Abstract: The invention relates to a hydraulic expanding chuck for gripping a tool, for example a drill or a milling tool, comprising: a clamping part having an expansion sleeve having a central receiving opening for receiving and clamping the tool; and a connection part, in particular having a HSK connection. According to the invention, the expansion sleeve has at least two pressure chambers, which are designed to run around the central receiving opening, which are arranged at an axial distance relative to one another, and which can bulge when the tool received in the central receiving opening is subjected to fluid pressure. The at least two pressure chambers are connected to one another by a fluid channel.

Abstract: Receiving arrangements for receiving camshafts and methods for grinding machining camshafts may be used with camshafts that have a shaft body that extends along an axis of rotation and includes functional elements. A gearwheel may be mounted on the shaft body, wherein a receiving body is provided, by means of which the camshaft can be at least partially received for purposes of performing a grinding machining process. The gearwheel may include a receiving means onto which the receiving body can be engaged and by way of which it is made possible for the camshaft to be received by the receiving body.

Abstract: A retainer ring structure for a chemical-mechanical polishing (CMP) machine includes: a upper ring made of metal and having a plurality of bolt holes formed on the top surface thereof and coupled to a head of the CMP machine; and a lower ring made of resin and having a coupling groove formed in the center thereof and coupled to the upper ring, wherein the upper ring and the lower ring are coupled to each other such that the top surface of the upper ring and the circumferential top surface of the lower ring are positioned on the same plane.

Abstract: A retainer ring structure for a chemical-mechanical polishing (CMP) machine includes: an insert ring made of metal and having a plurality of holes formed at the top surface thereof and coupled to a head of the CMP machine; an insert pin made of resin, including a body having a hollow portion of which the top surface is opened and one or more elongated grooves formed at side surfaces thereof in a longitudinal direction, and press-fitted into a hole of the insert ring so as to be subjected to a tapping process; and an outer ring formed to surround the insert pin and the insert ring.

Abstract: The present invention provides a polishing head including: an annular rigid ring; an elastic film bonded to the rigid ring; and an upward and downward movable mid-plate, the mid-plate defining a first sealed space together with the rigid ring and the elastic film; an incompressible fluid enclosed in a sealed space; and a mid-plate positioning device for adjusting vertical position of the mid-plate, to hold a back surface of a workpiece on a lower surface of the elastic film and polish a front surface by bringing the front surface into contact with a polishing pad attached to a turn table, wherein the mid-plate can adjust a shape of the lower surface of the elastic film by adjusting the vertical position of the mid-plate. The polishing head polishes a workpiece without generating surface defects on the workpiece surface and easy detachment of the workpiece from a polishing pad after polishing.

Abstract: A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

Abstract: The invention discloses a device (10) for clamping particularly an eye glass lens blocked on a block piece for processing and/or coating said eye glass lens, comprising a receiving space (34) having a center line (M) for a clamping section of the block piece, and a plurality of clamping surfaces (36) provided in a boundary region of the receiving space, which may optionally be engaged in the clamping section of the block piece in order to clamp the block piece. In order to avoid excessive deformation of the clamped block piece, the clamping surfaces are positioned opposite of each other in pairs at a radial distance to the center line and can be displaced optionally toward or away from each other by a clamping piece (38) in order to clamp the clamping section of the block piece by way of clamping forces (F), which are substantially oriented in a tangential direction at a radial distance to the center line, or in order to release the block piece.

Abstract: A processing end point detection method detects a timing of a processing end point (e.g., polishing stop, changing of polishing conditions) by calculating a characteristic value of a surface of a workpiece (an object of polishing) such as a substrate. This method includes producing a spectral waveform indicating a relationship between reflection intensities and wavelengths at a processing end point, with use of a reference workpiece or simulation calculation, based on the spectral waveform, selecting wavelengths of a local maximum value and a local minimum value of the reflection intensities, calculating the characteristic value with respect to a surface, to be processed, from reflection intensities at the selected wavelengths, setting a distinctive point of time variation of the characteristic value at a processing end point of the workpiece as the processing end point, and detecting the processing end point of the workpiece by detecting the distinctive point during processing of the workpiece.

Abstract: A polishing apparatus polishes a substrate by bringing the substrate into sliding contact with a polishing surface. The polishing apparatus includes: a substrate holder having a substrate holding surface configured to press the substrate against the polishing surface, a retaining ring coupled to the substrate holding surface and configured to surround the substrate, wherein the retaining ring is brought into contact with the polishing surface during operation of the polishing apparatus, the retaining ring being configured to be tiltable independently of the substrate holding surface; a rotating mechanism configured to rotate the substrate holder about its own axis; and at least one local load exerting mechanism configured to exert a local load on a part of the retaining ring in a direction perpendicular to the polishing surface, the at least one local load exerting mechanism being arranged so as not to move in accordance with the substrate holder.

Abstract: A centering machine for, in particular, optical lenses has two centering spindles. The rotationally drivable centering spindle shafts are axially aligned with respect to a centering axis and constructed at the ends for the mounting of clamping bells. A stroke device axially adjusts one centering spindle shaft relative to the other centering spindle shaft along the centering axis for alignment of the lens between the clamping bells. A clamping device applies to a centering spindle shaft a clamping force clamping the aligned lens. At least one processing unit is movable relative to the centering axis, with a tool for edge processing of the clamped lens. In order to enable an optimized bell clamping process, the stroke device and the clamping device and/or a rotary drive for the axially adjustable centering spindle shaft are arranged coaxially with respect to the centering axis.

Abstract: A carrier assembly includes carrier protrusions extending outward from a base plate front face, one protrusion for each wafer to be polished. Each carrier protrusion has a front face separated from the base plate front face. An optional detachable ring may surround each protrusion front face to form a cavity for holding a wafer. In some examples of a carrier assembly, a frame having a separate aperture for each carrier protrusion holds all the detachable rings against the base plate front face. In other examples of a carrier assembly, the detachable rings are omitted, or a separate retaining ring for each carrier protrusion replaces the frame. A carrier protrusion may optionally be formed with edge relief to allow part of the wafer to deflect away from a polishing pad during polishing. A compressible elastic material may optionally be placed between a wafer and a carrier protrusion.

Abstract: A grinding method of grinding the back side of a workpiece having a projection on the front side thereof. The grinding method includes a holding jig preparing step of preparing a holding jig having a circular recess and an annular projection surrounding the circular recess, a setting step of setting the workpiece in the circular recess of the holding jig with the back side of the workpiece exposed, a liquid curing agent supplying step of supplying a liquid curing agent into the circular recess (either before or after the setting step), a fixing step of curing the liquid curing agent with the workpiece set in the circular recess and the liquid curing agent present in the circular recess, thereby fixing the workpiece in the circular recess, and a grinding step of grinding the back side of the workpiece and the annular projection of the holding jig by using grinding means.

Abstract: A carrier head for chemical mechanical polishing that has a base, a mounting assembly connected to the base having a surface for contacting a substrate, and a retaining ring secured to the base. The retaining ring can include perfluoroalkoxy, polyetherketoneketone, polybenzimidazole, a semi-crystalline thermoplastic polyester, or a long molecular chain molecule produced from poly-paraphenylene terephthalamide.

Abstract: In one embodiment, an electrode polishing assembly may include an electrode securing platen, a plurality of electrode locating fasteners, and an electrode. Each of the electrode locating fasteners may include an electrode spacing shoulder, a variance cancelling shoulder extending from the electrode spacing shoulder, a threaded platen clamping portion extending from the variance cancelling shoulder, and a threaded nut that engages the threaded platen clamping portion. The electrode locating fasteners clamp the electrode securing platen between the threaded nut and the electrode spacing shoulder. The variance cancelling shoulder is at least partially within one of a plurality of variance cancelling passages of the electrode securing platen. A minimum position stack-up is equal to a minimum passage size minus a maximum shoulder size. A maximum position stack-up is equal to a maximum passage size minus a minimum shoulder size. The maximum position stack-up is greater than the minimum position stack-up.

Abstract: A double side polishing apparatus comprises an upper polishing plate and a lower polishing plate for polishing both sides of a wafer; a plurality of carriers, each including a center plate and a circumferential plate, the center plate having a mounting hole where the wafer is mounted, the circumferential plate having a fitting hole where the center plate is fitted and a gear part formed along the outer periphery thereof, the center of the mounting hole being eccentric from the center of the center plate, the center of the fitting hole being eccentric from the center of the circumferential plate; and a sun gear and an internal gear engaged with the gear part to transmit a rotational force to the plurality of carriers, wherein a fitting direction of a center plate into a fitting hole is adjustable for at least two carriers among the plurality of carriers.

Abstract: The present invention facilitates with high accuracy the adjustment of a minute angle degree, and also is capable of sufficiently securing the rigidity of the whole device after the adjustment and provides good operability, accuracy, and rigidity. Provided are a workpiece attaching body having a workpiece attaching surface and a rotating body rotatably supporting the workpiece attaching body.

Abstract: To facilitate with high accuracy adjustment of a minute angle degree and also to sufficiently secure the rigidity of a whole device after the adjustment.

Abstract: A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.

Abstract: Crankshaft rod bearings are pre-ground and finish-ground in a first grinding station and the crankshaft main bearings are then pre-ground and finish-ground in a second grinding station. The crankshaft is first mounted centered between the two points of the rotary drive. The chuck has two support members which can be moved in the radial direction and which are then positioned against the main bearing in a self-equalizing manner. In the engaged position, the support members are locked tightly to the chuck by locking pins. A pivoting clamping member is then clamped with the operating end thereof against the main bearing.

Abstract: Provided are magnetically actuated wafer chucks that permit a wafer to be clamped or unclamped at any time during a process and at any rotational speed, as desired. Such wafer chucks may include constraining members that are movable between open and closed positions. In a closed position, a constraining member aligns the wafer after wafer handoff and/or clamps the wafer during rotation to prevent it from flying off the chuck. In an open position, the constraining member moves away from the wafer to allow liquid etchant to flow from the wafer edge without obstruction. The constraining members may be, for example, cams, attached to arms or links of the chuck. The cams or other constraining members move between open and closed positions by self-balancing forces including a first force, such as a spring force, that acts to move a cam in a first direction, and a non-contact actuate-able force, such as a magnetic force, that acts to move the cam in the opposite direction.

Abstract: Provided is a noncontact apparatus for performing rotating process to a subject to be processed, without contaminating environment in an airtight container. A spin head (1) is held on a holder (7) in an airtight container, a pinning force is generated between the spin head (1) and a Type-II superconductor (11), and the spin head 1 is floated by lifting the Type-II superconductor (11) by a lifting means (22). Then, rotating force generated by a noncontact rotating power transmitting body (18) arranged in the internal center of the Type-II superconductor (11) is subsequently generated on the side of the spin head (1) and the spin head (1) is rotated in conjunction with a driving motor (19).

Abstract: An outer member and an inner member constituting a wheel bearing device are assembled and the brake rotor is fixed to the hub ring of the inner member. In this state, the pad slide surfaces of the brake rotor are lathed with the reference provided by a wheel pilot end surface. Alternatively, the wheel pilot end surface of the hub ring by chucking the knuckle pilot of the outer member with the wheel bearing device put in its assembled state, and the pad slide surfaces of the brake rotor are lathed with the reference provided by the wheel pilot end surface.

Abstract: An improved retaining ring used for chemical mechanical polishing of substrates, such as semiconductor wafers, to hold a substrate in place during the polishing process. The retaining rings are configured with inserts through which fasteners are positioned to securely affix the retaining ring to the polishing head. The inserts assist in dissipating the force of the fasteners, thereby allowing a more uniform polishing surface. The opening through which the fastener is positioned may be configured with concave or convex side walls to assist in dissipating the force of the fasteners during installation of the retaining ring or the polishing process.

Abstract: A substrate holding apparatus has a substrate holder body with a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.

Abstract: A grinding apparatus for grinding workpieces includes two clamping rods and a base. Each of the two clamping rods has a first end and an opposite second end. The first ends are opposite to each other for clamping workpieces therebetween. The base includes a receiving groove for receiving the workpieces therein and two positioning slots at opposite sides of the receiving groove. The positioning slots are aligned with each other and configured for receivingly engaging with the clamping rods to align the clamping rods with each other.

Abstract: A glass polishing system includes a lower unit capable of rotating a glass placed at a fixed position, an upper unit capable of contacting with the glass and being passively rotated due to the rotation of the glass, and a moving unit for moving the upper unit in a horizontal and/or vertical direction. The upper unit includes a platter installed to a spindle of the moving unit, a separative platter separatably installed to the platter and having a polishing pad contacting with the glass, and a vacuum chuck for fixing the separative platter with respect to the platter by means of vacuum.

Abstract: An apparatus comprises a flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus. The membrane comprises an outer surface providing a substrate receiving surface, wherein the outer surface has a central portion and an edge portion surrounding the central portion, wherein the central portion has a first surface roughness and the edge portion has a second surface roughness, the first surface roughness being greater than the second surface roughness.

Abstract: The partial contact wafer retaining ring apparatus is disclosed. For example, one disclosed embodiment provides a wafer retaining ring comprising a ring for retaining the wafer, the ring having an inner diameter surface configured to restrict lateral wafer motion, and at least one interface surface configured to interface with a polishing surface. The interface surface comprises a recessed section adjacent to the ring inner diameter, configured to preclude contact between the recessed section and the polishing surface.

Abstract: The present invention is a planar template for a CMP tool polishing head possessing a means of securing a wafer in CMP polishing where the back surface of the template is held to the polishing head by retaining means and a method for using the planar template.

Abstract: The present invention is a polishing head provided with an annular rigid ring, a rubber film bonded to the rigid ring with a uniform tension, a mid plate joined to the rigid ring and forming a space portion together with the rubber film and the rigid ring, and an annular template provided concentrically with the rigid ring in a peripheral portion on a lower face part of the rubber film and having an outer diameter larger than an inner diameter of the rigid ring, in which a pressure of the space portion can be changed by a pressure adjustment mechanism, a back face of a work is held on the lower face part of the rubber film, and a surface of the work is brought into sliding contact with the polishing pad attached onto a turn table for performing polishing, and an inner diameter of the template is smaller than an inner diameter of the rigid ring, and a ratio between an inner diameter difference between the rigid ring and the template and a difference between the inner diameter and an outer diameter of the templ

Abstract: A carrier head for a chemical mechanical polishing apparatus includes a retaining ring having a flexible lower portion and a rigid upper portion.

Abstract: A polishing apparatus (1) has a polishing pad (22), a top ring (20) for holding a semiconductor wafer (W), a vertical movement mechanism (24) operable to move the top ring (20) in a vertical direction, a distance measuring sensor (46) operable to detect a position of the top ring (20) when a lower surface of the top ring (20) is brought into contact with the polishing pad (22), and a controller (47) operable to calculate an optimal position of the top ring (20) to polish the semiconductor wafer (W) based on the position detected by the distance measuring sensor (46). The vertical movement mechanism (24) includes a ball screw mechanism (30, 32, 38, 42) operable to move the top ring (20) to the optimal position.

Abstract: A substrate holding apparatus has a substrate holder body with a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.

Abstract: An abrasive flow apparatus for polishing a workpiece wherein a horizontal machine tool is adapted such that a workpiece may be secured to first shaft rotatable about a first longitudinal axis. A conjugate form to the workpiece may be secured to a second shaft which is rotatable about a second longitudinal axis. The workpiece and conjugate form are secured to each shaft in a manner such that they are facing one another and slightly set apart to define a gap. A flowable abrasive media is introduced within this gap. The centerlines of the workpiece and the conjugate form are offset from one another such that rotation of the shafts in the same direction and at the same rotational speed produces relative motion between the workpiece and the conjugate form thereby polishing the workpiece. A slide may be used for axially positioning the first shaft and the second shaft a predetermined distance to define the size of the gap.

Abstract: A carrier head for chemical mechanical polishing that has a base having at least a portion formed of a polymer, a mounting assembly connected to the base having a surface for contacting a substrate, a retainer secured to the portion of the base to prevent the substrate from moving along the surface, and a dampening material secured between the retainer and the base.

Abstract: A wafer polishing apparatus for polishing a semiconductor wafer. The polisher comprises a base (23), a turntable (27), a polishing pad (29) and a drive mechanism (45) for driven rotation of a polishing head (63). The polishing head is adapted to hold at least one wafer (35) for engaging a front surface of the wafer with a work surface of the polishing pad. A spherical bearing assembly (75) mounts the polishing head (63) on the drive mechanism for pivoting of the polishing head about a gimbal point (p) lying no higher than the work surface when the polishing head holds the wafer in engagement with the polishing pad. This pivoting allowing the plane of the front surface of the wafer to continuously align itself to equalize polishing pressure over the front surface of the wafer, while rotation of the polishing head is driven by the driving mechanism.

Abstract: A center clamp used with a machining tool having an annular edge has a C-shaped body having an inner end inside the edge and an outer end outside the edge and spaced from it along a clamp axis. A push rod extends along the axis through the outer body end. A rotary joint centered on the axis has an inner part on the inner body end and an outer part rotatable on the inner part about the axis. An axial actuator relatively axially shifts the body and the push rod and thereby clamps a workpiece between an end face of the rod and the outer part of the joint. An angular actuator pivots the push rod about the axis and thereby, when the workpiece is clamped between the rod and the joint, pivots the workpiece about the axis.

Abstract: A carrier head for chemical mechanical polishing, includes a base, a support structure attached to the base having a surface for contacting a substrate, and a retaining structure attached to the base to prevent the substrate from moving along the surface. The retaining structure and the surface define a cavity for receiving the substrate. The retaining structure includes an upper portion in contact with the base, a lower portion, and a vibration damper separating the upper portion and the lower portion. The vibration damper, the vibration damper includes a material that does not rebound to its original shape when subjected to a deformation.

Abstract: An apparatus for polishing or lapping an aspherical surface of a work piece comprises a tool rotatable about an axis, the working surface area of the tool being smaller than the work piece, and an arrangement by means of which the tool and the work piece are adjustable relative to each other in all three directions in space, by means of which the orientation of the tool relative to the work piece is adjustable about at least two axes, and by means of which the work piece is rotatable about an axis.

Abstract: A drum slicing apparatus is capable of highly accurately and efficiently slicing a drum made of a thin metal sheet which is relatively highly flexible. The drum slicing apparatus has a support shaft rotatable about its own axis, a cylindrical drum holder supported on the support shaft for holding the drum by pressing engagement with an inner circumferential surface of the drum over an entire length thereof, and a slicing device having slicing edges for slicing the drum into the metal rings by engaging and cutting into the drum at predetermined cutting positions thereon while the drum is being rotated by the support shaft through the drum holder.

Abstract: A carrier head for chemical mechanical polishing, includes a base, a support structure attached to the base having a surface for contacting a substrate, and a retaining structure attached to the base to prevent the substrate from moving along the surface. The retaining structure and the surface define a cavity for receiving the substrate. The retaining structure includes an upper portion in contact with the base, a lower portion, and a vibration damper separating the upper portion and the lower portion. The vibration damper, the vibration damper includes a material that does not rebound to its original shape when subjected to a deformation.

Abstract: In a semiconductor device having a front surface where circuits are formed and a back surface, a hemispherical solid immersion lens is formed at the back surface of the semiconductor device in a body with the semiconductor device.

Abstract: Disclosed is a method and two apparatuses enabling suction control over surface cleaning and scraping. Suction control is necessary so as to obtain good contact between a cleaning/scraping pad and the surface to be cleaned/scraped, thereby achieving efficiency. Also, suction control is required so as to collect debris falling off during the cleaning/scraping process, which may otherwise contaminate the environment. Suction control provides guidance for the movement of a cleaning/scraping pad sucked on the surface of an object. This implies convenience when cleaning/scraping over a large surface area is attempted. Suction action is generated by convecting away surrounding fluid, being either water or air, to produce local negative pressure at the pad position. The disclosed devices are most desirable in cleaning water containers, such as a fish tank or a swimming pool, as well as to collect dusts on scraping the surface of a mortar wall.

Abstract: The invention relates to a device for the finishing treatment of shaft workpieces, in particular crankshafts and camshafts. The device comprises a carrier, at least one jaw for exerting contact pressure on the workpiece, and a linear guide for guiding the jaw. The linear guide is supported by a transverse guide to form a cross guiding system which follows the rotational motion of the workpiece by revolving around its axis of rotation. The transverse guide contains a main carriage guided on the carrier. The main carriage is radially aligned with respect to the axis of rotation of the workpiece. The main carriage has a fork-shaped head facing towards the side of the workpiece. A guide rail for the linear guide is chucked between the between the legs of the fork-like head.

Abstract: An apparatus for manufacturing a semiconductor device includes a rotatable spindle, a head detachably connected to the spindle, and a clamp for clamping outer circumferential surfaces of the spindle and the head to one another so that the head may be driven by the spindle. The clamp has an annular clamping frame sized to encircle the outer circumferential surfaces of the spindle and the head, a projection disposed on one end of the clamping frame, a lever pivotally connected to the other end of the clamping frame, and a fastener pivotally connected to the lever and configured to hook over the projection. Once the fastener is hooked over the projection, the lever is pivoted to force the ends of the annular clamping frame together and thereby produce a clamping force that secures the spindle and head to one another. The clamp can be manipulated easily and with a simple motion to clamp the head to the spindle. Also, the parts of the clamp generate little mechanical friction.

Abstract: An improved chuck for supporting elongated work pieces having conical end portions, such as single crystal ingots used to fabricate semiconductor wafers, while such. The chuck is typically used in a lathe for positioning and allowing rotation of the work piece during a grinding procedure that results in optimal work piece diameter. The chuck comprises a ring-shaped base, or socket, having a cavity defining a central axis therethrough and a series of fastener holes for securing the base to a headstock or tailstock of a lathe. The base receives within the cavity a portion of a chuck insert. The chuck insert defines a work piece support surface that is coaxial with the central axis when the chuck insert is disposed in a nominal position within the cavity of the base. The work piece support surface will typically define a continuous, arcuate, convex surface capable of supporting work pieces having conical end portions of varying diameters.

Abstract: A holder in a brush-cleaning installation, preferably for combined use in the brush-cleaning and centrifugal-drying process, contains a carrier part from which there extend, in a spider-shaped manner, a plurality of carrying arms. On the carrying arms there is mounted, in a rotatable manner in each case, a guide roller which, in addition to positioning the semiconductor wafer vertically, also makes it possible for the semiconductor wafer to be positioned horizontally with the aid of an annular collar on a bottom section of the guide roller.

Abstract: A description is given of an apparatus and a method for grinding a workpiece, in particular a shaft part. According to the method, the workpiece is clamped in place for the grinding working and its geometry is subsequently ground in such a way as to maintain its dimensions and shape. According to the invention, at least part of the surface of the workpiece is precision-worked at least partly at the same time as the grinding. The apparatus according to the invention has a work-spindle headstock and a tailstock for clamping the workpiece in place as well as a grinding unit with a grinding wheel for grinding the workpiece. The grinding unit and workpiece are arranged movably in relation to each other in a controlled manner. The apparatus according to the invention additionally has a precision-working unit, which can be moved according to the geometry of the workpiece in such a way that at least part of the surface of the workpiece is able to undergo precision working.

Abstract: There is a workpiece clamp device 10 for horizontally holding a thin section long workpiece 1 having a constant section shape or having the same section shape in spaced positions in a longitudinal direction in two positions of the same section shape. The workpiece clamp device 10 is constituted of a driving clamp device 10A and a driven clamp device 10B comprising the same holding device 12. The driving clamp device 10A rotates the workpiece 1 centering on a horizontal axis O extending in a longitudinal direction of the workpiece, and the driven clamp device 10B follows movement of the workpiece and idles centering on the horizontal axis. An arbitrary portion to be machined of the workpiece can be directed in a direction in which the portion is easily machined by the rotation (e.g., upward direction).

Abstract: This invention pertains to a substrate holding apparatus comprising a substrate holder having a center axis for rotation and adapted to hold a substrate to be polished and urge the substrate against a polishing pad, a drive shaft for drivingly rotating the substrate holder about the center axis, and a joint for connecting the substrate holder to the drive shaft in such a manner that the substrate holder can tilt relative to the joint. The substrate holder includes a substrate holding member and a cover member placed on and secured to the substrate holding member. The substrate holding member has a lower surface for holding the substrate and an upper surface having a curved surface recess with an opening at the upper surface and a center bottom portion which is the deepest in the recess.