Contact Pads Or Leads Bonded To Superconductor Patents (Class 505/706)
  • Patent number: 8731629
    Abstract: A junction box is provided which allows serial connection of the individual conductors of at least one high temperature superconductor (HTS) wire bundle. The junction box includes an electrical interface device disposed within a junction box housing. The interface device is configured receive both ends of each conductor of each HTS wire bundle, and to provide a superconductive electrical connection between respective first ends of conductors to respective second ends of other wire bundle conductors to form at least one superconductive multi-turn electromagnetic winding.
    Type: Grant
    Filed: March 28, 2008
    Date of Patent: May 20, 2014
    Assignee: American Superconductor Corporation
    Inventors: Christopher G. King, James F. Maguire
  • Patent number: 8315678
    Abstract: Superconducting connections are provided to internal layers of a multi-layer circuit board structure, for example by superconducting vias.
    Type: Grant
    Filed: October 8, 2008
    Date of Patent: November 20, 2012
    Assignee: D-Wave Systems Inc.
    Inventor: Sergey V. Uchaykin
  • Patent number: 8304372
    Abstract: The present invention provides a process for joining oxide-superconducting tubes with a superconducting joint. The process involves the preparation of a partially preformed superconducting material, followed by cold isopressing of the powder of partially performed superconducting material into tube shape and further provided with grooves at both ends of the tubes with a subsequent deposition of a silver layer. The process further involves the lapping of one of the end faces of a pair of said tubes to be joined. These lapped end faces of both the tubes clubbed together on a common silver bush are coated with a paste of the same partially preformed superconducting material in organic formulation. Then these coated end faces are closed pressed together to form a joint. This joint portion and the end portions of the tubes are wrapped with a perforated silver foil followed by deposition of another layer of silver.
    Type: Grant
    Filed: December 31, 2007
    Date of Patent: November 6, 2012
    Assignee: Council of Scientific and Industrial Research
    Inventors: Shrikant Narayan Ekbote, Gursharan Kaur Padam, Narendra Kumar Arora, Mukul Sharma, Ramesh Sethi
  • Patent number: 8306590
    Abstract: Disclosed is a three layer process for making contact points to a high transition temperature superconductor (HTSC), particularly to (Bi,Pb)2 Sr2 Ca2 CU3019+x with and without silver in the superconductor. The contact structure is a three layer configuration with a perforated silver foil (3) sandwiched between two metal spray gun deposited silver layers (2,5) and subsequent heat treatment in air. The contact has been made on tubes and rods (1). The silver contacts are capable of carrying a continuous current of 200 Amps without adding any substantial heat load to the cryogen used to cool the HTSC. The contact resistance at 4.2 K is in the range of 1.5×10 (hoch?8) to 8.5? 10 (hoch?8) OHM in zero applied filed.
    Type: Grant
    Filed: July 23, 2010
    Date of Patent: November 6, 2012
    Assignee: Council of Scientific and Industrial Research
    Inventors: Shrikant Ekbote, Gursharan Kaur Padam, Narendra Kumar Arora, Mukul Sharma, Ramesh Sethi, Mrinal Kanti Banerjee
  • Patent number: 8178473
    Abstract: Disclosed are a superconductive magnet manufactured by winding a thin superconductive rod wire in a coil without joint for maintaining a persistent current mode, and a method for manufacturing the same. The method includes winding both ends of a superconductive rod wire (10) on a first bobbin (21) and a second bobbin (22) respectively; forming a first unit rod wire (10a) and a second unit rod wire (10b) by slitting the superconductive rod wire (10) in the lengthwise direction; producing a pancake coil by winding the first and second unit rod wires (10a, 10b) on third bobbins (25) in one direction; and arranging the first and second unit rod wires (10a, 10b) such that magnetic fields (B, B?) in the same direction are generated from the pancake coil, by reversing one of the third bobbins (25) on which the first and second unit rod wires (10a, 10b) are wound.
    Type: Grant
    Filed: May 26, 2006
    Date of Patent: May 15, 2012
    Inventors: Gye-Won Hong, Hee-Gyoun Lee
  • Patent number: 7792560
    Abstract: Disclosed is a three layer process for making contact points to a high transition temperature superconductor (HTSC), particularly to (Bi,Pb)2Sr2Ca2Cu3O19+x with and without silver in the superconductor. The contact structure is a three layer configuration with a perforated silver foil (3) sandwiched between two metal spray gun deposited silver layers (2,5) and subsequent heat treatment in air. The contact has been made on tubes and rods (1). The silver contacts are capable of carrying a continuous current of 200 Amps without adding any substantial heat load to the cryogen used to cool the HTSC. The contact resistance at 4.2 K is in the range of 1.5×10 (hoch?8) to 8.5? 10 (hoch?8)OHM in zero applied filed.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: September 7, 2010
    Assignee: Council of Scientific and Industrial Research
    Inventors: Shrikant Ekbote, Gursharan Kaur Padam, Narendra Kumar Arora, Mukul Sharma, Ramesh Sethi, Mrinal Kanti Banerjee
  • Patent number: 7301425
    Abstract: The present invention discloses a pancake-type bifilar winding module using a superconducting wire and a winding bobbin therefor.
    Type: Grant
    Filed: March 10, 2006
    Date of Patent: November 27, 2007
    Assignee: Industry-Academic Cooperation Foundation, Yonsei University
    Inventors: Tae Kuk Ko, Duck Kwon Bae, Min Cheol Ahn
  • Patent number: 7040002
    Abstract: A method of terminating at least one conductor of a superconducting cable comprising a plurality of superconducting tapes, comprising the steps of associating an electrically conductive connector radially at the at least one conductor, embedding and end of the superconducting tapes in a thermosetting resin, embedding an end portion of the superconducting tapes in a solder and achieving an electric contact by the solder. Moreover, the invention relates to a terminated conductor of a superconducting cable, a superconducting cable, a joint between conductors of two superconducting cables, a current transmission/distribution network, and a terminator for at least one conductor of a superconducting cable that embody the above method.
    Type: Grant
    Filed: August 15, 2002
    Date of Patent: May 9, 2006
    Assignee: Pirelli Cavi e Sistemi S.p.A.
    Inventors: Walter Castiglioni, Gianangelo Cavalleri, Giacomo Coletta, Pietro Corsaro, Dirk Kunze, Pierluigi Ladie′, Marco Nassi, Sergio Spreafico
  • Patent number: 7042320
    Abstract: A method for mechanical stabilisation of a superconducting composite having a tube-shaped superconducting ceramic and a reinforcing pipe introduced into each other by pre-stressing the tube-shaped superconducting ceramic by applying compressive force on one end of the tube as well as to a pre-stressable superconducting composite.
    Type: Grant
    Filed: April 29, 2005
    Date of Patent: May 9, 2006
    Assignee: Nexans
    Inventor: Heribert Walter
  • Patent number: 6889068
    Abstract: A superconducting signal transmission apparatus provided with a vacuum container 11, a superconducting electronic device 12 provided in the vacuum container 11, an input side transmission line 13 and output side transmission line 14 for connection to the superconducting electronic device 12 through the vacuum container 11, and a cooling mechanism (15, 16, 17) for cooling the superconducting electronic device 12 and further having a heat cutoff signal transmission unit 20 inserted at least at part of the input side and output side transmission lines 13 and 14. The heat cutoff signal transmission unit 20 is comprised of a substrate 31 and a flat circuit body 30 provided with a signal transmission line 32 and ground layer (33, 33-1, 33-2). The substrate 31 is comprised of a dielectric material having a small heat conductivity. The conductor portions forming the signal transmission line 32 and the ground layer are formed with thin thicknesses enabling suppression of the inflow of heat from the outside.
    Type: Grant
    Filed: July 29, 2002
    Date of Patent: May 3, 2005
    Assignee: Fujitsu Limited
    Inventors: Manabu Kai, Toru Maniwa, Kazunori Yamanaka, Akihiko Akasegawa
  • Patent number: 6678540
    Abstract: A superconductor on-chip microstrip line (2, 4) to off-chip microstrip line (7) transition of low characteristic impedance (15, 20, 22) is realized that obtains a bandwidth of 200 GHz for MCM application while employing solder bump (15, 17) technology to connect the chips (3, 5) to the off-chip microstrip and substrate (6). Circular openings (20, 22) through the respective ground plane layers (10 & 16) of the off-chip and on-chip microstrips are provided in positions respectively underlying and overlying the solder bump (15) for the signal. The openings may be sized to provide a desired ratio of inductance to capacitance, the larger the size, the greater the ratio value. This technique may be used to match characteristic impedance to give broad bandwidth low impedance interconnections needed for direct SFQ chip-to-chip communication on a passive MCM.
    Type: Grant
    Filed: August 22, 2001
    Date of Patent: January 13, 2004
    Assignee: Northrop Grumman Corporation
    Inventors: Michael S. Wire, Quentin P. Herr
  • Patent number: 6657526
    Abstract: There is provided a power lead for a superconductive magnet capable of controlling the invasion of heat to liquid helium for storing superconductive coils therein and of sufficiently feeding power to the superconductive coils. The power lead for a superconductive magnet of a superconductor magneto unit for supplying a current to the superconductive coils which are cooled at a liquid helium temperature through a radiant heat shielded section which is cooled at a liquid nitrogen temperature, wherein at least a part of sections positioned inside the radiant heat shielded section of a current lead member of the superconductive magnet comprises a high temperature oxide superconductor bulk body having a critical temperature exceeding a liquid nitrogen temperature. In this case, it is preferable to apply a resin impregnation treatment to the bulk body to enforce the high temperature oxide superconductor bulk body section.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: December 2, 2003
    Assignees: International Superconductivity Technology Center, Railway Technical Research Institute
    Inventors: Ken Nagashima, Masaru Tomita, Kaoru Nemoto, Toshiki Herai, Masato Murakami
  • Patent number: 6590471
    Abstract: An electrical interconnect provides a path between cryogenic or cryocooled circuitry and ambient temperatures. As a system, a cryocable 10 is combined with a trough-line contact or transition 20. In the preferred embodiment, the cryocable 10 comprises a conductor 11 disposed adjacent an insulator 12 which is in turn disposed adjacent another conductor 13. The components are sized so as to balance heat load through the cryocable 10 with the insertion loss. In the most preferred embodiment, a coaxial cryocable 10 has a center conductor 11 surrounded by a dielectric 12 (e.g. Teflon™) surrounded by an outer conductor 13 which has a thickness between about 6 and 20 microns. The heat load is preferably less than one Watt, and most preferably less than one tenth of a Watt, with an insertion loss less than one decibel.
    Type: Grant
    Filed: October 5, 2000
    Date of Patent: July 8, 2003
    Assignee: Superconductor Technologies, Inc.
    Inventors: Michael J. Scharen, Wallace Kunimoto, Angela May Ho
  • Patent number: 6359540
    Abstract: A superconducting lead comprises a supporting board (1) with at least one superconducting tape (3) adhered to it and extending from one terminal area of the lead to another. Respective metal end-fittings soldered to the superconducting tape (3) at each of its ends, and in each of the terminal areas at least one metal insert is bonded to the board (1) and also soldered to the corresponding one of the said end-fittings, so relieving the tapes (3) of mechanical stress. The board (1), or each of them, is preferably flat and may support two or more superconducting tapes (3) coplanar with one another on one or on each of its major faces. The metal inserts are preferably of copper and may be made by removing most of the copper cladding from a commercially available circuit board (1).
    Type: Grant
    Filed: June 18, 2001
    Date of Patent: March 19, 2002
    Inventors: Darren Michael Spiller, Michael Patrick Webb, Carlos Beduz, Yifeng Yang
  • Patent number: 6154103
    Abstract: An electrical interconnect provides a path between cryogenic or cryocooled circuitry and ambient temperatures. As a system, a cryocable 10 is combined with a trough-line contact or transition 20. In the preferred embodiment, the cryocable 10 comprises a conductor 11 disposed adjacent an insulator 12 which is in turn disposed adjacent another conductor 13. The components are sized so as to balance heat load through the cryocable 10 with the insertion loss. In the most preferred embodiment, a coaxial cryocable 10 has a center conductor 11 surrounded by a dielectric 12 (e.g. Teflon.TM.) surrounded by an outer conductor 13 which has a thickness between about 6 and 20 microns. The heat load is preferably less than one Watt, and most preferably less than one tenth of a Watt, with an insertion loss less than one decibel. In another aspect of the invention, a trough-line contact or transition 20 is provided in which the center conductor 11 is partially enveloped by dielectric 12 to form a relatively flat portion 28.
    Type: Grant
    Filed: October 15, 1998
    Date of Patent: November 28, 2000
    Assignee: Superconductor Technologies, Inc.
    Inventors: Michael J. Scharen, Wallace Kunimoto, Angela May Ho
  • Patent number: 6069395
    Abstract: Current leads are used for connecting a power supply placed in a room-temature environment and a superconducting coil placed in an ultralow-temperature environment. The current leads includes a first current lead and a second current lead. The first current lead is made up of a room-temperature N-type thermoelectric semiconductor, a low-temperature N-type thermoelectric semiconductor, and a high-temperature superconductor. The second current lead is made up of a room-temperature P-type thermoelectric semiconductor, a low-temperature P-type thermoelectric semiconductor, and a high-temperature superconductor. At least one of the first and second current leads is formed of a functionally gradient material.
    Type: Grant
    Filed: November 5, 1997
    Date of Patent: May 30, 2000
    Assignee: The Director-General of the National Institute of Fusion Science
    Inventors: Sataro Yamaguchi, Kotaro Kuroda
  • Patent number: 6034324
    Abstract: A self-protected modular high temperature superconducting (HTS) down-lead that is capable of carrying large currents from a room temperature power source to a superconducting device operating at cryogenic temperatures. This down-lead incorporates a safety lead capable of carrying current and absorbing heat to protect the HTS material of the lead in the event of catastrophic failure of the HTS elements. The lead is in continuous contact with the HTS material and provides protection from interrupts and excess current. The down-lead is modular in design, and parts are easily replaced. Further, the down-lead is cooled through conduction in the middle stage, and gas cooled in the upper and lower stages by independent gas sources.
    Type: Grant
    Filed: November 12, 1997
    Date of Patent: March 7, 2000
    Assignee: BWX Technology, Inc.
    Inventors: Kelly Dale Dixon, Ralph C. Neimann, Christopher Mark Rey
  • Patent number: 5884485
    Abstract: A power lead for electrically connecting a superconducting coil with a power supply, comprising thermoelectric cooling means, said means including at least an N-type thermoelectric member and a P-type thermoelectric member, being electrically connected to a positive side and a negative side of said power supply, respectively.
    Type: Grant
    Filed: November 17, 1997
    Date of Patent: March 23, 1999
    Inventors: Sataro Yamaguchi, Kiyoshi Takita, Ikuo Itoh, Hisaaki Hiue, Shinichi Nose
  • Patent number: 5877124
    Abstract: A superconducting oxide ceramic pattern is described. The pattern is comprised of a high Tc superconducting region and a low Tc superconducting region which exhibits a resistivity at the liquid nitrogen temperature while the high Tc region is superconducitive at that temperature. The low Tc region is doped with impurity such as Si and then subjected to thermal treatment to oxidizing the impurity.
    Type: Grant
    Filed: May 17, 1995
    Date of Patent: March 2, 1999
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventor: Shumpei Yamazaki
  • Patent number: 5861788
    Abstract: In application to a superconducting magnet which is cooled by a cryogenic refrigerator, provided is a superconducting coil which can maintain a cooled state and enables a stable operation and continuous driving even if a ramping speed is increased. First and second superconducting conductors are connected with each other. Respective tape-like superconducting multifilamentary wires are electrically connected with each other through solder, to form joint bodies. The respective joint bodies are insulated from each other by interposition of an insulating material therebetween.
    Type: Grant
    Filed: May 8, 1997
    Date of Patent: January 19, 1999
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Kengo Ohkura, Munetsugu Ueyama, Kenichi Sato
  • Patent number: 5856768
    Abstract: An electrical interconnect provides a path between cryogenic or cryocooled circuitry and ambient temperatures. As a system, a cryocable 10 is combined with a trough-line contact or transition 20. In the preferred embodiment, the cryocable 10 comprises a conductor 11 disposed adjacent an insulator 12 which is in turn disposed adjacent another conductor 13. The components are sized so as to balance heat load through the cryocable 10 with the insertion loss. In the most preferred embodiment, a coaxial cryocable 10 has a center conductor 11 surrounded by a dielectric 12 (e.g. Teflon.TM.) surrounded by an outer conductor 13 which has a thickness between about 6 and 20 microns. The heat load is preferably less than one Watt, and most preferably less than one tenth of a Watt, with an insertion loss less than one decibel. In another aspect of the invention, a trough-line contact or transition 20 is provided in which the center conductor 11 is partially enveloped by dielectric 12 to form a relatively flat portion 28.
    Type: Grant
    Filed: April 26, 1996
    Date of Patent: January 5, 1999
    Assignee: Superconductor Technologies, Inc.
    Inventors: Gregory L. Hey-Shipton, Wallace Y. Kunimoto, Michael J. Scharen, Stephan M. Rohlfing, David J. Kapolnek
  • Patent number: 5802855
    Abstract: A power lead for electrically connecting a superconducting coil with a power supply, comprising thermoelectric cooling means, said means including at least an N-type thermoelectric member and a P-type thermoelectric member, being electrically connected to a positive side and a negative side of said power supply, respectively.
    Type: Grant
    Filed: November 20, 1995
    Date of Patent: September 8, 1998
    Inventors: Sataro Yamaguchi, Kiyoshi Takita, Ikuo Itoh, Hisaaki Hiue, Shinichi Nose
  • Patent number: 5728599
    Abstract: Process for manufacturing a high interconnection density, fine-line, superconductive printed leadframes using thick-film screen-printing techniques, or other printing techniques. Generally, a superconductive leadframe pattern is printed on a backing substrate. Once the pattern is cured, the backing substrate, or portions thereof can be removed. The backing substrate can be a "fish paper" substrate treated with a release agent, or other substrate material which can be dissolved away, etched away, or otherwise removed. Portions of the backing substrate can be used to provide mechanical integrity for the leadframe. The leadframe fingers can be printed using a superconductive paste or a superconductive precursor paste which is subsequently treated to exhibit superconductivity.
    Type: Grant
    Filed: August 7, 1995
    Date of Patent: March 17, 1998
    Assignee: LSI Logic Corporation
    Inventors: Michael D. Rostoker, Mark Schneider, Chok J. Chia
  • Patent number: 5698497
    Abstract: Carbonaceous materials based on the fullerene molecules have been developed which allow for superconductivity. The fullerene materials are soluble in common solvents.
    Type: Grant
    Filed: June 13, 1994
    Date of Patent: December 16, 1997
    Assignee: Lucent Technologies Inc.
    Inventors: Robert Cort Haddon, Arthur Foster Hebard, Donald Winslow Murphy, Matthew Jonathan Rosseinsky
  • Patent number: 5593918
    Abstract: Various techniques for forming superconductive lines are described whereby superconductive lines can be formed by stamping, etching, polishing, or by rendering selected areas of a superconductive film (layer) non-superconductive. The superconductive material can be "perfected" (or optimized) after it is formed into lines (traces). In one embodiment, trenches are etched in a substrate, the trenches are filled with superconductive material, and any excess superconductive material overfilling the trenches is removed, such as by polishing. In another embodiment, superconductive lines are formed by rendering selected areas of a superconductive layer (i.e., areas other than the desired superconductive lines) non-superconductive by "damaging" the superconductive material by laser beam heating, or by ion implantation. Superconductive lines formed according to the invention can be used to protect semiconductor devices (e.g.
    Type: Grant
    Filed: April 22, 1994
    Date of Patent: January 14, 1997
    Assignee: LSI Logic Corporation
    Inventors: Michael D. Rostoker, Mark Schneider, Nicholas F. Pasch, Abraham Yee, William C. Schneider
  • Patent number: 5590536
    Abstract: A cryogenic bypass current lead to bypass quenched magnets in a string of magnets in a superconducting super collider comprises a HTSC section interposed between a lower conductive body terminal and the conductive of the lead is described.
    Type: Grant
    Filed: April 13, 1995
    Date of Patent: January 7, 1997
    Assignee: Northrop Grumman Corp.
    Inventor: Jiing-Liang Wu
  • Patent number: 5506199
    Abstract: The invention relates to solid bodies made of high-temperature superconducting material to which contact is made by solid, compact metallic conductors.To produce said solid bodies, high-temperature superconducting material is either melted completely or a melt is obtained from the oxides of bismuth, strontium, calcium and copper, and, optionally, of antimony and lead. The solid, compact metallic conductors made of silver, gold, a platinum metal or an alloy containing said metals are then partially encased in the melt and the melt is allowed to solidify. Finally, the solid body obtained is annealed together with the conductors in a first stage at temperatures of from 710.degree. to 810.degree. C. and in a second stage in an oxygen-containing atmosphere at temperatures of from 750.degree. to 880.degree. C.
    Type: Grant
    Filed: November 15, 1994
    Date of Patent: April 9, 1996
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Joachim Bock, Eberhard Preisler, Steffen Elschner
  • Patent number: 5399547
    Abstract: The present invention provides a methodology for increasing the critical current density carried by high transition temperature; superconductive materials. The methodology is employed using any Noble metal to form an electrically conductive coating; and is used with any high transition temperature superconductive material conventionally known. The resulting improved superconducting material demonstrates an enhanced critical current density capability in the order of 48%; and substantially decreases the degradation of the critical current density in the presence of an applied magnetic field; and offers a range of other advantages including environmental degradation protection, an increased mechanical strength, and an improved capability for adding electrical contacts.
    Type: Grant
    Filed: September 17, 1993
    Date of Patent: March 21, 1995
    Assignee: Trustees of Boston University
    Inventors: Yehia Z. Negm, George O. Zimmerman, Robert E. Powers, Jr.
  • Patent number: 5359149
    Abstract: A superconductive device for helping shield magnetic field comprises at least two members; a layer containing superconductive oxide over each of the members; connecting component for connecting the members to form a substrate; and connecting element for connecting the layers containing superconductive oxide along a joint in which the members are connected.
    Type: Grant
    Filed: December 9, 1991
    Date of Patent: October 25, 1994
    Assignee: NGK Insulators, Ltd.
    Inventors: Shoji Seike, Hideki Shimizu, Makoto Tani
  • Patent number: 5357059
    Abstract: An electrical connection between an electric conductor and an oxide superconductor is effected without the intermediary of a thin insulating layer that is formed by leaving the oxide superconductor in the atmosphere. This electrical connection is formed by removing the thin insulating layer that is formed by leaving the oxide superconductor in the atmosphere, and by electrically connecting the electric conductor and an exposed surface of the oxide superconductor.
    Type: Grant
    Filed: June 29, 1990
    Date of Patent: October 18, 1994
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Saburo Tanaka, Hideo Itozaki, Hidenori Nakanishi
  • Patent number: 5308831
    Abstract: A method of connecting a high critical temperature superconductive ceramic part and a low critical temperature superconductor such as a multifilament strand of niobium-titanium, in which method a silver contact is prepared on said ceramic part, wherein said multifilament strand is soldered to said contact using an intermediate solder material whose melting temperature is less than 300.degree. C.
    Type: Grant
    Filed: June 26, 1992
    Date of Patent: May 3, 1994
    Assignee: GEC Alsthom SA
    Inventors: Alain Fevrier, Albert Leriche, Peter Herrmann
  • Patent number: 5296459
    Abstract: The present invention provides a methodology for forming an electrically conductive contact on the external surface of superconductive materials. The methodology is employed using any Noble metal to form the conductive contact; and is used with any superconductive material conventionally known. The resulting conductive contact provides a low electrical resistance and firm point of electrical junction for the superconductor with any conductive material in any electrical circuit or use.
    Type: Grant
    Filed: June 19, 1992
    Date of Patent: March 22, 1994
    Assignee: Trustees of Boston University
    Inventors: Yehia Negm, George O. Zimmerman, Randy J. McConeghy
  • Patent number: 5290760
    Abstract: A method of manufacturing an electrical contact between a current lead and a part made of a superconductive ceramic of the type RBa.sub.2 Cu.sub.3 O.sub.y, where R designates a lanthanide chosen from Y, La, Nd, Sm, Eu, Gd, Ho, Er, Tm, Yb, and Lu, and where y lies in the range 6.9 to 7, in which method a layer of a material based on a silver-containing resin is deposited on said part, the part is dried, and is then heat treated in oxygen by being heated to a temperature greater than 900.degree. C., and then cooled, with the temperature dwelling at 450.degree. C. for a certain length of time corresponding to the phase during which said ceramic is reoxygenated.
    Type: Grant
    Filed: June 3, 1992
    Date of Patent: March 1, 1994
    Assignee: GEC Alsthom SA
    Inventors: Fernand Grivon, Jacques Bouthegourd
  • Patent number: 5278136
    Abstract: This field-effect transistor comprises a conductive substrate (2) serving as the gate electrode, an insulating barrier layer (3), and a superconducting channel layer (1) on top of the barrier layer (3). The superconductor layer (1) carries a pair of mutually spaced electrodes (4, 5) forming source and drain, respectively. The substrate is provided with an appropriate gate contact (6).The substrate (2) consists of a material belonging to the same crystallographic family as the barrier layer (3). In a preferred embodiment, the substrate (2) is niobium-doped strontium titanate, the barrier layer (3) is undoped strontium titanate, and the superconductor (1) is a thin film of a material having a lattice constant at least approximately similar to the one of the materials of the substrate (2) and barrier (3) layers. A preferred material of this type is YBa.sub.2 Cu.sub.3 O.sub.7-.delta., where 0 .cent..delta..ltoreq.0.5.
    Type: Grant
    Filed: July 16, 1991
    Date of Patent: January 11, 1994
    Assignee: International Business Machines Corporation
    Inventors: Johannes G. Bednorz, Jochen D. Mannhart, Carl A. Mueller
  • Patent number: 5248663
    Abstract: A method of forming a superconductor pattern in which at lest a pair of electrodes is formed on a substrate in spaced, facing relationship nd an oxide superconductor thin film having a unit lattice which assumes a laminar structure then is formed on the substrate, extending between and contacting the electrodes. The superconductor pattern obtained by this method suffers less degradation of the superconductor thin film, in comparison with that of patterns formed by the prior art methods, and the decrease of the critical current density as a function of increasing temperature is extremely small.
    Type: Grant
    Filed: March 13, 1992
    Date of Patent: September 28, 1993
    Assignee: Fujitsu Limited
    Inventors: Hideyuki Noshiro, Seigen Otani
  • Patent number: 5240905
    Abstract: A metal electrode formed on an oxide superconductor for electric connection to the oxide superconductor, includes a first layer of Ag in direct contact with the oxide superconductor, and a second layer formed on the first layer. The second layer is formed of noble metal excluding Ag. The metal electrode can be formed by forming a first layer of Ag to cover a whole surface of the oxide superconductor layer, and forming a second layer of noble metal excluding Ag, to cover a whole surface of the first layer, thereby to form a double metal layer, and patterning the double metal layer so as to form a metal electrode composed of the double metal layer.
    Type: Grant
    Filed: January 28, 1992
    Date of Patent: August 31, 1993
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Saburo Tanaka, Hideo Itozaki, Shuji Yazu
  • Patent number: 5227361
    Abstract: A superconducting device comprises a substrate having an electric connecting section and a copper oxide superconducting material thereon, and an electric interconnecting means for the electric connecting section and the superconducting material formed from a first member selected from the group of copper, gold, platinum and materials including copper, gold, and platinum as a main component and tightly attached to the superconducting material, and/or a second member selected from the group of a heat resistant metal material and its compound with the first member and the substrate material and tightly attached to the first member and the substrate.
    Type: Grant
    Filed: April 29, 1988
    Date of Patent: July 13, 1993
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventor: Shunpei Yamazaki
  • Patent number: 5221660
    Abstract: A semiconductor substrate having a silicon substrate and a superconducting thin film layer composed of compound oxide such as Ln.sub.1 Ba.sub.2 Cu.sub.3 O.sub.7-.delta. (Ln is lanthanide) and stratified on the silicon substrate, characterized in that an intermediate semiconductor layer composed of compound semiconductor material such as GaAs is interposed between the silicon substrate and the superconducting thin film layer.
    Type: Grant
    Filed: March 25, 1992
    Date of Patent: June 22, 1993
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Hideo Itozaki, Keizo Harada, Naoji Fujimori, Shuji Yazu, Tetsuji Jodai
  • Patent number: 5212150
    Abstract: A superconducting device comprises a substrate having an electric connecting section and a copper oxide superconducting material thereon, and an electric interconnecting means for the electric connecting section and the superconducting material formed from a first member selected from the group of copper, gold, platinum and materials including copper, gold, and platinum as a main component and tightly attached to the superconducting material, and/or a second member selected from the group of a heat resistant metal material and its compound with the first member and the substrate material and tightly attached to the first member and the substrate.
    Type: Grant
    Filed: February 16, 1990
    Date of Patent: May 18, 1993
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventor: Shunpei Yamazaki
  • Patent number: 5179075
    Abstract: A method of making at least one low electrical resistance connection between a metal and a high T.sub.c superconducting ceramic part, said part being made from a ceramic powder which is placed in a mold, compressed, and sintered, wherein at least one volume of silver or gold powder corresponding to the shape of said connection and situated at the desired location is placed inside said mold in juxtaposition with said ceramic powder but without being mixed therewith, after which the compression and the sintering are performed under an atmosphere containing oxygen and at a temperature that is lower than the melting temperature of silver or gold.
    Type: Grant
    Filed: October 29, 1990
    Date of Patent: January 12, 1993
    Assignee: GEC Alsthom SA
    Inventors: Albert Leriche, Gerard Duperray, Fernand Grivon
  • Patent number: 5179071
    Abstract: A high-T.sub.c superconductor contact unit having low interface resistivity is disclosed, as is a method for making the unit. An inert metal is deposited on the surface of the superconductor, which surface is preferably non-degraded, to form a unit with the surface of the superconductor, and where temperatures as high as 500.degree. C. to 700.degree. C. can be tolerated, the unit is oxygen annealed to establish a still lower surface resistivity between the surface of the high-T.sub.c superconductor and the inert metal, including a low surface resistivity of about 10.sup.-10 .OMEGA.-cm.sup.2 at high-T.sub.c superconductor operating temperatures. The superconductor is a metal-oxide superconductor, and may be rare earth, thallium, or bismuth based.
    Type: Grant
    Filed: January 15, 1991
    Date of Patent: January 12, 1993
    Assignees: The United States of America as represented by the Secretary of Commerce, Westinghouse Electric Corp.
    Inventors: John W. Ekin, Armand J. Panson, Betty A. Blankenship
  • Patent number: 5149686
    Abstract: A high-T.sub.c superconducting unit is disclosed having low contact resistivity between a substantially non-degraded surface of the superconductor and a surface of a contact pad in engagement with the substantially non-degraded surface of the superconductor, with contact resistivity of less than 1000 .mu..OMEGA.-cm.sup.2 at high-T.sub.c superconductor operating temperatures being disclosed.
    Type: Grant
    Filed: October 16, 1990
    Date of Patent: September 22, 1992
    Assignee: The United States of America as represented by the Secretary of Commerce
    Inventors: John W. Ekin, Armand J. Panson, Betty A. Blankenship
  • Patent number: 5135908
    Abstract: In a method of patterning superconducting thin films such as YBaCuO, based on the inhibition of superconductivity by intermixing an impurity, such as silicon, with superconductor material, a thin film of silicon is formed on a magnesium oxide substrate and then patterned, by laser direct-writing for example, to correspond to a desired pattern of superconducting lines. Multilayered YBaCuO thin films are then deposited over the patterned silicon film and annealed using rapid thermal annealing at a temperature of 980.degree. C. maintained for a period in the range from 30 to 90 seconds. The rapid annealing results in intermixing of silicon and YBaCuO in regions of the film between the lines of the pattern which, in turn, causes these regions to become insulating, and at the same time causes the YBaCuO film over the line pattern to become superconducting.
    Type: Grant
    Filed: August 7, 1989
    Date of Patent: August 4, 1992
    Assignee: The Trustees of Columbia University in the City of New York
    Inventors: Edward S. Yang, Qiyuan Y. Ma
  • Patent number: 5116810
    Abstract: The invention relates to a process for making a superconducting connection between a pair of superconducting ceramic oxide pieces, each of the pieces having been formed by combining the metallic elements of the superconducting oxide in substantially the stoichiometric proportions needed to form the superconducting oxide into a precursor and forming the precursor into a shaped piece. The process comprises the steps of: contacting each of the shaped pieces with the other; connecting each of the shaped pieces to the other by means for forming a metallurgical bond between the shaped pieces; and oxidizing the connected shaped pieces under conditions sufficient to oxidize the metallic elements to the superconducting oxide.In other embodiments of the invention, the process is for forming a superconducting connection between a pair of pieces having a superconducting ceramic oxide/noble metal composition; or for forming a joint between a superconducting ceramic oxide and a normal conductor.
    Type: Grant
    Filed: October 16, 1989
    Date of Patent: May 26, 1992
    Assignee: American Superconductor Corporation
    Inventors: Chandrashekhar H. Joshi, Christopher A. Craven
  • Patent number: 5099162
    Abstract: Coils for electric appliances such as motor or generator are made with a superconducting material, and the width of the coil and the gap between the coils are so adjusted that the passage of magnetic flux generated by a magnetic flux generating member in the electric appliance is not influenced by the magnetic repulsion of the superconducting material.
    Type: Grant
    Filed: July 18, 1988
    Date of Patent: March 24, 1992
    Assignee: Canon Kabushiki Kaisha
    Inventor: Takeshi Sawada
  • Patent number: 5079223
    Abstract: A method of forming a composite by providing a ceramic capable of having zero electrical resistance and complete diamagnetism at superconducting temperatures, bonding a thin layer of Ag, Au or alloys thereof with the ceramic. Thereafter, there is bonded a first metal to the ceramic surface at a temperature less than about 400.degree. C., and then a second metal is bonded to the first metal at a temperature less than about 400.degree. C. to form a composite wherein the first metal is selected from the class consisting of In, Ga, Sn, Bi, Zn, Cd, Pb, Ti and alloys thereof and wherein the second metal is selected from the class consisting of Al, Cu, Pb and Zn and alloys thereof.
    Type: Grant
    Filed: August 14, 1990
    Date of Patent: January 7, 1992
    Assignee: Arch Development Corporation
    Inventor: Victor A. Maroni
  • Patent number: 5051396
    Abstract: A manufacturing method of Josephson devices is described. A superconducting ceramic film is deposited on a non-conductive surface and partly spoiled in order to form a barrier film by which two superconducting regions is separated. The spoiling is performed by adding a spoiling element into the ceramic film by ion implantation.
    Type: Grant
    Filed: May 21, 1990
    Date of Patent: September 24, 1991
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventor: Shunpei Yamazaki
  • Patent number: 5015620
    Abstract: A high-T.sub.c superconductor contact unit having low interface resistivity is disclosed, as is a method for making the unit. An inert metal is deposited on the surface of the superconductor, which surface is preferably non-degraded, to form a unit with the surface of the superconductor, and where temperatures as high as 500.degree. C. to 700.degree. C. can be tolerated, the unit is oxygen annealed to establish a still lower surface resistivity between the surface of the high-T.sub.c superconductor and the inert metal, including a low surface resistivity of about 10.sup.-10 .OMEGA.-cm.sup.2 at high-T.sub.c superconductor operating temperatures. The superconductor is a metal-oxide superconductor, and may be rare earth, thallium, or bismuth based.
    Type: Grant
    Filed: November 22, 1988
    Date of Patent: May 14, 1991
    Assignees: The United States of America as represented by the Secretary of Commerce, Westinghouse Electric Corporation
    Inventors: John W. Ekin, Armand J. Panson, Betty A. Blankenship
  • Patent number: 4990489
    Abstract: A read only memory device includes a first electrode and a second electrode arranged in an overlapping relation with the first electrode so as to be geometrically in connection at an intersection therewith corresponding to a storage location for one type of data. At least one of the first and second electrodes is formed of a ceramics system high temperature superconductor. A prescribed one of the two electrodes which is formed of the high temperature superconductor has a high resistance region for insulating the first and second electrodes from each other at an intersection corresponding to a storage location for another type of stored data. The high resistance region is formed by irradiating an intersection with a focused ion beam.
    Type: Grant
    Filed: July 6, 1988
    Date of Patent: February 5, 1991
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yoji Mashiko, Tadashi Nishioka
  • Patent number: 4963523
    Abstract: A low resistivity contact to a high-Tc superconductor is made by forming a contact pad on the surface of an abraded or freshly prepared superconductor by depositing an inert metal on the surface so that a surface resistivity between the surface of the high-Tc superconductor and the pad is established of less than about 1000.mu..OMEGA.-cm.sup.2 at high-Tc superconductor operating temperatures.
    Type: Grant
    Filed: November 6, 1987
    Date of Patent: October 16, 1990
    Assignees: The United States of America as represented by the Secretary of the Commerce, Westinghouse Electric Corporation
    Inventors: John W. Ekin, Armand J. Panson, Betty A. Blankenship