Providing Direct Contact Between Contacts Of Printed Circuit Board And Different Type Conductors Patents (Class 439/632)
  • Patent number: 10176410
    Abstract: An electronic card connector, defining an insertion direction, an ejection direction, and a transverse direction perpendicular to the insertion direction, includes an insulative housing and a number of terminals retained in the insulative housing. The terminals include a row of first contacts disposed along the insertion direction. Each first contact has a first affixed portion and a first contacting portion located at a peak therein. Each of the first contacts extends along the transverse direction. The first contacting portions of the neighboring first contacts are located offset along the insertion direction. The first contacting portions and associated first affixed portions of the first contacts are distanced differently in the transverse direction.
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: January 8, 2019
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Gang Hu, Guo-Dong Gu, Jin-Guo Qiu, Yong-Qi Wang, Tien-Chieh Su
  • Patent number: 9318850
    Abstract: In an embodiment, a connector such as an edge connector includes a connector housing, a first set of pins configured within the housing and having first ends to couple to corresponding signal lines of a first circuit board and second ends to couple to corresponding signal lines of a mating connector of a second circuit board, and a conductive material adapted to the housing to reduce interference caused by one or more sources of interference. Other embodiments are described and claimed.
    Type: Grant
    Filed: May 23, 2014
    Date of Patent: April 19, 2016
    Assignee: Intel Corporation
    Inventors: Xiang Li, Hao-Han Hsu, Yun Ling, Gong Ouyang, Kai Xiao, Jiangqi He, Lu-Vong T. Phan, Wei Xu
  • Patent number: 9124049
    Abstract: In an embodiment, a micro ethernet connector includes an outer housing that has a recessed front end and a back end. The micro ethernet connector further includes an inner housing that is disposed within the recessed front end of the outer housing. The inner housing has an exposed end. The exposed end includes a recessed channel. The volume of the recessed channel is substantially equal to the volume of a correspondingly shaped protruding printed circuit board of a male micro ethernet connector. A plurality of spring-biased connectors are disposed within the recessed channel of the inner housing.
    Type: Grant
    Filed: March 29, 2013
    Date of Patent: September 1, 2015
    Assignee: Silicon Graphics International Corp.
    Inventor: Peter Siltex Yuen
  • Publication number: 20140218924
    Abstract: A LED strip light connector system for providing a reliable connection between a flexible LED light strip and a connector. The LED strip light connector system generally includes a connector adapted to receive an end of a light strip, and a support member extending outwardly from the connector to support the light strip near the connector. The light strip is attached to the surface of the support member thereby preventing movement of the light strip with respect to the connector.
    Type: Application
    Filed: April 11, 2014
    Publication date: August 7, 2014
    Inventors: James J. Levante, Tanner J. Leland
  • Patent number: 8508949
    Abstract: The invention relates to a multiple micro HF-contact arrangement with HF-connections for passing through or contacting in a housing opening or in a duct, in particular at the transition from coaxial line or microstrip line to a coplanar line. The HF-connection thus comprises at least two circuit boards arranged in a plane which may be connected to each other by means of a planar contact pin on one circuit board and at least one planar socket on the other circuit board.
    Type: Grant
    Filed: August 11, 2008
    Date of Patent: August 13, 2013
    Assignee: Rosenberger Hochfrequenztechnik GmbH & Co. KG
    Inventor: Bernd Rosenberger
  • Patent number: 8371880
    Abstract: A signal transmission medium inserted in a connector main body portion, which can be held and released successfully with a simple configuration, is disclosed. A distal end portion of an elastically-displaceable cantilever-shaped locking arm member formed so as to be integral with a board connection leg portion (holddown) is provided with a locking portion engaged with a portion of the signal transmission medium inserted in the connector main body portion to hold the inserted state. The held state of the signal transmission medium is maintained by elastic action of the locking arm member extending in a relatively-elongated shape from a swinging fulcrum. Simultaneously, an unlocking-action force on the locking portion can be reduced, and an unlocking-operation force is stably received by the board connection leg portion (holddown) fixed to a printed circuit board so that improvement in strength is achieved.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: February 12, 2013
    Assignee: Dai-Ichi Seiko Co., Ltd.
    Inventor: Masao Ishimaru
  • Patent number: 8172587
    Abstract: The card connector can adequately detect the state in which an electronic device such as a memory card to be inserted and removed is fitted, and saves the footprint for mounting the card connector. With this card connector, a card detection switch detects a state in which a memory card is fitted in an accommodating part of a housing through an insertion slot. The card detection switch has movable terminals and fixed terminals, and the movable terminals each have a card contact part which is displaced by being pressed by the memory card to be inserted, and a movable contact part which is displaced in a same direction as a direction in which card contact part is displaced following displacement of the card contact part. The fixed terminals are each arranged in the housing to project in a direction to interest the direction in which the movable contact part is displaced, and is slid against by the movable contact part when the movable contact part is displaced.
    Type: Grant
    Filed: August 5, 2010
    Date of Patent: May 8, 2012
    Assignee: Mitsumi Electric Co., Ltd.
    Inventors: Takeshi Konno, Katsuhiro Hori, Makoto Watanabe
  • Patent number: 7957156
    Abstract: An electrical connection assembly includes a substrate having first and second sides and a substrate aperture formed therein. The substrate is made of an electrically non-conductive material. A busbar is attached to the first side of the substrate. The busbar has a busbar aperture formed therein. A trace is formed on the second surface of the substrate. The busbar and trace are formed of an electrically conductive material. A pin is disposed in both the substrate aperture and the busbar aperture, wherein the pin is in electrical communication with the busbar and the trace.
    Type: Grant
    Filed: August 6, 2007
    Date of Patent: June 7, 2011
    Assignee: Lear Corporation
    Inventor: Antonio Palomo
  • Patent number: 7948761
    Abstract: The present invention provides a technique which can decrease the number of folding times of a flexible printed circuit board in a display device having the structure which can fold the flexible printed circuit board in a compact form by folding the flexible printed circuit board plural times. The display device includes a display panel having substrates, and a flexible printed circuit board having one end thereof fixed to a peripheral portion of a first side of the substrate, wherein the flexible printed circuit board forms an I/F portion on which a plurality of input terminals is formed in the inside thereof in a state that the flexible printed circuit board is developed.
    Type: Grant
    Filed: October 2, 2007
    Date of Patent: May 24, 2011
    Assignee: Hitachi Displays, Ltd.
    Inventor: Fumiaki Komori
  • Publication number: 20090191763
    Abstract: An electrical connector includes a main board (5) with a first card edge connector (1) mounted thereon, a sub-board (6) with a second card edge connector (2) mounted thereon, and a pair of complementary board to board connectors (3, 4) mounted on the main board (5) and the sub-board (6) respectively. The first and second card edge connectors (1, 2) are aligned with each other in a vertical direction and the second card edge connector (2) is on top of the first card edge connector (1).
    Type: Application
    Filed: January 29, 2009
    Publication date: July 30, 2009
    Inventors: Jian-Kuang Zhu, Xiao-Gao Yang, Wei-Hua Pan
  • Patent number: 7495893
    Abstract: A portable computer includes a main body, a keyboard assembly and an interface unit. The main body has a main circuit substrate received in the main body and a main body connector. The interface unit has a plurality of signal pads and a plurality of groups of branch pads split from an end of a line extended from each signal pad into a plurality of branches. The keyboard assembly has a plurality of keyboard signal pins connected to one of either each of the branch pads of each group or the signal pad, and a main body cable unit of which one side is provided with a cable connector connected to the main body connector, and the other side is provided with main body signal pins connected to the other of either each of the branch pads of each group or the signal pad.
    Type: Grant
    Filed: July 13, 2006
    Date of Patent: February 24, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Jae-chun Choi
  • Publication number: 20090047835
    Abstract: A card connector base is mounted on a printed circuit board and has a metal-inserted housing, a pair of hooking assemblies and a card tray. The metal-inserted housing has a metal substrate and an insulative body. The insulative body is mounted securely on the metal substrate by an insert-molding process. The hook assemblies are mounted on the metal-inserted housing. The card tray is detachably mounted slidably in the metal-inserted housing. Because the metal substrate formed from the sheet-metal is thin and has fine structure strength such as tensile strength and compressive strength, the metal-inserted housing with the metal substrate is more compact and more structurally strong when compare to conventional insulative housings.
    Type: Application
    Filed: August 15, 2008
    Publication date: February 19, 2009
    Applicant: Advanced Connectek Inc.
    Inventor: Keng-Liang Lin
  • Publication number: 20090034217
    Abstract: A connector for mounting to a panel is provided that includes a housing that has a front edge configured to be located proximate an opening in the panel. The connector also includes a tab that extends from the front edge of the housing where the tab is oriented to engage an outer surface of the panel. A spring member also extends from the front edge of the housing and is positioned to engage an inner surface of the panel. The spring member is flexible toward and away from the tab.
    Type: Application
    Filed: August 3, 2007
    Publication date: February 5, 2009
    Inventors: Richard Elof Hamner, Matthew Richard McAlonis
  • Publication number: 20080268670
    Abstract: An embodiment of the present invention is a Land Grid Array (LGA) socket. A first L-shaped area has a first center, a first outer long side, and a first outer short side. The first L-shaped area contains a first set of contacts oriented in a first direction. A second L-shaped area has a second center, a second outer long side, and a second outer short side and is located symmetrically to the first L-shaped area. The second L-shaped area contains a second set of contacts oriented in a second direction opposite to the first direction such that pressing a device on the first and second sets of contacts results in approximately zero force and moment.
    Type: Application
    Filed: July 3, 2008
    Publication date: October 30, 2008
    Applicant: INTEL CORPORATION
    Inventor: Tieyu Zheng
  • Patent number: 7375958
    Abstract: A plurality of specific external connecting parts can be short-circuited, without increasing the number of parts and mounting work. A plurality of external connecting parts provided in parallel to each other, and a short-circuit part for short-circuiting edges located at rear end side of each of a first external connecting part and a second external connecting part which separate external connecting parts not short-circuited among the external connecting parts are inserted therebetween are comprised. The short-circuit part is formed by upward or downward bending process, and has a curved part.
    Type: Grant
    Filed: February 15, 2005
    Date of Patent: May 20, 2008
    Assignee: Alps Electric Co., Ltd.
    Inventors: Yoshimasa Kuroda, Yuichiro Ikeda
  • Patent number: 7374088
    Abstract: A portable reader is arranged to read a card. The card is provided with a set of contact areas. The reader is provided with a connector. The connector is provided with a set of contact pads. The portable reader comprises a first and a second holding elements arranged to hold the card so that at least one contact pad of the set contact pads can be connected to at least one contact area of the set of contact areas. At least the one of the holding elements is arranged to be movable.
    Type: Grant
    Filed: October 10, 2003
    Date of Patent: May 20, 2008
    Assignee: AXALTO S.A.
    Inventors: C├ędric Perben, Delphine Begassat, Bruno Blanchard, Tim Lloyd, Jean-Claude Perrin
  • Patent number: 7367845
    Abstract: A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.
    Type: Grant
    Filed: November 16, 2006
    Date of Patent: May 6, 2008
    Assignee: Micron Technology, Inc.
    Inventors: Warren M. Farnworth, David J. Corisis, Salman Akram
  • Patent number: 7338324
    Abstract: A card connector comprises an insulating housing, a plurality of contacts, an ejector and a pressing member. The insulating housing has a rear wall and a pair of arms extending from lateral ends of the rear wall; the ejector is received on one of the arm and comprises a slider movable in a card insertion/ejecting direction, a spring and a guiding pin, the slider defines a heart groove on an outside surface thereof, and the guiding pin and the heart groove forms a locking member to lock the slider in a final position. The pressing member has a retaining portion and a pressing portion, the retaining portion is retained to a bottom surface of the insulating housing by a hot-melt way, the pressing member presses the guiding pin toward the heart groove to prevent the guiding pin from jumping out from the heart groove.
    Type: Grant
    Filed: December 26, 2006
    Date of Patent: March 4, 2008
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hsueh-Lung Hsiao, Wei-Cheng Chang
  • Patent number: 7281952
    Abstract: An edge connector, system, printed circuit board and electronic module are described, which include an edge connector comprised of a substrate, including a first major exterior surface, a second major exterior surface, and a minor exterior surface. The edge connector further includes at least one of a first conductive contact affixed to the first major exterior surface and one of a second conductive contact affixed to the second major exterior surface. Additionally, the edge connector includes at least one third conductive contact conductively coupled to at least a portion of any internal conductive layer of the substrate and the third conductive contact is configured off-plane from the minor exterior surface.
    Type: Grant
    Filed: December 20, 2006
    Date of Patent: October 16, 2007
    Assignee: Micron Technology, Inc.
    Inventor: Thomas H. Kinsley
  • Patent number: 7275965
    Abstract: A testing tool for testing an I/O port includes a cable and a testing card. The cable includes a port formed at one end thereof configured for being connected to the I/O port, and a first connector formed at an opposite end thereof. The testing card includes two testing circuits and a second connector connected to the first connector. The second connector includes a slider shiftable between a first position where the second connector and a testing circuit are interconnected, and a second position where the second connector and the other testing circuit are interconnected.
    Type: Grant
    Filed: June 14, 2006
    Date of Patent: October 2, 2007
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Ping Liu, Li-Ping Chen
  • Publication number: 20070218771
    Abstract: A testing tool for testing an I/O port includes a cable and a testing card. The cable includes a port formed at one end thereof configured for being connected to the I/O port, and a first connector formed at an opposite end thereof. The testing card includes two testing circuits and a second connector connected to the first connector. The second connector includes a slider shiftable between a first position where the second connector and a testing circuit are interconnected, and a second position where the second connector and the other testing circuit are interconnected.
    Type: Application
    Filed: June 14, 2006
    Publication date: September 20, 2007
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Ping Liu, Li-Ping Chen
  • Patent number: 7172465
    Abstract: An edge connector, system, printed circuit board and electronic module are described, which include an edge connector comprised of a substrate, including a first major exterior surface, a second major exterior surface, and a minor exterior surface. The edge connector further includes at least one of a first conductive contact affixed to the first major exterior surface and one of a second conductive contact affixed to the second major exterior surface. Additionally, the edge connector includes at least one third conductive contact conductively coupled to at least a portion of any internal conductive layer of the substrate and the third conductive contact is configured off-plane from the minor exterior surface.
    Type: Grant
    Filed: February 22, 2005
    Date of Patent: February 6, 2007
    Assignee: Micron Technology, Inc.
    Inventor: Thomas H. Kinsley
  • Patent number: 7094108
    Abstract: A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.
    Type: Grant
    Filed: March 27, 2003
    Date of Patent: August 22, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Warren M. Farnworth, David J. Corisis, Salman Akram
  • Patent number: 7049176
    Abstract: In a method of forming a thick-film wiring on a substrate, photosensitive-electroconductive paste is filled into a pattern groove formed on the surface of a light-transmitting intaglio plate. The pattern groove corresponds to a desired thick-film wiring pattern. The photosensitive-electroconductive paste filled in the pattern groove are irradiated with light-rays from the front and back sides of the intaglio plate to cause the paste to harden until the overall peripheral surface of the electroconductive paste has a predetermined hardness. The electroconductive paste hardened in the pattern grooves of the intaglio plate is transferred to an intermediate piece. Then, the electroconductive paste is transferred from the intermediate piece to a substrate. Thereafter, the electroconductive paste is fired, whereby a thick-film wiring is formed on the substrate.
    Type: Grant
    Filed: December 1, 2003
    Date of Patent: May 23, 2006
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Tetsuya Oda, Choichiro Fujii, Etsuo Nishikawa
  • Patent number: 7040930
    Abstract: A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor die to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.
    Type: Grant
    Filed: February 3, 2005
    Date of Patent: May 9, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Warren M. Farnworth, David J. Corisis, Salman Akram
  • Patent number: 7025626
    Abstract: A connector assembly is provided for removably interconnecting first conductors of a flat flexible circuit to a plurality of second conductors without the use of conductive terminals. The assembly includes a male connector having a relatively rigid male body member with an edge about which the flexible circuit is wrapped, and with the first conductors of the circuit facing away from the body member at the edge thereof. An adapter or other female connecting device includes a first receptacle for receiving the male connector inserted edge-first into the first receptacle. A second receptacle receives the second conductors in position for engaging the first conductors of the flexible circuit at the edge of the male body member.
    Type: Grant
    Filed: January 14, 2004
    Date of Patent: April 11, 2006
    Assignee: Molex Incorporated
    Inventors: Robert M. Fuerst, Yves LePottier
  • Patent number: 6926561
    Abstract: A connector assembly includes a substrate assembly and a receptacle. The substrate assembly includes a first substrate layer having a conductive trace that is accessible for direct electrical interconnection with a first conductor associated with another device. A second substrate layer on the assembly includes an electrical contact for electrical interconnection with a second conductor associated with the other device. The electrical contact on the second substrate layer is disposed such that when the substrate assembly is inserted into the receptacle, the electrical contact is electrically connected with the second conductor, a direct electrical interconnection between the conductive trace and the first conductor is maintained. The arrangement is advantageous in that the connector assembly is capable of transmitting low frequency signals through electrical connections that also serve to maintain a high frequency direct electrical interconnection.
    Type: Grant
    Filed: May 7, 2002
    Date of Patent: August 9, 2005
    Assignee: Nortel Networks Ltd
    Inventors: Martin R. Handforth, John J. Stankus
  • Patent number: 6881085
    Abstract: In a connector for a small circuit board, contacting means is formed independently of elastic means that provides contact pressure on the small circuit board when the edge portion of the small circuit board is fitted to the connector. The contacting means comprises for example an insulator film and electrical contacts corresponding to terminals of the plate object. The insulator has first and second surfaces and the electrical contacts are formed on the first surface. The elastic means is for example arranged within a housing of the connector. Within the housing, the second surface of the insulator is fixed on the elastic means, so that the electrical contacts are also arranged on the elastic means via the insulator film. When the edge portion of the small circuit board is accommodated within the housing, the elastic means gives the contact pressure to the edge portion of the small circuit board so that the electrical contacts are connected with the terminals of the small circuit board.
    Type: Grant
    Filed: December 7, 2001
    Date of Patent: April 19, 2005
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Yasufumi Yahiro, Akira Natori, Keiichiro Suzuki
  • Patent number: 6857908
    Abstract: A connector for receiving a plug-in card comprises a carrier which defines a receiving space for the plug-in card, at least one guide hole which is formed in the carrier and which opens in the receiving space, a contact element which is movably arranged in the guide hole, a spring which urges the contact element towards the receiving space, and a conductor path which is electrically connected with the contact element.
    Type: Grant
    Filed: January 21, 2003
    Date of Patent: February 22, 2005
    Assignee: GmbH & Co. KG
    Inventor: Michael Burmeister
  • Patent number: 6796822
    Abstract: A contact module includes: a strip base; and a plurality of first and second protrusions continuously extending from the first and second ends of the base, respectively. The second end is opposite to the first end. The first and second protrusions include the same materials as the base. Each of the first and second protrusions includes first and second contact portions, respectively. The base includes a sheet made of a metal material, an insulating film formed on at least one side of the sheet, and a film including a noble metal material formed on the insulating film. The film forms the first and second contact portions and circuit patterns. The circuit patterns are formed between the first and second contact portions. The first and second contact portions and the circuit patterns integrally form a plurality of contacts. Each of the contacts includes one of the first contact portions, a corresponding one of the second contact portions, and the circuit pattern therebetween.
    Type: Grant
    Filed: March 31, 2003
    Date of Patent: September 28, 2004
    Assignee: Fujitsu Component Limited
    Inventors: Shiho Sato, Takeshi Ito, Noboru Shimizu, Hideo Miyazawa
  • Patent number: 6758696
    Abstract: A modular bare die socket assembly for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.
    Type: Grant
    Filed: March 27, 2003
    Date of Patent: July 6, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Warren M. Farnworth, David J. Corisis, Salman Akram
  • Patent number: 6712630
    Abstract: An electrical connector for establishing an interconnection between the contact pads of a printed circuit board device under test (DUT) and an electrical device. The connector includes a flexible circuit carrying the interconnect between the DUT and pcb, which is moved into position by the inflation of a bladder that changes its form to press the contacts on the flexible circuit onto the contact positions of the DUT. The bladder is constrained to minimize its expansion. The flexible circuit is not constrained except at the point it is mated with the circuit board of the equipment driving the DUT. The path of the flexible circuit is shaped by fixed formers and terminates at the bladder. This avoids impinging on the DUT area outwith the contact zone. The connector includes variants which have a lock to secure the DUT in place and sensors to determine when the DUT is fully inserted.
    Type: Grant
    Filed: June 27, 2000
    Date of Patent: March 30, 2004
    Assignee: Acuid Corporation Limited
    Inventor: Vladimir Nikolayevich Davidov
  • Patent number: 6688911
    Abstract: A connector assembly is provided for removably interconnecting first conductors of a flat flexible circuit to a plurality of second conductors without the use of conductive terminals. The assembly includes a male connector having a relatively rigid male body member with an edge about which the flexible circuit is wrapped, and with the first conductors of the circuit facing away from the body member at the edge thereof. An adapter or other female connecting device includes a first receptacle for receiving the male connector inserted edge-first into the first receptacle. A second receptacle receives the second conductors in position for engaging the first conductors of the flexible circuit at the edge of the male body member.
    Type: Grant
    Filed: December 13, 2000
    Date of Patent: February 10, 2004
    Assignee: Molex Incorporated
    Inventors: Robert M. Fuerst, Yves LePottier
  • Publication number: 20040023558
    Abstract: Interconnected systems of function cards are presented. An interconnected system may include function cards with substantially identical sets of connectors. The interconnected system includes two groups of function cards, where the function cards within a group are parallel to each other but are perpendicular to the function cards of the other group. The function cards have sets of connectors, which form connector arrays. The connector array of one group of the function cards is reciprocal to the connector array of the other group of function cards. This reciprocity makes it possible to couple the two groups of function cards without a printed circuit board or back plane. The connectors can be male or female, and the male and female connectors of a function card can be arranged in various connector groups. The connectors can form checkerboard and other alternated and interchanged arrays.
    Type: Application
    Filed: June 11, 2003
    Publication date: February 5, 2004
    Inventors: Michael L. Fowler, Oscar Freitas, John F. Whalen
  • Patent number: 6627483
    Abstract: A method for mounting an electronic component. In one example of this method, the electronic component is an integrated circuit which is placed against an element of a carrier, such as a frame of a carrier. The electronic component has a plurality of elongate, resilient, electrical contact elements which are mounted on a corresponding first electrical contact pads on the electronic component. The electronic component is secured to the carrier, aNd the carrier is pressed against a first substrate having a plurality of second electrical contacts on a surface of the first substrate. In a typical example of this method, the electronic component is an integrated circuit which is being tested while being held in a carrier. The integrated circuit has been singulated from a wafer containing a plurality of integrated circuits.
    Type: Grant
    Filed: March 1, 1999
    Date of Patent: September 30, 2003
    Assignee: FormFactor, Inc.
    Inventors: Douglas S. Ondricek, David V. Pedersen
  • Patent number: 6612872
    Abstract: A modular bare die socket assembly for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.
    Type: Grant
    Filed: May 30, 2002
    Date of Patent: September 2, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Warren M. Farnworth, David J. Corisis, Salman Akram
  • Patent number: 6478627
    Abstract: A modular bare die socket assembly for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.
    Type: Grant
    Filed: June 7, 2001
    Date of Patent: November 12, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Warren M. Farnworth, David J. Corisis, Salman Akram
  • Patent number: 6402556
    Abstract: An improved flexible circuit connector that is particularly useful in connections for circuit boards has a housing and a circuit card engaging assembly mounted therein. The circuit card engaging assembly includes at least two contact spring members having a U-shaped portion adjoining a body portion thereof such that when the two contact spring members are brought together at their body portions, a U-shaped channel is formed that supports two lengths of flexible circuity close to the surface and edge of a circuit board inserted into the connector channel.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: June 11, 2002
    Assignee: Molex Incorporated
    Inventors: Harold Keith Lang, Martin Uche Ogbuokiri, Steve Anil Shah, Gregory D. Spanier, Irvin R. Triner
  • Patent number: 6346012
    Abstract: The present invention discloses a direct-current (DC) electric connector that includes plurality of conductive and insulation layers constituting a near-zero inductance connector. The connector further includes a top and a bottom insulation-and-protection covers covering and protecting the plurality of conductive and insulation layers. The top and bottom insulation-and-protection covers having a tapered outer surface for providing a tapered profile along a horizontal direction toward a connector opening for receiving a printed circuit board into the near-zero inductance connector. The connector further includes a locking cartridge for adaptively enclosing the near-zero inductance connector with the printed circuit board inserted therein. The locking cartridge has top and bottom surfaces each engages the top and bottom insulation-and-protection covers respectively for horizontally pushing toward a direction having a gradually increased profile height for generating a vertical pressing force.
    Type: Grant
    Filed: February 23, 2000
    Date of Patent: February 12, 2002
    Assignee: Delta Electronics, Inc.
    Inventors: Bruce C. H. Cheng, Timothy Chen-Yu Yu, Kelly Jui-Yuan Shyu, Szu-Lu Huang
  • Patent number: 6319065
    Abstract: A modular bare die socket assembly for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.
    Type: Grant
    Filed: January 20, 2000
    Date of Patent: November 20, 2001
    Assignee: Micron Technology, Inc.
    Inventors: Warren M. Farnworth, David J. Corisis, Salman Akram
  • Publication number: 20010036771
    Abstract: A modular bare die socket assembly for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.
    Type: Application
    Filed: June 7, 2001
    Publication date: November 1, 2001
    Inventors: Warren M. Farnworth, David J. Corisis, Salman Akram
  • Publication number: 20010014556
    Abstract: A packaging and interconnection of a contact structure formed of a contact structure made of conductive material and formed on a contact substrate through a photolithography process, a contact trace formed on the contact substrate and electrically connected to the contact structure at one end, and the other end of the contact trace is provided with a contact pad for establishing packaging and interconnection from an upper surface thereof, a printed circuit board (PCB) pad provided on a printed circuit board (PCB) substrate to be electrically connected with the contact pad, an elastomer provided under the contact substrate for allowing flexibility in the interconnection and packaging of the contact structure, and a support structure provided between the elastomer and the PCB substrate for supporting the contact structure, contact substrate and elastomer.
    Type: Application
    Filed: January 18, 2001
    Publication date: August 16, 2001
    Inventors: Mark R. Jones, Theodore A. Khoury
  • Patent number: 6116957
    Abstract: An electrical connector (10) for interconnecting discrete circuits on a first circuit board (14) with discrete circuits on a second circuit board (16), includes an insulating housing (18) having a series of contact members (20) arranged in side by side cavities (22). Each contact member (20) has a straight shank (130) that is only partially supported by the floor (32) of the housing. The shank (130) has a first beam (136) at one end and a second beam (138) at the other end, each end of which has a respective one of first and second contacts (140, 142) attached thereto. Each contact terminates in a pre-load member (144, 146) that is formed parallel to the shank and slidingly extends into a recess (120) in the housing. Each pre-load member (144, 146) includes a latch surface (168) that abuts against a stop surface (124) formed in the housing (18) to limit movement of the contacts and thereby provide a desired pre-load to each contact (140, 142).
    Type: Grant
    Filed: December 17, 1997
    Date of Patent: September 12, 2000
    Assignee: The Whitaker Corporation
    Inventors: Scott Keith Mickievicz, Scott Anthony Faulkner, Edmund Luther Jacobs
  • Patent number: 6093061
    Abstract: An electrical connector includes a housing having a cavity which holds a pair of terminal inserts. Each of the terminal inserts includes a respective molding which holds a respective plurality of terminals. The moldings have respective latch arms which latchably secure the terminal inserts together to form a terminal insert subassembly which is inserted into the cavity as a unit. The latch arms have latch tabs which are cooperable with the housing to secure the terminal insert subassembly in the housing. The terminals in one of the terminal inserts are laterally staggered with respect to the terminals in the other of the terminal inserts.
    Type: Grant
    Filed: July 31, 1998
    Date of Patent: July 25, 2000
    Assignee: The Whitaker Corporation
    Inventors: Laura L. Varsik, Ronald D. Sizemore, Randy G. Simmons
  • Patent number: 6089920
    Abstract: A modular bare die socket assembly 10 for attaching a plurality of miniature semiconductor dice 18 to a substrate. The socket assembly 10 is comprised of a plurality of two-sided plates 14 joined vertically in a horizontal stack, wherein each plate 14 has a die socket 22 for the removable insertion of a bare semiconductor die 18. A multi-layer interconnect lead tape 50 has a plurality of lithographically formed leads bent on one end to form nodes 88 for attachment to bond pads 90 on the removably inserted semiconductor die 18, and having opposing ends 92 connectable to the substrate.
    Type: Grant
    Filed: May 4, 1998
    Date of Patent: July 18, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Warren M. Farnworth, David J. Corisis, Salman Akram
  • Patent number: 6077124
    Abstract: A female connector is adapted for electrically interconnecting the conductors of a flat flexible circuit to the conductors of a complementary mating connecting device. The connector includes a female housing having wall portions defining a cavity for receiving the flexible circuit. The wall portions are relatively movable between an open condition allowing a yieldable backing structure to be assembled on a cavity-side of at least one of the wall portions and a closed condition defining the cavity. The yieldable backing structure resiliently biases the conductors of the flexible circuit received in the cavity against the conductors of the mating connecting device when the connector is mated with the device.
    Type: Grant
    Filed: October 10, 1997
    Date of Patent: June 20, 2000
    Assignee: Molex Incorporated
    Inventors: Harry N. Etters, Robert M. Fuerst, Russell J. Watt
  • Patent number: 6053746
    Abstract: A first terminal portion constructed by a plurality of contact pins of a first circuit board and a second terminal portion constructed by a plurality of contact pins of a second circuit board are joined in a housing of a connector. The connector has a presser for applying a pressing force to a joint portion. The presser applies the pressing force, thereby joining the plurality of contact pins of the first terminal and the plurality of contact pins of the second terminal through soft metal projections. Thus, a joint area of the contact terminal portion can be increased and the reliability of the joining can be improved. Since the circuit boards are positioned, the terminal portions of the circuit boards can be accurately joined.
    Type: Grant
    Filed: August 26, 1997
    Date of Patent: April 25, 2000
    Assignee: Canon Kabushiki Kaisha
    Inventor: Tetsuo Yoshizawa
  • Patent number: 6027363
    Abstract: A connector (10,10A) is provided for electrically interconnecting the conductors (12) of a flat flexible circuit (14)to the conductors of a complementary mating connecting device. The connector includes a body member (22) on which a first length (14a) of the flexible circuit (14) is fixed. A second length (14b) of the circuit extends away from the body member. A resilient strain relief component (33) on the body member (22) is engageable with the flexible circuit (14) to locate the second length (14b) of the flexible circuit in a plane offset from the plane of the first length (14a) of the circuit. Therefore, pulling forces on the second length (14b) of the flexible circuit away from the body member biases the circuit against the resilient strain relief component (33). The body member may be a two-part housing (46) relatively movable between open and closed positions. A flexible molded-in-place (56) hinge joins the housing parts to accommodate their movement.
    Type: Grant
    Filed: April 22, 1998
    Date of Patent: February 22, 2000
    Assignee: Molex Incorporated
    Inventors: Russell J. Watt, Robert M. Fuerst, Yves LePottier
  • Patent number: 6012928
    Abstract: A circuit card connector that utilizes flexible circuitry includes an elongated base, a pair of cradle spring members supported on the base, and a pair of contact springs movably supported on the cradle spring members. The cradle spring members include a plurality of reset arms that extend upwardly therefrom into contact with the undersides of the flexible circuitry. The flexible circuitry includes an apertured ground plane layer spaced apart from and located beneath the signal face layer. The apertures in the ground plane layer increase its flexibility especially at the interconnection interfaces to increase the compliance of the connector.
    Type: Grant
    Filed: August 28, 1998
    Date of Patent: January 11, 2000
    Assignee: Molex Incorporated
    Inventors: John E. Lopata, Jeremy Martin, Dennis Pak, Gregory David Spanier, Paul Quang Vo
  • Patent number: 5971806
    Abstract: A connector for connecting electrical conductor areas of flexible circuits with associated conductor pads of an edge connector portion of a circuit board, comprising a connector housing having a circuit board opening sized to at least partially accommodate the edge connector portion, and a further opening allowing passage of the flexible circuits into an interior cavity of the connector housing. A first spring and second spring each have a resilient arched feature for supporting one of the flexible circuits to resiliently bias an electrical conductor area of the associated flexible circuit into electrical contact with associated conductor pads when the connector engages the edge connector portion. The electrical conductor areas of the flexible circuits face each other.
    Type: Grant
    Filed: November 26, 1997
    Date of Patent: October 26, 1999
    Assignee: Berg Technology, Inc.
    Inventors: Robert F. Evans, Jose L. Ortega