Abstract: To provide a cleaning agent that can remove impurities such as metal polishing dust adhering to a semiconductor substrate without corroding metal and can prevent re-adhesion of the impurities. The semiconductor substrate cleaning agent of the present invention contains at least the following component (A) and component (B): Component (A): a water-soluble oligomer having a weight average molecular weight of not less than 100 and less than 10000; and Component (B): water. It is preferable that the water-soluble oligomer is at least one compound selected from compounds represented by the following formulas (a-1) to (a-3).

Abstract: The present invention relates to a remover composition comprising, tetraalkylammonium hydroxide, a benzylic alcohol, a glycol component comprising at least one glycol compound, and a and an alkyl amine component, wherein said alkyl amine component is selected from the group consisting of a dialkyl amine, a mono-alkyl amine having structure having structure (I), and combinations thereof wherein, in said di-alkyl amine, one of the alkyl groups is a C-1 to C-4 n-alkyl and the other alkyl group is a C-16 to C-20 n-alkyl, and for said mono-alkyl amine m? and m are independently chosen from an integer ranging from 4 to 8. This invention also pertains to the process of using these compositions to remove a patterned photoresist from a substrate.

Abstract: The aqueous alkaline cleaning composition comprising (A) at least one thioamino acid having at least one secondary or tertiary amino group and at least one mercapto group and (B) at least one quaternary ammonium hydroxide; the use of the alkaline cleaning composition for the processing of substrates useful for fabricating electrical and optical devices; and a method for processing substrates useful for fabricating electrical and optical devices making use of the said aqueous alkaline cleaning composition.

Abstract: An aqueous cleaning composition for a substrate for a perpendicular magnetic recording hard disk including a Ni—P containing layer contains at least one surfactant selected from the group consisting of surfactants represented by Formulas (1) to (6) and has a pH at 25° C. of 5 or less. In Formula (1), R1 is an alkyl group having a carbon number of 10 to 16, and X is a halogen atom.

Abstract: A method of manufacturing a magnetic disk glass substrate has a cleaning step of cleaning the glass substrate. In the cleaning step, the cleaning is performed under an acidic condition using a cleaning liquid containing oxalate ions and bivalent iron ions. In parallel with the cleaning step or before or after the cleaning step, trivalent iron ions generated by oxidation of the bivalent iron ions contained in the cleaning liquid are reduced by ultraviolet irradiation.

Abstract: An alkaline detergent composition for hard surface comprises an alkaline agent (component A), a nonionic surfactant (component B), a chelating agent (component C), water (component D), at least one carboxylic acid compound (component E) selected from the group consisting of compounds represented by general formula (1) and general formula (2), and at least one anionic surfactant (component F) selected from the group consisting of surfactants represented by general formula (3) and salts thereof. Therein, the content ratio [component E (weight %)/component B (weight %)] is 1/1.5-15/1, the content ratio [component F (weight %)/component B (weight %)] is 10/1-1/5, and the pH at 25° C. is 12 or greater.

Abstract: A cleaning solution and method for removing submicron particles from the surface and/or the bevel of an electronic substrate such as a semiconductor wafer. The cleaning solution comprises a polycarboxylate polymer or an ethoxylated polyamine. The method comprises the step of contacting a surface of the substrate with a cleaning solution comprised of a polycarboxylate polymer or an ethoxylated polyamine. Additional optional steps in the method include applying acoustic energy to the cleaning solution and/or rinsing the surface with a rinsing solution with or without the application of acoustic energy to the rinsing solution.

Abstract: Provided are a rinsing agent to produce a hard disk substrate free from remaining abrasive grains as well as a pit defect on the surface thereof and a method for production of a hard disk substrate using such a rinsing agent. A rinsing agent of the present invention is rinsing solution containing colloidal silica as abrasive grains. Letting that the colloidal silica abrasive grains have a concentration C and an average grain size R (C and R are represented in weight % and nm, respectively), the concentration C and the average grain size R of the colloidal silica abrasive grains have a relation matching the following Expression (1): 12.2C+18.2 (1).

Abstract: A cleaning solution and method for removing submicron particles from the surface and/or the bevel of an electronic substrate such as a semiconductor wafer. The cleaning solution comprises a polycarboxylate polymer or an ethoxylated polyamine. The method comprises the step of contacting a surface of the substrate with a cleaning solution comprised of a polycarboxylate polymer or an ethoxylated polyamine. Additional optional steps in the method include applying acoustic energy to the cleaning solution and/or rinsing the surface with a rinsing solution with or without the application of acoustic energy to the rinsing solution.

Abstract: The aqueous alkaline cleaning composition comprising (A) at least one thioamino acid having at least one secondary or tertiary amino group and at least one mercapto group and (B) at least one quaternary ammonium hydroxide; the use of the alkaline cleaning composition for the processing of substrates useful for fabricating electrical and optical devices; and a method for processing substrates useful for fabricating electrical and optical devices making use of the said aqueous alkaline cleaning composition.

Abstract: Provided is a cleaning agent for electronic materials, which enables very efficient advanced cleaning such that yield in the production of the electronic materials is improved and cleaning in a short period of time becomes possible, the cleaning agent having excellent cleaning power for fine-grained particles and organic matter and being able to reduce metallic contamination on the substrate. The cleaning agent for electronic materials comprises sulfamic acid (A), an anionic surfactant having at least one sulfonic acid group or a salt thereof in the molecule (B), a chelating agent (C), and water, wherein the pH at 25 C is preferably not more than 3.0 and the (B) is preferably a polymeric anionic surfactant (B1) having a weight average molecular weight of 1,000 to 2,000,000.

Abstract: A cleaning solution and method for removing submicron particles from the surface and/or the bevel of an electronic substrate such as a hard disk media substrate, or an imprint mold used in the manufacturing of the hard disk media or a read/write head assembly part. The cleaning solution comprises a polycarboxylate polymer or an ethoxylated polyamine. The method comprises the step of contacting a surface of the substrate with a cleaning solution comprised of a polycarboxylate polymer or an ethoxylated polyamine. Additional optional steps in the method include applying acoustic energy to the cleaning solution and/or rinsing the surface with a rinsing solution with or without the application of acoustic energy to the rinsing solution.

Abstract: An alkali-type nonionic surfactant composition contains a nonionic surfactant (component A), water (component B), at least one compound (component C) selected from the group consisting of benzenesulfonic acid, toluenesulfonic acid, dimethylbenzenesulfonic acid, hydroxybenzenesulfonic acid and salts thereof, and at least one alkaline chemical (component D) selected from the group consisting of potassium hydroxide and sodium hydroxide. The alkali-type nonionic surfactant composition contains the nonionic surfactant (component A) in an amount of 0.5 to 20 wt % and has a pH at 25° C. of 12 or greater.

Abstract: A microwaviness reducing agent for polishing a substrate for a precision part, containing either a surfactant having two or more ionic hydrophilic groups, or a polycarboxylic acid compound having 2 to 15 total carbon atoms and having either OH group or groups or SH group or groups, or a salt thereof; a polishing composition for a substrate for a precision part, containing the microwaviness reducing agent, an abrasive and water; a polishing composition comprising water, an abrasive, an organic acid or a salt thereof, and a surfactant, wherein the organic acid is a polycarboxylic acid compound having 2 to 15 total carbon atoms and having either OH group or groups or SH group or groups, and wherein the surfactant has two or more ionic hydrophilic groups in its molecule and has a molecular weight of 300 or more; a method of reducing microwaviness of a substrate for a precision part; and a method for manufacturing a substrate for a precision part.

Abstract: The invention provides a method of cleaning a magnetic recording medium substrate that removes residual substances and suppresses oxidation of the substrate surface. The method of cleaning the magnetic recording medium substrate uses nano-bubble water. Also disclosed is a method of manufacturing a magnetic recording medium that includes the method of cleaning the magnetic recording medium substrate and steps of sequentially forming at least a magnetic layer, a protective layer, and a liquid lubricant layer on the cleaned substrate.

Abstract: A self-cleaning colloidal slurry and process for finishing a surface of a glass, ceramic, glass-ceramic, metal or alloy substrate for use in a data storage device, for example. The slurry comprises a carrying fluid, colloidal particles, etchant, and a surfactant adsorbed and/or precipitated onto a surface of the colloidal particles and/or substrate. The surfactant has a hydrophobic section that forms a steric hindrance barrier and substantially prevents contaminates, including colloidal particles, from bonding to the substrate surface. The slurry is applied to the surface of the substrate while a pad mechanically rubs the surface. Subsequent cleaning with standard soap solutions removes substantially all remaining contamination from the substrate surface. In an exemplary embodiment, the slurry is used to superfinish a glass disk substrate to a surface roughness of less than 2 ?, with substantially no surface contamination as seen by atomic force microscopy (AFM) after standard soap cleaning steps.

Abstract: A polishing composition for memory hard disk containing water and silica particles, wherein the silica particles have a particle size distribution in which the relationship of a particle size (R) and a cumulative volume frequency (V) in a graph of particle size-cumulative volume frequency obtained by plotting a cumulative volume frequency (%) of the silica particles counted from a small particle size side against a particle size (nm) of the silica particles in the range of particle sizes of from 40 to 100 nm satisfy the following formula (1): V?0.5×R+40 (1), wherein the particle size is determined by observation with a transmission electron microscope (TEM). The polishing composition of the present invention can be even more suitably used for the manufacture of a substrate for precision parts such as substrates for memory hard disks.

Abstract: A polishing composition comprising an abrasive, an acid and/or a salt thereof, and water, wherein copper (Cu) is contained in an amount of 1 mg or less per kg of the polishing composition; a process for reducing a surface defect of a substrate comprising applying to a substrate or a polishing pad a polishing composition comprising an abrasive, an acid and/or a salt thereof, and water, wherein copper (Cu) is contained in an amount of 1 mg or less per kg of the polishing composition fed to the substrate or the polishing pad; and a process for manufacturing a substrate comprising a polishing step comprising applying to a substrate or a polishing pad the above polishing composition.

Abstract: A process for restoring magnetic recording tape damaged by “Sticky Shed” syndrome cleans magnetic tapes of the Backcoating which is causing their eventual degradation and destruction. The Backcoating is first removed in a multi-step process. A liquid cleaner, such as isopropyl alcohol, is applied to the Backcoating to dissolve it from and clean it off the Mylar Base. Before the liquid cleaner is applied, steps are taken to prevent the cleaner fluid from getting onto the Oxide side of the tape. The chemical cleaning is done as quickly as possible. The second step is to dry clean the Base surface of the tape to remove the remaining solvent and the debris of any remaining Backcoating. Then, the Oxide side of the tape is given a dry, non-chemical cleaning to remove the residue of contamination of the Backcoating which was deposited on the Oxide side of the tape as the result of physical contact with the Backcoating from the storage on the reel of tape.

Abstract: A collection of silicon oxide nanoparticles have an average diameter from about 5 nm to about 100 nm. The collection of silicon oxide nanoparticles effectively include no particles with a diameter greater than about four times the average diameter. The particles generally have a spherical morphology. Methods for producing the nanoparticles involve laser pyrolysis. The silicon oxide nanoparticles are effective for the production of improved polishing compositions including compositions useful for chemical-mechanical polishing.

Abstract: To provide a polishing composition which enables maintenance of excellent properties and high quality of the surface of a hard disk without lowering polishing rate during polishing of the surface, and which can provide a polished surface in which the amount of dub-off is considerably reduced as compared with that of a conventional level, a polishing composition containing water, a polishing material (particularly alumina), a polishing accelerator, and at least one of hydroxypropyl cellulose and hydroxyalkyl alkyl cellulose is provided.

Abstract: An abrasive composition for substrates for magnetic recording disks and a process for producing a substrate for a magnetic recording disk are provided, which enable lowering of surface roughness of a substrate for a magnetic recording disk; form no nodules, polishing scratches, and minute defects such as micropits; and enable polishing at economical speeds. The abrasive composition comprises at least water, titanium oxide fine particles and an abrasion promoter, wherein 90-100% of the titanium oxide is constituted by a single crystal structure.

Abstract: A polishing composition comprising silica particles, water, and Fe salt and/or Al salt of a polyaminocarboxylic acid; a polishing process comprising applying the polishing composition; a process for manufacturing a magnetic disk substrate, comprising the step of polishing a substrate with the polishing composition; a magnetic disk substrate manufactured by applying the polishing composition.

Abstract: A cleaning solution for electronic materials contains dissolved oxygen gas at a concentration greater than atmospheric saturation concentration, 0.1-10,000 mg/liter of ammonia, and 0.1-10,000 mg/liter of hydrogen peroxide in water. Alternatively, the cleaning solution contains dissolved reducing agents, 0.1-10,000 mg/liter of ammonia, and 0.1-10,000 mg/liter of hydrogen peroxide in water. A method for making the cleaning solution of the present invention is provided. A method for cleaning electronic materials using the cleaning solution of the present invention is also provided.

Abstract: A chemical cleaning composition for cleaning electronic equipment and electric or electronic appliances, a device for the application of such composition, and a method of cleaning such equipment are disclosed.

Abstract: The present invention relates to a polishing composition for polishing alumina disks, polishing substrates having silica surfaces and semiconductor wafers, comprising a stable aqueous silica sol containing moniliform colloidal silica particles having a ratio (D1/D2) of a particle diameter D1 nm (as measured by dynamic light scattering method) to a mean particle diameter D2 (as measured by nitrogen absorption method) of 3 or more, wherein D1 is between 50 to 800 nm and D2 is between 10 to 120 nm, said moniliform colloidal silica particles being composed of spherical colloidal silica particles and a metal oxide-containing silica bond which bonds these spherical colloidal silica particles together, wherein the spherical colloidal silica particles are linked together in rows in only one plane by observation through an electron microscope, and further wherein said polishing composition contains 0.5 to 50% by weight of said moniliform colloidal silica particles.

Abstract: A cleaning solution for electronic materials contains dissolved oxygen gas at a concentration greater than atmospheric saturation concentration, 0.1-10,000 mg/liter of ammonia, and 0.1-10,000 mg/liter of hydrogen peroxide in water. Alternatively, the cleaning solution contains dissolved reducing agents, 0.1-10,000 mg/liter of ammonia, and 0.1-10,000 mg/liter of hydrogen peroxide in water. A method for making the cleaning solution of the present invention is provided. A method for cleaning electronic materials using the cleaning solution of the present invention is also provided.

Abstract: The present invention provides a process for efficient recovery of dyestuffs from dye-based optical disks, and to provide a solvent used for recovery. Disclosed herein is a process for recovering dyestuffs from dye-based optical disks by treating the dyestuff-containing layer with a solvent containing a singlet oxygen quencher. Disclosed also herein is a solvent for dyestuff recovery which contains a singlet oxygen quencher.

Abstract: A thermoplastic norbornene resin is purified by using a cleaning liquid to eliminate organic impurities, ionic impurities, metallic impurities, and particles of the resin. The cleaning liquid is selected from 2-propanol and a mixed solvent of 2-propanol and water. A substrate for a magnetic recording medium of the invention is fabricated by injection-molding the thermoplastic norbornene resin purified by this method. A magnetic recording medium of the invention includes such a substrate, and a magnetic layer, a protective layer, and a liquid lubricant layer sequentially formed on the substrate. A method for manufacturing such a magnetic recording medium is also provided.

Abstract: A polishing composition for a magnetic disk substrate to be used for a memory hard disk, which comprises: (a) colloidal silica as an abrasive in an amount within a range of from 0.1 to 35 wt % based on the total weight of the composition; (b) iron nitrate as a polishing accelerator in an amount within a range of from 0.04 to 2.2 wt % based on the total weight of the composition; (c) citric acid as a stabilizer in an amount within a range of from 0.4 to 22 wt % based on the total weight of the composition; (d) hydrogen peroxide as a polishing acceleration assistant in an amount within a range of from 0.155 to 9.3 wt % based on the total weight of the composition; and (e) water.

Abstract: A polishing composition for a memory hard disk, which comprises the following components (a) to (d): (a) from 0.1 to 50 wt %, based on the total amount of the polishing composition, of at least one abrasive selected from the group consisting of silicon dioxide, aluminum oxide, cerium oxide, zirconium oxide, titanium oxide, silicon nitride and manganese dioxide, (b) from 0.001 to 10 wt %, based on the total amount of the polishing composition, of at least one iron salt selected from the group consisting of iron nitrate, iron sulfate, ammonium iron sulfate, iron perchlorate, iron chloride, iron citrate, ammonium iron titrate, iron oxalate, ammonium iron oxalate and an iron chelate complex salt of ethylenediaminetetraacetic acid, (c) from 0.01 to 30 wt %, based on the total amount of the polishing composition, of at least one peroxydisulfate salt selected from the group consisting of ammonium peroxydisulfate, potassium peroxydisulfate and sodium peroxydisulfate, and (d) water.

Abstract: A polishing composition for polishing a memory hard disk, which comprises the following components (a) to (d): (a) from 0.1 to 50 wt %, based on the total amount of the polishing composition, of at least one abrasive selected from the group consisting of silicon dioxide, aluminum oxide, cerium oxide, zirconium oxide, titanium oxide, silicon nitride and manganese dioxide, (b) from 0.0001 to 3.0 wt %, based on the total amount of the polishing composition, of at least one polishing resistance-reducing agent selected from the group consisting of a surfactant, a water-soluble polymer and a polyelectrolyte, (c) from 0.001 to 40 wt %, based on the total amount of the polishing composition, of at least one polishing accelerator selected from the group consisting of an inorganic acid, an organic acid and their aluminum, iron, nickel and cobalt salts, and (d) water.

Abstract: A slurry in accordance with the invention comprises CeO2 polishing particles and sodium polyacrylate in an aqueous solution. This slurry is used to polish a glass or glass ceramic substrate. I have discovered that adding sodium polyacrylate to a CeO2 slurry improves the polishing rate without causing a major negative impact on the slurry stability or redispersibility. In addition, the addition of the sodium polyacrylate does not cause a great deal of foaming. This polishing process can be used to prepare substrates for the manufacture of magnetic disks.

Abstract: An abrasive composition for polishing a substrate for a magnetic recording disc is described, which comprises finely divided titanium oxide particles, an abrasion promoter, an optional water-soluble oxidizing agent, and water. This abrasive composition is used for polishing a substrate for a magnetic recording disc by a process wherein the substrate is polished with a pad while the abrasive composition is supplied between the substrate and the pad, and at least one of the pad and the substrate is rotated. The contents of the finely divided titanium oxide particles, the abrasion promoter and the optional water-soluble oxidizing agent are 2-20 wt. %, 1-20 wt. % and up to 10 wt. %, respectively, based on the weight of the abrasive composition as used for polishing the substrate.

Abstract: A surface treatment composition containing a complexing agent as a metal deposition preventive in a liquid medium, in which the complexing agent is an ethylenediaminephenol derivative of the following general formula (1) or its salt: ##STR1## wherein X.sub.1 and X.sub.2 are hydroxyl groups; Y.sub.1 to Y.sub.8 are respectively independently a hydrogen atom, a hydroxyl group, a halogen atom, a carboxyl group, a phosphonic acid group, a sulfonic acid group, a carbonyl group, a nitro group, a nitroso group, an amino group, an imino group, a nitrilo group, a nitrile group, a thiocyanate group, a hydroxyamino group, a hydroxyimino group, or an alkyl or alkoxy group which may have a substituent, provided that at least one of Y.sub.1 to Y.sub.8 is not a hydrogen atom; Z.sub.1 to Z.sub.4 are respectively independently a hydrogen atom, a carboxyl group or a sulfonic acid group; and R.sub.1 to R.sub.4 are respectively independently a hydrogen atom or an alkyl group which may have a substituent.

Abstract: A cleaning composition comprising at least one low molecular weight polyorganosiloxane selected from the group consisting of straight chain polydiorganosiloxane represented by a general formula: ##STR1## (wherein R.sup.1 is an organic group of single valence substituted by the same or different group or unsubstituted, and l is an integer from 0 to 5), and cyclic polydiorganosiloxane represented by a general formula: ##STR2## (wherein R.sup.1 is an organic group of single valence substituted by the same or different group or unsubstituted, and m is an integer from 3 to 7). To use it as a water system cleaning agent, polyoxyalkylene group containing polyorganosiloxane, a surfactant, and water are additionally mixed. Accordingly, a cleaning effect free from environmental destruction and contamination, equivalent to flon containing cleaning agents, and satisfactorily stable in terms of dispersion as a water system cleaning agent can be obtained.

Abstract: A substrate, on which a base metal layer and a magnetic recording metal layer are to be deposited, is cleaned by contacting it with an aqueous solution of at least one compound selected from a carboxylic acid or L-ascorbic acid having a pH of 5.0 or less.

Abstract: A bleach and oxidation catalyst is provided comprising a catalytically active metal-complex having a poly-dentate ligand containing at least 6 hetero-atoms. Such metal-complexes can activate hydrogen peroxide, peroxy acids or molecular oxygen and were found to have both favourable stain removal and remarkable dye transfer inhibition properties. In addition, these complexes can be easily prepared.

Abstract: Microelectronics wafer substrate surfaces are cleaned to remove metal contamination while maintaining wafer substrate surface smoothness by contacting the wafer substrate surfaces with an aqueous cleaning solution of an alkaline, metal ion-free base and a polyhydroxy compound containing from two to ten --OH groups and having the formula: ##STR1## wherein or in which --R--, --R.sup.1 --, --R.sup.2 -- and --R.sup.3 -- are alkylene radicals containing two to ten carbon atoms, x is a whole integer of from 1 to 4 and y is a whole integer of from 1 to 8, with the proviso that the number of carbon atoms in the polyhydroxy compound does not exceed ten, and wherein the water present in the aqueous cleaning solution is at least about 40% by weight of the cleaning composition.

Abstract: A cleaning composition comprising at least one low molecular weight polyorganosiloxane selected from the group consisting of straight chain polydiorganosiloxane represented by a general formula: ##STR1## (wherein R.sup.1 is an organic group of single valence substituted by the same or different group or unsubstituted, and 1 is an integer from 0 to 5), and cyclic polydiorganosiloxane represented by a general formula: ##STR2## (wherein R.sup.1 is an organic group of single valence substituted by the same or different group or unsubstituted, and m is an integer from 3 to 7). To use it as a water system cleaning agent, polyoxyalkylene group containing polyorganosiloxane, a surfactant, and water are additionally mixed. Accordingly, a cleaning effect free from environmental destruction and contamination, equivalent to flon containing cleaning agents, and satisfactorily stable in terms of dispersion as a water system cleaning agent can be obtained.

Abstract: A cleaning method for a video tape recorder (VTR) employs a cleaning liquid. The cleaning liquid is applied to a tape surface of a tape-shaped support. The tape surface then slides against a surface of a VTR component, such as a magnetic head surface, to clean the surface. The cleaning liquid is a mixture of perfluorocarbons having a boiling point of about 56.degree. C. to about 155.degree. C. The cleaning liquid may also contain a hydrocarbon based solvent and a fluorine based resin. The cleaning liquid acts to clean and to prevent redeposition of contaminants on the surface of VTR component.

Abstract: The present invention relates to a cleaning liquid which is used for removing an image forming material containing a resin component from surface of a recording medium on which an image is formed by the image forming material in order to permit the recording medium serviceable again as a recording medium, characterized by comprising water, a gelatinizer or a swelling agent which is compatible with water and gelatinizes the resin component of the image forming material, and an enzyme.