Between Parallel Conductors Patents (Class 439/90)
  • Patent number: 10542978
    Abstract: The present disclosure provides a powered surgical instrument including a housing defining an inner cavity therein; at least one internal component disposed within the housing; and potting material injected into the inner cavity encapsulating at least a portion of the at least one internal component.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: January 28, 2020
    Assignee: Covidien LP
    Inventors: Matthew Chowaniec, Xingrui Chen, Michael Zemlok
  • Patent number: 9313885
    Abstract: Disclosed is a flexible flat cable including an incision section including a cutting line, a connection section including a conductive line exposure end portion, and a transition section to connect the incision section with the connection section. Plural conductive lines are arranged with a pitch interval of 0.5 mm to form one conductive line group, and plural conductive line groups are arranged with an interval of 1.0 mm, such that the cutting line is in a space having the interval of 1.0 mm between the conductive groups. The conductive lines are collected at an end portion side of the incision section in the transition section, and the connection section includes a linear section which the conductive lines extending from an end portion of the transition section extend while being spaced apart from each other with a pitch of 0.5 mm and a conductive line exposure part exposed to an outside.
    Type: Grant
    Filed: October 15, 2013
    Date of Patent: April 12, 2016
    Inventor: Misook Ji
  • Patent number: 9099967
    Abstract: An audio source device has an audio connector to which an external load can be connected. An audio signal is amplified and then driven through the connector, wherein the amplification process uses feedback from the return pin of the connector. The return pin is directly connected to a ground break resistor circuit. The ground break resistor circuit is connected between the return pin of the audio connector and circuit ground. A determination is made as to whether the connected external load has a low impedance or a high impedance. When a low impedance load is detected, such as a headset, the ground break resistor circuit is essentially short-circuited. When a high impedance load is detected, the ground break resistor circuit is maintained and its value is set in accordance with the detected load. Other embodiments are also described.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: August 4, 2015
    Assignee: Apple Inc.
    Inventors: David C. Breece, III, Nathan Johanningsmeier, Cara S. Yang
  • Publication number: 20130252445
    Abstract: Examples of electrical connectors that incorporate electromagnetic interference (EMI) absorbing materials are described. In one example, an electrical connector includes a first pair of conductors, a second pair of conductors, and electromagnetic interference (EMI) absorbing material at least partially separating the first pair of conductors from the second pair of conductors. Each of the first and second pairs of conductors defines one of a differential pair or a signal conductor/ground pair. The EMI absorbing material may be configured to attenuate, primarily by absorption, an electromagnetic field generated due to transmission of electrical signals via one of the first pair and second pair of conductors to reduce the electromagnetic inference from the electromagnetic field on the other of the first pair and second pair of conductors.
    Type: Application
    Filed: December 8, 2011
    Publication date: September 26, 2013
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventor: Alexander W. Barr
  • Patent number: 7618266
    Abstract: The anisotropically conductive connector 36 of the present invention includes an anisotropic sheet 102 made up of conducting path forming parts 69 to electrically connect an electrode 101 of an electronic component 33 with an electrode for inspection of a circuit substrate 12 for inspections and of an anisotropically conductive film to insulate the conducting path forming parts 69 and a positioning member 103 connected between the anisotropically conductive sheet 102 and electronic component 33 and having an aperture portion in a position corresponding to the conducting path forming part 69, wherein the positioning member 103 has an insulating layer formed in a location surrounding a perforated metallic member and, when the electrode 101 is fitted into the aperture portion 107, the electrode 101 is guided into the conducting path forming parts 69.
    Type: Grant
    Filed: December 19, 2006
    Date of Patent: November 17, 2009
    Assignee: JSR Corporation
    Inventors: Daisuke Yamada, Kiyoshi Kimura
  • Patent number: 7456483
    Abstract: A bond portion for bonding the principal plane of a solid-state imaging element with a transparent covering portion and configuring a hollow portion therebetween is provided with: a first opening end portion on the hollow portion side; a second opening end portion on the outer side; and a trap portion. The first opening end portion, the trap portion and the second opening end portion constitute a vent path. The vent path is shaped not to connect the first opening end portion with the second opening end portion linearly but to connect the opening end portions in the bond portion via the trap portion larger than the opening end portions.
    Type: Grant
    Filed: May 9, 2005
    Date of Patent: November 25, 2008
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Hiroaki Tsukamoto, Kazuya Fujita, Takashi Yasudome
  • Patent number: 7229296
    Abstract: A contact device for enhancing the conductance of an electrical connection which includes two conductors (21 and 23) in contact with each other essentially including an interposed conductive element arranged between the two contact surfaces (22 and 24) of the two conductors (21 and 23) of the connection. The interposed conductive element is made of electrically conductive foam (10) which includes one or more materials with high porosity and deformability so as to reduce the electrical resistance of the connection.
    Type: Grant
    Filed: November 20, 2003
    Date of Patent: June 12, 2007
    Assignee: AMC S.a.r.l.
    Inventor: Michel Pillet
  • Patent number: 7001191
    Abstract: A conductive contact element is characterized by molding and curing a conductive silicone rubber composition comprising (A) 100 parts by weight of an organopolysiloxane having at least two aliphatic unsaturated groups represented by the average compositional formula (1): R1nSiO(4-n)/2??(1) wherein R1 is each independently a substituted or unsubstituted monovalent hydrocarbon group, and n is a positive number of 1.98 to 2.02, (B) 300–700 parts by weight of a granular silver powder having a tap density of up to 2.0 g/cm3 and a specific surface area of up to 0.7 m2/g, and (C) an effective amount to cure component (A) of a curing agent for component (A).
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: February 21, 2006
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventor: Koji Nishizawa
  • Patent number: 6579116
    Abstract: Modular plugs and jacks connect data signal transmission cables to computer components are provided with cross-talk reducing members surrounding or between parallel or near parallel sections of conductors in the plugs and jacks. Each cross-talk reducing member includes a dielectric body surrounding an irregular three dimensional conductive lattice made of a plurality of straight conductive carbon fiber rods. The lattice reduces cross-talk between signal conductors in the plugs and jacks.
    Type: Grant
    Filed: March 12, 2001
    Date of Patent: June 17, 2003
    Assignee: Sentinel Holding, Inc.
    Inventors: Robert J. Brennan, Randy K. Schwartz, Justin S. Wagner
  • Patent number: 6340798
    Abstract: A printed circuit board includes a first wiring line and a second wiring line spaced apart from the first wiring line. The first wiring line has a first portion having a surface which faces the second wiring line and is smaller in area than that of the second portion, so that a crosstalk noise between the first portion of the first wiring line and the second wiring line can be reduced.
    Type: Grant
    Filed: August 1, 2000
    Date of Patent: January 22, 2002
    Assignee: Fujitsu Limited
    Inventor: Kazuhiko Tokuda
  • Patent number: 4720269
    Abstract: A modular jack for a telephone set comprises a hollow housing having an elastomeric contact member extending across at the junction of the end wall and the bottom wall. The contact member has a plurality of parallel conductive contact members on its surface positioned to make contact with terminals of a modular plug. The contact members also extend out of the housing to make contact with a circuit pattern on a circuit board on which the jack is mounted.
    Type: Grant
    Filed: March 10, 1987
    Date of Patent: January 19, 1988
    Assignee: Northern Telecom Limited
    Inventors: Steve W. Haskins, John R. McFarland