Abstract: A curable composition which comprises the following two components: (I) a vinyl polymer having at least one crosslinkable silyl group represented by the general formula (1) given below, and (II) an epoxy resin or a polyether polymer having at least one crosslinkable silyl group; —[Si(R1)2−b(Y)bO]m—Si(R2)3−a(Y)a  (1) {wherein R1 and R2 each represents an alkyl group containing 1 to 20 carbon atoms, an aryl group containing 6 to 20 carbon atoms, an aralkyl group containing 7 to 20 carbon atoms, or a triorganosiloxy group represented by the formula (R′)3SiO— (in which R′ represents a monovalent hydrocarbon group containing 1 to 20 carbon atoms and the three R's may be the same or different) and, when there are two or more R1 or R2 groups, they may be the same or different; Y represents a hydroxy group or a hydrolyzable group and, when there are two or more Y groups, they may be the same or different; a represents 0, 1, 2 or 3; b represents

Abstract: A coated abrasive article comprises a backing, a first binder on the backing, and a plurality of abrasive particles in the first binder. The first binder precursor is an energy-curable preferably, melt-processable resin containing an epoxy resin, an ethylene-vinyl acetate copolymer, and a curing agent for crosslinking the epoxy resin that is cured to provide a crosslinked make coating. The above binder precursors of the invention are preferably free of homopolymers and copolymers of olefinic monomers. In another aspect, the invention also describes an energy curable first binder precursor containing an epoxy resin, an ethylene-vinyl acetate copolymer, a polyfunctional acrylate component and a curing agent for crosslinking the epoxy resin that is cured to provide a crosslinked make coating. The invention also relates to a method of producing such coated abrasive articles and a surface-treated backing material.

Abstract: The invention relates to a liquid curable resin composition comprising: (A) a polyfunctional (meth)acrylic compound containing at least three (meth)acryloyl groups in the molecule, (B) a reaction product of an alkoxy silane compound having a polymerizable unsaturated group, an urethane bond group, and an organic group represented by the following formula (1), wherein X is NH—, —O—, or —S— and Y is an oxygen atom or a sulfur atom, and when X is —O—, Y is a sulfur atom, with silica particles, (C) a radiation curable acrylic resin comprising a carboxyl group in its molecule, of which the Tg is 50 or higher, (D) a radiation polymerization initiator, and (E) a non reactive solvent. The invention further relates to the coating obtained after evaporation of the solvent, and to the cured coating after irradiation.

Abstract: A radiation-curable composition in a liquid or solid form comprises at least one solid, non-crystalline radiation-transmissible material, dispersed in at least one cationic-curable or free-radical curable composition or mixture thereof. The solid, non-crystalline radiation-transmissible materials comprise glasses and other suitable materials that transmit (i.e., are transparent to) at least about 40% of radiation having a wavelength from about 180 to about 600 nanometers. The solid forms of the radiation-curable compositions of the invention are useful as powder coatings for coating decorative and functional objects and that would be cured by a thermal heating flow process followed by radiation exposure. The cured compositions of the invention are useful as coatings and inks for metal, paper, plastics, glass, ceramics, and wood, as adhesives, as sealants, and as composite materials and other articles and in biomedical and dental applications.

Abstract: The present invention relates to a photo-curable polymer composition comprising (a) a first block copolymer comprising at least two blocks A of polymerised monovinyl aromatic monomer, at least one internal block B of polymerised conjugated diene monomer, and at least one tapered or random block C of polymerised monovinyl aromatic monomer and polymerised conjugated diene monomer and/or at least one block D which may be a block of polymerised conjugated diene monomer or a tapered or random block of polymerised monovinyl aromatic monomer and polymerised conjugated diene monomer, wherein block C is an internal polymer block adjacent a terminal block A or an internal block A which is adjacent to a terminal block D, and block D is a terminal block adjacent an internal block A, and, optionally, a residue of a coupling agent, wherein the residue, if present, is derived from a coupling agent containing alkoxy or epoxy functional groups; and (b) a photo-initiator.

Abstract: A liquid curable resin composition comprising (1) a (meth)acrylate polymer having a weight average molecular weight relative to polystyrene standard of at least about 5,000, (2) a ring-opening polymerizable monomer containing at least one epoxy group, and (3) a cationic photopolymerization initiator is disclosed. The composition produces cured products which exhibit superior heat resistance, excellent mechanical strength, and superb adhesive characteristics, and is suitable for use as a photo-curable adhesive, a photo-curable sealing material, a resin for optical three-dimensional molding, and a coating material for optical fibers, and optical fiber ribbon matrix.

Abstract: A curable composition comprising a) a curable epoxy resin, a thermoplastic ethylene-vinyl acetate copolymer resin, and an effective amount of a photocatalyst for the curable epoxy resin, wherein the composition is free from hydrocarbon polyolefins and wherein the sum of a) and b) is 100 weight percent.

Abstract: A hot-melt adhesive composition, which has a high curing rate, requires no water for a curing reaction or no solvent for the formation of a film, has good storage stability, and is suitable for adhering electronic parts or producing integrated circuit (IC) packages is provided. Specifically, a thermosetting hot-melt adhesive composition comprising a polyethylene copolymer having epoxy groups in a molecule as an epoxy component, which further comprises a cationic polymerization catalyst, is provided herein. Also disclosed are heat-bonding film adhesives and adhering methods using the hot-melt adhesive composition.

Abstract: Disclosed are compounds of the formulas which are useful as monomers in photopolymerizable compositions. Also disclosed are methods of polymerizing these monomers, and polymers produced thereby.

Abstract: Single-solution adhesive resin formulations are made of predominantly dimethacrylates or diacrylates containing (predominantly) two carboxyl groups and a functionalized methacrylate or acrylate diluent monomer. A novel light-activated initiator can be used for photopolymerization of such adhesives.

Abstract: UV-hardenable and thermally hardenable epoxy resins for the underfilling process in electrical and electronic components are provided. A new casting resin component has an increased storage stability at room temperature of at least 6 months and improved characteristics for the underfilling process including faster hardening and lower viscosity. Filler material with a maximum grain size of 20 &mgr;m and a siloxane component are provided in addition to the casting resin formulation.

Abstract: This invention discloses a radiation curable coating composition which is comprised of (1) a crosslinked polymeric resin which is comprised of repeat units which are derived from (a) at least one member selected from the group consisting of acrylate monomers and vinyl aromatic monomers and (b) a crosslinking monomer; (2) an acrylate diluting monomer; and (3) a photocatalyst.

Abstract: A curable composition comprising a) a curable epoxy resin, a thermoplastic ethylene-vinyl acetate copolymer resin, and an effective amount of a photocatalyst for the curable epoxy resin, wherein the composition is free from hydrocarbon polyolefins and wherein the sum of a) and b) is 100 weight percent.

Abstract: A curable composition comprising a) a curable epoxy resin, a thermoplastic ethylene-vinyl acetate copolymer resin, and an effective amount of a photocatalyst for the curable epoxy resin, wherein the composition is free from hydrocarbon polyolefins and wherein the sum of a) and b) is 100 weight percent.

Abstract: A curable composition comprising a) a curable epoxy resin, a thermoplastic ethylene-vinyl acetate copolymer resin, and an effective amount of a photocatalyst for the curable epoxy resin, wherein the composition is free from hydrocarbon polyolefins and wherein the sum of a) and b) is 100 weight percent.

Abstract: The invention relates to a radiation curable primary coating composition for coating an optical fiber, composed of a component having a first end and a second end, a saturated aliphatic backbone, and at least one epoxide group at the first end of the component, and at least one reactive functional group at the second end; a mixture of acrylate monomers, composed of a first monomer having one acrylate group, and a second monomer having at least two acrylate groups; and a photoinitiator. The invention further relates to a radiation curable primary coating composition for coating an optical fiber, composed of a component having a first end and a second end, a saturated aliphatic backbone, and at least one epoxide group at the first end of the component, and at least one reactive functional group at the second end; a mixture of acrylate monomers, composed of a first monomer having one vinyl ether group, and a second monomer having at least two vinyl ether groups; and a photoinitiator.

Abstract: The invention relates to a radiation curable primary coating composition for coating an optical fiber, composed of a component having a first end and a second end, a saturated aliphatic backbone, and at least one epoxide group at the first end of the component, and at least one reactive functional group at the second end; a mixture of acrylate monomers, composed of a first monomer having one acrylate group, and a second monomer having at least two acrylate groups; and a photoinitiator. The invention further relates to a radiation curable primary coating composition for coating an optical fiber, composed of a component having a first end and a second end, a saturated aliphatic backbone, and at least one epoxide group at the first end of the component, and at least one reactive functional group at the second end; a mixture of acrylate monomers, composed of a first monomer having one vinyl ether group, and a second monomer having at least two vinyl ether groups; and a photoinitiator.

Abstract: Photocurable compositions and methods for making same are provided. The compositions comprise at least one ethylenically unsaturated monomer, at least one photoinitiator, and at least one water dispersible ethylenically unsaturated rubber. The ethylenically unsaturated rubber is rendered water dispersible by reaction of olefinic functionality therein with a hydrophilic diene. The resulting water-dispersible ethylenically unsaturated rubber is then blended with one or more ethylenically unsaturated monomers and one or more photoinitiators.

Abstract: A thermosetting composition containing a carbonaceous material (1-1) and a thermosetting resin (1-2), the carbonaceous material (1-1) being obtained by reacting by contacting a carbon material (a) with a polymer (b) having in the molecule thereof at least one particular reactive group such as aziridine group, oxazoline group, N-hydroxyalkylamido group, epoxy group, or hydroxyl group, and an alkoxycarbonyl group represented by the formulaR.sup.1 R.sup.2 R.sup.3 C--O--CO-- (1)wherein each of R.sup.1, R.sup.2, and R.sup.3 stands for a hydrogen atom or an organic residue selected from an alkyl group having 1 to 6 carbon atoms, a cycloalkyl group having 5 to 8 carbon atoms, an alkylcycloalkyl group having 6 to 16 carbon atoms, or an aryl group having 6 to 16 carbon atoms, wherein at least two of R.sup.1, R.sup.2, and R.sup.

Abstract: A process for producing a fabric absorbent that is capable of efficient removal of odorous substances, in particular malodorous substances. The absorbent is obtained by exposing an organic high-molecular weight compound, such as polyolefinic polymers or halogenated polyolefinic polymers, to an ionizing radiation and thereafter graft polymerizing the high-molecular weight compound with a polymerizable monomer that contains ion-exchange groups and/or a polymerizable monomer that can be converted to ion-exchange groups so as to incorporate the ion-exchange groups in the high-molecular weight compound.

Abstract: A photoimageable composition, useful as a photoresist for forming a printed circuit board, is both alkaline aqueous developable but, subsequent to exposure and development, is processable in highly alkaline environments, such as additive plating baths and ammoniacal etchants. The photoimageable composition comprises A) between about 25 and about 75 wt % of a binder polymer, B) between about 20 and about 60 wt % of a photopolymerizeable material which is a multifunctional photopolymerizeable monomer or short chain oligomer, and C) between about 2 and about 20 wt % of a photoinitiator chemical system, the weight percentages being based on the total weight of components A)-C).

Abstract: Disclosed are a photo-setting colored filter composition, a color filter, a process for the preparation thereof, a curable resin, and a curable resin composition. The photo-setting colored filter composition of the present invention has an excellent photo-curability, miscibility in the composition, and developability.The curable resin composition is excellent in stability of the composition, tackiness, developability, sensitivity, anti-strippability, and hydrolysis resistance compared to conventional curable resin compositions.

Abstract: Novel photosensitive polymer films are provided that include (1) a polymer carrier having .dbd.N--C(.dbd.O)-- groups; (2) an initiation system for photo polymerization; (3) polymerizable compounds; and (4) other chemicals as appropriate. The photosensitive polymer films demonstrate short pump times, short DRAW times, short fix times, and reduced noise levels equal to one-third to one-fifth the noise level of prior photosensitive polymer films.

Abstract: A photoimageable composition, useful as a photoresist for forming a printed circuit board, is both alkaline aqueous developable but, subsequent to exposure and development, is processable in highly alkaline environments, such as additive plating baths and ammoniacal etchants. The photoimageable composition is tack-free and is resistance to polymerization inhibition by oxygen, and is therefore particularly suitable for contact printing. The photoimageable composition comprises A) between about 25 and about 75 wt % of a binder polymer, B) between about 20 and about 60 wt % of a photopolymerizeable material which is a multifunctional photopolymerizeable monomer or short chain oligomer, and C) between about 2 and about 20 wt % of a photoimageable chemical system, the weight percentages being based on the total weight of components A)-C).

Abstract: A reactive microgel suitable for a photosensitive resin composition for a water-developable flexographic printing plate, which has an average particle diameter to 10 .mu.m, and is formed ofmicrogel particles, as a core, synthesized from an acrylic monomer in an aqueous medium in the presence of an oil-soluble initiator and in the presence of a reactive polymer emulsifier which is an adduct of a neutralized product of an acrylic copolymer having a tertiary amino group with a compound having an epoxy group and an .alpha., .beta.-unsaturated double bond, and a nonionic emulsifier having an HLB of 12 to 16, anda compound having an epoxy group and an .alpha., .beta.-unsaturated double bond, attached to surfaces of the microgel particles.

Abstract: An epoxy group-containing thermosetting resin composition comprising (A) a copolymer obtained From (a) at least one member selected from an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride, (b) an epoxy group-containing unsaturated compound, (c) a monoolefin unsaturated compound, and optionally (d) a conjugated diolefin unsaturated compound, and (B) an organic solvent for dissolving the above copolymer. There is also provided another epoxy-group containing thermosetting resin composition which contains the above component (A), (C) a polymerizable compound having at least one ethylenically unsaturated double bond, and (D) a photopolymerization initiator. These epoxy-group containing thermosetting resin compositions are excellent in storage stability.

Abstract: This invention concerns positive-working photodefinable polyimide precursors which make use of chemical amplification based on photoacid catalyzed cleavage of acid labile-poly(amic acetal esters).

Abstract: This invention concerns positive-working photodefinable polyimide precursors which make use of chemical amplification based on photoacid catalyzed cleavage of acid labile-poly(amic acetal esters).

Abstract: There are provided pressure-sensitive adhesives which comprise free radical cured mixtures of at least one crosslinkable olefin polymer and at least one tackifying organic additive, preferably a hydrogenated additive, which is substantially nonresponsive to action of free radicals and present in an amount sufficient to tackify the cured mixture of polymer and additive.

Abstract: Excellent resolution and sensitivity in the patterning of resists utilized in device and mask manufacture is obtained with a specific composition. In particular this composition involves polymers having recurring pendant acid labile .alpha.-alkoxyalkyl carboxylic acid ester moieties in the presence of an acid generator activated by actinic radiation such as UV-visible, deep ultraviolet, e-beam and x-ray radiation.

Abstract: This invention is directed to a thermal or radiation curable prepolymer, formulations containing same and processes of using same, said prepolymer comprising a liquid meth(acrylate) terminated polymeric hydrocarbon maleate having pendant maleate groups. Said prepolymer either per se or formulated with mono- or multi-functional unsaturated monomers and either a thermal or photoinitiator on exposure to heat or UV or high energy ionizing radiation forms a cured material utilizable as a printing plate, coating, adhesive or sealant.

Abstract: The present invention provides a photosensitive resin composition comprising (a) 10-60 wt. % of a styrene--maleic acid copolymer or its partially esterified product having a molecular weight of 1,000-3,000 and an acid value of 50-500, (b) 1-30 wt. % of acrylate or methacrylate having a tetrahydrofurfuryl group or a hydroxyl group, (c) 1-30 wt. % of diacrylate or dimethacrylate of polyethyleneglycol or polypropylene glycol, (d) 1-40 wt. % of a monoester compound represented by the following general formula (I), (II), (III), (IV) or (V). ##STR1## (wherein, X stands for a divalent organic group, preferably an alkylene group having carbon atoms of 1-4 or --C.sub.n H.sub.2n O--.sub.p CH.sub.2 group wherein n is an integer of 2-6 and p is an integer of 1-19; Y stands for hydrogen atoms or a methyl group; and Y' stands for hydrogen atoms or an alkyl group having carbon atoms of 1-4.).

Abstract: Mixtures which are curable by heating or irradiation with actinic light contain one or more cationically curable compounds, such as an epoxy, an olefinically unsaturated monomer, amino resin or phenolic resin, and as a cationically active curing catalyst one or more N-sulfonylamino-sulfonium salts of the formula ##STR1## such as N-p-toluenesulfonyl-N-methylaminodiphenylsulfonium hexafluorophosphate with or without quinones or peroxides are suitable, inter alia, for producing moldings, coatings, relief images and resist patterns.

Abstract: The present invention provides a resinous composition of modified phenolic compounds comprising a phenolic compound and an unsaturated cycloacetal, the composition being curable with an active energy rays, the improvement residing in the use of an onium salt. The cured material has no appreciable odor of acrolein and is stable in storage.

Abstract: Ultraviolet-curable, liquid coating compositions are disclosed which are resistant to abrasion and which are strongly adherent to basic plastic surfaces. These compositions comprise one or more polyacrylates or polymethacrylates, preferably including from 70% to 85% of trimethylol propane triacrylate, from 5% to 15% of a carboxylic acid which contains acrylic or methacrylic unsaturation, preferably acrylic acid itself, and photoinitiators (which are preferably ketonic and which desirably comprise a substituted acetophenone and benzophenone) are used to render the composition sensitive to ultraviolet light. The polyacrylate component preferably includes from 1% to 12% of a diacrylate or dimethacrylate of a diglycidyl ether of a bisphenol in which the molecular weight of the diglycidyl ether is less than about 600. The above proportions are based on the total weight of polymerizable material. The composition preferably also includes 0.5% to 2.