For Connection To Rigid Preformed Panel Circuit Arrangement, E.g., Pcb Patents (Class 439/493)
  • Patent number: 11445948
    Abstract: The present disclosure includes a connector assembly that is a part of a sensor assembly for collecting patient physiological data. The connector assembly can include a first connector tab with catches, a second connector tab with openings, a retainer with pins, and a circuit board coupled to a cable. Each of the pins of the retainer can include a detent that can engage one of the catches of the first connector tab. The pins can extend through the openings of the second connector tab so that the retainer is coupled to the first connector tab by the detents engaging the catches. The first and second connector tabs can thereby be coupled together to support the circuit board and the cable between the first and second connector tabs.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: September 20, 2022
    Assignee: MASIMO CORPORATION
    Inventors: Stephen Scruggs, Yassir Kamel Abdul-Hafiz, Ammar Al-Ali, Marc Antoine Laidet
  • Patent number: 11367971
    Abstract: An insulator interface serves as both an insulator and the forming tool for a busbar. The busbar insulator interface includes a hollow riser having at least one channel extending between first and second openings at opposite ends of the riser, a busbar forming section located at one of the first and second openings of the riser and a terminal locating section extending from the busbar forming section, wherein the busbar forming section is configured for folding a busbar onto the terminal locating section. A busbar assembly includes a combination of a single piece busbar and an insulator interface. The busbar has one end pre-formed and other end straight to allow the busbar to pass through the insulator interface. The busbar insulator interface is designed to act as the forming tool with the proper bend radius for the busbar.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: June 21, 2022
    Assignee: BAE Systems Controls Inc.
    Inventor: David J. Czebiniak
  • Patent number: 11355888
    Abstract: A connector assembly is configured to connect a first circuit board and a second circuit board. The connector assembly includes a board-to-board connector, a buckle pressing plate and a pressing and covering piece. The buckle pressing plate and the board-to-board connector which is spaced from the buckle pressing plate are arranged on the second circuit board, and the board-to-board connector is connected with the first circuit board to enable the first circuit board to be electrically connected with the second circuit board. The pressing and covering piece includes a covering portion and a buckling portion extending from a first end of the covering portion. The buckling portion is connected to the buckle pressing plate in a buckling manner. The covering portion presses and covers the board-to-board connector to fix the board-to-board connector on the second circuit board. A power supply assembly and an electronic device are also provided.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: June 7, 2022
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventors: Wuchun Zeng, Zanjian Zeng, Zhigang Sun, Feng Xiong, Mingkun Zhao
  • Patent number: 11116076
    Abstract: A flexible conductor track (10) for connecting electronic modules, includes conductor track structures (12), two connecting regions (14, 16) for electrically connecting the conductor track structures (12) to corresponding conductor tracks of electronic modules, and at least one long slit (18, 20) in a region (11) in the conductor track (10) located between the two connecting regions. At least one of the connecting regions is designed to be connected to a corresponding connecting region of an electronic module by anisotropic conductive film adhesive (ACFA) bonding.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: September 7, 2021
    Assignee: Conti Temic microelectronic GmbH
    Inventors: Konrad Rothenhaeusler, Franz Pfeiffer, Thilo Berg, Jos Becher, Andreas Schleinkofer, Martin Vallendor, Matthias Dropmann, Oscar Torres Alsina, Steffen Goermer, Patrick Albrecht, Hendrik Powileit, Dieter Kroekel
  • Patent number: 11095075
    Abstract: An electrical device including a plug connector. The plug connector includes a first flexible substrate having a plurality of signal contacts, the first flexible substrate extending from a terminating end to a mating end and configured to be flexible between the terminating end and mating end. A second flexible substrate extends in parallel spaced relation to the first flexible substrate to form a cavity between the first flexible substrate and second flexible substrate. The second flexible substrate having a plurality of signal contacts. The second flexible substrate extends from a terminating end to a mating end and configured to be flexible between the terminating end and mating end. The plug connector includes a rigid section disposed in the cavity at the mating end, the first flexible substrate moves in relation to the rigid section.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: August 17, 2021
    Assignee: TE CONNECTIVITY SERVICES GmbH
    Inventors: Sandeep Patel, Dustin Grant Rowe, Bruce Allen Champion, Alex Michael Sharf
  • Patent number: 11063380
    Abstract: A universal power input assembly includes an input power terminal, a first circuit board and a second circuit board. The input power terminal is electrically coupled to the first circuit board and the first circuit board includes a connector, wherein a first end of the connector is electrically coupled to the first circuit board and a second end of the connector is electrically coupled to the second circuit board.
    Type: Grant
    Filed: February 28, 2020
    Date of Patent: July 13, 2021
    Assignee: Delta Electronics (Shanghai) CO., LTD
    Inventors: Xiaojun Wu, Baohua Li
  • Patent number: 11056839
    Abstract: A cable connector assembly includes: an electrical connector including a plug and a metal shell disposed outside the plug and the cable; a cable electrically connected with the electrical connector, the cable including plural core wires, an inner shield layer covering the core wires, a metal braided layer covering outside the inner shield layer, and an outer cover layer; and an inner mold integrally formed on the core wire to fix each core wire at a predetermined position.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: July 6, 2021
    Assignees: New Ocean Precision Component (Jiangxi) Co., Ltd., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Yang-Tsun Hsu, Xu-Xiang Qi, Jun-Cheng Lin
  • Patent number: 11029331
    Abstract: A semiconductor device includes a circuit board, a semiconductor package, and a contact interface. The semiconductor package is mounted on the circuit board. The semiconductor package includes a plurality of conductive bumps with a first pitch. The contact interface is electrically connected to the circuit board. The contact interface includes a plurality of first contact pads with a second pitch substantially the same as the first pitch. The first contact pads are separated from the conductive bumps.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: June 8, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Mill-Jer Wang, Chi-Che Wu, Hung-Chih Lin, Hao Chen
  • Patent number: 11032907
    Abstract: A printed board joining method according to an embodiment includes preparing a printed board having, on an upper surface, a plurality of connection land portions provided along a side end, preparing a printed board having, on a lower surface, a plurality of connection land portions along a side end, and joining the printed board and the printed board together with a conductive joining material such that the upper surface is opposed to the lower surface and the plurality of connection land portions are electrically connected to the corresponding connection land portions. One or more cutout portions are provided between the plurality of connection land portions and/or between the plurality of connection land portions.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: June 8, 2021
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventor: Toshifumi Okano
  • Patent number: 10971880
    Abstract: A printed circuit board assembly is provided. The assembly has a substantially rigid member, the substantially rigid member having a first protrusion, a support member with a first slot that accepts the protrusion in such a way to produce flex in at least one of the rigid member and the support member. The flex exerts compression on the protrusion that prevents it from disengaging the slot.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: April 6, 2021
    Assignee: NEPTUNE TECHNOLOGY GROUP INC.
    Inventors: Wilson Philip Parker, Jeffrey Keith Dorris, Frederick Guhl Papenburg, Jr.
  • Patent number: 10965074
    Abstract: A system for the read-out of vehicle data via a diagnostic port, specifically an OBD plug connection of a vehicle, including a connector unit for a diagnostic port of a vehicle, and a gateway apparatus for communication with an air-conditioning installation of the vehicle, specifically a parking heater, wherein the connector unit, specifically the OBD plug connection, includes a connector body, having a plug-in side with first contacts for connection with the diagnostic port, and a connection side with second contacts, specifically for connection with a diagnostic device, and at least one branch feeder, wherein the branch feeder is brought out of the connector body from at least one of the first contacts, and is communicatively connected to the gateway apparatus.
    Type: Grant
    Filed: May 4, 2018
    Date of Patent: March 30, 2021
    Assignee: WEBSTO SE
    Inventors: Daniel Thürmer, Sebastian Sonnek
  • Patent number: 10910741
    Abstract: A connector assembly comprises a main connector, a first wiring sheet and a second wiring sheet. The main connector has a receiving portion. The first wiring sheet has a first positioned portion, a first deformable portion extending from the first positioned portion and a first contact provided on the first deformable portion. The second wiring sheet has a second positioned portion, a second deformable portion extending from the second positioned portion and a second contact provided on the second deformable portion. When the connector assembly is assembled, the first positioned portion and the second positioned portion are positioned by a positioning jig. Then, the first deformable portion and the second deformable portion are pressed downward to be pushed into the receiving portion so that the first contact and the second contact are located within the receiving portion to be in contact with each other.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: February 2, 2021
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Keisuke Nakamura
  • Patent number: 10868383
    Abstract: A surface-treated plated material is provided. The surface-treated plated material can suppress generation of whiskers, maintain good solderability and low contact resistance even when exposed to an elevated temperature environment, and have lower insertion force for terminals/connectors. The surface-treated plated material comprises a substrate provided with an upper layer, and the upper layer comprises a plated material containing Sn or In. A surface of the plated material contains at least one compound represented by a certain general formula and at least one compound represented by a certain general formula. One or more compounds selected from a group D of constituent compounds represented by certain general formulae are further applied onto a surface on the upper layer side.
    Type: Grant
    Filed: January 30, 2017
    Date of Patent: December 15, 2020
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Atsushi Kodama, Satoru Endo
  • Patent number: 10852762
    Abstract: An electrical board includes a ground layer, a power layer, a first signal layer, a top surface, first and second vias that extend substantially perpendicularly to the top surface through the ground layer, the power layer and the first signal layer, and one or more conductive traces disposed in the first signal layer, the one or more conductive traces lying between the first and second vias.
    Type: Grant
    Filed: April 5, 2018
    Date of Patent: December 1, 2020
    Assignee: Western Digital Technologies, Inc.
    Inventor: John E. Maroney
  • Patent number: 10658799
    Abstract: A transmission cable including a signal wire and a shielding layer is provided. The signal wire is configured to transmit a differential signal provided by an eDP interface or a V-by-one interface. The shielding layer is configured to cover the signal wire. An end of the signal wire receives the differential signal provided by the eDP interface or the V-by-one interface, and another end of the signal wire outputs the differential signal provided by the eDP interface or the V-by-one interface. In addition, a display system is also provided.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: May 19, 2020
    Assignee: Innolux Corporation
    Inventors: Chih-Yang Hsu, Chien-Hung Chen, Heng-Chang Chang, Chin-Lung Ting, Cheng-Te Wang
  • Patent number: 10658772
    Abstract: A connection system has a high-density, high-speed connector that is electrically connected to a plurality of cables by a tiered circuit board. Edges of the circuit board are offset in order to form steps on which conductive pads may be formed. Each set of pads on a given step may be electrically connected to one or more conductors of a cable, such as a twinax ribbon cable. Thus, each of the cables may be coupled to one or more conductive pads on a respective step of the circuit board such that a large number of conductors may be electrically interfaced with the connector in a relatively small space, unencumbered by the bend radius of the cable. In addition, the cables may be coupled to the circuit board in a manner that does not require significant bending at the ends of the cables helping to preserve signal integrity. That is, conductive paths turn at high angles (e.g., close to 90 degrees) within the circuit board rather than at the ends of the cables connected to the circuit board.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: May 19, 2020
    Assignee: ADTRAN, Inc.
    Inventors: Jared D. Cress, Troy W. White
  • Patent number: 10617003
    Abstract: A method for manufacturing a surface mount technology (SMT) pad structure includes attaching an adjacent pair of differential contact strips to a nonconductive surface of respective landing pads of a surface mount technology (SMT) pad structure of a circuit board substrate, the pair of differential contact strips having converging narrowing at a respective distal end and each having a proximal signal trace for conducting a high-speed communication signal to another functional component attached to a circuit board substrate. The method includes attaching a return current strip that is longitudinally aligned adjacent to the pair of differential contact strips on a first lateral side and connected to a ground plane of the circuit board substrate, the converging narrowing of the adjacent differential contact strip increasing separation from a distal end of the return current strip, the separation improving signal integrity by reducing fringe effects, increasing impedance, and quenching resonance.
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: April 7, 2020
    Assignee: Dell Products, L.P.
    Inventors: Vijendera Kumar, Bhyrav M. Mutnury, V. Mallikarjun Goud
  • Patent number: 10538089
    Abstract: There is provided a head unit including: a first substrate provided with a first terminal and a second terminal; a second substrate provided with a third terminal; a first flexible wiring substrate that connects the first terminal and the third terminal to each other; a first driving module that is electrically connected to the second substrate; a third substrate provided with a fourth terminal; a second flexible wiring substrate that connects the second terminal and the fourth terminal to each other; a second driving module that is electrically connected to the third substrate; and a liquid flow passage which is positioned between the second substrate and the third substrate, and supplies the liquid to the first driving module and the second driving module, in which the first substrate is positioned on the second substrate side in a direction intersecting with a direction in which a liquid is discharged.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: January 21, 2020
    Assignee: Seiko Epson Corporation
    Inventors: Koji Kitazawa, Masahiko Tsuyuki
  • Patent number: 10490959
    Abstract: An electrical receptacle connector is provided for contacting conductive surfaces of a conductive substrate. The connector includes an insulated housing out of a terminal retaining member and an outer shell enclosing the insulated housing. The outer shell includes two side plates extending toward two sides of a mount member at the rear portion of the insulated housing. The conductive substrate is inserted into the mount member and in contact with first receptacle terminals. An embedded member is inserted between the side plates for positioning the conductive substrate. Hence, the electrical receptacle connector can be connected with the conductive substrate without connecting to an additional FPC receptacle connector and additional terminals of the FPC connector. Consequently, a product with the connector can be assembled with flexible circuit board or flexible flat cables, and the circuit board or cable can be replaced easily when the board or the cable has defects.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: November 26, 2019
    Assignee: ADVANCED-CONNECTEK INC.
    Inventors: Fan-Cheng Huang, Ying-Te Lin
  • Patent number: 10401424
    Abstract: Neutron soft error rate derivation is calculated from data at the low energy neutron radiation. An outline value of an SEU cross-section function corresponding to a given neutron energy value is outputted. This outline value and the low energy neutron spectrum data are used to calculate an error count basic value of errors to occur over time. An error count actual measurement value over time is calculated from an error count during radiation of low energy neutrons and low energy neutron radiation time. The error count basic value and the error count actual measurement are used to calculate a proportionality coefficient of the SEU cross-section function. While holding a natural neutron spectrum, an error rate calculator outputs a neutron flux corresponding to a neutron energy value. The neutron soft error rate is calculated by an integration operation of multiplying the SEU cross-section function with the natural neuron spectrum.
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: September 3, 2019
    Assignee: HITACHI, LTD.
    Inventors: Takumi Uezono, Tadanobu Toba, Kenichi Shimbo, Fumihiko Nagasaki
  • Patent number: 10405425
    Abstract: An Information handling system (IHS) includes a circuit board assembly with surface mount technology (SMT) pad structure. Landing pad(s) attached to circuit board substrate have a mounting area that receive an SMT connector pin onto adjacent pair of differential contact strips plated to nonconductive surface and extending longitudinally in parallel alignment. A return current strip is longitudinally aligned, adjacent to the differential contact strips on a first lateral side. The return current strip is connected to a ground plane of the circuit board substrate. Converging narrowing of the adjacent differential contact strip increases separation from a distal end of the return current strip. The separation improves signal integrity by reducing fringe effects, increasing impedance, and quenching resonance. A surface mount device (SMD) has one or more connector pins that are attached to the one or more landing pads to conduct the high-speed communication signal.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: September 3, 2019
    Assignee: Dell Products, L.P.
    Inventors: Vijendera Kumar, Bhyrav M. Mutnury, V. Mallikarjun Goud
  • Patent number: 10374344
    Abstract: The pocket connector of the invention has been manufactured of a substrate, which is preferably flexible in at least one direction, of which three parts have been prepared, which are bent or assembled from three parts and joined together superimposed so that at least two opposite sides of the pocket connector have coupling apertures. Two flat cables or a connector for a flexible circuit board is connectable to these coupling apertures.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: August 6, 2019
    Assignee: New Cable Corporation Oy
    Inventors: Tommi Rintala, Antti Backman
  • Patent number: 10356902
    Abstract: A system for board-to-board interconnect is described herein. The system includes a first printed circuit board (PCB) having a first recess along a first edge of the first PCB that exposes a first solder pad on a layer of the first PCB. The system also includes a second PCB having a second recess along a second edge of the second PCB that exposes a second solder pad on a layer of the second PCB. The second recess is complementary to the first recess to allow the first PCB to mate with the second PCB. The first solder pad is aligned with the second solder pad when the first PCB is mated with the second PCB. The system additionally includes an assembly configured to electronically couple the first solder pad with the second solder pad.
    Type: Grant
    Filed: December 26, 2015
    Date of Patent: July 16, 2019
    Assignee: Intel Corporation
    Inventors: Chee Ling Wong, Wil Choon Song, Khang Choong Yong, Eng Huat Goh, Mohd Muhaiyiddin Bin Abdullah, Tin Poay Chuah
  • Patent number: 10312566
    Abstract: A cable connection structure includes a substrate and a coaxial cable connected to the substrate. The coaxial cable has: a conductor; an inner insulator that coats an outer periphery of the conductor; a shield that coats an outer periphery of the inner insulator; and an outer insulator that coats an outer periphery of the shield. The substrate has: a plate-shaped insulating base material; a conductor connection electrode to which the conductor is connected; and a shield connection electrode to which the shield is connected. A ground is provided on a back surface of the base material opposite to where the conductor connection electrode is formed. The shield connection electrode is an exposed portion of the ground. At a connection part of the substrate to which the coaxial cable is connected, the shield connection electrode, the base material, and the conductor connection electrode are bared in a stepwise fashion.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: June 4, 2019
    Assignee: OLYMPUS CORPORATION
    Inventor: Junya Yamada
  • Patent number: 10283915
    Abstract: Disclosed is a connector that interrupts electromagnetic waves and includes a terminal part, an inner shell surrounding the terminal part and having a plug form that is inserted into the connector from outside of the connector, and an outer shell surrounding at least a portion of the inner shell.
    Type: Grant
    Filed: May 9, 2016
    Date of Patent: May 7, 2019
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Jae Ryong Han, Kyu Hyuck Kwak, Eun Seok Hong
  • Patent number: 10164308
    Abstract: A flexible electronic circuit includes a shape memory material disposed within a flexible dielectric material.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: December 25, 2018
    Assignee: International Business Machines Corporation
    Inventors: Matthew S. Doyle, Jeffrey N. Judd, Joseph Kuczynski, Scott D. Strand, Timothy J. Tofil
  • Patent number: 10141676
    Abstract: A modular electrical connector with modular components suitable for assembly into a right angle connector may also be used in forming an orthogonal connector or connector in other desired configurations. The connector modules may be configured through the user of extender modules. Those connector modules may be held together as a right angle connector with a front housing portion, which, in some embodiments, may be shaped differently depending on whether the connector modules are used to form a right angle connector or an orthogonal connector. When designed to form an orthogonal connector, the extender modules may interlock into subarrays, which may be held to other connector components through the use of an extender shell. The mating contact portions on the extender modules may be such that a right angle connector, similarly made with connector modules, may directly mate with the orthogonal connector.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: November 27, 2018
    Assignee: Amphenol Corporation
    Inventors: Allan Astbury, John Robert Dunham, Marc B. Cartier, Jr., Mark W. Gailus, Daniel B. Provencher
  • Patent number: 10069287
    Abstract: A connection system for electrical, signal and/or data installations, which includes: multilayer flat cables with parallel conductive tracks disposed between a first layer made of a semi-rigid, flat insulating material and having a series of transverse recesses to remove a portion of the first layer and define an end connecting portion at the ends of the flat cable; and a second layer of insulating material formed by a polymer. The disclosure further includes mechanisms that includes a printed circuit provided with conductive tracks and housed in a connection box made of insulating material, the box having lateral windows for inserting the flat cables and containing flexible feet that act, by an oblique jagged surface, on the insulating layer of the flat cable.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: September 4, 2018
    Inventor: Amadeu F. Zamora Gil
  • Patent number: 10033136
    Abstract: A strain relief assembly is provided for a bundle of cables surrounded by an electrically conductive sleeve. The strain relief assembly can include a ferrule and at least one retention member. The cables extend through the ferrule, and the sleeve extends over the ferrule, so as to be captured between the ferrule and the retention member.
    Type: Grant
    Filed: August 20, 2015
    Date of Patent: July 24, 2018
    Assignee: FCI USA LLC
    Inventor: David Humbert
  • Patent number: 9949367
    Abstract: Disclosed are a flexible printed circuit and a detecting device, a detecting method and a display device thereof. The flexible printed circuit comprises a body and an interface structure that is connected with the body, wherein the interface structure is provided with a plurality of mark lines dividing the interface structure into a plurality of interfaces with the same structure. When a front end interface of the flexible printed circuit of the disclosure is damaged, the front end interface can be removed along the mark line, and then an exposed rear end interface can be used successively, thus preventing a situation where the flexible printed circuit cannot be used because the only interface is damaged, thereby extending the life span of the flexible printed circuit, reducing productivity loss due to frequent replacements of the flexible printed circuit and reducing production cost.
    Type: Grant
    Filed: April 14, 2016
    Date of Patent: April 17, 2018
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Yimin Wang, Xingguang Jin, Lei Jin, Ping Chen, Pengjun Fang
  • Patent number: 9888571
    Abstract: Connector receptacles that may be space efficient and provide a direct connection to a flexible circuit board. One example may provide an electronic device having a receptacle including a recess formed in a housing of the electronic device. The recess may have a sidewall and a bottom surface portion, and the bottom surface portion may include one or more openings extending through the bottom surface portion from an external surface to an internal surface. One or more contacts formed on a flexible circuit board may be aligned with the one or more openings in the bottom surface portion. In this way, the receptacle may be space efficient and provide a direct connection to a flexible circuit board inside an electronic device. A cosmetic cap may be placed in the recess to obscure the existence of the connector receptacle.
    Type: Grant
    Filed: March 7, 2015
    Date of Patent: February 6, 2018
    Assignee: Apple Inc.
    Inventors: Dustin J. Verhoeve, Jason C. Sauers, Benjamin J. Kallman
  • Patent number: 9888562
    Abstract: Electrical components in an electronic device are mounted on substrates such as printed circuits. Printed circuits contain signal paths formed from metal traces. The signal lines in the signal paths of the printed circuits are coupled together using electrical connection structures such as printed circuit board-to-board connectors, contacts joined by anisotropic conductive film, or contacts joined using solder. Electrical connection structures may be surrounded by conductive resilient ring-shaped structures such as conductive foam structures or spring structures. The conductive foam structures may be provided with a metal layer with which the conductive foam structures are soldered to a ring of metal on a printed circuit. Strain relief structures may be formed from an elastomeric ring that surrounds the electrical connection structures or an overmolded plastic structure.
    Type: Grant
    Filed: December 24, 2012
    Date of Patent: February 6, 2018
    Assignee: Apple Inc.
    Inventors: Shayan Malek, Michael B. Wittenberg, Sawyer I. Cohen, Ashutosh Y. Shukla
  • Patent number: 9882312
    Abstract: An electrical connecting device is described that is designed to indicate a geometrical orientation of a connection between this connecting device and a complementary connecting device when the two connecting devices are connected to one another. The connecting device comprises at least one terminal for contacting by the complementary connecting device, whereby the terminal comprises a plurality of contact regions. Differing electrical parameters are assigned to the contact region, so that in the event of a contacting of the terminal by the complementary connecting device a resultant parameter is assigned to the contacting of the terminal, which indicates in which contact region (or in which group of contact regions) the contacting exists.
    Type: Grant
    Filed: May 13, 2015
    Date of Patent: January 30, 2018
    Assignee: e.solutions GmbH
    Inventors: Thomas Franke, Michael Himmel
  • Patent number: 9825384
    Abstract: A point-of-care system that can include a contact pad on a printed circuit board and a connector assembly for retaining a lead and positioning the lead in contact with the pad on the printed circuit board and with interfaces of a cuvette. The connector assembly can include a base component and a clamp component, where the base component can define at least one recessed track for receiving each lead. The clamp component can be secured to the base component to clamp the at least one lead between the base component and the clamp component without flux or solder. The connector assembly can be secured to the printed circuit board without flux or solder.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: November 21, 2017
    Assignee: LifeHealth, LLC
    Inventors: James D. Kurkowski, Thomas Paul Brastad
  • Patent number: 9825389
    Abstract: Connectors providing solderless contact between conductors and a plurality of contact pads disposed on a substrate are disclosed. Connectors accommodating cables including pairs of insulated conductors are disclosed. Connector assemblies including frames for reversibly mounting the connectors with substrates having a plurality of contact pads are also disclosed.
    Type: Grant
    Filed: January 22, 2015
    Date of Patent: November 21, 2017
    Assignee: 3M Innovative Properties Company
    Inventors: Dennis L. Doye, Alexander W. Barr, Douglas B. Gundel, Charles F. Staley
  • Patent number: 9811988
    Abstract: Embodiments of the present invention are directed to security systems for securing an item of merchandise from theft or unauthorized removal. For example, the security system may include a sensor configured to be coupled to the item of merchandise and a base configured to removably support the sensor and the item of merchandise thereon. The base includes a charging circuit for providing power to the sensor and/or the item of merchandise. The security system also includes a controller operably coupled to the base and a key configured to wirelessly communicate with the base and/or controller. The sensor is configured to wirelessly communicate with the base.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: November 7, 2017
    Assignee: InVue Security Products Inc.
    Inventors: Jeffrey A. Grant, Jonathon D. Phillips, Gary A. Taylor
  • Patent number: 9787033
    Abstract: A system according to one embodiment includes opposing slide plates, and opposing guide blocks configured to receive the slide plates therebetween and push the slide plates together during a relative motion between the slide plates and the guide blocks. A system according to another embodiment includes opposing slide plates and a thermal interface material coupled to opposing inner faces of the slide plate. Opposing guide blocks are configured to receive the slide plates therebetween and push the slide plates together during a relative motion between the slide plates and the guide blocks. An interface connector is coupled to at least one of the guide blocks and the slide plates, the interface connector having electrical connectors on opposite ends thereof.
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: October 10, 2017
    Assignee: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
    Inventors: Jonathan Randall Hinkle, Yasushi Honda, Shiro Konaka, Jason A. Matteson, Shigefumi Odaohhara
  • Patent number: 9761975
    Abstract: A connector module includes a board connector and a cable connector. The board connector includes a board connecting body whereon a slot is formed, conductive terminals disposed on the board connecting body and extending into the slot, and two metal pads disposed on two sides of the board connecting body and each having a resilient buckle. The cable connector includes a cable connecting body including an installation portion and two engaging portions, and a flexible transmission unit installed in the installation portion. Contacts are disposed on a front end of the flexible transmission unit. The front end of the flexible transmission unit is inserted into the slot, the conductive terminals contact with the contacts, and the resilient buckles engage with the engaging portions when the cable connector is connected with the board connector.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: September 12, 2017
    Assignee: P-TWO INDUSTRIES INC.
    Inventors: Chien-Chun Wang, Tung-Ching Kuan
  • Patent number: 9753568
    Abstract: Sensors incorporating piezoresistive materials are described. One class of includes conductive traces formed directly on or otherwise integrated with the piezoresistive material.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: September 5, 2017
    Assignee: BeBop Sensors, Inc.
    Inventor: Keith A. McMillen
  • Patent number: 9590339
    Abstract: An inline communications connector is provided that includes a housing and tip and ring contacts that are mounted in the housing. The tip contact includes an input tip socket, an output tip socket and a tip socket connection section that physically and electrically connects the input and output tip sockets. The ring contact includes an input ring socket, an output ring socket and a ring socket connection section that physically and electrically connects the input and output ring sockets. The input tip socket is not collinear with the output tip socket and the input ring socket is not collinear with the output ring socket.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: March 7, 2017
    Assignee: CommScope, Inc. of North Carolina
    Inventors: Jeffrey A. Oberski, Amid I. Hashim, Scott M. Keith, Steven W. Knoernschild
  • Patent number: 9572246
    Abstract: A printed wiring board comprises a pattern layer, an insulating layer and a ground layer laminated in an upper-lower direction. The printed wiring board is formed with one or more vias. The insulating layer is provided between the pattern layer and the ground layer. The ground layer is formed with a ground pattern. The pattern layer is formed with one common ground plane and two or more pads. The pads are arranged in a lateral direction. The common ground plane is located forward of the pads in the front-rear direction. The vias include a first via that connects the common ground plane and the ground pattern with each other. The pads include one or more ground pads and one or more signal pads. The ground pads are connected with the common ground plane. The signal pads are unconnected with the common ground plane.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: February 14, 2017
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Yukitaka Tanaka, Chikara Kawamura
  • Patent number: 9508465
    Abstract: Sealing performance between a sealing member and a reinforcing plate adhered to a wiring unit is prevent from being deteriorated. An FPC 1 is integrated with a sealing member 2, and a cover 3 is attached to a front end portion. On upper and lower surfaces of the FPC 1, reinforcing plates 12 each having a shape of a rectangular flat plate are arranged and adhered in an opposing manner interposing the FPC 1. The sealing member 2 is formed of elastic material such as rubber, and is fixedly attached to the FPC 1 such that the sealing member 2 covers the reinforcing plates 12 adhered to the upper and lower surfaces of the FPC 1 together with the FPC 1 located along front edges and rear edges of the reinforcing plates 12.
    Type: Grant
    Filed: October 14, 2011
    Date of Patent: November 29, 2016
    Assignee: Yazaki Corporation
    Inventors: Kazunori Miura, Takatoshi Suzuki
  • Patent number: 9502798
    Abstract: An electrical connector having a circuit board and elastic pieces is provided. The elastic pieces are disposed on the circuit board. Each elastic piece includes contact portions, fixing portions and insulating portions. The fixing portions are fixed on the circuit board and electrically connected to the circuit board. The contact portions are connected to corresponding fixing portions and are protruded from the fixing portions along a direction away from the circuit board. Each insulating portion is connected to two adjacent fixing portions, so as to connect and electrically insulate the fixing portions. Moreover, an electronic device including the above-mentioned connector is also provided.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: November 22, 2016
    Assignee: HTC Corporation
    Inventors: Hsin-Hao Lee, Ying-Yen Cheng, Chia-Lin Chang, Han-Ying Lei
  • Patent number: 9480142
    Abstract: Disclosed is wiring substrate and method of manufacturing thereof, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.
    Type: Grant
    Filed: May 28, 2014
    Date of Patent: October 25, 2016
    Assignee: YAZAKI CORPORATION
    Inventors: Akira Harao, Mototatsu Matsunaga, Yasuhiro Sugiura, Minoru Kubota
  • Patent number: 9468099
    Abstract: Disclosed is contact pad connection structure for connecting a conductor assembly and a flexible circuit board. A substrate has a top surface on which a plurality of elevation pads are formed and respectively located in spacing zones between contact pads. Each of the elevation pads has a height above a top contact surface of the contact pads. The conductor assembly has exposed conductors that are respectively set in contact with the top contact surfaces of the contact pads and a solder material is applied to solder and fix the exposed conductors respectively in position on the top contact surfaces of the contact pads. Each of the elevation pads includes an extension section extended in a direction toward a front edge of the substrate.
    Type: Grant
    Filed: June 5, 2015
    Date of Patent: October 11, 2016
    Assignee: Advanced Flexible Circuits Co., Ltd.
    Inventors: Kuo-Fu Su, Gwun-Jin Lin
  • Patent number: 9413109
    Abstract: The present invention provides a computer system comprising an enclosure adapted to contain one or more printed circuit boards, the enclosure including a back plane having a recessed port for coupling a data communication cable to a printed circuit board, the recessed port including a receptacle adapter coupled to the printed circuit board adapted to receive a connector of the data communication cable, and a perpendicular clearance space for facilitating alignment of the connector of the data communication cable with the receptacle.
    Type: Grant
    Filed: March 20, 2015
    Date of Patent: August 9, 2016
    Assignee: EMC CORPORATION
    Inventors: Ryan C. McDaniel, Jeffrey M. Lewis, Keith L. Daly
  • Patent number: 9414493
    Abstract: A printed circuit board (PCB) assembly includes a first PCB and a second PCB disposed substantially parallel and opposite to each other, such that a second side of the first PCB is opposite to a first side of the second PCB; wherein the second PCB has a first set of side connectors on its first side and a second set of side connectors on its second side, configured for both electrical power supply to and signal communication with the second PCB; the second PCB both electrically and mechanically connected to the second side of the first PCB via a first elastomeric connector; and the second PCB electrically connected to the first PCB via its second set of side connectors and a flexible electrical connector that is electrically connected to the second set of side connectors and the first PCB.
    Type: Grant
    Filed: May 19, 2015
    Date of Patent: August 9, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Andreas C. Doering, Ralph Heller, Ronald P. Luijten, Martin L. Schmatz
  • Patent number: 9413105
    Abstract: A carrier for a flexible printed circuit (FPC) includes a number of latching members. The latching members secure the carrier to a printed circuit board (PCB).
    Type: Grant
    Filed: September 9, 2014
    Date of Patent: August 9, 2016
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yi-Hua Wang, Pen-Uei Lu, Chin-Yu Hsu
  • Patent number: 9357654
    Abstract: A cable assembly including a connector insert to fit in a connector receptacle in an electronic device, where a back surface of the connector insert is substantially flush with an outside of an enclosure for the electronic device. One example may provide a cable assembly that includes a connector insert formed by wrapping a flexible circuit board at least partially around a housing. The flexible circuit board may be routed against an underside of the electronic device such that it does not obstruct a user, consume space in a display area, or have an undesirable appearance.
    Type: Grant
    Filed: March 3, 2014
    Date of Patent: May 31, 2016
    Assignee: Apple Inc.
    Inventors: Nathan Ng, Paul Yuan, Min Chul Kim
  • Patent number: 9337552
    Abstract: A device for the reversible mechanical fixing and electrical contacting of one or more electrical conductors (11) of a cable (10) it is proposed to fix the cable (10) mechanically by means of a cable receptacle (2) and to position exposed conductor ends (12) of the electrical conductor (11) on a contact plate (3). A fixing element (4) is provided for pressing the exposed conductor ends (12) onto the contact plate (3). Such a device and such a method are needed for the temporary electronic contacting of one or more electrical conductors carried in a cable. Such contacting is above all necessary for carrying out electrical measurements on such cables.
    Type: Grant
    Filed: August 14, 2013
    Date of Patent: May 10, 2016
    Assignee: HARTING ELECTRONICS GMBH
    Inventors: Markus Witte, Lars Fennen