Abstract: A golf ball comprising a core; and a cover layer disposed concentrically about the core; wherein at least one of the core or the cover is formed of a polymer comprising lipid-based nanotubules in which an active compound is microencapsulated.

Abstract: A golf ball comprising a core; and a cover layer disposed concentrically about the core; wherein at least one of the core or the cover is formed of a polymer comprising metallized lipid-based nanotubules.

Abstract: A microencapsulated adhesive component, comprising a cross-linking constituent microencapsulated with a silanized polybutadiene, wherein the reactive constituent has been first reacted in the melt with cross-linking, thereby resulting in a cross-linkable hot-melt adhesive component for coating and/or laminating surface formations.

Abstract: A method for making a fiber-reinforced composite comprises dispensing a reactive liquid into a mold. The mold comprises fibers and a single-component activator on the fibers. The reactive liquid comprises a cyclic olefin, and the mold comprises fibers and a single-component ROMP activator on the fibers. Composites formed by the method may have high fiber densities.

Abstract: The present invention discloses a composition of matter for use in wallboard in the construction that has a morphology of pores and a network of interconnected inorganic particles that are coated with a thin layer of organic binder. The process used to produce the wallboard can use either hydrophobic or hydrophilic prepolymers or preferably both to create the desired network of coated inorganic particles. A preferred embodiment uses at least one hydrophobic constituent and a decomposition reaction that produces a gas to form one or more layers or a gradient of the morphology in one or more layers to create wallboard products with superior properties to those wallboard products now known.

Abstract: A thermosetting water-based resin composition comprising an oil-soluble initiator of which a temperature for one-minute half-life is from 90° to 270 ° C. and a polycondensation resin comprising an unsaturated dicarboxylic acid having a radical-polymerizable unsaturated bond or an acid anhydride thereof as at least one constituent monomer, wherein the polycondensation resin has an acid value of from 3 to 100 mg KOH/g, and wherein said oil-soluble initiator is present in said polycondensation resin; a process for preparing the thermosetting water-based resin composition; a molding compound composition comprising the water-based resin composition; and a molding product prepared by molding the molding compound composition.

Abstract: A process for making composite colorant particles comprising, in order: I) suspending in an aqueous medium, under agitation, finely divided colorant particles to form an aqueous colorant mixture; II) adding to the aqueous colorant mixture an addition polymerization initiator; and III) causing the addition polymerization initiator to form a free radical while continuously introducing continuously to the aqueous colorant mixture a monomer mixture comprising: a) an addition polymerization initiator, and b) at least one ethylenically-unsaturated monomer; thereby forming the composite colorant particles having a colorant phase and a polymer phase.

Abstract: In one embodiment the invention is An adhesive composition comprising a) a polymer having a flexible backbone and a reactive moiety capable of cross-linking, b) a particle comprising an active agent encapsulated in an encapsulating agent wherein the active agent comprises a catalyst for cross-linking of the reactive moiety, a curing agent for the reactive moiety, an accelerator for the curing reaction or a mixture thereof; and the encapsulating agent comprises a side chain crystallizable polymer wherein the active agent is not substantially extractable from the particle at ambient conditions in a first extraction after particle formation.

Abstract: The invention provides a room-temperature-curing composition which comprises (A) a polymer ingredient comprising a copolymer (A1) which contains a silicon having a hydrolyzable functional group and has a molecular chain substantially comprising (a) alkyl (meth)acrylate monomer units having an alkyl group having 1 to 8 carbon atoms and (b) alkyl (meth)acrylate monomer units having an alkyl group having 10 to 30 carbon atoms, (B) a moisture curing catalyst, and (C) any of the following (C1) to (C3): (C1) a metal salt hydrate; (C2) a primary amine compound (C2a) and a compound having a carbonyl groups (C2b); and (C3) an inorganic filler surface-treated with a silicate. The room-temperature-curing composition of the invention is excellent in rapid curing property, depth curability, and workability.

Abstract: The present invention is characterized by comprising a two-pack adhesive of an A agent selected from components, an acrylic monomer, a peroxide, a reducing agent, an epoxy resin precursor and a curing agent and containing at least one or two of the acrylic monomer, the peroxide and the reducing agent, and a B agent containing all of the remaining components which are not selected in the A agent. The use of this adhesive makes it possible to stably obtain the bonding free from a thermal stress with the excellent heat resistance and the good reliability.

Abstract: A molding composition including reactive high-volatility monomeric groups, such as acrylics, at least one primary thermal initiator and at least one secondary thermal initiator is described. Molding process using molding compositions including reactive high-volatility monomeric groups are also described.

Abstract: The present invention provides a resin composition for semiconductor encapsulation excellent in reliability in humidity resistance and storage stability as well as in dischargeability and coatability, a semiconductor device encapsulated with the resin composition for semiconductor encapsulation and a process for the production of the semiconductor device. The resin composition for semiconductor encapsulation comprises the following components (A) to (D) and has a viscosity of 700 Pa•s or higher at 25° C. and 500 Pa•s or lower at 80° C.: (A) an epoxy resin; (B) an acid anhydride-based curing agent; (C) a latent curing accelerator; and (D) an inorganic filler.

Abstract: A single-liquid type adhesive composition contains a main agent, an imidazole serving as a hardener, and a hardening promoter for increased hardening speed. The imidazole has its surface covered by a thermoplastic resin, and the hardening promoter is provided by a modified imidazole composition with its imino group (—NH—) having the H replaced by a specific reaction retarder group.

Abstract: An epoxy resin composition comprising an epoxy resin, a first curing agent for polymerizing the epoxy resin into a linear polymer, and a second curing agent for crosslinking the linear polymer into a three-dimensional polymer. The use of two curing agents corresponding to straight chain growth reaction and crosslinking reaction of the epoxy resin optimizes the reaction conditions to B-stage, giving a semi-cured film having a minimized variation. A laminate includes a layer of the epoxy resin composition and a protective layer. By sealing a semiconductor chip with the film, there is obtained a semiconductor package having improved heat resistance, improved moisture resistance, low stress property.

Abstract: A one-part curable epoxy adhesive composition is provided. The adhesive comprises curable epoxy resin, a latent curative system comprising (a) at least one first curative encapsulated in thermoplastic polymeric microcapsules and (b) a second latent curative admixed in the curable epoxy resin, and sufficient particulate thermoplastic polymeric material to at least partially regionally plasticize the cured epoxy resin wherein up to all of the particulate thermoplastic polymeric material may be provided by the walls of the microcapsules. A method of curing the adhesive by heating the composition is also provided. A joint made by adhering members together with the adhesive composition and a method of making the joint are also provided.

Abstract: A method and composition are disclosed for preventing uncontrolled exothermic reaction in the presence of a catalyst. A catalyst deployed as a finely divided powder which is attached to the surface of a low melting point wax or wax-like material which is utilized as a carrier for the catalyst. During operation should the catalyst overheat due to uncontrolled conditions brought about by a run-away reaction the heat of reaction melts the low melting point wax which would itself wet the surface of the catalyst and prevent further catalysis.

Abstract: An epoxy resin composition comprising (A) a polyfunctional epoxy resin, (B) a phenolic resin, (C) an inorganic filler, and (D) curing catalyst-containing microcapsules having a mean particle size of 0.5-50 &mgr;m is suited for semiconductor package encapsulation since it minimizes the warpage of packages and has satisfactory catalyst latency, storage stability and cure.

Abstract: A sealing material for flip chip-type semiconductor devices comprises a liquid epoxy resin composition which includes (A) a liquid epoxy resin, (B) an optional curing agent, (C) an inorganic filler, and (D) 1 to 15 parts by weight of a microencapsulated catalyst per 100 parts by weight of components A and B combined. The excellent thin-film penetration and shelf stability of the sealing material confer a very high reliability to flip chip-type semiconductor devices made using the sealing material.

Abstract: A molding composition including reactive high-volatility monomeric groups, such as acrylics, at least one primary thermal initiator and at least one secondary thermal initiator is described. Molding processs using molding compositions including reactive high-volatility monomeric groups are also described.

Abstract: High levels of treated fumed silica, processing fluid and high molecular weight silicone polymer are continuously compounded into a homogeneous silica filled heat-vulcanizable silicone composition by forming a premix in a continuous annular layer mixer and continuously discharging the premix into a compounding apparatus for compounding to form the filled heat-vulcanizable silicone composition.

Abstract: Disclosed is a sPS nanocomposite with improved crystallization properties and higher mechanical strength, which comprises a polymer matrix containing syndiotactic polystyrene (sPS), and a layered clay material uniformly dispersed in the polymer matrix. The layered clay material is intercalated with an organic onium cation and optionally along with a polymer or oligomer which is compatible or partially compatible with sPS. The interlayer distances of the layered clay material are at least 20 Å. The sPS nanocomposite can be prepared by ways of in-situ polymerization, melt blending, or solution blending. According to the invention, the layered clay material dispersed in the sPS matrix not only leads to higher mechanical strength, but also, surprisingly, improves crystallization properties of sPS.

Abstract: An epoxy resin composition for semiconductor encapsulation comprising an epoxy resin, a phenolic resin, a hardening accelerator and an inorganic filler. The epoxy resin composition having the following properties (X) to (Z) does not cause the chip tilting attributable to resin flow during resin encapsulation, such as semiconductor element shifting or gold wire deformation, and can obtain highly reliable semiconductor devices: (X) the viscosity thereof as measured with a flow tester at 175° C. is from 50 to 500 P; (Y) the minimum melt viscosity thereof as determined from the temperature dependence of viscosity thereof as measured with a dynamic viscoelastic meter at a shear rate of 5 (1/s) is 1×105 poise or lower; and (Z) the ratio of the viscosity thereof as measured at 90° C. (Z1) to that as measured at 110° C. (Z2) both with a dynamic viscoelastic meter at a shear rate of 5 (1/s), (Z1/Z2), is 2.0 or higher.

Abstract: A rope of chemical anchoring adhesive useful in heavy construction applications includes first and second parts in continuous contact along an interface extending the length of the rope. The first part includes a resin and has a highly viscous, putty-like consistency. The second part includes a curing agent and has a highly viscous putty-like consistency. The rope can be cut into slugs at the construction site which are sized according to the depth of the borehole, into which the anchor pin is driven.

Abstract: Encapsulated crosslinking agents and gel-forming compositions are provided that can be utilized in oil field applications. Processes for producing said encapsulated crosslinking agents and said gel-forming compositions are also provided. In addition, a process for injecting said gel-forming composition into a subterranean formation is also provided.

Abstract: A microencapsulated adhesive component, comprising a cross-linking constituent microencapsulated with a silanized polybutadiene, wherein the reactive constituent has been first reacted in the melt with cross-linking, thereby resulting in a cross-linkable hot-melt adhesive component for coating and/or laminating surface formations.

Abstract: In one embodiment the invention is An adhesive composition comprising a) a polymer having a flexible backbone and a reactive moiety capable of cross-linking, b) a particle comprising an active agent encapsulated in an encapsulating agent wherein the active agent comprises a catalyst for cross-linking of the reactive moiety, a curing agent for the reactive moiety, an accelerator for the curing reaction or a mixture thereof; and the encapsulating agent comprises a side chain crystallizable polymer wherein the active agent is not substantially extractable from the particle at ambient conditions in a first extraction after particle formation. This composition is used in binding two subtracters together.

Abstract: An epoxy resin composition contains (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) catalyzed microcapsules containing an imidazole compound or organic phosphorus compound and having a mean particle size of 0.5-50 &mgr;m, the quantity of the catalyst leached out from the microcapsules in o-cresol at 30° C. for 15 minutes being at least 70% by weight of the entire catalyst quantity. The composition is suited for semiconductor package encapsulation since it has satisfactory catalyst latency, storage stability and cure.

Abstract: A composition for bonding ligno-cellulosic materials to form shaped products, the composition containing a formaldehyde based thermosetting bonding agent and capsules containing an agent reactive with said bonding agent which is at least one of a resin hardening agent, a flame/fire retardant and a water absorbent, wherein the capsules have walls that are capable of degradation to allow access of the agent to the bonding material, such degradation being at a temperature above the temperature prevailing in the system prior to application of heat in a final compression and heating stage.

Abstract: A mineral containing thermoplastic granule for incorporation in a thermoplastic material to produce a thermoplastic end product, the granule comprising at least 50% by weight of an inorganic particulate material, at least 0.1% by weight of an additive comprising a blowing agent, and the balance comprising a thermoplastic binder.

Abstract: The invention relates to a dental material with at least one polymerizable binder and at least one filler containing a redox-initiator system for the radical polymerization, which comprises an initiator and an activator. The material is characterized in that the filler contains a homogeneous mixture of a first part of the filler, which is mixed with the initiator, a second part of the filler, which is mixed with the activator, and a third part of the filler, which does not contain a component of the initiator system. The materials are particularly suitable as cements and filling materials.

Abstract: Novel modifying agents contain a sharply-melting crystalline polymer ingredient, preferably a side chain crystalline (SCC) ingredient, and an active chemical ingredient. Such modifying agents, especially when in the form of particles, can be placed in contact with a matrix, will not modify the matrix below the crystalline melting point Tp, but will rapidly modify the matrix above Tp. The active chemical ingredient can react with the matrix, catalyze a reaction of the matrix, or inhibit a reaction of the matrix. Particularly useful compositions are polymer precursors which are storage-stable at low temperatures but which are rapidly converted to crosslinked resins when heated to temperatures above Tp, optionally in the presence of light.

Abstract: Organopolysiloxane particles containing hydrosilylation catalysts (H) and organopolysiloxane (O) and having a particle size of 0.01-10 &mgr;m have, at least in the outermost shell, no glass-transition temperature, softening point or melting point in the range 20° C.-260° C. These organopolysiloxane particles enable the preparation of one-component, addition-crosslinking, thermocurable silicone compositions having a long shelf life.

Abstract: An epoxy resin composition for semiconductor encpsulation, which is excellent in both storage stability and rapid curability, is disclosed. The epoxy resin composition for semiconductor encapsultion comprises (A) an epoxy resin, (B) a phenolic resin, and a combination of (C) a cure accelerator and (D) cure accelerator-containing microcapsules having a core/shell structure in which a cure accelerator as a core is encapsulated in a thermoplastic resin shell.

Abstract: An easily shaped evacuated porous stonelike body is impregnated in a consistent manner with a fluid polymer forming composition or molten polymer composition and solidified to form a polymeric matrix stone product bearing a striking resemblance to a natural rock in texture, structure, and formation exhibited throughout any substantial cross section. The polymeric composition is decoratively enhanced by the labyrinthic skeletal framework of the porous body and the skeletal framework is structurally enhanced by the polymeric composition. The method of forming the product closely duplicates the natural formation of most of the rocks exposed at the surface of the earth. Therefore, a wide range of stonelike textures are now available in a dimensional stock product of pre-determined size and shape. A wide range of chemical and physical properties are also possible depending upon the specific combination of porous bodies and solidified polymeric compositions.

Abstract: A process for homogeneously dispersing at least one reactant in a fluid matrix, characterized in that capsules of a first type containing the reactant(s) are prepared with a first encapsulation product and capsules of a second type containing the fluid matrix are prepared with a second encapsulation product which is compatible with the first, these two types of capsules bearing electric charges of opposite polarity, the capsules of the two types are combined by electric attraction and the first and second encapsulation products are removed so as to obtain a composite material consisting of the fluid matrix containing the reactant(s) in homogeneous dispersion form, and products obtained according to this process.

Abstract: A molding composition including reactive high-volatility monomeric groups, such as acrylics, at least one primary thermal initiator and at least one secondary thermal initiator is described. Molding processs using molding compositions including reactive high-volatility monomeric groups are also described.

Abstract: A method of making polymer-coated pigment particles, involving the steps of providing a plurality of pigment particles, each of which has an outer surface coated with a layer of material that operates as a nucleus for initiating polymerization on the outer surface of each of the pigment particles. The pigment particles are mixed with a reaction mixture containing a solvent and a monomer material, wherein the layer of material coating each of the pigment particles causes the monomer material to polymerize on the outer surface of substantially each of the pigment particles to form a polymer coating thereon.

Abstract: A composition for producing light plaster contains as main constitutive elements particles of plaster in anhydride or hemihydrate form and at least one foaming agent. The composition is characterized in that the foaming agent generates gas after a delay of 1 minute to 24 hours and constitutes 0.1 to 50% by weight of the total dry mixture. Also disclosed is the use of said composition to produce in-situ cellular plastic and low density plaster moldings.

Abstract: A granule containing a high proportion of a mineral filler and a colorant pigment system in a thermoplastic binder, for blending with an end product thermoplastic in which the mineral filler and the colorant pigment is to be dispersed. The granule comprises 85% to 92% by weight of the granule of mineral particles, which is coated with one or more fatty acids having a carbon chain length of from 12 to 20 carbon atoms and the colorant pigment. The colorant pigment may be inorganic or organic or a mixture thereof. The balance of the granule by weight comprises a thermoplastic polymeric binder. The particle size distribution of both the mineral and the colorant particles is in accordance with the optimum particle packing equation to optimize packing of the particles in the granule. The ratio of mineral to colorant pigment to binder may be about 75:15:10 or about 0.1:89.9:10. The invention includes a granule with only a colorant pigment system.

Abstract: A hydrosilylation catalyst is provided wherein a platinum catalyst is enclosed in a heat-fusible compound having a melting point of 40-200.degree. C. and containing an aliphatic unsaturated bond, carbonyl, carboxyl or thioether radical in a molecule. The catalyst is blended in organo-polysiloxane to form a silicone composition having both shelf stability and fast-curing capability.

Abstract: The present invention is a one-part adhesive composition comprising:A) an isocyanate functional polyurethane prepolymer;B) a catalyst capable of catalyzing the reaction of isocyanate moieties with an isocyanate reactive compound;C) particles comprising a curing agent for an isocyanate functional. polyurethane prepolymer encapsulated within a coating material;wherein the prepolymer has a free isocyanate content of from about 0.8 to about 2.2 percent. In another embodiment the invention is a process for bonding two substrates together which comprises rupturing the encapsulated curing agent particles so as to contact the curing agent with the prepolymer in the adhesive composition, contacting the adhesive composition of the invention with at least one of the substrates and contacting the substrates together along the portion of the substrate(s) to which the adhesive has been applied before the adhesive applied cures and allowing the adhesive to cure and bond the substrates together.

Abstract: An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards under heat and pressure.

Abstract: The present invention provides a thermosetting epoxy resin composition which copes with both storage stability and curing properties at a low temperature. A thermosetting epoxy resin composition of the present invention comprises (A) an epoxy resin, and (B) a fine powder-treated curing agent which comprises a curing agent in the solid state at room temperature, and particle surfaces of which are adhered with a fine powder having a center particle size of 2 .mu.m or less in a weight ratio of said solid curing agent to said fine powder in the range between 1:0.001 to 1:0.7, for hiding active sites on the surface of the curing agent. This composition is useful as an adhesive, a sealant, a coating material, a paint, a potting material, and a molding material.

Abstract: Vinyl halide resin compositions containing a metal compound stabilizer and coated acid absorber particles, where the coating consists of a tin-based coating or a complex calcium/zinc/strontium phosphate-based coating, are used to confer heat stability to such compositions. Use of the costabilizers of this invention results in economic advantages and material cost savings.

Abstract: Methods and compositions for encapsulated polymeric gels swollen with nonaqueous reactive materials are provided. The methods include gel synthesis, swelling of a gel precursor with a first nonaqueous reactive material, and encapsulation of the swollen gel with a second nonaqueous reactive material. Gels precursors may be synthesized from crosslinking polymers, or alternatively, may be formed by crosslinking and polymerizing a monomer starting material. An accelerator may be utilized to facilitate swelling of the gel precursor with the first nonaqueous reactive material. Foams and composites may also be swollen with the first nonaqueous reactive material. The swollen gel is then contacted with a second nonaqueous reactive material such that an encapsulation layer is formed thereby. The encapsulated gels may be stored for subsequent use.

Abstract: Finishing agents comprise the combination of an alkoxysilane surface active agent, a silanol condensing catalyst, and a nonaqueous liquid or solid medium, or the combination of an alkoxysilane surface active agent, an acid catalyst and a liquid or solid medium. In the latter embodiment, it is preferred that at least one of the alkoxysilane surface active agent and the acid catalyst be microencapsuled. The finishing agent permits formation of chemically adsorbed protecting films. Such protecting films are used for substrates of such equipments as electronics products, electric domestic products, automobiles, industrial equipments, mirrors, lenses for glasses and the like. The protecting films have a durability and heat, weather and abrasion resistance, and also water and oil repellent properties.

Abstract: Disclosed is a coated granular curing agent, which is for use in curing at least one first radically curable compound selected from the group consisting of a radically curable resin and a radically polymerizable monomer and which comprises an organic peroxide granule, wherein the organic peroxide granule has an entire surface thereof coated with a layer of a cured resin derived from at least one second radically curable compound selected from the group consisting of a radically curable resin and a radically polymerizable monomer, and wherein the first and second radically curable compounds are the same or different. The coated granular curing agent of the present invention is advantageous not only in that the curing agent can be handled with ease, but also in that the curing agent can be uniformly dispersed in a radically curable compound, so that it exhibits excellent curing performance.

Abstract: A method of making polymer-coated pigment particles, involving the steps of providing a plurality of pigment particles, each of which has an outer surface coated with a layer of material that operates as a nucleus for initiating polymerization on the outer surface of each of the pigment particles. The pigment particles are mixed with a reaction mixture containing a solvent and a monomer material, wherein the layer of material coating each of the pigment particles causes the monomer material to polymerize on the outer surface of substantially each of the pigment particles to form a polymer coating thereon.

Abstract: A liquid silicone rubber composition for a lubricant seal having after it is cured high resistance to lubricant, with high stability displayed even in lubricant that has been subjected to thermal and oxidative degradation, and having its rubber elasticity well maintained. The liquid silicone rubber composition for a lubricant seal comprises the following ingredients: (A) an organopolysiloxane containing 2 or more silicon-atom-bonded alkenyl groups in each molecule; (B) an inorganic filler; (C) an oxide or hydroxide of an alkaline-earth metal with an atomic weight of 40 or greater; (D) an organohydrogensiloxane containing 3 or more silicon-atom-bonded hydrogen atoms in each molecule; and (E) a platinum-type catalyst.

Abstract: The thermosetting silicone composition of the instant invention is comprised of (a) a diorganopolysiloxane containing alkenyl groups, (b) an organohydrogenpolysiloxane, (c) a platinum catalyst-containing silicone resin fine particle catalyst comprised of (i) a thermoplastic silicone resin containing 5 to 90 mole % PhSiO.sub.3/2 siloxane units and 5 to 20 mole % MeViSiO.sub.2/2 siloxane units, wherein Ph denotes phenyl, Me denotes methyl and Vi denotes vinyl; said resin having a glass transition point of 40.degree. to 70.degree. C. and (ii) 0.05 to 2 wt % as platinum atoms of a platinum catalyst; and (d) a hydrosilation reaction inhibiting compound. The thermosetting silicone compositions have excellent storage stability at about room temperature, and cure at a fast rate when heated.