Abstract: A method of producing an open, porous structure having an outer surface defining a shape having a bulk volume and having interconnecting openings extending throughout said volume and opening through said surface, and products resulting from the method. The method comprises preparing a viscous mixture comprising a sinterable powder dispersed in a sol of a polymer in a primary solvent, replacing the primary solvent with a secondary liquid in which the polymer is insoluble to produce a gel comprising an open polymeric network having the sinterable powder arranged therein, removing the secondary liquid from the gel; removing the polymer network, and sintering the sinterable powder to form the open, porous structure. Also disclosed are shaped, porous products resulting from methods of the invention.

Abstract: Methods of preparing porous optical materials are provided. These methods allow for the selection of the desired pore size and level of porosity in the porous optical material. Such methods utilize a preformed polymeric porogen.

Abstract: Crosslinked particles are provided that are useful in the manufacture of dielectric materials for use in electronic devices such as integrated circuits. The crosslinked particles are prepared by activating crosslinkable groups on synthetic polymer molecules, where the crosslinkable groups are inert until activated and, when activated, undergo an irreversible intramolecular crosslinking reaction to form crosslinked particles.

Abstract: A suitable cross-linkable matrix precursor and a poragen can be treated to form a porous cross-linked matrix having a Tg of greater than 300° C. The porous matrix material has a lower dielectric constant than the corresponding non-porous matrix material, making the porous matrix material particularly attractive for a variety of electronic applications including integrated circuits, multichip modules, and flat panel display devices.

Abstract: A process of making a nanoporous substrate, such as the matrix in an electrical laminate, by grafting onto an organic resin backbone a thermolabile functionality by reacting hydrogen active groups of the organic resin with a compound containing thermolabile groups; then thermally degrading the thermolabile groups grafted on the organic resin to form a nanoporous laminate. Advantageously, the nanoporous electrical laminate has a low dielectric constant (Dk) because of the nanopores present in the laminate matrix.

Abstract: Performance additives in high performance polymers using polyhedral oligomeric silsesquioxanes (POSS) and polyhedral oligomeric silicates (POS) as nanoscopic reinforcements, porosity control agents, thermal and oxidative stability aids to improve the properties of the polymers.

Abstract: A method of preparing a porous fiber, the method including blending a natural polymer having a thermal stability with a synthetic polymer having a thermal stability, wherein the thermal stability of the natural polymer is different from the thermal stability of the synthetic polymer, and wherein the natural polymer and synthetic polymer from immiscible phases; extruding the blended polymers while heating at a predetermined heating rate to the fiber spinning temperature; spinning the fibers while maintaining the temperature; and heating the fibers at a heating rate that maintains the natural polymer in a fiber form and that removes the synthetic polymer, whereby a porous fiber is formed.

Abstract: Methods of forming a polymeric structure having a plurality of cells therein that include contacting a polymeric material that includes a first phase and a second phase with a composition comprising carbon dioxide to form the polymeric structure having a plurality of cells therein are described. Polymeric materials and microelectronic devices formed by such methods are also described.

Abstract: The present invention provides a composition comprising (a) thermosetting component comprising: (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where E, Q, G, h, l, j, and w are as set forth below and (b) porogen that bonds to thermosetting component (a). Preferably, the porogen is selected from the group consisting of unsubstituted polynorbornene, substituted polynorbornene, polycaprolactone, unsubstituted polystyrene, substituted polystyrene, polyacenaphthylene homopolymer, and polyacenaphthylene copolymer. Preferably, the present compositions may be used as dielectric substrate in microchips, multichip modules, laminated circuit boards, or printed wiring boards.

Abstract: A suitable cross-linkable matrix precursor and a poragen can be treated to form a porous cross-linked matrix having a Tg of greater than 300° C. The porous matrix material has a lower dielectric constant than the corresponding non-porous matrix material, making the porous matrix material particularly attractive for a variety of electronic applications including integrated circuits, multichip modules, and flat panel display devices.

Abstract: A method of producing an open, porous structure having an outer surface defining a shape having a bulk volume and having interconnecting openings extending throughout said volume and opening through said surface, and products resulting from the method. The method comprises preparing a viscous mixture comprising a sinterable powder dispersed in a sol of a polymer in a primary solvent, replacing the primary solvent with a secondary liquid in which the polymer is insoluble to produce a gel comprising an open polymeric network having the sinterable powder arranged therein, removing the secondary liquid from the gel; removing the polymer network, and sintering the sinterable powder to form the open, porous structure. Also disclosed are shaped, porous products resulting from methods of the invention.

Abstract: A suitable cross-linkable matrix precursor and a poragen can be treated to form a porous cross-linked matrix having a Tg of greater than 300° C. The porous matrix material has a lower dielectric constant than the corresponding non-porous matrix material, making the porous matrix material particularly attractive for a variety of electronic applications including integrated circuits, multichip modules, and flat panel display devices.

Abstract: A method of producing an open, porous structure having an outer surface defining a shape having a bulk volume and having interconnecting openings extending throughout said volume and opening through said surface, and products resulting from the method. The method comprises preparing a viscous mixture comprising a sinterable powder dispersed in a sol of a polymer in a primary solvent, replacing the primary solvent with a secondary liquid in which the polymer is insoluble to produce a gel comprising an open polymeric network having the sinterable powder arranged therein, removing the secondary liquid from the gel; removing the polymer network, and sintering the sinterable powder to form the open, porous structure. Also disclosed are shaped, porous products resulting from methods of the invention.

Abstract: Porous dielectric materials having low dielectric constants useful in electronic component manufacture are disclosed along with methods of preparing the porous dielectric materials. Also disclosed are methods of forming integrated circuits containing such porous dielectric materials.

Abstract: Disclosed are organo polysilica dielectric materials having low dielectric constants useful in electronic component manufacture are disclosed along with methods of preparing the porous organo polysilica dielectric materials. Also disclosed are methods of forming electronic devices containing such porous organo polysilica dielectric materials without the use of antireflective coatings.

Abstract: Disclosed are organo polysilica dielectric materials having low dielectric constants useful in electronic component manufacture are disclosed along with methods of preparing the porous organo polysilica dielectric materials. Also disclosed are methods of forming electronic devices containing such porous organo polysilica dielectric materials without the use of antiretlective coatings.

Abstract: Disclosed are organo polysilica dielectric materials having low dielectric constants useful in electronic component manufacture are disclosed along with methods of preparing the porous organo polysilica dielectric materials. Also disclosed are methods of forming electronic devices containing such porous organo polysilica dielectric materials without the use of antireflective coatings.

Abstract: A suitable cross-linkable matrix precursor and a poragen can be treated to form a porous cross-linked matrix having a Tg of greater than 300° C. The porous matrix material has a lower dielectric constant than the corresponding non-porous matrix material, making the porous matrix material particularly attractive for a variety of electronic applications including integrated circuits, multichip modules, and flat panel display devices.

Abstract: A suitable cross-linkable matrix precursor and a poragen can be treated to form a porous cross-linked matrix having a Tg of greater than 300° C. The porous matrix material has a lower dielectric constant than the corresponding non-porous matrix material, making the porous matrix material particularly attractive for a variety of electronic applications including integrated circuits, multichip modules, and flat panel display devices.

Abstract: A method of forming a porous insulating composition comprising the steps of (A) providing at least one organic sacrificial material/dielectric material composition comprising at least one organic sacrificial material and at least one dielectric material; and (B) removing the at least one organic sacrificial material in the at least one organic sacrificial material/dielectric material composition, in order to generate pores in the at least one dielectric material. Also disclosed is a composition useful in making a porous insulator, comprising a heat-activated, pore-forming, sacrificial material; and a dielectric material. Alternatively, the composition useful in making a porous insulator, comprises at least one pore-forming, organic sacrificial material; and at least one dielectric material, wherein the at least one pore-forming, material is a norbornene-type polymer.

Abstract: Porous dielectric materials having low dielectric constants useful in electronic component manufacture are disclosed along with methods of preparing the porous dielectric materials. Also disclosed are methods of forming integrated circuits containing such porous dielectric materials.

Abstract: A nanoporous polymer comprises hollow structures fabricated from crosslinked polymeric strands. The hollow structures are further coupled to other crosslinked polymeric strands by a covalent bond. Particularly contemplated nanoporous polymers have a Tg of no less than 400° C. and a dielectric constant k of no more than 2.5.

Abstract: Porous dielectric materials having low dielectric constants useful in electronic component manufacture are disclosed along with methods of preparing the porous dielectric materials. Also disclosed are methods of forming integrated circuits containing such porous dielectric materials.

Abstract: The invention relates to a process for forming an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises porous organic polysilica.

Abstract: Disclosed are organo polysilica dielectric materials having low dielectric constants useful in electronic component manufacture are disclosed along with methods of preparing the porous organo polysilica dielectric materials. Also disclosed are methods of forming electronic devices containing such porous organo polysilica dielectric materials without the use of antireflective coatings.

Abstract: Porous polyimide dielectric materials having low dielectric constants useful in electronic component manufacture are disclosed along with methods of preparing the porous polyimide dielectric materials. Also disclosed are methods of forming integrated circuits containing such porous polyimide dielectric material.

Abstract: A porous article having excellent heat resistance, a finely cellular structure, and a low dielectric constant; and a process for producing the porous article which comprises subjecting a polymer composition having a micro-domain structure comprising a continuous polymer phase and dispersed therein a discontinuous phase having an average diameter smaller than 10 &mgr;m to a treatment for removing the ingredient constituting the discontinuous phase by at least one operation selected from vaporization and decomposition and by an extraction operation to thereby make the polymer porous. The ingredient constituting the discontinuous phase has a weight average molecular weight of, e.g., 10,000 or lower. Liquefied carbon dioxide, supercritical carbon dioxide, or the like can be used as an extraction solvent for the ingredient constituting the discontinuous phase.

Abstract: The present invention provides a material for electrical insulating organic film, superior in electrical properties, thermal properties and low water absorption; an electrical insulating organic film made from the material; and a process for production of the film. That is, the present invention provides an electrical insulating organic film having fine pores, consisting of a layer of a polybenzoxazole resin represented by the following general formula (1): wherein n is an integer of 2 to 1,000; X is a tetravalent organic group; and Y is a bivalent organic group; a material for electrical insulating organic film obtained by mixing a polybenzoxazole precursor or a polybenzoxazole resin, with an oligomer; and a material for electrical insulating organic film, obtained by reacting at least one carboxylic acid terminal of a polybenzoxazole precursor with an amino group- or hydroxyl group-containing oligomer.

Abstract: A composition has a polymeric network that includes a porogen and a photoinitiator. The photoinitiator produces a reactive species upon irradiation, which reacts with the porogen in a degradation reaction that degrades at least some of the porogen. A method of forming a nanoporous polymer has one step in which a plurality of polymeric strands, a photoinitiator, and a porogen are provided. In a subsequent step, at least some of the polymeric strands are crosslinked to form a polymeric network that includes the porogen and the photoinitiator, and in a further step the photoinitiator in the polymeric network is irradiated to generate a reactive species that reacts with the porogen in a degradation reaction to degrade at least some of the porogen.

Abstract: A porous polyimide having a finely cellular structure and having a low dielectric constant and heat resistance. The porous polyimide can be produced by a process comprising adding a dispersible compound to a polyimide precursor to form a micro-domain structure in which the dispersible compound is dispersed in the polymer so as to have a size smaller than 10 &mgr;m and then removing the dispersible compound by extraction with supercritical carbon dioxide to thereby make the precursor porous, wherein the interaction parameter &khgr;AB between the polyimide precursor A and the dispersible compound B is larger than 3. This porous polyimide has an average cell diameter smaller than 5 &mgr;m and a dielectric constant of 3 or lower.

Abstract: A low dielectric constant material has a polymeric network that is fabricated from a first and a second component. The first component comprises a polymeric strand, and the second component comprises a molecule having a central portion with at least three arms extending from the central portion, wherein each of the arms includes a backbone with a reactive group. The first component and the second component form the polymeric network in a reaction that involves at least one of the reactive groups when the first and second components are thermally activated. Contemplated low dielectric constant materials are advantageously employed in the fabrication of electronic devices, and particularly contemplated devices include integrated circuits.

Abstract: A silicone rubber is produced by curing a silicone rubber composition which includes (A) a curable organopolysiloxane composition and (B) at least one hollow organic resin filler whereby the filler forms cells in an open-cell state. The open-cell state gives the silicone rubber good cushioning property and a low compression set.

Abstract: Nanoporous materials are fabricated from polymers having backbones with reactive groups used in crosslinking. In one aspect of preferred methods and compositions, the reactive groups in the backbone comprise a diene and a dienophile. The diene may advantageously comprise a tetracyclone, and the dienophile may advantageously comprise an ethynyl. In another aspect of preferred methods and compositions, the reactive groups in the backbone are included in a conjugated system. Especially preferred polymeric strands comprise a poly(arylene ether) synthesized from a difluoroaromatic portion and an aromatic bisphenolic portion. It is still more preferred that the difluoroaromatic portions of the poly(arylene ether) are modified in such a way that some difluoroaromatic portions carry a thermolabile portion. In still other aspects crosslinking may advantageously occur without reliance on an exogenous crosslinker.

Abstract: A mesoporous material prepared by polymerizing a resorcinol/formaldehyde system from an aqueous solution containing resorcinol, formaldehyde and a surfactant and optionally pyrolyzing the polymer to form a primarily carbonaceous solid. The material has an average pore size between 4 and 75 nm and is suitable for use in liquid-phase surface limited applications, including sorbent, catalytic, and electrical applications.

Abstract: Porous organo polysilica dielectric materials having low dielectric constants useful in electronic component manufacture are disclosed along with methods of preparing the porous organo polysilica dielectric materials. Also disclosed are methods of forming integrated circuits containing such porous organo polysilica dielectric materials.

Abstract: Disclosed are methods for sterilizing cyanoacrylate prepolymer compositions under E-beam irradiation conditions wherein the prepolymer remains in polymerizable form after sterilization.

Abstract: A method for preparing a nanoporous silicone resin which can be used to form low dielectric constant films useful for electrical insulating coatings on electronic devices comprising (A) contacting a hydridosilicon containing resin with a 1-alkene comprising about 8 to 28 carbon atoms in the presence of a platinum group metal-containing hydrosilation catalyst effecting formation of an alkylhydridosiloxane resin where at least 5 percent of silicon atoms are substituted with at least one group comprising about 8 to 28 carbon atoms and at least 45 percent of silicon atoms are substituted with at least one hydrogen atom and (B) heating the alkylhydridosiloxane resin of step (A) at a temperature sufficient to effect curing and thermolysis of alkyl groups comprising about 8 to 28 carbon atoms from the silicon atoms thereby forming a nanoporous silicone resin.

Abstract: The invention herein relates to a process of preparing a novel polyimide foam having superior heat-resistance, flame retardancy, homogeneous size and distribution of cells, and low density, wherein a polyimide precursor in a granular form is prepared by means of using heterocyclic amine as catalyst and then foaming. According to the present invention, the preparing process of a polyimide foam comprises reacting aromatic carboxylic acid or the anhydrides thereof with an excess of aliphatic univalent alcohol to yield an aromatic ester solution. To the aromatic ester solution, divalent amines or the mixture thereof were added in the equivalent amount of said carboxylic acid or the anhydrides thereof in addition to a catalyst and surfactant to yield a polyimide. Then, the precursor in a granular form mixture was imidized while foaming by means of pre-heating and then heating in a microwave oven, after which was cured at a high temperature.

Abstract: Nanoporous polymeric materials are fabricated in which polymeric strands are crosslinked via ring structures. Preferred ring structures are formed de novo during crosslinking, and at least some of the ring structures are preferably included in the backbones of the strands. At least one of the ring structures may advantageously comprise an aromatic structure, and may more advantageously comprise a benzyl moiety. Especially preferred polymers comprise a poly(arylene ether) synthesized from a difluoroaromatic portion and an aromatic bisphenolic portion. In another preferred aspect, the difluoroaromatic portions of the poly(arylene ether) carry at least two different crosslinking functionalities. In an even more preferred aspect, the crosslinking functionalities comprise an ethynyl and a tetracyclone. Nanoporosity is preferably introduced by thermolyzing one or more thermolabile portions in the crosslinked polymer. An especially preferred thermolabile portion comprises ethylene glycol-poly(caprolactone).

Abstract: A method of forming a porous insulating composition comprising the steps of (A) providing at least one organic sacrificial material/dielectric material composition comprising at least one organic sacrificial material and at least one dielectric material; and (B) removing the at least one organic sacrificial material in the at least one organic sacrificial material/dielectric material composition, in order to generate pores in the at least one dielectric material. Also disclosed is a composition useful in making a porous insulator, comprising a heat-activated, pore-forming, sacrificial material; and a dielectric material. Alternatively, the composition useful in making a porous insulator, comprises at least one pore-forming, organic sacrificial material; and at least one dielectric material, wherein the at least one pore-forming, material is a norbornene-type polymer.

Abstract: Compositions and methods are provided in which nanoporous polymeric materials are produced via stable, polymeric template strands having reactive groups that can be used for forming crosslinking functionalities and/or adding thermolabile groups, wherein at least some of the thermolabile groups are thermolyzed to produce voids. The template strands preferably comprise aromatic systems and vicinal keto groups, such as a polybenzil formed from fluorene bisphenol or 3,3'-dihydroxytolane with 4,4'-difluorobenzil. At least some of the reactive groups preferably react using an addition-elimination reaction. Especially preferred thermolabile groups comprise poly(propylene oxide), and especially preferred crosslinkers comprise ethynyl-moiety and tetracyclone moieties.

Abstract: A method for preparing a nanoporous silicone resin which can be used to form low dielectric constant films useful for electrical insulating coatings on electronic devices comprising (A) contacting a hydridosilicon containing resin with a 1-alkene comprising about 8 to 28 carbon atoms in the presence of a platinum group metal-containing hydrosilation catalyst effecting formation of an alkylhydridosiloxane resin where at least 5 percent of silicon atoms are substituted with at least one group comprising about 8 to 28 carbon atoms and at least 45 percent of silicon atoms are substituted with at least one hydrogen atom and (B) heating the alkylhydridosiloxane resin of step (A) at a temperature sufficient to effect curing and thermolysis of alkyl groups comprising about 8 to 28 carbon atoms from the silicon atoms thereby forming a nanoporous silicone resin.

Abstract: A novel dielectric composition is provided that is useful in the manufacture of electronic devices such as integrated circuit devices and integrated circuit packaging devices. The dielectric composition is prepared by crosslinking a thermally decomposable porogen to a host polymer via a coupling agent, followed by heating to a temperature suitable to decompose the porogen. The porous materials that result have dielectric constants less than about 3.0, with some materials having dielectric constants less than about 2.5. Integrated circuit devices, integrated circuit packaging devices, and methods of manufacture are provided as well.

Abstract: A method is disclosed for the enzymatic degradation of polyester amides. The method involves mixing polyester amides with esterase or protease enzymes in aqueous solution.

Abstract: Composite materials made wholly from aromatic polyamides are prepared, which have the advantage of better performance and less delamination than composites composed of chemically distinct components. The foam matrix for such composites is prepared using N,N'-dialkylated aromatic polyamide. Both fiber reinforced foam structural forms and foam/felt laminates are prepared.

Abstract: The novel blend comprises:(A) from 1 to 99% by weight of at least one thermotropic-liquid-crystalline polyester and/or polyesteramide and(B) from 1 to 99% by weight of at least one sulfoxide group-containing polymer,in each case based on the total weight .SIGMA.?(A)+(B)!. Component (B) is a linear and/or branched polymer having a mean molecular weight M.sub.w in the range from 4,000 to 200,000 comprising recurring units of the formula ?--F--S).sub.c --(F--SO).sub.d --!, where F, independently of one another, are simple or para-, meta- or ortho-linked arylene systems having 6 to 18 carbon atoms, preferably phenylene, naphthylene or biphenylene, where the sum c+d is 1, with the proviso that d is always .gtoreq.0.70. Component (A) is a thermotropic liquid-crystalline polymer having a mean molecular weight M.sub.w in the range from 10,000 to 200,000 g/mol and a transition temperature of >250.degree. C., and/or an amorphous thermotropic liquid-crystalline polymer having a mean molecular weight M.sub.

Abstract: There is provided a thermosetting foamable organopolysiloxane composition comprising (A) an organopolysiloxane with a viscosity of 10-100,000 cSt at 25.degree. C. containing a specified amount of an alkenyl group and/or a hydroxyl group, such as a linear dimethylpolysiloxane blocked with a vinyldimethylsiloxy group or a hydroxydimethylsiloxy group at both terminal ends of the molecular chain and not containing an alkenyl group and a hydroxyl group in the diorganosiloxane repeating unit constituting the backbone chain; (B) an organohydrogenpolysiloxane and/or organohydrogensilane each having at least two hydrogen atoms bonded to silicon atoms in the molecule, such as Me.sub.3 SiO--?SiH(Me)O!.sub.40 --SiMe.sub.3 wherein Me stands for a methyl group or C.sub.6 H.sub.5 SiH.sub.3 ; (C) a compound having an active hydrogen group, such as a hydroxyl group-containing compound, such as alcohols; (D) a platinum catalyst; and (E) an acetylenic alcohol compound.

Abstract: A foamed polyarylene sulfide according to the invention has a density which is reduced by at least 50% compared with the theoretical density of nonfoamed material, and is expediently produced by subjecting a polyarylene sulfoxide as such or a mixture of one or more polyarylene sulfides with a polyarylene sulfoxide to heat treatment. The temperature of the heat treatment is in the range from 250.degree. to 400.degree. C.

Abstract: Molding compositions or mixtures comprising a high-temperature-resistant polymer and at least one polymer containing sulfoxide groups are used for the production of a foam by exposure to heat. The foam is employed for heat-resistant insulating layers.

Abstract: The present invention relates to an insulating foamed polymer having a pore size less than about 1000 .ANG. made from a copolymer comprising a matrix polymer and a thermally decomposable polymer by heating the copolymer above the decomposition temperature of the decomposable polymer.