Abstract: In a substrate polishing apparatus where a polishing liquid passes through inside a rotary joint, the rotary joint requires maintenance. There is provided a substrate polishing apparatus that includes: a polishing head for holding a substrate; a rotary table that has a surface to which a first opening portion is provided; a polishing liquid discharge mechanism disposed to the rotary table; and a controller configured to control at least the polishing liquid discharge mechanism. The polishing liquid discharge mechanism includes a first cylinder, a first piston, and a driving mechanism that drives the first piston. The first opening portion is communicated with a liquid holding space defined by the first cylinder and the first piston. The controller controls the driving of the first piston by the driving mechanism to increase and decrease a volume of the liquid holding space.

Abstract: In a substrate polishing apparatus where a polishing liquid passes through inside a rotary joint, the rotary joint requires maintenance. There is provided a substrate polishing apparatus that includes: a polishing head for holding a substrate; a rotary table that has a surface to which a first opening portion is provided; a polishing liquid discharge mechanism disposed to the rotary table; and a controller configured to control at least the polishing liquid discharge mechanism. The polishing liquid discharge mechanism includes a first cylinder, a first piston, and a driving mechanism that drives the first piston. The first opening portion is communicated with a liquid holding space defined by the first cylinder and the first piston. The controller controls the driving of the first piston by the driving mechanism to increase and decrease a volume of the liquid holding space.

Abstract: An apparatus and method of roughening the sole side surface of a tread band is provided wherein the sole side surface of a tread band is roughened with at least one abrasive roller. The bottom of at least one groove in a tread side of the tread band is supported while the abrasive roller is roughening the sole side surface opposite the supported groove.

Abstract: An automatic insulation block milling machine is disclosed. The machine combines a series of operations into a single, automatic, production-line machine. Blocks of rigid insulation material, such as cellular glass blocks, are fed into the automated machine. The blocks are first placed on an automatic programmed moving conveyor belt and are first cut on a pre-determined angle developed from the horizontal and vertical centerline of the block. This cut is made by an angled, vertical band saw mounted with its blade in the center of the moving conveyor, thus producing one angled side on each of the two cut blocks. The remaining three primary sides of the cut blocks are machined to create curved sectional blocks that are used to cover the outer surface of large bore pipe systems or other cylindrical items such as tanks.

Abstract: A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.

Abstract: A light source emits light toward a semiconductor wafer, and a light receiving sensor detects light passing a peripheral edge of the semiconductor wafer. Each coordinates of the peripheral edge of the semiconductor wafer is obtained from a result of the detection. Further, a center of the semiconductor wafer is obtained from a group of the coordinates. Then, an illumination device emits light toward the peripheral edge of the semiconductor wafer and an optical camera detects light reflected from the peripheral edge of the semiconductor wafer. A position of a “V”-shaped notch formed on the peripheral edge of the semiconductor wafer is obtained from a result of the detection. A handling position of the semiconductor wafer is determined based on the center of the semiconductor wafer and the position of the “V”-shaped notch.

Abstract: A method for grinding a number of objects includes a series of steps from arranging the objects to be ground on a grinding jig (a master plate) through removing the ground objects from the grinding jig after completion of the grinding process, smoothly and precisely without damaging a number of the objects to be ground and without altering the arrangement pattern of the objects to be ground from the start through the end of the series of steps.

Abstract: A grinding jig set comprising a combination of several jig units and a method for grinding a number of objects are provided. The method comprises a series of steps from arranging the objects to be ground on a grinding jig (a master plate) through removing the ground objects from the grinding jig after completion of grinding process, smoothly and precisely without damaging a number of the objects to be ground and without altering the arrangement pattern of the objects to be ground from the start through the end of the series of steps. The jig set for grinding comprises a set of jig units used for a series of processing from allocation of objects to be ground on a grinding jig through removing the ground objects from the grinding jig after the grinding operation.

Abstract: A guide ring removal device. The guide ring removal device includes a column press, a first disc, a second disc, and a plurality of fasteners. The first disc is disposed on the column press. The second disc is disposed on a point of the column press to exert force on a carrier. The plurality of fasteners is disposed on the first disc, the fasteners grasping the guide ring. As the second disc exerts the primary force on the carrier, the fasteners generate reciprocal force on the guide ring, thus separating the guide ring. Engagement of the column press alters the distance between the first disc and the second disc, and the primary force is exerted on the carrier.

Abstract: The present invention provides a polishing pad alignment device having an alignment member positionable against a side wall of a platen. The height of the alignment member is sufficient to extend above a top surface of the platen when positioned against the wall of the platen. In one embodiment, the alignment member is an arcuate member having an arc substantially equal to an arc of the platen. In another embodiment, the alignment member is removably attachable to the wall of the platen and the polishing pad alignment member further includes an attachment device configured to attach the alignment member to the platen.

Abstract: A robotic transport apparatus is capable of providing an effective waterproofing function of working components without using mechanical seals. The robotic transport apparatus includes a robot body, an arm assembly extendably attached to the robot body, and a workpiece holding section attached to the arm assembly. A pan member for waterproofing of the robot body is provided between the workpiece holding section and the robot body and has an area not smaller than the workpiece holding section.

Abstract: A robotic transport apparatus is capable of providing an effective waterproofing function of working components without using mechanical seals. The robotic transport apparatus includes a robot body, an arm assembly extendably attached to the robot body, and a workpiece holding section attached to the arm assembly. A pan member for waterproofing of the robot body is provided above the robot body and has an area not smaller than the workpiece holding section.