Abstract: A card edge connector for being retained into a notch of a print circuit board includes an insulative housing defining a central slot extending along a longitudinal direction, a first wall and a second wall located on the opposite sides of the central slot and a fitting portion extending downwardly into the notch from a bottom portion of the first wall, the fitting portion defining a plurality of first terminal slots and the second wall defining a plurality of second terminal slots. A plurality of first terminals are received in the first terminal slots, and a plurality of second terminals are received in the second terminal slots. Each first terminal defines a first retaining portion received in the first terminal slot and a first soldering portion extending out of the housing forwardly, each second terminal defines a second soldering portion rearwardly extending out of the housing.

Abstract: In a plug connection for the direct electrical contacting of contact surfaces on a circuit board, having a plug receptacle associated with the circuit board, into which the circuit board extends, having a plug pluggable into the plug receptacle, which has a contact carrier having contact elements for the direct electrical contacting of the contact surfaces of the circuit board, and having a contact pressure spring device for pressing the contact elements of the contact carrier against the contact surfaces of the circuit board, the contact pressure spring device is provided in the plug receptacle.

Abstract: Embodiments of apparatus, methods, systems, devices, and connectors are described herein for a connector having a longitudinal body configured to mount the connector to a PCB. In various embodiments, a first and a second socket may be respectively disposed at a first side and a second side of the longitudinal body. In various embodiments, the first and second sockets may removably receive a first memory module from a first direction and a second memory module from a second direction opposite to the first direction. In various embodiments, the second side may be opposite to the first side. In various embodiments, on insertion into the first and second sockets, the first and second memory modules may be coplanar and/or equidistant from the PCB along a third direction orthogonal to the first and second directions.

Abstract: Methods and apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a substrate based inductive device which utilizes inserted conductive pins in combination with plated substrates which replace windings disposed around a magnetically permeable core. In some variations this is accomplished without a header disposed between adjacent substrates while alternative variations utilize a header. In another embodiment, the substrate inductive devices are incorporated into integrated connector modules. Methods of manufacturing and utilizing the aforementioned substrate based inductive devices and integrated connector modules are also disclosed.

Abstract: A semiconductor module socket apparatus including a socket main body in which a socket groove corresponding to a semiconductor module is formed; a socket pin mounted in the socket groove of the socket main body so as to be electrically connected to a module pin of the semiconductor module; and a heat radiating member mounted in the socket main body so as to externally radiate heat that is generated in the semiconductor module and then is delivered from the socket groove and the socket pin. According to the semiconductor module socket apparatus, it is possible to prevent the heat generated in the semiconductor module from being delivered to the main board, to increase the heat radiation efficiency, to significantly save an installation space, to reduce the installation costs, and to realize no-noise and no-vibration of the semiconductor module socket apparatus.

Abstract: An interconnect member is provided for electrically connecting an electronic module to a printed circuit. The interconnect member includes a substrate having a module side and an opposite circuit side. Module contacts are held by the substrate. The module contacts are arranged within an array along the module side of the substrate. The module contacts include module mating interfaces that are configured to be electrically connected to the electronic module. Circuit contacts are held by the substrate. The circuit contacts are arranged within an array along the circuit side of the substrate. The circuit contacts include circuit mating interfaces that are configured to be electrically connected to the printed circuit. Electrical components extend between and electrically connect corresponding module contacts to corresponding circuit contacts to provide electrical paths for electrical signals transmitted between the module and circuit contacts.

Abstract: A connector assembly includes a contact module comprising a lead frame having contacts defining separate conductive paths. The contact module also includes a compensation component coupled to selected contacts and affecting signals transmitted along the conductive paths of the selected contacts. The contact module also includes a body overmolded over the contacts and the compensation component.

Abstract: An Active edge connector for memory modules has a base including two PCB sides and a spacer separating the sides, with driver chips mounted on each side of each side, printed wiring electrically connecting a first set of electrical signals from each of the driver chips to a mother board on which the connector is mounted, and printed wiring for electrically connecting a second set of electrical signals from each of the driver chips to a memory module inserted in the edge connector. When a group of connectors are mounted on a mother board, electrical signals arriving at the first connector are routed to its driver chips, producing re-driven signals to the next connector, and so on. A decoder circuit provides addressing signals determining the last such connector to which the signals are intended, and which prevents the signals from going to any connectors containing memories not addressed.

Abstract: An IC socket (1) for receiving an IC package includes a socket body (2), a plurality of contacts (3) received in the socket body (2), and a pick-up cap (4) mounted upon the socket body (2). The socket body (2) has a base section (20) and a plurality of side walls (21) extending upward from the base section (20). At least one side wall (21) defines a top surface (212), an inner surface (210), an outer surface (211) and a pair of datum projections (2100) extending inwardly from the inner surface (210). The side wall (21) with the datum projections (2100) includes a carrying surface (213) and an inclined surface (214) which are formed by excavating the top surface (212). The carrying surface (213) is lower than the top surface (212) for engaging with a carrying portion (400) formed on the pick-up cap (4). The inclined surface (214) is away from the datum projection (2100) with a selected distance therebetween.

Abstract: An IC socket (1) for receiving an IC package includes a socket body (2), a plurality of contacts (3) received in the socket body (2), and a pick-up cap (4) mounted upon the socket body (2). The socket body (2) has a base section (20) and a plurality of side walls (21) extending upward from the base section (20). At least one side wall (21) defines a top surface (212), an inner surface (210), an outer surface (211) and a pair of datum projections (2100) extending inwardly from the inner surface (210). The side wall (21) with the datum projections (2100) includes a carrying surface (213) and an inclined surface (214) which are formed by excavating the top surface (212). The carrying surface (213) is lower than the top surface (212) for engaging with a carrying portion (400) formed on the pick-up cap (4). The inclined surface (214) is away from the datum projection (2100) with a selected distance therebetween.

Abstract: An Active edge connector for memory modules has a base including two PCB sides and a spacer separating the sides, with driver chips mounted on each side of each side, printed wiring electrically connecting a first set of electrical signals from each of the driver chips to a mother board on which the connector is mounted, and printed wiring for electrically connecting a second set of electrical signals from each of the driver chips to a memory module inserted in the edge connector. When a group of connectors are mounted on a mother board, electrical signals arriving at the first connector are routed to its driver chips, producing re-driven signals to the next connector, and so on. A decoder circuit provides addressing signals determining the last such connector to which the signals are intended, and which prevents the signals from going to any connectors containing memories not addressed.

Abstract: The invention includes a device and method providing a return-signal pathway through a circuit board connector. In one embodiment of the invention, a circuit board connector having an integral bypass capacitor provides a return-signal path between the circuit boards without using the ground planes of the circuit boards outside of an area occupied by the connector. The circuit board connector includes first connector reference conductor arranged for coupling with a first circuit-board reference plane, a second connector reference conductor arranged for coupling with a second circuit-board reference plane, and a capacitor coupled between the first and second reference planes.

Abstract: An electronic component pin connector comprising a non-conductive housing with a substrate end and an electronic component connection end, the housing comprising one or more electrical contacts, the or each electrical contact extending from the substrate end to the component connection end to provide one or more electrical contact points to a substrate at the substrate and one or more electrical contact points for a electronic component at the component connection end, the housing comprising a filter aperture extending from the component connection end to the substrate end, the aperture dimensioned to house one or more filters in an electrically connected position to provide filtering of signalling between a substrate connected at the substrate end and a electronic component connected at the component connection end.

Abstract: An adapter for interconnecting a Small Form Factor Pluggable (SFP) transceiver into a receptacle configured to receive a Small Form Factor (SFF) transceiver. The innovative adapter provides an interface for connecting an SFP transceiver to an SFF receptacle (e.g. footprint) on a printed circuit board. This enables manufacturers and customers with printed circuit boards originally designed to receive and interoperate only with SFF transceivers, to replace SFF transceivers with newer SFP transceiver models through the use of the innovative interface described herein.