Abstract: The end mill grinding device of the present invention includes a tool spindle assembly and a motor tower which enables multi-axis positioning of a sharpening wheel in relation to an end mill cutting tool being sharpened, for sharpening the end mill tool. The present invention combines linear sharpening and radial tool end grinding capability in the same device.

Abstract: A blade sharpening system using the interior surface of a grinding wheel against which a blade is drawn along its entire length for sharpening. The sharpening system includes a blade holding configuration having multiple hinged arms. A cam operating between two of the hinged arms serves to alter the angle of incidence between the blade and the grinding wheel as the blade is drawn across the grinding wheel. The result is that a wide variety of different blade configurations can be easily accommodated by the sharpening system.

Abstract: A workholder includes a connecting member, a polishing member mounted on the connecting member, an elastic member sleeved on the connecting member, and a fixing assembly for movably receiving the connecting member. An end of the elastic member resists the polishing member, and the other end of the elastic member resists the fixing assembly, such that the connecting member is moveable to adjust a position of the polishing member when polishing.

Abstract: An apparatus for grinding a continuously cast slab having a longitudinal axis and a rectangular cross-sectional shape with two opposite wide faces and two opposite narrow faces apparatus has a frame, two transversely spaced grinders carried on the frame, and a holder having two transversely spaced grippers engageable with the opposite faces of the slab in a vertical position with the wide faces of the slab vertical for grinding of the wide faces of the slab by the grinders and in a horizontal position offset by 90° to the vertical position with the wide faces of the slab horizontal for grinding of the narrow faces of the slab.

Abstract: A flexure assembly comprising a flexure stack comprising a plurality of individual webs connected together with a force in an x-direction to produce a friction in a z-direction orthogonal to the x-direction between the plurality of webs, the friction holding the plurality of webs in engagement. In some embodiments, the flexure assembly includes a second flexure stack fixedly spaced from the first stack comprising a second plurality of individual webs connected together with a second force in the x-direction to produce a second friction in the z-direction between the second plurality of webs. The flexure assembly may be used, for example, for supporting a workpiece such as a slider row bar in a lapping machine.

Abstract: To facilitate with high accuracy adjustment of a minute angle degree and also to sufficiently secure the rigidity of a whole device after the adjustment.

Abstract: The present invention facilitates with high accuracy the adjustment of a minute angle degree, and also is capable of sufficiently securing the rigidity of the whole device after the adjustment and provides good operability, accuracy, and rigidity. Provided are a workpiece attaching body having a workpiece attaching surface and a rotating body rotatably supporting the workpiece attaching body.

Abstract: Hands free removal of layers of material simultaneously from a number of dies is accomplished by temporarily positioning a plurality of die holding devices into different segmented open areas of a template mounted over the grinding surface. In one embodiment, frictional force imparted to each holding device by the grinding wheel serves to position the holding device against a stop within the confines of each opening. The stop in each segment could be positioned at a different radial distance from the center of the grinding wheel in order to use different portions of the grinding wheel to grind each of the dies. In some embodiments, the segments are offset from each other around the template in order to increase the effective working area of the grinding surface.

Abstract: An electronic component manufacturing method that efficiently grinds a cover layer provided on a substrate even when the substrate is warped includes the step of forming first grooves at intervals in a cover layer provided on a substrate by repeating grinding with a rotary blade at a pitch more than a thickness W of the rotary blade. Next, at least portions provided in the cover layer along the first grooves are removed to reduce the thickness of the cover layer by repeating grinding at a pitch equal to or less than the thickness W of the rotary blade.

Abstract: Method of and apparatus for indexing a workpiece to a tool at a predetermined angle of orientation, using a bubble level to establish a horizontal reference plane. The bubble level may be pivotally fixed to a housing of a jig which may incorporate a magnet for adhering the housing to a magnetically responsive workpiece. The bubble level may be secured at a particular pivotal orientation such that when the workpiece is held against the cutting or abrading surface of a tool, the workpiece may be manually maintained at the predetermined angle of orientation such that a ground surface disposed at a predetermined angle on the workpiece may be formed while holding the workpiece manually. The jig may incorporate an adjustable leg to assist in tightening the bubble level at the particular pivotal orientation.

Abstract: Embodiments of the present invention pertain to a evaluating the quality of a lapping plate. In one embodiment, information that indicates the quality of a lapping plate is received while the lapping plate is being used to lap a slider, and the information is used to evaluate the quality of the lapping plate while the lapping plate is being used to lap the slider.

Abstract: The invention relates to a grinding center for the simultaneous grinding of multiple main bearings and rod bearings and/or central sections of crankshafts (22). Two rod bearing grinding spindles (14, 15), wherein the first can be displaced only in the Z direction and the second can be minimally displaced only in the X direction, are mounted on a common rod bearing crosslide (11). In the final phase of the grinding, a correction of dimension deviation between the two machined rod bearings is carried out via a separate control of the second rod bearing grinding spindle (15), as a dimension or roundness correction. The deviations are detected by measuring devices.

Abstract: The present invention facilitates with high accuracy the adjustment of a minute angle degree, and also is capable of sufficiently securing the rigidity of the whole device after the adjustment and provides good operability, accuracy, and rigidity. Provided are a workpiece attaching body having a workpiece attaching surface and a rotating body rotatably supporting the workpiece attaching body.

Abstract: To facilitate with high accuracy adjustment of a minute angle degree and also to sufficiently secure the rigidity of a whole device after the adjustment.

Abstract: The present invention provides a polishing apparatus for polishing a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

Abstract: Disclosed herein is a chemical mechanical polishing apparatus. The apparatus comprises a carrier to hold a wafer and being capable of lifting, lowering and rotating, a polishing pad compressed onto the wafer through the lowering of the carrier to polish the wafer, a contact pressure sensor to detect contact pressure between the polishing pad and the wafer when the polishing pad is compressed onto the wafer, a support physical property controller to generate control signals corresponding to the contact pressure detected by the contact pressure sensor, a variable physical property support being adapted to come into close contact with the polishing pad and having physical properties varied in response to the control signals generated by the support physical property controller, and a rotational table to hold the variable physical property table.

Abstract: An elongated work is attached to an elongated holding surface opposed to a flat abrasive surface in a grinding device. The holding member is supported on a spherical receiving body so that the holding member changes its attitude around the spherical receiving body. The change of the attitude of the holding member reliably enables the work to uniformly contact with the flat abrasive surface. When relative movement is induced between the work and the flat abrasive surface, a chamfer is formed on the work with a high accuracy. The work is prevented from suffering from generation of microcracks and chipping. In addition, if the work moves on the flat abrasive surface only in one direction, the probability of generation of microcracks and chipping is considerably reduced.

Abstract: A lens presser for holding an eyeglass lens includes: a base member which is to be attached to a distal end of a lens chucking shaft; an abutting member which has an abutting surface which is to be abutted on a rear refractive surface of the lens; a movable member to which the abutting member is to be attached; a circular-arc-shaped concave portion which is formed in one of the base member and the movable member and has a radius center of a circular arc on a central axis of the chucking shaft; and a circular-arc-shaped convex portion which is formed in the other of the base member and the movable member and is fitted into the concave portion so as to slide only in a direction of the circular arc. The movable member is tiltable with respect to the base member.

Abstract: A holder, guide, or jig for sharpening tools is disclosed, in which the jig holds and orients a tool to be sharpened to properly align the tool on or against abrasive wheels, discs, or sharpening stones, thereby creating a fine, square, beveled edge on the tool, at a predetermined and accurately reproducible angle.

Abstract: A fixture for slider lapping includes a holding portion for holding the object with its surface to be lapped toward the lapping surface of the lapping device; a main body for mounting the lapping fixture to the lapping device; a plurality of load-applied portions which are arranged along said longitudinal direction and independent from said main body, said load-applied portions receiving a load which presses the surface to be lapped to the lapping surface tightly from at least the lapping device; a plurality of connection members connecting said holding portion and said main body along said longitudinal direction at intervals; and a plurality of wrist portions connecting said connection members and said holding portion; wherein at least one wrist portion is disposed between said adjacent connection members; at least one wrist portion is disposed at each outer side of the connection members which are located at both ends of the longitudinal direction.

Abstract: A cylindrical grinder includes a workpiece support section adapted to support a generally cylindrical workpiece and rotate the workpiece about a rotational axis, and a wheel head adapted to support and rotate a grinding wheel. The wheel head is moved relative to the workpiece support section, along a first direction parallel to a rotational axis of the workpiece and along a second direction perpendicular to the first direction in order to grind an outer surface of the workpiece. The wheel head is turnable relative to the workpiece so that a rotational axis of the grinding wheel can be tilted within a plane substantially passing through the rotational axis of the grinding wheel and the rotational axis of the workpiece, within a range extending across a reference plane perpendicular to the rotational axis of the workpiece. Further, link-type parallel link mechanisms for moving the grinding wheel are disclosed.

Abstract: An apparatus for lapping a workpiece including a plurality of magnetic heads supported by a tool is disclosed. The lapping apparatus comprises a rotary-lapping table having an abrasive surface, and a lapping device assembly provided so as to be movable with respect to the abrasive surface of the lapping table. The lapping device assembly includes a device provided at a lower portion of the lapping device assembly for supporting the tool and a device for respectively applying predetermined loads to a plurality of load applying portions of the tool. The load applying portions of the tool is disposed along the longitudinal direction of the tool. The load-applying device applies the loads from a plurality of different directions to at least one of the load applying portions of the tool so that the tool is deformed into a predetermined shape.

Abstract: A clamping wafer holder for chemical-mechanical planarization (“CMP”) machines is provided. It comprises a plate having a surface for receiving on it the wafer, and a retainer around the surface. The retainer includes at least two jaws shaped and arranged such that they define a recess with the surface. The wafer is placed in the recess. An actuator is coupled with the retainer and adjusts it from an open position where the jaws are separated from each other, to a closed position where the jaws clamp an edge portion of the wafer. When the retainer is in the closed position the jaws preferably contact each other and define a continuous cylindrical inner surface. The surface can have a stopper that engages a flat zone of a wafer. Where the shape of the jaws does not match exactly the periphery of the wafer, elastic inserts are mounted on the jaws. A vacuum source is coupled with the plate, to hold the wafer in the holder during reorientation.

Abstract: An apparatus is provided for cleaning parts in a production line. The part is placed on the apparatus at an ergonomically comfortable height and angle with respect to the worker, thus avoiding fatigue, while at the same time providing a faster turn-around time in the production line. The apparatus is especially suited for a semiconductor manufacturing line.

Abstract: A grinding wheel machine bracket comprises a fixations eat having a long through hole to receive a screw for fastening the fixation seat with a grinding wheel machine. The fixation seat has a pivoting seat with an axial hole, and a pointer located at the top thereof. A bracket seat is provided with a loading surface, a threaded hole, and an arcuate shoulder plate located over the threaded hole. A threaded rod is engaged with the threaded hole of the fixation seat via the axial hole. The bracket seat is changed in angle in relation to the fixation seat so as to adjust the angle of the loading surface of the bracket seat in relation to the grinding wheel of the grinding wheel machine. The bracket seat is fixed by the threaded rod at an angle so set.

Abstract: A gas turbine component blank is shaped by clamping the gas turbine component blank into a fixture that accurately positions the gas turbine component blank in three dimensions. The positioning is accomplished against stops accurately machined into a base of the fixture, by first supporting the gas turbine component blank on one set of stops that prevents movement in the direction perpendicular to a plane of the base, and then operating a movable clamp to force the gas turbine component blank against other sets of stops that limit the movement of the gas turbine component blank in directions lying in the base plane. The clamp has a compound movement that simultaneously forces the gas turbine component blank against stops that prevent movement in orthogonal directions lying in the base plane. The gas turbine component blank is thereafter shaped, preferably by grinding the sides of the root precursor of the gas turbine component blank.

Abstract: The wafer handling and support system disclosed herein does not use tape and is adapted for use in conjunction with a number of work stations. The wafer handling and support system includes a chuck plate comprised of a non-porous section surrounding a porous section and a robotic arm for transporting a chuck plate/wafer combination under vacuum. The chuck plate is sized to be carried by a wafer chuck and the porous section of the chuck plate is configured to support a wafer. The wafer may be held in place on the chuck plate by the application of a vacuum.

Abstract: A processing jig comprises: a main body to be fixed to a processing apparatus; a retainer that is long in one direction for retaining a bar as an object long in one direction; four couplers for coupling the retainer to the main body; three load application sections, coupled to the retainer, to each of which a load is applied for deforming the retainer; and three arms for coupling the load application sections to the retainer. The retainer has a beam structure that is bent with an application of external force. A bar fixing section to which the bar is fixed is provided at a lower end of the retainer. Both ends of the retainer are not coupled to the main body but left open.

Abstract: Jig for grinding sharp-edged tools. The jig consists of a housing in the form of a casing designed with a passage running through it whose at least one end is flat, plus a seat, also in the form of a casing designed with a passage running through it, located in the passage of the housing and lockable in this housing in an inclined position in relation to the passage in the housing, whereby the seat is provided with a clamping device (4) for firmly holding a tool that is to be ground so that it extends through the passage of the seat, and that the seat has such a length that one end of it extends out beyond the housing at the flat end of the housing.

Abstract: A processing jig of the invention is provided for deforming an object to be processed that is long in one direction into a complicated shape and processing the object with accuracy. The jig comprises: a main body to be fixed to a processing apparatus; a retainer that is long in one direction for retaining a bar as the object long in one direction; four couplers for coupling the retainer to the main body; five load application sections, coupled to the retainer, to which a load is applied for deforming the retainer; and arms for coupling the load application sections to the retainer.

Abstract: A fixture securely holds a blank having at least two spaced apart locators. The fixture has a base with spaced apart end walls, one supporting a clamping mechanism and the other supporting an abutment, at least one of which is free to pivot in relation to the end wall that supports it. Upon securing the blank into the fixture, the clamping mechanism mates with one of the locators on the blank and forces another of the locators into contact with the abutment. A method includes providing a blank having a least two spaced apart locators, providing a fixture having a base with two spaced apart end walls, one supporting a clamping mechanism and the other supporting an abutment, at least one of which is fee to pivot in relation to the end wall that supports it, and securing the bland into the fixture where in the clamping mechanism mates with one of the locators and forces another of the locators into contact with the abutment.

Abstract: A row of disk drive slider blanks with magneto-resistive read sensors are lapped after being mounted on the flat surface of a row carrier used to mount the row assembly on a row bending tool. Residual stresses present in the row due to wafer processing are relieved by removing the kerf areas between the slider blanks prior to lapping to prevent the stresses from causing inaccuracies in the lapping process. The stability of sliders below 30% can be enhanced by using wafers thicker than is required and then slicing the extra material from the row of slider blanks after it has been bonded to the row carrier either before or after the lapping process.

Abstract: A system for enhancing lens preparation which allows for error compensation to provide nearly error-free lens fining and/or polishing. The system employs a flexure to allow three degrees of freedom for a lens being prepared. The system also employs a Hall effect circuit board to monitor movement of the flexure to account for error, provide feedback to a controller so that compensation for such error can be effected and so that proper force may be maintained. The flexure and the sensor feedback subsystem enable nearly error-free lens surfaces.

Abstract: A method and apparatus for controlling the amount of row distortion before and dynamically during the lapping process used to manufacture sliders for magnetic storage devices. A wafer quadrant of slider rows is bonded to an extender tool held in a carrier assembly and an actuator is used to laterally apply force to the extender tool such that it changes the profile of the wafer quadrant, and thus the foremost slider row. Multiple arms may be defined in the extender tool, permitting independent engagement with and application of the lateral force by the actuator. Bending moments in each arm are then efficiently and controllably transferred into a beam in the extender tool which is proximate to the point where the wafer quadrant is bonded.

Abstract: A clamping wafer holder for chemical - mechanical planarization ("CMP") machines is provided. It comprises a plate having a surface for receiving on it the wafer, and a retainer around the surface. The retainer includes at least two jaws shaped and arranged such that they define a recess with the surface. The wafer is placed in the recess. An actuator is coupled with the retainer and adjusts it from an open position where the jaws are separated from each other, to a closed position where the jaws clamp an edge portion of the wafer. When the retainer is in the closed position the jaws preferably contact each other and define a continuous cylindrical inner surface. The surface can have a stopper that engages a flat zone of a wafer. Where the shape of the jaws does not match exactly the periphery of the wafer, elastic inserts are mounted on the jaws. A vacuum source is coupled with the plate, to hold the wafer in the holder during reorientation. The actuator is advantageously operated by the vacuum source.

Abstract: A fixture for holding a semiconductor chip during a polishing process can be made to also hold the chip while the chip is inspected by a scanning electron microscope. In this manner, the polishing of the chip may be inspected and monitored without removing the chip from the polishing fixture. This allows polishing to be resumed, if necessary, with more precision. This results because the position of the chip with respect to the polishing fixture has not been altered by removing and then resecuring the chip as would be otherwise necessary for microscopic inspection of the chip.

Abstract: An apparatus for preparing an ultra-thin specimen with a polishing wheel is developed. The apparatus includes a base, a holding unit mounted on the base and having a movable part for supporting the specimen, and an adjusting assembly attached to the base for adjusting an orientation of the specimen relative to a top surface of the polishing wheel by providing a fine movement during polishing. The movable part of the holding unit is advantageously moved away from the adjusting assembly to enlarge the latitudinal cross-section of the apparatus so as to increase the precision of the orientation.

Abstract: A fixture securely holds a blank having at least two spaced apart locators. The fixture has a base with spaced apart end walls, one supporting a clamping mechanism and the other supporting an abutment, at least one of which is free to pivot in relation to the end wall that supports it. Upon securing the blank into the fixture, the clamping mechanism mates with one of the locators on the blank and forces another of the locators into contact with the abutment. A method includes providing a blank having a least two spaced apart locators, providing a fixture having a base with two spaced apart end walls, one supporting a clamping mechanism and the other supporting an abutment, at least one of which is fee to pivot in relation to the end wall that supports it, and securing the bland into the fixture where in the clamping mechanism mates with one of the locators and forces another of the locators into contact with the abutment.

Abstract: A wafer polisher head drive includes a head drive housing; a head portion extending from the housing for mounting an unpolished wafer when the head drive housing and head portion are in a horizontal orientation; a pivot mechanism extending from the head drive housing for pivoting the head drive housing and the head portion from the horizontal orientation to a vertical orientation juxtaposed to a transverse vertical portion of a continuous rotating polishing belt; a drive in the housing for moving the head portion and a mounted wafer outwardly from the housing against the transverse vertical portion of the rotating polishing belt; and a drive in the housing for rotating the head portion and the mounted wafer. The head drive housing may be pivoted from the vertical orientation in a sweeping arc extending perpendicularly from the belt transverse vertical portion or in a swinging arc extending parallel from the belt transverse vertical portion.

Abstract: The present invention discloses a sample holder for a miniature device for use in a parallel lapping tool that is equipped with a hollow-centered sample holder assembly such that the condition of the sample being prepared can be continuously monitored from either the top side or the bottom side of the holder, and at least three adjusting screws that are used to adjust a plane of lapping to be the same as the plane of interest in said miniature device to be observed such that once the plane is obtained, only the sample displacement knob situated at the center of the holder needs to be adjusted to further advance the sample for removal of more material.

Abstract: A swing grinding fixture and process for using the same is disclosed that enables a conventional surface grinder to remanufacture a machine tool cutting insert by grinding a predetermined shape into the insert. A quick clamping insert holder coupled to a slide secures the tool insert in the fixture. A precision spindle cartridge is mounted in a rigid fixture body and coupled to the slide to provide the swing motion required to generate the radius to be ground. The rigid fixture body includes a pair of micrometer adjustable stops which limit the arc through which the slide may be swung and control the flank shape ground into the insert. In an alternative embodiment, a sine plate is attached to the fixture body and is used to incline the fixture to a predetermined insert rake angle. In operation, the grinding fixture is securely mounted to the table of a surface grinder and a cutting tool insert is secured in the insert holder.

Abstract: A lapping apparatus for uniformly laps work pieces. The lapping apparatus includes a rotary lapping plate, a lapping base including a plurality of pads contacting the lapping plate, an adapter including first and second surfaces for supporting the mounting base contacting the lapping plate, and a supporting mechanism provided on the lapping base for supporting the second surface of the adapter by a supporting point. As the adapter supporting the work piece is supported on two points on the work piece and one supporting point of the lapping plate, the lapping surface of the work piece may follow as the lapping plate. Accordingly, it becomes possible to uniformly lap the work piece regardless of accuracy of the lapping base.

Abstract: A tool and method for holding an integrated circuit (IC) sample so that only a cross-section of the processed layers of the sample is polished and exposed. The tool includes (a) a mounting block with a recess, (b) a pivoting member pivotably attached in the recess so as to be pivotable between a first position at which an edge of the sample can be ground at a first angle of approximately 25.degree. and a second position at which the sample can be polished at a second angle of approximately 0.degree. to expose the cross-section of the processed layer without polishing the more resistant substrate, (c) a sample holder removably attached to the pivoting member with a face inclined at the first angle for attachment of the sample, and (d) a level corrector for adjusting a side-to-side tilt of the mounting block.

Abstract: Apparatus and method for grinding semiconductor chips and other specimens prior to microscopic examination thereof by supporting a specimen on a specimen mount, fixing the specimen mount to a lower end of a lower arm, connecting an upper end of the lower arm to a swingable arm by a horizontal pivot which permits the lower arm and specimen mount to move upwardly and downwardly relative to the swingable arm, providing a stop to limit downward movement of the specimen mount relative to the swingable arm when the lower arm reaches a zero position, moving the swingable arm downwardly to lower the specimen to engage an underlying rotatable grinding platen to define a zero position, and continuing to move the swingable arm downwardly beyond the zero position by an amount corresponding to the amount of material to be removed from a lower portion of the specimen so that the stop will prevent removal of additional material.

Abstract: Disclosed is an improved apparatus and method for polishing a semiconductor wafer, which involves mounting the wafer to a carrier assembly. The wafer carrier assembly has been split into two plates which are joined by springs around the peripheries. The wafer carrier assembly is universally mounted on a rotation shaft which rotates the wafer carrier assembly during cleaning. An adjustment screw tilts the upper plate relative to the lower plate. The adjustment screw can be located at any predetermined point on a circle around the rotation shaft. Since the bottom plate is forced relatively flat by contact with a polishing pad, the net effect of the wafer carrier assembly is to apply increased pressure to the wafer edge under the screw. This provides for an even polishing action to compensate for otherwise non-uniform radial polishing action on the wafer surface.

Abstract: A device for holding and positioning stones that are being prepared for invisible set jewelry. The device includes an automatically cooled blade and a holding member for holding the stone wherein the position of the stone may be adjusted linearly and angularly about a plurality of orthogonal axes. A base is coupled to three orthogonal translation stages for linearly adjusting the location of the stone with respect to the blade. Further, the base is rotatably coupled to the linear translation stages thereby enabling the linear translation stages to rotate about a first axis of rotation which is orthogonal to the top planar surface of the base. A mounting arm is pivotally coupled to the linear translation stages about a second axis of rotation parallel to the planar surface of the base.

Abstract: An adjustable row or transfer tool is disclosed herein compensating for row bow or distortion during a lapping process on a surface so as to establish uniform and substantially precise throat heights for a plurality of thin film transducers carried on a row of magnetic head sliders. To provide for adjustment, the body of the row tool is a double series of relief slots provided in an edge marginal region immediately adjacent to the surface intended to be lapped. The first series includes elongated relief slots disposed between square shaped slots extending across the length of the tool while the second series includes several relief slit openings across the tool length above the first series to terminate in cavities at each end. Bend holes in the tool body are located between the first and second series of relief slots and slits. Adjustment may be achieved by mounting the row tool to a closed loop lapping system.

Abstract: An apparatus and method for sharpening a cutting tool, including the grinding and honing of the cutting tool is described and illustrated. The apparatus comprises a base plate with a biasing frame mounted on the base plate. A tool holder is clamped to the biasing frame and releasably clamps a cutting tool, having an edge which is to be sharpened. A variety of tool holders allow the sharpening of different types of cutting tools. The cutting tool, and particularly, the edge thereof, is held in a stationary position and an abrasive member is moved with respect to the cutting edge of the tool. The apparatus forces the cutting edge of the tool against the abrasive member with a uniform amount of pressure and at a selected angle. Both the pressure and the selected angle are easily adjustable by the user. When the major variables, such as angle of sharpening and the pressure between the abrasive element and tool are fixed, an accurate, correct and reproducible sharpening will occur.

Abstract: A workpiece holder for rotary grinding machines for grinding semiconductor afers has a rotatable work surface which points toward a rotating grinding tool and on which the semiconductor wafer to be machined is laid, and has piezoelectric elements on which the workpiece holder is axially supported. The piezoelectric elements can be operated independently of one another and, when operated, undergo a change in their linear dimension, an operated piezoelectric element axially raising or lowering the workpiece holder at the point at which it supports the workpiece holder. There is also a method for positioning the workpiece holder.