Abstract: A workpiece has a device area and a peripheral area surrounding the device area on a front surface side thereof. A workpiece grinding method includes a groove forming step of performing grinding feed of a grinding unit while a spindle is rotated, and grinding a predetermined area on a back surface side of the workpiece, the predetermined area corresponding to the device area, in a state in which a chuck table holding the workpiece is not rotated, thereby forming a groove on the back surface side, a groove removing step of starting rotation of the chuck table while the spindle is kept rotating, thereby grinding side walls of the groove and removing the groove, and a recess forming step of performing grinding feed of the grinding unit while the spindle and the chuck table are rotated, thereby grinding the predetermined area and forming a recess and a ring-shaped reinforcement part.

Abstract: A method and structure for forming a 3D chip stack using a vacuum chuck. The method may include: forming a first bonding layer on a first wafer and first chips, where the first chips are on a first substrate; forming a second bonding layer on a second wafer and second chips, where the second chips are on a second substrate; separating the second chips from the second wafer, wherein a portion of the second bonding layer remains on the second chips; moving the separated second chips to a cleaning chamber using a vacuum chuck; cleaning the separated second chips in the cleaning chamber; and bonding the second bonding layer on the separated second chips to the first bonding layer on the first chips.

Abstract: The present invention facilitates with high accuracy the adjustment of a minute angle degree, and also is capable of sufficiently securing the rigidity of the whole device after the adjustment and provides good operability, accuracy, and rigidity. Provided are a workpiece attaching body having a workpiece attaching surface and a rotating body rotatably supporting the workpiece attaching body.

Abstract: To facilitate with high accuracy adjustment of a minute angle degree and also to sufficiently secure the rigidity of a whole device after the adjustment.

Abstract: The present invention relates to semiconductor integrated circuit technology and discloses an electrochemical mechanical processing system for uniformly distributing an applied force to a workpiece surface. The system includes a workpiece carrier for positioning or holding the workpiece surface and a workpiece-surface-influencing-device (WSID). The WSID is used to uniformly distribute the applied force to the workpiece surface and includes various layers that are used to process and apply a uniform and global force to the workpiece surface.

Abstract: An apparatus provided for supporting at least one component in a grit blasting process comprises a base and a platform table assembly mounted to the base. The platform table assembly includes a platform table therein which is rotatable and angularly adjustable with respect to the base. The platform table includes a component holding device for releasably holding the at least one component in position during the grit blasting process.

Abstract: A multi-channel rotary joint including a first joint structural member rotatably linked to a second joint structural member. Sealing regions defined and formed by mechanical seals that are lined up concentrically around relative rotational axis are provided between opposing peripheral surfaces in a relative rotational axial direction of the first and second joint structural members. A plurality of channels passing independently through the sealing regions (except for the sealing region which is used as a drain region) are provided for the first and second joint structural members, and an electrical wire insertion path is provided so as to pass through the inner peripheral region of a mechanical seal that has the smallest diameter. A drain path that opens into the drain region is provided for the joint structural member.

Abstract: Systems and methods of thermal control in the carbon dioxide cleaning of data storage disks to reduce or prevent condensation on the surface of the media during cleaning with frozen carbon dioxide are disclosed. A hub recess receives at least a portion of the outer flange of the hub to improve contact between the data storage media and a media platform supporting the media. Contact between the media and the media platform may be further improved by drawing a vacuum through openings in the media platform. In addition, drawing a vacuum through a vacuum channel with an annular ring opening about the media platform and a tangential vacuum port may reduce fluttering of the media on the media platform.

Abstract: A grinding apparatus comprises a table having a first bearing surface; a chuck mounted on the table for rotation about a chuck axis and provided with means for holding a workpiece, the chuck having on its underside a second bearing surface, such that when the chuck is stationary, the second bearing surface rests on the first bearing surface; a grinding head having a least one grinding surface capable of grinding a workpiece mounted on the table, the grinding head being mounted for rotation about a head axis substantially parallel to the chuck axis; and transport means for moving the chuck relative to the grinding head in both directions along a transport axis substantially perpendicular to both the chuck axis and the head axis.

Abstract: A device for conditioning the surface of a polishing pad covering a platen mounted on a polishing machine for rotation about a vertical axis, comprising a rigid carrier element carrying cutting means on its bottom surface and which is adapted for vertical movement into and out of engagement with the surface of a polishing pad and which is adapted for oscillating horizontal movement over the surface of the polishing pad. The cutting means are dispersed in a circular or ring configuration.