Abstract: A polycarbonate polyol composition which can be used to prepare polycarbonate(meth)acrylate and urethane(meth)acrylate compositions is obtained by the ester interchange reaction of a polycarbonate diol composition with a triol and/or tetraol. The (meth)acrylate compositions have excellent photo and electron beam curability and the cured layers prepared therefrom have excellent heat resistance under moisture conditions.

Abstract: (I) A photosensitive resin composition comprising(i) a thermoplastic elastomer selected from(A) a poly(amide-imide) ester produced by reacting a polyamide-forming monomer with either an aromatic carboxylic acid or its anhydride and either a polyalkylene glycol or an .alpha.,.omega.-dihydroxy hydrocarbon,(B) a poly(amide-imide) urethane produced by reacting the above poly(amide-imide) ester with a diisocyanate compound, and(C) a poly(amide-imide) urethane produced by reacting the above diisocyanate compound with a mixture of polymer diol and a poly(amide-imide) ester obtained from a Chthd 2-C.sub.4 alkylene glycol and a polyamide-forming monomer, and(ii) an ethylenic unsaturated compound, and(iii) a photopolymerization initiator,(II) a photosensitive sheet for printing plate formation which comprises a resin layer formed of the above composition, and(III) the above defined thermoplastic elastomer.

Abstract: Photocurable filling compounds for closing the gaps which result between the end or edge regions of gravure printing plates when the latter are clamped on forme cylinders consist of a homogeneous, solvent-free, photopolymerizable mixture which is free-flowing at room temperature and contains from 10 to 90% by weight of one or more hydrophilic, polar, photopolymerizable, ethylenically unsaturated low molecular weight compounds, from 5 to 65% by weight of one or more polymeric binders which are resistant to toluene-containing, gasoline-containing, ketone-containing and/or ester-containing solvents and are compatible with the photopolymerizable low molecular weight compounds, from 0.01 to 10% by weight of one or more photoinitiators and from 0 to 70% by weight of further additives and/or assistants.

Abstract: Oligomeric condensation products of certain diketones and phenols can be end-capped with a vinylbenzyl moiety and certain other moieties, especially alkyl groups, to afford thermosetting resins particularly valuable in making laminated circuit boards. Resins prepared by the reaction of 1 molar proportion of diacetylbenzene with from 3.5 to 4.0 molar proportions of phenol and end-capped with from 50 to 100% vinylbenzyl groups with the remainder being alkyls of 1 through 11 carbon atoms are particularly useful.

Abstract: Thermosetting resins which are essentially vinylbenzyl end-capped ethers of the oligomeric condensation products of certain dihydric phenols and formaldehyde are readily polymerized to give an extensively cross-linked polymer particularly useful in printed circuit boards and similar laminates. Effective cost reduction may be enjoyed by replacing up to 50% of the vinylbenzyl moieties by other groups, such as alkyl and benzyl groups, without destroying the usefulness of the resulting thermosetting resins. The vinylbenzyl ether product from bisphenol-A is especially recommended.

Abstract: A composite substance made of conjugated polymers that contain an inorganic moiety and an organic moiety in their molecule is provided. The conjugated polymers are produced from metal alkoxides and silane coupling agents, or else from metal alkoxides, silane coupling agents, and organic monomers. The conjugated polymers may be fired to give another composite substrate of this invention. These composite substances have both inorganic and organic characteristics, thereby attaining the excellent heat-stability, mechanical strength, resistance to chemicals, and workability.

Abstract: The invention relates to a thermoplastic solid composition which can be cured by the application of a radiation, for example UV, and to solid products which can be handled and stored and are obtained by shaping such a composition, before application of the radiation.The solid thermoplastic composition comprises at least one solid thermoplastic polymer and a radiation-crosslinkable oligomer containing at least two ethylenic unsaturations, each of these unsaturations being situated either at the end of a chain or in a pendent position. The weight ratio of the solid thermoplastic polymer to the radiation-crosslinkable oligomer is between 55/45 and 964, preferably between 70/30 and 96/4, respectively.The products obtained after crosslinking by the application of radiation have good mechanical properties, even at elevated temperature.The compositions of the invention can be used particularly for producing packaging sheets having the shape of the product to be wrapped, and of prosthetic components.

Abstract: High photo resolution of over 100 lines is obtained for solder masks of thicknesses greater than 0.002 in. (0.005 cm) with liquid photopolymers of special compositions deposited from mesh screens over printed wiring board traces and photoexposed with a phototool image in contact with the photopolymer. Special interrelated properties of the liquid photopolymer interacting in an explicit process of screen depositing two adjacent liquid polymer layers include freedom from volatiles, a paste-like viscosity permitting use with mesh screens of about 60 mesh to obtain a uniform thickness layer free of bubbles and mesh marks, solder mask insulator and heat resistance characteristics, an ability to photo flash through a phototool image in contact with one layer surface and the other surface exposed to air to polymerize through a significant thickness of about one-third of the layer thickness, photo response to polymerize to a depth of about 0.02 in. (0.

Abstract: A method of forming preceramic polymers by mixing (A) an organic polysilane, preferably either a methylpolysilane of the formula [(RSiH).sub.x (RSi).sub.y ].sub.n, (where R is a lower alkyl group having from 1 to about 6 carbon atoms, a cycloalkyl group having from 3 to about 6 carbon atoms, a substituted or unsubstituted lower aryl group having from 6 to about 10 carbon atoms, a tri(lower)alkyl- or di(lower)alkylsilyl group x+y=1, (x and y are each >0 and also x=1, y=0), and n is an integer greater than 1) or a polycarbosilane having repeat units of the formula [R.sup.a Si(H)--(CH.sub.2).sub.q ], [R.sup.a Si(H)--CH.dbd.CH], and [R.sup.a Si(H)--C.tbd.C] (where R.sup.

Abstract: A uranium adsorbing material made of a graft polymer with a graft ratio of 20 to 100% which contains amidoxime groups and cation exchange groups in a molar ratio of 1:1 to 20:1 and a process for preparing said material are herein disclosed.

Abstract: A method for cross-linking organopolysilane polymers. The method includes the steps of mixing an organopolysilane with a cross-linking agent to make a reaction mixture. The cross-linking agent includes molecules having at least two carbon-carbon double bonds and a ratio of such bonds to the molecular weight of the molecule of at least 1:150. Radical formation is then induced in the organopolysilane of the reaction mixture to cause formation of a reaction product including cross-linked organopolysilane polymers.