Abstract: The disclosed apparatus may include a rack-side support structure dimensioned to hold a two-sided port interface with a rack-side mating end and an adapter-side mating end. The rack-side mating end may be configured to interface with supply cables, and the adapter-side mating end may be configured to interface with an opposite adapter-side mating end of another port interface. The apparatus may also include a device-side support structure dimensioned to hold a two-sided port interface including an opposing adapter-side mating end and a device-side mating end. The opposing adapter-side mating end may be configured to interface with the adapter-side mating end of the rack-side's port interface, and the device-side mating end may interface with cables that connect to the electronic devices. The rack-side support structure may be configured to interlock with the device-side support structure to connect to the electronic devices. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: The disclosed apparatus may include a rack-side support structure dimensioned to hold a two-sided port interface with a rack-side mating end and an adapter-side mating end. The rack-side mating end may be configured to interface with supply cables, and the adapter-side mating end may be configured to interface with an opposite adapter-side mating end of another port interface. The apparatus may also include a device-side support structure dimensioned to hold a two-sided port interface including an opposing adapter-side mating end and a device-side mating end. The opposing adapter-side mating end may be configured to interface with the adapter-side mating end of the rack-side's port interface, and the device-side mating end may interface with cables that connect to the electronic devices. The rack-side support structure may be configured to interlock with the device-side support structure to connect to the electronic devices. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: A connector assembly may include first and second connector bodies and a terminal splitter. The second connector body may matingly engage the first connector body. The terminal splitter may be received in at least one of the first and second connector bodies. The terminal splitter may include a body portion having first and second wires connected thereto and a blade portion extending from the body portion and including a third wire connected thereto. The third wire may be joined to a female receptacle mounted in the other one of the connector bodies for being joined to the blade portion.

Abstract: An organic light emitting element includes an organic light emitting diode formed on a substrate, coupled to a transistor including a gate, a source and a drain and including a first electrode, an organic thin film layer and a second electrode; a photo diode formed on the substrate and having a semiconductor layer including a high-concentration P doping region, a low-concentration P doping region, an intrinsic region and a high-concentration N doping region; and a controller that controls luminance of light emitted from the organic light emitting diode, to a constant level by controlling a voltage applied to the first electrode and the second electrode according to the voltage outputted from the photo diode.

Abstract: A system comprises a chassis and a system board contained within the chassis. The system board has an edge connector adapted to receive an add-in card in a configuration in which the system board and add-in card are substantially co-planar.

Abstract: This invention describes an I/O module for a modular automation controller. The controller has a main assembly including a motherboard. The I/O modules plug into the motherboard. The modules are parallel to the motherboard allowing use of surface mount LED indicators reducing manufacturing costs. The modules use a plastic cover which retains the module's PCA as well latches the module to the motherboard, making the automation controller less expensive.

Abstract: Methods of interfacing parts in a high voltage environment and related structures are disclosed. A method comprises: providing an insulation medium between a first part and a second part in a high voltage environment; and interfacing the first part and the second part by compressing the first part and the second part against the insulation medium.

Abstract: This invention describes an I/O module for a modular automation controller. The controller has a main assembly including a motherboard. The I/O modules plug into the motherboard. The modules are parallel to the motherboard allowing use of surface mount LED indicators reducing manufacturing costs. The modules use a plastic cover which retains the module's PCA as well latches the module to the motherboard, making the automation controller less expensive.

Abstract: A disk drive test device for performing a test (e.g., power only self test, tests which use a serial interface) on at least one disk drive at a time. The test device includes an electrical connector which is configured so as to be able to provide the necessary electrical interconnections for executing a test on disk drives having different types of drive interface connectors (i.e., the same electrical connector may be used with at least 2 different types of drive interface connectors). There is no need to use an in-line adapter to electrically interconnect a disk drive having a first drive interface connector or to electrically interconnect a disk drive having a second drive interface connector. There is also is no need to change out the electrical connector when performing a test on disk drives which use this different types of drive interface connectors.

Abstract: A layered circuit-board designing method and layered circuit-board where circuit-boards to be overlaid are connected at the center or an arbitrary position of each circuit-board. The layered circuit-board includes an upper-layer first circuit-board, a lower-layer third circuit-board, and an intermediate-layer second circuit-board between the first and third circuit-boards. A first connector is mounted on the first circuit-board, a second connector is mounted on the third circuit-board, a third connector is mounted on the top surface of the second circuit-board, while maintaining the positional relation between the third connector and the first connector, and a fourth connector is mounted on the bottom surface of the second circuit-board, while maintaining the positional relation between the fourth connector and the second connector. In addition, through holes are provided at pins of the third and fourth connectors for passing through the front and bottom surfaces of the second circuit-board.

Abstract: A voice bus on a computer backplane provides point-to-point connection between a plurality of slots on the backplane to a particular slot. Connection from the plurality of slots is provided by third connectors which lie between first and second connectors defining the slots. Connection to the particular slot is via its respective second connector. In particular, the computer backplane is physically and electrically compatible with the IEEE standard 1014-1987 defining the VMEbus. The presence of the third connector is compatible with the VMEbus standard both electrically and physically.

Abstract: The present invention is a double headed pin for electrically interconnecting a PGA substrate carrier to a surface mount printed circuit board. The double headed pins provide for a stronger interconnection to the conductive pads on the surface mount printed circuit board. The increase in contact and soldering wetting area makes the interconnections stronger and more durable.

Abstract: An intraoperative ultrasonic transducer probe is described comprising a handle section and a transducer section which resemble a tiny leg and foot. The two sections are obtusely angled relative to each other so that the physician may continue to clearly view the surgical site while holding and manipulating the probe. The extension of the transducer section away from its point of attachment to the handle section results in the toe of the foot being insertable under unincised tissue, enabling the surgeon to ultrasonically examine organs and tissue peripheral to the surgical site and to follow a vessel even beyond the incision. The transducer section is completely encapsulated in a rubberlike material which electrically insulates the transducer from the patient, enables the probe to be easily sterilized, and further provides an inherent standoff between the transducer and the contact surface of the probe.

Abstract: An arrangement of modular supporting structure or subassemblies constituted of interconnected circuit boards, especially for the assembly of a complex processing circuit in articles of ammunition possessing a search fuze or in airborne target-tracking bodies. The structures or modular subassemblies of the type considered herein consist of circuit boards arranged in a succession, in which between respectively two adjacent circuit boards, there are formed a series of optronic intersecting connections between coupling elements, wherein in the operational positioning of the circuit boards, a transmitting diode and a receiving detector are arranged opposite each other, which are connected with a multiplexer or, respectively, a demultiplexer.