Abstract: Short and/or rod-shaped workpieces are completely machined by grinding two parallel end faces and the longitudinal sides of the workpiece with very short cycle times. The grinding machine includes two grinding spindles that are arranged in a tandem arrangement with parallel rotational axes on a shared grinding headstock and that are jointly moved in the X direction. In cooperation with a special holding and transport device for the workpieces, two workpieces are each ground, at least partly concurrently, the end faces of the one workpiece being ground in one machining position and the final non-circular grinding of the exterior contour of a second workpiece occurring in a second machining station, the end faces of the second workpiece having already been ground.

Abstract: A chemical mechanical polishing pad having a polishing layer with an integral window and a polishing surface adapted for polishing a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate, wherein the formulation of the integral window provides improved defectivity performance during polishing. Also provided is a method of polishing a substrate using the chemical mechanical polishing pad.

Abstract: A device for dressing a tool having a plurality of teeth, wherein said device comprises a support surface having guiding elements, said guiding elements having at least two movable positioning elements, said movable positioning elements being adapted to be locked in a fixed position within said guiding elements such that said positioning elements form a stop for said tool; and a dressing tool mounted in a holding device positioned in front of a dressing side of said support surface, wherein said dressing tool is locked in position by a locking element during the dressing of said teeth, hence said dressing tool not being movable at least in a direction running substantially parallel to said dressing side; wherein said positioning elements are arranged in said guiding elements in said support surface such that said tool to be dressed engages with said positioning elements at its side turned towards said dressing side of said support surface, so that said tool can be moved towards said positioning elements by a

Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.

Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.

Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrofoil polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.

Abstract: The invention relates to a method and to a device for regrinding tools having straight or helical grooves with the help of a positioning head, which is provided with a feeler pin, which engages a groove and which, in the direction of advance, is disposed in front of the grinding disk. In order to make it possible to regrind the tool over the whole of its length, it is proposed pursuant to the invention that a positioning head with two feeler pins be used, the first feeler pin, which leads the grinding disk, being retracted from the groove before entry into the groove outlet or, if this groove runs out into the open, before leaving this groove and the second feeler pin, which is rigidly connected with the positioning head, trailing the grinding disk and, after removal of the first feeler pin from the groove, taking over the guidance of the spindle sleeve of the spindle head of the workpiece.