Abstract: A carrier tray includes a housing, an ingot accommodating recess that accommodates a semiconductor ingot, and a wafer accommodating recess that accommodates a wafer. The housing has an upper wall, a lower wall, a pair of side walls connecting the upper wall and the lower wall to each other, and a tunnel defined by the upper wall, the lower wall, and the pair of side walls. A plurality of levers each of which has a point of application projecting from a bottom surface of the ingot accommodating recess, a point of action projecting from a side surface of the ingot accommodating recess, and a fulcrum formed between the point of application and the point of action are each attached to the housing so as to be rotatable around the fulcrum.

Abstract: A clamping component is provided to clamp a chip module, which has a circuit board and a protruding portion protruding upward from an upper surface thereof. In a left-right direction, a width of a first region from a left side of the circuit board to a left side of the protruding portion is greater than that of a second region from a right side of the circuit board to a right side of the protruding portion. Two abutting surfaces respectively abut the left and the right sides of the circuit board. A stopping block is located at a left side of an opening, and extends rightward to the left side of the protruding portion and beyond the left side of the circuit board. When the chip module is installed in the clamping component and the circuit board abuts the abutting surfaces, the stopping block is located above the first region.

Abstract: An electrical connector socket includes an insulative housing forming a plurality of passageways extending through the opposite top and bottom surfaces of the housing. A plurality of contacts are disposed in the corresponding passageways, respectively. Each of the contacts includes opposite upper and lower contacting sections extending beyond the top surface and the bottom surface respectively. First and second upper posts extend upwardly from the top surface around two opposite corners and are different and spaced from each other diagonally. First and second lower posts extend downward from the bottom surface around the same two opposite corners and are different and spaced from each other diagonally.

Abstract: An electrical connector for electrically connecting an IC package to a printed circuit board includes an insulating housing, a number of contacts received in the insulating housing and at least one sleeve assembled on the insulating housing. The insulating housing includes a bottom wall and a number of side walls extending upwardly from the bottom wall. The bottom wall and the side walls define a cavity for accommodating the IC package. The sleeve is assembled on the side wall and defines a supporting portion towards the cavity. The supporting portion includes a pair of abutting walls perpendicular to each other.

Abstract: A socket for providing an electric connection between a package and an electronic circuit board, the socket includes a package mounting area in which the package is mounted and an isotropic elastic body provided on the package mounting area and having a continuous shape along four side walls of the package so as to press the four side walls of the package.

Abstract: A test socket is provided including a socket board, socket pins and a guiding member. The socket pins are exposed to an upper surface of the socket board and are configured to be electrically contacted by external terminals of an object. The guiding member is disposed on an upper surface of the socket board and is arranged to guide the external terminals as a single unit to contact the external terminals with the socket pins. The guiding member is also configured to a center of the socket board with a center of the object.

Abstract: An electronic device test fixture deploys a plurality of contact elements in a dielectric housing. The plumb arrangement of contact elements each include an armature or transversal configured to first depress and then slide laterally when urged downward by the external contacts of a device under test. The rotary movement of the transversal is optimized via the configuration of a surrounding forked regulator such that surface oxide deposition on the external device under test terminal is disrupted to reliably minimize contact resistance without damaging or unduly stressing the electrical junction of the device under test.

Abstract: Provided are a supported catalyst for a fuel cell, a method of preparing the same, an electrode for a fuel cell including the supported catalyst, a membrane electrode assembly including the electrode, and a fuel cell including the membrane electrode assembly. Specifically, the supported catalyst for a fuel cell has a layered structure obtained by sequentially depositing a carbonaceous support, metal oxide particles, and catalyst metal. The supported catalyst has excellent electrical activity, excellent durability, and can be easily mass-produced at low cost. The membrane electrode assembly including the supported catalyst and a fuel cell including the membrane electrode assembly each show excellent output density and high performance.

Abstract: An apparatus, includes a plurality of pins which include a longitudinal axis, each of the pins to be respectively electronically contacted with each of a plurality of terminals of an electronic component by pressing each of the terminals onto each of the pins from a direction corresponding to the longitudinal axis, and an adjusting unit which adjusts a position of the electronic component so that each of the terminals corresponds to each of the pins respectively.

Abstract: An apparatus for forming a temporary electrical connection with a microelectronic component and associated systems and methods are disclosed herein. Embodiments of the apparatus can include a base, a plurality of electrical contacts coupled to the base, and a nest attached to the base. The nest includes a plurality of contact compartments aligned with peripheral leads of the microelectronic component and at least partially covering the contacts. Individual contact compartments are masked to prevent a corresponding contact from electrically contacting the peripheral leads of the microelectronic component. In one embodiment, the masked contact compartments are used as a guide zone to guide individual peripheral leads when the microelectronic component is seated at or unseated from the support surface. In an additional or alternative embodiment, the masked contact compartments are used to selectively isolate contacts, for example, from supply or ground electrical potentials.

Abstract: An electrical socket connector (100) includes an insulative housing (1) having a general flat base (11) with a mating surface (11a) adapted to face a chip package (3), and a mounting surface (11b) adapted to face a printed circuit board. The base includes a peripheral wall (102) extending from edges thereof. A plurality of passageways (12) extends from the mating interface toward the mounting interface, with a plurality of terminals each inserted into the passageways from the mating interface to the mounting interface. A detachable aligning key (2) is assembled to the insulative housing.

Abstract: A burn-in socket for receiving an integral circuit (IC) package comprises a base defining a cavity for receiving the IC package and an adapter retained in the cavity. The adapter has two-pieces configuration and comprises a loading board for loading the IC package and a positioning board assembled upon the bottom plate of the loading board for positioning the IC package.

Abstract: An implantable device includes a housing, a circuit board having a plurality of through holes, and a plurality of interconnect pins within the housing and oriented perpendicular to a major surface of the housing. The circuit board is connected to the interconnect pins such that the pins extend through the through holes of the circuit board.

Abstract: A socket adapted for electrically connecting a semiconductor package to a printed circuit board, comprises an insulating body and a plurality of position clump. The insulating body has a plurality of sidewalls, which define a plurality of assembling slots. The position clumps are movably assembled to the assembling slots of the insulating housing, each of the position clump has a position block and a spring member disposed between the position block and the insulating housing, the position block has a supporting face for supporting the IC package and is able to downwardly move toward the mating face of insulating housing.

Abstract: A burn-in socket for testing an integral circuit package includes a base defining a cavity, an adapter received in the cavity of the base, an alignment plate secured to the adapter, and a cover movable mounted to the base. The alignment plate is detachable assembled to the adapter so as to the burn-in socket can apply to different IC package when the alignment plate is replaced with another.

Abstract: An electrical connector assembly comprises an insulative housing having a base, with a mating interface, and a mounting interface corresponding to the mating face. The base has peripheral walls extending upwardly from the mating face. A plurality of contacts arranged in the base of the insulative housing. At least a pair of cantilevered push fingers formed on two adjacent walls for pushing the integrated circuit module toward opposing walls. At least a support device formed on the bottom of the push finger.

Abstract: An IC socket connector comprises a base and perimeter walls with corresponding inner sidewalls and outer sidewalls to form an inner cavity therebetween for receiving an IC package. An inner sidewall of the perimeter walls has a push arm at least which has an interfacing part between an inclined lead-in surface and a flat surface at the terminal end of the push arm. The distance from the interfacing part to the contact area is larger than the one from the corresponding inner sidewall to the contact area.

Abstract: An adjustable test socket for aligning an electronic device with spring probes in a test fixture is provided having two adjustable walls or four adjustable walls.

Abstract: An electrical connector assembly (100) includes a frame (2) defining a central cavity (21) therein. A connector assembled to the central cavity and at least one alignment post (3) assembled to the frame (2). Each alignment post (3) defining a middle stop section (32) and an upper latching section (33) consisting of number of latching ribs (331) symmetrically arranged around a circle and a lower engaging section formed with a plurality of ribs around outer periphery; and the frame (2) defining at least one locating hole (23) for said alignment post (3) extending through. The frame (2) is sandwiched between the latching section (33) and the stop section (32) of the at least alignment post.

Abstract: An electrical connector for connection to an electrical component assembly along a connection axis is provided. The electrical connector includes a body holding a first array of electrical contacts. The first array of electrical contacts are configured to electrically connect to a second array of electrical contacts of the electrical component assembly. An alignment pin extends outwardly from the body. The alignment pin is configured to be received within an alignment opening of the electrical component assembly for aligning the electrical component assembly with the body. The alignment pin includes at least one slot configured to receive an edge portion of the electrical component assembly that at least partially defines the alignment opening thereof.

Abstract: An electrical connector (1) for connecting an LGP (12) to a printed circuit board includes a housing having a bottom wall (100), side walls (101) and a number of contacts (11) mounted into the bottom wall. The side walls have a first side wall (1011) including a number of spring plates (104) assembled thereto, and a second side wall (1012) opposite to the first side wall having a guiding portion (102) disposed thereon. A receiving space (105) is defined between the guiding portion and the bottom wall for receiving the LGP.

Abstract: An electrical connector comprising: an insulative housing defining a top surface with a plurality contact terminals planted within the housing; a frame having an rectangle framework securely attaching to the housing defining sidewalls jointly formed a room for receiving an IC package therein, engaging hollows are defined at an pair of opposite corner of the framework and a chamber at a corner of the framework; a compliant biasing device positioned in the said chamber of the corner of framework for positioning the IC package; a thermal control element having alignment pins related to the engaging hollows, said thermal control element pushing the compliant biasing device sliding in the chamber so the compliant biasing device attaching on the IC package to ensure proper and reliable electrical interconnection.

Abstract: An electrical connector assembly comprise a chip module (2) formed a number of protrusions (21) extending outwardly from sidewalls thereof, a bracket (1) comprising a number of receiving sections (11), a number of housings (4) each having a plurality of terminals (5) assembled therein and received in the corresponding receiving section respectively, and each housing (4) disposed a number of supporting members (3) corresponding to the protrusions (21) for interferingly engaging with the protrusions (21) to supporting the chip module (2) thereon.

Abstract: An electrical connector assembly comprise a chip module (2) formed a number of protrusions (21) extending outwardly from sidewalls thereof, a bracket (1) comprising a number of receiving sections (11), a number of housings (4) each having a plurality of terminals (5) assembled therein and received in the corresponding receiving section respectively, and each housing (4) disposed a number of supporting members (3) corresponding to the protrusions (21) for interferingly engaging with the protrusions (21) to supporting the chip module (2) thereon.

Abstract: An electrical connector (100) for connecting a chip module to a printed circuit board comprises an insulative housing (1) of a substantially rectangular shape defining a receiving area (130) with sidewalls therearound, the receiving area (130) defining a number of passageways (1300) therethrough, a number of terminals (3) receiving in corresponding passageways (1300) of the housing (1), wherein at least one detachable datum member (2) is engaged on the housing (1) for providing a datum surface (233) for a chip module received in the housing (1). In assembly, the housing (1) can provide more areas for defining passageways (1300) for receiving the terminals (3), because the datum member (2) is defined detachable with the housing (1). When the passageways (1300) made or the terminals (3) inserted, the datum members (2) are removed from the housing (1) for providing an enlarged space.

Abstract: A system includes a first bus coupler element, a second bus coupler element, and a visual element associated with the second bus coupler element and including a transparent media enabling the second coupler element to be visually aligned with the first coupler element.

Abstract: The electrical connector includes a connector body and an accessing device. The connector body includes an insulation body that receives a plurality of pins and has a multilateral through hole in the middle. The PCB has a positioning frame line that corresponds to the through hole. The accessing device has one or a plurality of holes near the middle of the accessing device and the one or the plurality of holes cover at least one part of the positioning frame's two sides that are not located opposite. The precision of the positioning is enhanced substantially and the welding effect is ensured between the electrical connector and the PCB.

Abstract: A socket connector is provided that includes a housing holding a plurality of electrical contacts. The housing includes a base having a top side and a bottom side. Opposed side walls upwardly extend from the top side of the base. A datum protrusion is formed on each of the side walls. The datum protrusions define a first dimension extending in a first direction and a second dimension extending in a second direction that is perpendicular to the first direction. The first and second dimensions extend from a maximum protrusion on one of the side walls to a maximum protrusion on an opposed side wall. An inspection window is proximate each datum protrusion. The inspection window enables a measurement of the first dimension and the second dimension.

Abstract: A computing system includes a circuit board, a first connector portion electrically connected to the circuit board, an electronic component and a plurality of resilient support members. The electronic component includes a first electronic device, a second connector portion electrically coupled to the electronic device and connected to the first connector portion along an axis. The plurality of resilient support members are asymmetrically located about the axis and extend between the device and the circuit board.

Abstract: A system and method to form a reworkable compression seal between an electronic module and a cap are disclosed. The system and method include an electronic module having a tapered edge configured on at least a portion of the edge defining a perimeter of the electronic module and the cap configured with an opening to receive the electronic module therein. A compression seal is disposed with the cap and is configured to surround one or more chips or other electronic components on the electronic module to form a seal between the electronic module and the cap. A plurality of side loaders are operably coupled to the cap and aligned to receive the tapered edge on the electronic module. Each side loader is configured to engage the tapered edge and provide sufficient compressive force to the compression seal disposed between the electronic module and the cap.

Abstract: An electrical connector (1) for connecting a land grid array (LGA) chip with a printed circuit board (PCB) includes a housing (10), and terminals (11) received in passageways (102) of the housing. The housing defines a base (100) and four sidewalls (12), the base and the sidewalls cooperatively defining a space therebetween for receiving the LGA chip. The base has a multiplicity of passageways along a length thereof, for receiving the corresponding terminals therein. Two adjacent sidewalls each define a resilient beam (13) with an incline surface and joining the sidewall at two ends. A space (15) is defined between the beam and the sidewall. When the LGA chip is placed on the base, the two resilient beams can resiliently act on the chip to ensure reliable engagement between the LGA chip and the connector.

Abstract: A tip end of a stationary terminal section of a contact pin is inserted via a hole of a contact pin supporting plate into a common gap formed by holes, and held there the holes of the first position-restricting plate and the holes of the second position-restricting plate may be slid away from each other in a common plane to grip the end of the stationary terminal section of the contact terminal by the peripheral edges of the holes; the stationary terminal section of the contact terminal may have an engaging portion to be engageable with an open end peripheral edge of the hole in the first position-restricting plate.

Abstract: A packaged device adapter assembly for use with high density integrated circuit packages, e.g., micro lead frame packages, micro lead chip carriers, quad flat no lead packages, and micro ball grid array packages, etc., includes an alignment structure for aligning a packaged device therein.

Abstract: An electronic assembly is provided, with a socket body having a support plane. The support plane supports a surface of a package substrate, especially a contoured package substrate, and thereby limits the extent of travel of springs held by the socket body. Spring fingers are also provided to align the package substrate in x- and y-directions relative to the socket springs. A relief opening is formed to remove a circular chamfer that can inhibit movement of a package substrate up to side surfaces of the socket body.

Abstract: An LGA socket (1) includes a slab like insulative housing (11), a reinforcing plate (12) attached on an exterior surface of the housing, and a clip (14) and a lever (15). The clip and the lever are respectively mounted on two opposite ends of the housing to fasten an LGA package. The lever includes a driver portion (151), a driven portion (152) adjoining the driver portion, and a baffle (124) extending from a side of the reinforcing plate. The baffle prevents the lever from breaking away from the housing. After the LGA package is positioned on the housing, the rigidity of the housing is improved with the reinforcing plate made of rigid material being equipped on the housing. Steady electrical connection between the contacts pads of the LGA package and respective contacts of the housing is ensured.

Abstract: An electrical connector includes a base (2′), a metal clip (3) pivotably engaged on the base, and a lever (4) for fastening the clip onto the base. A floor (232′) is defined in a middle of the base. A rectangular raised support area (23′) is provided around a periphery of the floor. The support area defines four inner side walls (231′). The side walls and the floor cooperatively define a substantially rectangular cavity (230′) therebetween. One of the side walls defines a pair of protrusions (2310′) protruding towards the cavity, wherein the two protrusions are coplanar with each other. The other side walls define a protrusion thereof respectively. Therefore, a first benchmark is obtained by a line joining the pair of protrusions on the side wall, and a second benchmark is determined by a line passing the protrusion on the adjacent and perpendicular side wall, perpendicular to the first benchmark.

Abstract: An electronic assembly is provided, with a socket body having a support plane. The support plane supports a surface of a package substrate, especially a contoured package substrate, and thereby limits the extent of travel of springs held by the socket body. Spring fingers are also provided to align the package substrate in x- and y-directions relative to the socket springs. A relief opening is formed to remove a circular chamfer that can inhibit movement of a package substrate up to side surfaces of the socket body.

Abstract: A tip end of a stationary terminal section of a contact pin is inserted via a hole of a contact pin supporting plate into a common gap formed by holes, and held there.

Abstract: An electrical connector assembly (1) for electrically connecting an electronic package (5) with a circuit substrate. The connector assembly includes an electrical connector (2) and a mounting base (3). The connector defines a pair of spring arms (241) in two adjacent sidewalls (24). The mounting base defines a pair of guiding blocks (321) corresponding to the spring arms. When the connector is put in the mounting base, the spring arms slidably engage with the blocks, and the spring arms are pushed to bent outwardly. Thus the electronic package can be attached on the connector with zero insertion force. Then the connector is removed from the mounting base. The spring arms disengage from the blocks, and resiliently rebound toward their normal positions thereby secure the electronic package in the connector.

Abstract: A KGD carrier holds the IC chip by means of a carrier retaining member and a carrier base assembly. The carrier base assembly includes a carrier body, a carrier base and a substrate. The carrier body is provided with grooves, which are located opposing to pads formed on a peripheral portion of the substrate, to permit the in-and-out motion of contacts of the IC socket. The carrier base is provided with the grooves, which are located opposing to the pads formed on the peripheral portion of the substrate, to permit the in-and-out motion of the contacts of the IC socket. The substrate is interposed between the carrier body and the carrier base so as to enable the pads of the substrate and the corresponding contacts of the IC socket to be electrically connected with each other.

Abstract: A mounting arrangement and a method for preventing a migration of soldering materials from an electric terminal into the body of an electric device via electric contacts that project from the body of the electric device. The mount comprises a platform that is adapted for spacing a base of the electric device from the electric terminal. The method comprises providing a surface of the electrical terminal with a depressed surface portion. The platform at least partially overlays the depressed surface portion and supports the body of the electric device such that the electric contacts project toward the depressed surface portion. Soldering materials are used to electrically connect the electric contact to the depressed surface portion.

Abstract: An IC socket is disclosed which facilitates automatic mounting of an IC package without a fear of lead terminal deformation and reduces the number of steps of assembling contacts into a socket body. The IC socket is an open top type IC socket which includes a socket body; and a cover member mounted vertically movable to the socket body to open and close contacts, wherein the socket body has a mounting portion on which to support an IC package mounted on the socket, and the cover member has a square opening facing the mounting portion and inclined guide wall surfaces leading to the opening and adapted to guide the mounted IC package onto the mounting portion.

Abstract: The electrical connector is provided with a locking member which is disposed on the base housing so that the locking member can move between an open position and a locking position in a direction that is perpendicular to the direction of movement of the slide member. The locking member is positioned in the open position when the slide member is in a first position. Furthermore, when the slide member is in a second position, in which pins of an electronic component and contacts of the electrical connector are in contact, the locking member moves to the locking position and contacts the slide member, so that the movement of the slide member is checked. Furthermore, an engaging part, which engages with a tool that is used to move the locking member, is disposed in the upper surface of the locking member.

Abstract: An IC socket (1) includes a base (10), a cover (11) pivotally mounted to one side of the base, and a plurality of electrical contacts received in the base for electrically connecting with a burn-in board. The base has six projecting members (102) to form a container for receiving an IC therein. The cover includes a frame (110) defining an opening (1101) a middle thereof, and a pressing portion (111). The pressing portion comprises a pair of bearing springs (1110), and a pair of bars (1111) interconnecting corresponding opposite ends of the bearing springs. The bars are embedded in the rear and front sides of the frame, and the bearing springs are located in opposite lateral sides of the opening. When the cover firmly engaging with the base, the bearing springs press the IC on the contacts. The IC socket thus electrically connects the IC with the burn-in board.

Abstract: An electrical connector (2) for connecting a land grid array (LGA) chip (3) with a printed circuit board includes a housing (20) and terminals (21) received in the housing. Two cylindrical posts (201, 202) extend upwardly from diagonally opposite corners of the housing. Two recesses (301, 302) are defined in diagonally opposite corners of the LGA chip. The LGA chip is inserted into the LGA connector, with the recesses interferentially receiving the posts. Thus the LGA chip is securely mounted on the housing, with the posts and the recesses cooperating to precisely position the LGA chip on the LGA connector. This ensures that engagement between contact pads (300) of the LGA chip and the terminals is highly accurate and reliable. Further, the posts are sized differently from each other, and the recesses are correspondingly sized differently from each other. Mismating of the LGA chip with the LGA connector is prevented.

Abstract: A socket for an electrical part is provided with a socket body for accommodating an electrical part and a guide member is provided for the socket body so as to guide side surfaces of a body of the electrical part at the time of the accommodation thereof. The socket body is formed with a number of contact pins so as to be contacted to or separated from an electrode as a terminal of the electrical part. The guide member includes a plurality of guide portions, at least one of the guide portions being disposed so as to correspond to each of all the side surfaces of the electrical part body, respectively, and each of the guide portions has an elastic portion for elastically pressing inward the side surfaces.

Abstract: An apparatus for use in manipulating one or more IC die through testing after they have been cut from the original wafer. A carrier supports the die during the transport, testing, and/or final application. The die is placed into the carrier through an opening and then resides on a ledge lining some portion of the base of the opening. The spring components of the die extend downward through the opening and past the lower side of the ledge to allow for electrical contact. The die may be secured within the carrier opening in a variety of ways, including a cover coupled to the top of the carrier or through use of snap locks in the carrier. One useful cover has openings revealing a portion of the backside of the die. The cover openings allow access to the backside of the die. The carrier can be mounted onto a test bed for testing or a printed circuit board for a specific application. Alternatively, the carrier may first be positioned on the board with the die and the cover subsequently mounted thereon.

Abstract: A sleeve assembly for housing and protecting an electronic chip. The sleeve assembly includes a first sleeve member and a second sleeve member attached to the first sleeve member. The first sleeve member includes at least one substrate engaging member adapted to be inserted into an engaging member hole located on a substrate and at least one chip guiding member adapted to substantially correctly align an electronic chip with a socket when the electronic chip is inserted into the sleeve assembly. Additionally, the at least one engaging member and the at least one chip guiding member extend from a lower surface of the sleeve assembly. The sleeve assembly serves to protect the electronic chip from physical and electrostatic discharge damage during storage as well as after the electronic chip is mated with the socket.

Abstract: A sleeve assembly for housing and protecting an electronic chip. The sleeve assembly includes a first sleeve member and a second sleeve member attached to the first sleeve member. The first sleeve member includes at least one substrate engaging member adapted to be inserted into an engaging member hole located on a substrate and at least one chip guiding member adapted to substantially correctly align an electronic chip with a socket when the electronic chip is inserted into the sleeve assembly. Additionally, the at least one engaging member and the at least one chip guiding member extend from a lower surface of the sleeve assembly. The sleeve assembly serves to protect the electronic chip from physical and electrostatic discharge damage during storage as well as after the electronic chip is mated with the socket.

Abstract: An IC socket is disclosed which facilitates automatic mounting of an IC package without a fear of lead terminal deformation and reduces the number of steps of assembling contacts into a socket body. The IC socket is an open top type IC socket which includes a socket body; and a cover member mounted vertically movable to the socket body to open and close contacts, wherein the socket body has a mounting portion on which to support an IC package mounted on the socket, and the cover member has a square opening facing the mounting portion and inclined guide wall surfaces leading to the opening and adapted to guide the mounted IC package onto the mounting portion.