Abstract: Carrier assemblies, planarizing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, the carrier assembly includes a head having a chamber, a magnetic field source carried by the head, and a fluid with magnetic elements in the chamber. The magnetic field source has a first member that induces a magnetic field in the head. The fluid and/or the magnetic elements move within the chamber under the influence of the magnetic field source to exert a force against a portion of the micro-device workpiece. In a further aspect of this embodiment, the carrier assembly includes a flexible member in the chamber. The magnetic field source can be any device that induces a magnetic field, such as a permanent magnet, an electromagnet, or an electrically conductive coil.

Abstract: Carrier assemblies, planarizing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, the carrier assembly includes a head having a chamber, a magnetic field source carried by the head, and a fluid with magnetic elements in the chamber. The magnetic field source has a first member that induces a magnetic field in the head. The fluid and/or the magnetic elements move within the chamber under the influence of the magnetic field source to exert a force against a portion of the micro-device workpiece. In a further aspect of this embodiment, the carrier assembly includes a flexible member in the chamber. The magnetic field source can be any device that induces a magnetic field, such as a permanent magnet, an electromagnet, or an electrically conductive coil.

Abstract: A lapping method of a magnetic head slider provided with an element-forming surface, an ABS and an MR element formed on the element-forming surface, including a step of setting the magnetic head slider to be lapped on a lapping means, and a step of lapping by the lapping means the ABS of the magnetic head slider with while keeping an angle between the element-forming surface of the magnetic head slider and a lapping direction in a range greater than 0 degrees and equal to or less than 30 degrees.

Abstract: A metal bond grinding wheel 12 having a horizontal working surface 12a, a holding and rotating means 14 for a workpiece having a horizontal supporting surface 14a opposite to said working surface 12a, a voltage applying means 16 having the metal bond grinding wheels and an electrode 16a installed oppositely to the working surfaces in an uncontacted state and applying a pulsed voltage between them, a grinding fluid feeding means 18 for feeding an electroconductive grinding fluid to the working surfaces are installed.

Abstract: A unitary lap blank has a front polishing portion and a rear disk portion contoured for coupling the disk to a chuck of the lathe and also to a chuck of the polishing machine. Preferably, the disk has a circular channel in its face opposed to its base and a pair of seats in the opposed face symmetrically diametrically aligned in a land defined by the channel. The channel is of diameter, width and depth and the seats are spaced for mating with complementary components on the lathe chuck. The disk also has a circular seat centered in the land and a pair of parallel side walls disposed along symmetrically opposed cords of the disk transverse to a line connecting the pair of seats, the side walls being spaced apart by a distance and the seat being of diameter and depth for mating with complementary components on the polishing machine chuck.

Abstract: Improved compositions for polishing silicon, silica or silicon-containing articles is provided which consists of an aqueous medium, abrasive particles and an anion which controls the rate of removal of silica. The anion is derived from a class of compounds which contain at least two acid groups and where the pKa of the first dissociable acid is not substantially larger than the pH of the polishing composition. Methods using the composition to polish or planarize the surfaces of work pieces, as well as products produced by such methods, are also provided.

Abstract: This invention provides a lap capable of reducing the pole recession produced between the substrate and the magnetic film when the air-bearing surface of a thin-film magnetic head is lapped, a lapping liquor used for such lapping, and a thin-film magnetic head having its air-bearing surface lapped by using them. Lapping is carried out by using a lap made of a material having both a phase of tin and a phase of brass with a greater rigidity in supporting the abrasive grains than tin, and a lapping liquor prepared by mixing an anionic surfactant (15) and an ampholytic surfactant (16). According to the present invention, it is possible to reduce the pole recession in the thin-film magnetic heads and to accordingly shorten the recording bit length of the magnetic discs.