Abstract: The present disclosure relates generally to semiconductor techniques. More specifically, embodiments of the present disclosure provide methods for efficiently dicing substrates containing gallium and nitrogen material. Additionally, the present disclosure provides techniques resulting in an optical device comprising a substrate having a dislocation bundle center being used as a conductive region for a contact.
Type:
Grant
Filed:
June 7, 2012
Date of Patent:
December 16, 2014
Assignee:
Soraa, Inc.
Inventors:
Arpan Chakraborty, Michael R. Krames, Tal Margalith, Rafael Aldaz