rotation.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: September 5, 2017
    Assignee: ENPLAS CORPORATION
    Inventor: Osamu Hachuda
  • Patent number: 9697386
    Abstract: An electrical connector for electrically connecting to a chip module. The chip module includes a base plate and a protruding portion projecting upward from the base plate. The electrical connector includes a socket for bearing the chip module, a fixing plate located above the base plate, and a load plate covering the chip module and the fixing plate. The load plate is provided with a first urging portion directly pressing the protruding portion downward, and a second urging portion pressing against the fixing plate downward, so that the fixing plate presses the base plate downward, thereby pressing the chip module downward and electrically connecting the chip module to the socket.
    Type: Grant
    Filed: March 14, 2016
    Date of Patent: July 4, 2017
    Assignee: LOTES CO., LTD.
    Inventor: Yu Sheng Chen
  • Patent number: 9625522
    Abstract: An adaptor structure includes a main adaptor, a first sub-adaptor, a second sub-adaptor and a first driving mechanism. The main adaptor is over a socket. The main adaptor has an opening. The first sub-adaptor is movably received in the opening of the main adaptor in a first direction. The first sub-adaptor is configured to support a first side surface of the semiconductor package. The second sub-adaptor is movably received in the opening of the main adaptor in the first direction and a second direction. The second sub-adaptor faces the first sub-adaptor to support a second side surface of the semiconductor package. The first driving mechanism is configured to move the second sub-adaptor in the second direction. Thus, the adaptor structure can guide the semiconductor packages having different sizes to the socket.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: April 18, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun-Guen Iy, Bo-Seong Park
  • Patent number: 9578775
    Abstract: A land grid array (LGA) socket apparatus includes an LGA socket, with two guide rails provided respectively on the inner sides of two opposite side walls of the socket. The height of the top surface of each guide rail from the socket's bottom is greater than the height of socket terminals from the socket's bottom. The length of each guide rail is smaller than the length of the sidewall's inner side. The guide rails support at least two protrusions provided at corners at opposite sides of an integrated circuit chip assembly when the assembly is slid into the socket from a side. The guide rails, when the assembly is slid to the end of the guide rail, enable the at least two protrusions to fall into the gaps between the ends of the guide rail and the respective socket end walls to install the assembly in the socket.
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: February 21, 2017
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Sen Xiong Huang, Yun Liang, Yuan Lin
  • Patent number: 9509073
    Abstract: An electrical connector assembly comprises a first connector, and a second connector mounted onto the first connector, a frame surrounding the connectors, a locking member, and a lever assemble the locking member to the frame. The locking member has a main body pivoting to the frame, a supporting portion being seated by the lever and a pushing portion. The main body locks the second connector, a user can press the lever to make the locking member to rotate, then to release the second connector, and upwardly push the second connector to apart the second connector from the first connector.
    Type: Grant
    Filed: May 28, 2015
    Date of Patent: November 29, 2016
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventor: Shuo-Hsiu Hsu
  • Patent number: 9476910
    Abstract: The present invention provides a test socket adaptable for testing different Integrated Circuit (IC) pad size during an IC testing. The test socket comprising a molded socket having an inner space and a plurality of through-apertures disposed on its surface; and a plurality of contact elements disposed within the inner space of the molded socket, each contact element has a pin contact edge and a pin-end; wherein each pin contact edge extends through the through-apertures of the molded socket; wherein each pin contact edge provides a linear surface area for contact with the DUT's lead; and wherein each pin contact edge provides a large contact area for various DUT's lead size.
    Type: Grant
    Filed: November 19, 2012
    Date of Patent: October 25, 2016
    Assignee: Test Max Manufacturing Pte Ltd
    Inventors: Hui Li Natali Tan, Hui Shan Melisa Tan
  • Patent number: 9470530
    Abstract: An electronic device comprises a circuit substrate (5), and a moulded interconnect device (4) incorporating integral legs (8) to mount the interconnect device upon the substrate, the legs spacing at least one of the legs carrying a conducting track (20, 21, 22) to provide an electrical interconnection between the interconnect device and the substrate. The substrate (5) may comprise another moulded interconnect device and may be mounted upon a processor (3) and may include an electromagnetic shield (30) on its lower surface.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: October 18, 2016
    Assignee: ATLANTIC INERTIAL SYSTEMS LIMITED
    Inventor: Henry Thomas
  • Patent number: 9466900
    Abstract: Various apparatus and methods of electrically connecting a packaged integrated circuit to a circuit board are disclosed. In one aspect, an apparatus includes a first frame to be mounted on the circuit board and having a first end. An insulating housing is adapted to be mounted on the circuit board and positioned in the first frame. A second frame is pivotally coupled to the first frame. The second frame includes two spaced-apart rail members and a cross member coupled to and between the rail members opposite the first end of the second frame. The rail members are operable to receive the packaged integrated circuit. The second frame has at least one engagement member to engage a first portion of the insulating housing when the second frame is pivoted toward the insulating housing. A third frame is pivotally coupled to the first frame to apply force to the packaged integrated circuit.
    Type: Grant
    Filed: October 7, 2015
    Date of Patent: October 11, 2016
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Stephen F. Heng, Mahesh S. Hardikar, Sanjay Dandia
  • Patent number: 9459288
    Abstract: A test interposer includes an interposer layer configured to receive a test socket, and a stiffening layer attached to the interposer layer so that the interposer layer is kept in an unalterable shape.
    Type: Grant
    Filed: January 16, 2014
    Date of Patent: October 4, 2016
    Assignee: Infineon Technologies AG
    Inventor: Rianda Rizza
  • Patent number: 9276386
    Abstract: A lead frame assembly having a lead frame made of a single layer, a housing substantially surrounding the lead frame, and a plurality of leads formed as part of the lead frame. The lead frame assembly also includes a plurality of interfaces, allowing various devices to interact with the lead frame, such as sensors, thermistors, solenoids, engine controllers, or electronic control units, or the like. The interfaces may be formed as part of the lead frame, oriented in different directions, and may be located in different planes, making the lead frame assembly suitable for applications with different packaging requirements. The interfaces may be a plurality of connectors, where one of the connectors has multiple rows of pins which are in communication with the rest of the connectors, facilitating the communication between the connector and various devices.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: March 1, 2016
    Assignee: Continental Automotive Systems, Inc.
    Inventors: Donald J Zito, Valentin M Stefaniu, Gabriel Tirlea
  • Patent number: 9257802
    Abstract: An electrical connector includes a base with a number of contacts, a cover pivotally mounted to the base, a pair of supporting components for mating with the cover and a pair of rail brackets for mating with the base. Each supporting component is pivotal between an opening status and a closed status relative to the base. The base is slidable relative to the rail brackets along a front-to-back direction. The cover and the pair of supporting components are mateable with each other in condition that one of the cover and the pair of supporting components pivots clockwise while a remaining one of the cover and the pair of supporting components pivots anticlockwise.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: February 9, 2016
    Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.
    Inventors: Wang-I Yu, Siu-Mien Yang
  • Patent number: 9250263
    Abstract: A socket is electrically connected to a test carrier. The test carrier includes a film-shaped first member on which at least one internal terminal, which contacts at least one electrode of an electronic device, is provided; and at least one external terminal which is electrically connected to the internal terminal. The socket includes: at least one contactor which contacts the external terminal; and a first pusher which pushes a portion of the first member where the internal terminal is provided and a portion of the first member surrounding the internal terminal. The first pusher includes: a bag member which has a sealed space within the bag member; and a fluid which is housed in the sealed space.
    Type: Grant
    Filed: February 10, 2015
    Date of Patent: February 2, 2016
    Assignee: ADVANTEST CORPORATION
    Inventors: Kiyoto Nakamura, Takashi Fujisaki
  • Patent number: 9245818
    Abstract: In one embodiment, a biasing device is actuated using an actuator which is aligned with the biasing device along an alignment axis. A first frame is thereby biased toward a second frame along the alignment axis to bias an integrated circuit package toward a socket. The actuator also latches the first and second frames together and biased towards each other with the integrated circuit package and the socket biased toward each other. Other aspects and features are also described.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: January 26, 2016
    Assignee: INTEL CORPORATION
    Inventors: Thomas A. Boyd, Michael Z. Eckblad
  • Patent number: 9231318
    Abstract: A holding member and system including a first holding member and a second holding member, wherein each of the first holding member and the second holding member are coupled to opposite sides of a load plate of a socket. A holding member includes a body including a pair of arms extending from a first side of the body and spaced to accommodate a portion of an integrated circuit chip package therebetween and at least one clip extending from a second side opposite the first side. Also, a method including coupling an integrated circuit chip package to a first holding member and a second holding member, wherein the first holding member is coupled to a first side of a load plate of a socket and the second holding member is coupled to a second side of the load plate; and inserting the package into a socket of a printed circuit board.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: January 5, 2016
    Assignee: Intel Corporation
    Inventors: Tao Liu, Tejinder Pal S. Aulakh
  • Patent number: 9214754
    Abstract: A holding device for an electrical connector, includes a frame with an opening defined on a center thereof. A first locking portion is disposed on the frame and extends into the opening. A second locking portion has a main body with an elastic arm. The main body defines a fixed end fixed to the frame and an active end rotating around the fixed end. The second locking portion has an open position that the active end can move freely and a closed position that the active end locks to the frame while the elastic arm extends into the opening.
    Type: Grant
    Filed: January 22, 2014
    Date of Patent: December 15, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Cheng-Chi Yeh, Chih-Kai Yang
  • Patent number: 9213375
    Abstract: An enclosure assembly and systems and methods for using the same are disclosed. The enclosure assembly may include a base plate, a plurality of sidewalls, and one or more insulator layers disposed on the sidewalls. When coupled to a module, the enclosure assembly may least partially enclose the module to prevent the spread of EMI, to assist in heat dissipation, to protect the structural integrity of the module, and the like.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: December 15, 2015
    Assignee: Apple Inc.
    Inventors: Shashikant G. Hegde, Ashutosh Y. Shukla, Kenta K. Williams
  • Patent number: 9054473
    Abstract: A component loading system includes a board having a socket. A first base member is secured to the board through a plurality of first heat dissipater coupling posts. A first securing member is moveably coupled to the first base member. A second base member is secured to the board through a plurality of second heat dissipater coupling posts. A second securing member is moveably coupled to the second base member. A loading member is moveably coupled to the first base member. A heat dissipater is operable to be coupled to the plurality of first heat dissipater coupling posts and the plurality of second heat dissipater coupling posts. The loading member is operable to be secured to the board by moving the first securing member into engagement with the second base member and moving the second securing member into engagement with the first base member.
    Type: Grant
    Filed: September 20, 2012
    Date of Patent: June 9, 2015
    Assignee: Dell Products L.P.
    Inventor: Lawrence Alan Kyle
  • Patent number: 9011170
    Abstract: A method and apparatus for mounting a semiconductor is disclosed. First, the semiconductor is mounted into the bracket of a lid while the lid is detached from a frame. Once the semiconductor has been loaded into the lid/bracket assembly, the loaded lid is mounted onto the frame. The lid is then locked in place on the frame by rotating a locking lever into a closed locked position.
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: April 21, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Keith A. Sauer, Kelly K Smith, Robert J. Hastings, Chong Sin Tan
  • Patent number: 8992246
    Abstract: A circuit board connector and a method for connecting circuit board. The circuit board connector includes: a housing, including a left side wall and right side wall opposite each other and a bottom wall arranged between the left and right side walls, the bottom wall provided with a plurality of contact pins, and the left and right side walls and the bottom wall forming an accommodation space for accommodating the circuit board; a cover, one end being connected to the housing, so that the cover may be opened or closed relative to the housing; and a locking device arranged on the housing and cover to lock the cover when the cover is closed. Reliable connection of the circuit board can be realized, without a gasket or a film, and also the circuit board can be locked firmly, preventing the rebounding of the hinge of the connector.
    Type: Grant
    Filed: July 11, 2012
    Date of Patent: March 31, 2015
    Assignees: Sony Corporation, Sony Mobile Communications AB
    Inventors: Xiyong Tian, Lingchang Li, Yinong Liu
  • Patent number: 8979566
    Abstract: An electrical connector (100) for electrically connecting an IC package with a substrate and includes an insulative housing (1) with a plurality of contacts (10) received therein, a stiffener (3) located outside of the insulative housing (1) and includes a front end (20) and a rear end (21) opposite to the front end (20), a holding member (61) pivotally assembled to the front end (20) of the stiffener (2), a carrier (8) assembled to the holding member (61) for holding the IC package (9), a load plate (3) pivotally assembled to the rear end (21) of the stiffener (2) and includes an opening (310) to permit the exposing of the IC package (9), the load plate (3) presses on the holding member (61).
    Type: Grant
    Filed: March 29, 2013
    Date of Patent: March 17, 2015
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Cheng-Chi Yeh
  • Patent number: 8979565
    Abstract: An electrical connector for electrically connecting an IC package with a substrate and includes an insulative housing with a plurality of contacts received therein, a stiffener located outside of the insulative housing, a holding member and a load plate pivotally assembled to the stiffener, the stiffener includes a first end and a second end opposite to the first end, the holding member is pivotally assembled to the first end of the stiffener for holding and assembling the IC package to the insulative housing, the load plate is configured to frame shape and is pivotally assembled to the second end of the stiffener.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: March 17, 2015
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Cheng-Chi Yeh
  • Patent number: 8961212
    Abstract: A burn-in socket for an IC package includes a base loaded with several terminals, a sliding plate, an actuator and a pair of locking elements. The sliding plate is assembled on the base and defines an upper surface. The actuator is mounted on the base and defines a receiving opening facing the upper surface. The locking elements is assembled on the actuator under a condition that the locking elements rotate inwards to press against the IC package and outwards to release the IC package when the actuator is push downwards in a vertical direction. Each locking element includes a rotating element and a pressing element. The rotating elements rotate in relative to the actuator and the pressing element rotates in relative to the rotating element. The pressing element defines a sliding slot and the rotating element defines a sliding post slidably receiving in the sliding slot.
    Type: Grant
    Filed: March 22, 2013
    Date of Patent: February 24, 2015
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Wei-Chih Lin, Hsiu-Yuan Hsu, Ming-Lun Szu
  • Patent number: 8939784
    Abstract: A semiconductor chip package test socket may include a socket housing; a plurality of probe needles in the socket housing; a conductive pad on the probe needles; a floating guide configured to cover an edge of the conductive pad and configured to provide a semiconductor chip package on the conductive pad; and/or clamps fixed at the socket housing. The clamps may combine the floating guide with the socket housing.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: January 27, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sangki Lee, Insik Kim, Teaseog Um, Suklae Kim, Yoonoh Han
  • Patent number: 8934253
    Abstract: A fiber panel system includes a chassis including a backplane; and at least a first blade configured to mount to the chassis. The first blade is moveable relative to the chassis between a refracted (closed) position and at least one extended position. The first blade includes a coupler arrangement for connecting together media segments. Each blade includes a blade processor and a plurality of smart couplers. A chassis processor is electrically coupled to a processor port of the chassis backplane.
    Type: Grant
    Filed: February 11, 2011
    Date of Patent: January 13, 2015
    Assignee: ADC Telecommunications, Inc.
    Inventors: Chad Anderson, Joseph C. Coffey, Ryan Kostecka, David Stone, Michael Wentworth
  • Patent number: 8905775
    Abstract: An retaining device of an electrical connector assembly for use with a heat dissipating device, includes a first retainer, a fixing lever, and a second retainer. The fixing lever has one end pivotally mounted to the first retainer and another end capable of locked by the first retainer. The second retainer is integral formed with an elastic plate. The first retainer and the second retainer are two separated members, and the fixing lever and the elastic plate are used for pressing two opposite ends of the heat dissipating device.
    Type: Grant
    Filed: October 22, 2012
    Date of Patent: December 9, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Cheng-Chi Yeh
  • Patent number: 8905765
    Abstract: An electrical connector for use with an electronic package, includes a base having two posts. A plurality of contacts is received in the base. A carrier defines a center opening to receive the electronic package and two holes corresponding to the posts. The holes of the carrier cooperate with the posts of the base to guide the carrier loading the electronic package mount to the base.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: December 9, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Cheng-Chi Yeh
  • Patent number: 8879260
    Abstract: The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is arranged on the first side. The module heat conductor comprises a contact surface configured to contact a heat transfer system.
    Type: Grant
    Filed: August 7, 2012
    Date of Patent: November 4, 2014
    Assignee: Qimonda AG
    Inventors: Sven Kalms, Christian Weiss
  • Patent number: 8834191
    Abstract: An electrical connector for electrically connecting an IC package to a circuit board includes an insulating housing having a number of contacts received therein, a load plate covering the insulating housing and rotating between an open position and a closed position and a holder assembled on the load plate for retaining the IC package. The holder is sandwiched between the insulating housing and the load plate and capable of loading the IC package to the insulating housing when the load plate is rotated to a close position.
    Type: Grant
    Filed: September 26, 2012
    Date of Patent: September 16, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Cheng-Chi Yeh, Fang-Jwu Liao
  • Patent number: 8834192
    Abstract: An electrical connector for use with an electronic package, includes an insulative housing defining an upward facing cavity, a plurality of contacts disposed in the cavity of the insulative housing with contacts sections extending into the cavity, and a carrier frame mounted to the insulative housing and having a main body defining an opening for allowing part of the electronic package passing through the opening. The carrier frame assembles to the insulative housing having a preliminary alignment state and a final alignment state.
    Type: Grant
    Filed: October 8, 2012
    Date of Patent: September 16, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Albert Harvey Terhune, IV
  • Patent number: 8808021
    Abstract: A securing structure includes a housing, and a securing member. The housing defines a receiving space and includes a base at end of the housing adjacent to the receiving space. The base includes at least one latching patch secured on the base. The securing member includes a latching portion and at least one resisting portion extended from one side of the latching portion. The latching portion detachably engages with the at least one latching patch with an end of the at least one latching patch pressing the resisting portion toward the receiving space.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: August 19, 2014
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: Zhen-Lin Liu, Kai Xu, Wen-Ze Liu
  • Patent number: 8801450
    Abstract: An IC socket includes a socket body, a contact pin that contacts a terminal of an IC package, and a latch that presses the IC package from an upper side thereof. An elastic piece of the contact pin is extended along substantially horizontal direction. The latch is formed with a can portion. When the latch is rotated in an opening direction thereof, the elastic piece is pressed by the cam portion so as to be elastically deformed downward so that the contact portion is displaced to be separated downward from a contacting position to the terminal of the IC package. When the latch is rotated in a closing direction thereof, a pressing force of the cam portion applied to the elastic piece is released so as to displace the cam portion upward by the elastic force of the elastic piece to thereby contact the terminal of the IC package.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: August 12, 2014
    Assignee: Enplas Corporation
    Inventor: Kenji Hayakawa
  • Publication number: 20140187074
    Abstract: An electrical connector includes an electrical connector used for locking an electronic package, comprises an insulative base having a plurality of contacts. A cover is mounted upon the base. An active device is mounted between the base and the cover for driving the cover moving horizontally along the base in an open position and a closed position. The cover and the base respectively have a first latch and a second latch disposed in a direction moving by the cover for locking the electronic package.
    Type: Application
    Filed: December 30, 2013
    Publication date: July 3, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: JIE-FENG ZHANG