Abstract: A memory card connector, within a slot of a host device, for receiving a first memory card having a first row of contact fingers and a second row of contact fingers and a second memory card having only a single row of contact fingers. The memory card connector includes a first row of contact pins, a second row of contact pins and a protrusion. The first row of contact pins are configured to mate with the first row of contact fingers of the first memory card. The second row of contact pins are configured to mate with the second row of contact fingers of the first memory card. The protrusion is received within a contact finger in the second row of contact fingers of the first memory card to allow full insertion of the first memory card into the connector, and abuts against a distal end of one of the contact fingers of the second memory card to prevent full insertion of the second memory card into the connector.

Abstract: Techniques for a land grid array (LGA) socket loaded mechanism for mobile platforms are described. An apparatus includes a LGA socket mounted to a printed circuit board, and a LGA package seated in the LGA socket. The LGA package includes an LGA package substrate and a semiconductor die mounted on the LGA package substrate, and a heat pipe attached to the semiconductor die, wherein the heat pipe is to apply a compressive load to the semiconductor die. The heat pipe includes at least two leaf springs to apply a compressive load to the LGA package substrate. Other embodiments are described and claimed.

Abstract: A method of fabricating a polysilicon film by an excimer laser crystallization process. First, a substrate comprising a first region and a second region is provided. An amorphous silicon layer and a mask layer are formed on the substrate in sequence. Then, a photo-etching process is performed to remove the mask layer in the first region. A heat-retaining capping layer is formed on the mask layer and the amorphous silicon layer. After that, an excimer laser crystallization process is performed so that the amorphous silicon layer in the first region is crystallized into a polysilicon film.

Abstract: A connector-integrated coil apparatus that includes a stress-absorbing elbow segment that minimizes the chance of coil breakage. A fusing portion of a coil terminal wire and a terminal is located within a coupler rather than the interface between a metal housing and the resin coupler. Further, the fusing portion is located between a stress-absorbing elbow segment of the coil terminal wire and a tip of the terminal. Accordingly, even if stress is caused by a difference of thermal expansion coefficients between the housing and the coupler, the stress is absorbed by the stress-absorbing elbow segment. Accordingly, breakage of the coil terminal wire at the fusing portion is prevented.

Abstract: A lamp retainer of a light source device, which retains a light source lamp that has two electrodes, at least one of them being on the side thereof. The lamp retainer comprises an electrically conductive heat sink, and an electrically conductive electrode press device that is attached to the heat sink. The press device is biased to resiliently press the electrode from the side thereof, so that the electrode and the heat sink are electrically connected through the press device.