Three-membered Chalcogen Ring Patents (Class 524/114)
  • Publication number: 20140000933
    Abstract: The present disclosure is directed to a single phase acetylated castor component (SP-ACC). An acetylated castor component is purified to produce the SP-ACC which contains a reduced amount of, or no, insoluble component(s) therein. The SP-ACC enhances the performance and properties of plasticizers of which it is a component.
    Type: Application
    Filed: September 6, 2013
    Publication date: January 2, 2014
    Applicant: Dow Global Technologies LLC
    Inventors: Bharat I. Chaudhary, Beate Sczekalla, Abhijit Ghosh-Dastidar, Yang Cheng, Prashant Tatake, Raymond M. Collins
  • Publication number: 20130338277
    Abstract: As a manufacturing method of a stable coumarone-indene resin water-dispersed composition which does not use an organic solvent, can be applied to various resin compositions, enhance sticky and adhesive properties, water resistance, heat resistance, and compatibility, and achieve consideration of health and safety of operators, arrangement of a work environment, and cost reduction relating to exhaust gas treatment, a manufacturing method which includes a process of dispersing a coumarone-indene resin which contains 50% by weight or more of coumarone and indene in total as monomer-constituents and is in a solid form at an ordinary temperature in the presence of a surfactant by a wet milling and dispersing method is used.
    Type: Application
    Filed: November 7, 2011
    Publication date: December 19, 2013
    Inventors: Masayuki Hashimoto, Asako Ogasawara, Tadashi KImura, Kimiko Izumi
  • Publication number: 20130331484
    Abstract: The present invention relates to a hybrid adhesive, in particular for use in the production of engineered wood such as particle boards, fiber boards, plywood or glued-laminated timber, comprising at least one polycondensation adhesive, at least one polyaddition adhesive, and at least one particular, in particular a nanoparticle smaller than 500 nm, wherein the at least one particle is modified with at least one compound of the general Formula (I) RaSiX(4-a), or the general Formula (II) ObXc(OH)dReSiO(4-b-c-d-e)/2. The present invention also relates to the use of the adhesive in engineered wood boards and to methods for the production thereof.
    Type: Application
    Filed: October 21, 2011
    Publication date: December 12, 2013
    Applicant: KRONOTEC AG
    Inventors: Roger Braum, Andreas Gier, Joachim Hasch
  • Publication number: 20130317140
    Abstract: A polymer composition containing a polymer, which polymer contains a residue of a dimerised fatty acid and/or a derivative thereof, which polymer composition contains an epoxidized plasticizer.
    Type: Application
    Filed: December 12, 2011
    Publication date: November 28, 2013
    Applicant: DSM IP Assets B.V.
    Inventors: Zeynep Özyürek, Atze Jan Nijenhuis, Paul Willem Jan Van Den Heuvel, Francois Antoine Marie Buijsch Op Den
  • Publication number: 20130303653
    Abstract: A composition containing (a) at least one biodegradable/biorenewable thermoplastic material that includes poly(lactic acid) (PLA); and (b) at least one plasticizer that includes an epoxidized fatty acid alkyl ester is provided. In some embodiments, the epoxidized fatty acid alkyl ester is methyl epoxy soyate. It was found that epoxidized fatty acid alkyl esters impart a reduction in tensile modulus in compositions containing PLA. The compositions may be formed into films, such as those used in food packaging. A method that includes extruding a composition comprising PLA and at least one epoxidized fatty acid alkyl ester is provided.
    Type: Application
    Filed: January 20, 2012
    Publication date: November 14, 2013
    Applicant: Arkema Inc.
    Inventor: Zuzanna Donnelly
  • Patent number: 8575247
    Abstract: A high flow polyvinyl halide compound is disclosed. The compound employs conventional ingredients plus a combination of phosphite stabilizer and hydrotalcite stabilizer which improve the melt flow index of the compound by at least 20%, as compared with a compound without the two types of stabilizers. The dramatically improved melt flow allows a molding cycle time reduction by as much as 22% because of a five-fold reduction in the fill step.
    Type: Grant
    Filed: August 4, 2009
    Date of Patent: November 5, 2013
    Assignee: PolyOne Corporation
    Inventors: Saleem Shakir, Sang Lee
  • Patent number: 8563635
    Abstract: A resin composition contains (A) a polylactic acid, (B) a polyhydroxyalkanoate, (C) an ammonium polyphosphate, and (D) a phenol-modified epoxy compound. With respect to the total amount of the resin composition, the polylactic acid (A) and the polyhydroxyalkanoate (B) are contained from about 60% by mass to about 95% by mass; the ammonium polyphosphate (C) is contained from about 4% by mass to about 35% by mass; the phenol-modified epoxy compound (D) is contained from about 1% by mass to about 5% by mass; the polylactic acid (A) is contained from about 40% by mass to about 90% by mass; the polyhydroxyalkanoate (B) is contained from about 5% by mass to about 55% by mass; and the amount ratio of the polylactic acid (A) to the polyhydroxyalkanoate (B) is from about 0.7 to about 18.
    Type: Grant
    Filed: April 4, 2012
    Date of Patent: October 22, 2013
    Assignee: Fuji Xerox Co., Ltd.
    Inventor: Kenji Yao
  • Publication number: 20130274389
    Abstract: Improved processes are described for making trialkyl esters and acylated trialkyl esters of carboxylic acids, as well as epoxidized trialkyl esters and acylated trialkyl carboxylate esters, such as are used in developing plasticized PVC compositions. In particular, processes are described for conducting the esterification and acylation steps involved in making the acylated trialkyl esters in a single vessel without an intermediate purification step, by means of a Lewis acid metal triflate catalyst.
    Type: Application
    Filed: July 21, 2011
    Publication date: October 17, 2013
    Applicant: ARCHER DANIELS MIDLAND COMPANY
    Inventor: Stephen Howard
  • Patent number: 8557139
    Abstract: The present invention is a replacement plasticizer system made from or containing an epoxidized fatty acid ester plasticizer as a primary plasticizer and a secondary plasticizer. The replacement placement system is useful with a variety of polymers in applications such as wire-and-cable insulations, wire-and-cable jackets, coatings, adhesives, and castings.
    Type: Grant
    Filed: February 12, 2009
    Date of Patent: October 15, 2013
    Assignee: Dow Global Technologies LLC
    Inventor: Robert F. Eaton
  • Patent number: 8552123
    Abstract: A thermosetting resin including at least one repeating unit represented by the following Chemical Formula 1: wherein, in Chemical Formula 1, A is derived from a phenolic moiety, an anilinic moiety, or a combination thereof, L is C(O)O, C(O)NR? wherein R? is hydrogen, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C6 to C30 aryl group, or a substituted or unsubstituted C6 to C30 aryloxy group, an aromatic ester, an aromatic ester-imide, an aromatic ester-amide, an aromatic amide, or a combination thereof, Z is a substituted or unsubstituted aliphatic group including a double bond or a triple bond, a substituted or unsubstituted alicyclic group including a double bond or a triple bond, a substituted or unsubstituted aryl group including a double bond or a triple bond, (iso)cyanate, a derivative thereof, or a combination thereof, and n is an integer ranging from 1 to about 4.
    Type: Grant
    Filed: August 19, 2010
    Date of Patent: October 8, 2013
    Assignees: Samsung Electronics Co., Ltd., Samsung Electro-Mechanics Co., Ltd., Samsung Fine Chemicals Co., Ltd.
    Inventors: Jae-Jun Lee, Myung-Sup Jung
  • Publication number: 20130253107
    Abstract: Sound damping compositions and methods for their application are described herein. The compositions can include a polymer, a polyacrylate rheology modifier, and a polyurethane rheology modifier. The compositions can alternatively include a polymer derived from greater than 80% of one or more monomers selected from the group consisting of butyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate, methyl acrylate and ethyl acrylate and combinations thereof and greater than 0% and less than 4% of one or more functional monomers, at least one rheology modifier, and a surfactant. Also described herein are sound damping products including the compositions described herein and structures including the sound damping products. Methods for damping sound in a structure are further described herein. The methods include applying the compositions to the surface of a structure and drying the composition.
    Type: Application
    Filed: June 21, 2010
    Publication date: September 26, 2013
    Applicant: BASF SE
    Inventor: Beverly Ann Gordon
  • Publication number: 20130245155
    Abstract: A sealant composition having between 30 wt % and 60 wt % of a dispersion of a hydrophilic binder; between 30 wt % and 70 wt % of a filler; between 0.05 wt % and 1 wt % of a thickener, wherein the pigment volume concentration (PVC) is between 40% and 80%. A method for preparing such a sealant composition.
    Type: Application
    Filed: November 30, 2011
    Publication date: September 19, 2013
    Applicants: KOCHITOON INNOVATIONS B.V., VAN LOON CHEMICAL INNOVATIONS B.V.
    Inventors: Sander Van Loon, Gurami Kochibrolashvili
  • Publication number: 20130221400
    Abstract: Provided is an encapsulant for optical semiconductor devices, which is capable of enhancing the adhesion between a housing and the encapsulant when an optical semiconductor device is encapsulated in the housing, and which is also capable of enhancing the bonding reliability with respect to humidity. The encapsulant for optical semiconductor devices includes: a first organopolysiloxane having an alkenyl group bonded to a silicon atom and an aryl group bonded to a silicon atom, but not having a hydrogen atom bonded to a silicon atom; a second organopolysiloxane having a hydrogen atom bonded to a silicon atom and an aryl group bonded to a silicon atom; a catalyst for hydrosilylation reaction; and an organic compound having a titanium atom.
    Type: Application
    Filed: September 15, 2011
    Publication date: August 29, 2013
    Inventors: Mitsuru Tanikawa, Takashi Watanabe, Osamu Inui, Yoshitaka Kunihiro, Ryosuke Yamazaki, Yusuke Kobayashi
  • Publication number: 20130213260
    Abstract: The present invention relates to effect pigments based on substrates having an outer coating comprising metal oxide, hydroxide and/or oxide hydrate and at least one organic coupling agent.
    Type: Application
    Filed: October 12, 2011
    Publication date: August 22, 2013
    Applicant: Merck Patent GmbH
    Inventor: Koshiro Kunii
  • Publication number: 20130209882
    Abstract: In one aspect, a composite binder for a battery, including an inorganic particle; a binder polymer; and an organic-inorganic coupling agent, a negative electrode including the composite binder, and a lithium battery including the negative electrode is provided.
    Type: Application
    Filed: January 16, 2013
    Publication date: August 15, 2013
    Applicant: Samsung SDI Co., Ltd.
    Inventor: Samsung SDI Co., Ltd.
  • Publication number: 20130206450
    Abstract: The disclosure is directed to a plasticizer system with improved electrical properties. The plasticizer system includes (a) a primary plasticizer consisting of an epoxidized vegetable oil and (b) a secondary plasticizer consisting of an epoxidized fatty acid ester, where the primary plasticizer is present in an amount greater than 50% by weight of the total plasticizer system weight.
    Type: Application
    Filed: November 3, 2011
    Publication date: August 15, 2013
    Applicant: Dow Global Technologies LLC
    Inventors: Robert F. Eaton, Abhijit Ghosh-Dastidar, Jeffrey M. Cogen, Bharat I. Chaudhary, Caroline H. Laufer
  • Patent number: 8506854
    Abstract: The present invention relates to a stabilizer system for halogenated polymers comprising, as component (A), calcium monocarbonatohydroxodialuminate of the formula (A) CamAl2(OH)6+2(m-1)CO3*nH2O??(A), where m=from 3.8 to 4.2, and n=from 0 to 3, and, as component (B), a catena-2,2?,2?-nitrilotrisethanolperchloratolithium or -sodium coordination polymer (B1) with a monomer unit of the formula where Mt=Li or Na, An=OClO3 and q=1, and/or a quaternary or ternary ammonium or phosphonium perchlorate (B2). The present invention further relates to compositions and articles comprising these stabilizer systems, and to the use of the systems and compositions.
    Type: Grant
    Filed: August 4, 2008
    Date of Patent: August 13, 2013
    Assignee: Nabaltec AG
    Inventors: Trupti Dave, Wolfgang Wehner
  • Publication number: 20130203907
    Abstract: The invention relates to an epoxidized composition and a process for producing the same. The epoxidized composition is useful as a plasticizer for thermoplastics such as polyvinyl chloride (PVC) and other polymers. The process includes forming a blend containing one or more fatty acid esters and one or more bio-based oils; and epoxidizing the blend to form the epoxidized composition. This process has several advantages over a process of forming a blend of already epoxidized fatty acid esters and epoxidized bio-based oils.
    Type: Application
    Filed: August 5, 2011
    Publication date: August 8, 2013
    Applicant: Arkema Inc.
    Inventors: Mohammad R. Kazemizadeh, Timothy E. McKinney, David E. Maixner, Zuzanna Donnelly
  • Patent number: 8501845
    Abstract: Thermoplastic molding compositions, comprising A) from 10 to 98.9% by weight of at least one thermoplastic polyester, B) from 0.01 to 50% by weight of B1) at least one highly branched or hyperbranched polycarbonate or B2) at least one highly branched or hyperbranched polyester of AxBy type, where x is at least 1.1 and y is at least 2.1 or a mixture of these C) from 0.1 to 10% by weight of at least one epoxidized naturally occurring oil or fatty acid ester, or a mixture of these, and D) from 0 to 60% by weight of other additives, where the total of the percentages by weight of components A) to D) is 100%.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: August 6, 2013
    Assignee: BASF SE
    Inventors: Dietrich Scherzer, Bernd Bruchmann, Andreas Eipper, Jean-Francois Stumbe, Carsten Weiss, Michaela Liese, Mark Völkel
  • Patent number: 8497313
    Abstract: A thermoplastic elastomer compound is disclosed having polyether-polyamide copolymer, epoxidized soybean oil, and vulcanized vegetable oil. The compound has a biorenewable content of the compound of at least about 70 weight percent. The compound can be used to make a plastic article needing a Shore A hardness of from about 22 to about 72. The compound is a sustainable solution for extruded or molded articles.
    Type: Grant
    Filed: February 22, 2010
    Date of Patent: July 30, 2013
    Assignee: PolyOne Corporation
    Inventors: Guoqiang Qian, Krishna Venkataswamy
  • Publication number: 20130189525
    Abstract: The present invention relates to adhesives that are suitable for use in a broad variety of bonding applications. In particular, the present invention relates to adhesives that are suitable for use in polymer-to-metal, for example elastomer-to-metal, such as rubber-to-metal bonding applications, wherein the adhesives comprise at least one halogenated polyolefin, at least one epoxysilane having at least one terminal alkoxy silane group, at least one bis-silane, and optionally at lease one organic solvent.
    Type: Application
    Filed: March 12, 2013
    Publication date: July 25, 2013
    Applicants: Henkel AG & Co. KGaA, Henkel Ireland Limited
    Inventors: Henkel Ireland Limited, Henkel AG & Co. KGaA
  • Publication number: 20130181361
    Abstract: A thermosetting resin composition for semiconductor encapsulation contains a both end allyl isocyanurate ring-terminated organopolysiloxane polymer as a sole base polymer and an isocyanurate ring-containing organohydrogenpolysiloxane polymer as a sole curing agent or crosslinker. When a semiconductor element array having semiconductor elements mounted on a substrate with an adhesive is encapsulated with the thermosetting resin composition, warp-free semiconductor devices having improved heat resistance and moisture resistance are obtainable.
    Type: Application
    Filed: January 15, 2013
    Publication date: July 18, 2013
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventor: Shin-Etsu Chemical Co., Ltd.
  • Patent number: 8487050
    Abstract: A composition comprises a fluorine-containing aromatic polymer, an epoxy compound and an initiator. Its use as film, laminate with polyimide or copper foils, copper-clad laminated board and adhesive film. The fluorine-containing aromatic polymer is preferably a fluorine-containing aryl ether polymer. The initiator is preferably a cationic initiator.
    Type: Grant
    Filed: April 27, 2006
    Date of Patent: July 16, 2013
    Assignee: Nippon Shokubai Co., Ltd.
    Inventors: Kazushi Omote, Ai Nishichi, Shimpei Sato
  • Publication number: 20130178566
    Abstract: The invention relates to rubber mixtures comprising (A) at least one polyacrylate rubber, (B) at least one silicatic or oxidic filler or carbon black and (C) at least one epoxysilane. The rubber mixtures can be used to produce mouldings.
    Type: Application
    Filed: January 4, 2013
    Publication date: July 11, 2013
    Applicant: EVONIK INDUSTRIES AG
    Inventor: EVONIK INDUSTRIES AG
  • Publication number: 20130178565
    Abstract: The present invention relates to thermoplastic molding compositions and moldings with improved wear resistance comprising at least one thermoplastic matrix M, at least one carbon reinforcing fiber F, at least one carbon component K; at least one silicate component S, where the at least one silicate component S comprises particles which have, in any particle dimension, a length/thickness ratio greater than or equal to 3, and at least one titanium dioxide T.
    Type: Application
    Filed: October 10, 2012
    Publication date: July 11, 2013
    Applicant: BASF SE
    Inventors: Florian Hennenberger, Mark Völkel, Rüdiger Bluhm, Christian Maletzko, Andreas Gebhard, Stefan Sutor
  • Publication number: 20130178564
    Abstract: Disclosed is a thermoplastic resin composition with superior flame retardancy, colorability and scratch resistance. More specifically, disclosed is a thermoplastic resin composition comprising A) 100 parts by weight of a basic resin comprising 11 to 89% by weight of an acrylonitrile-butadiene-styrene copolymer and 89 to 11% by weight of a styrene-acrylonitrile copolymer, B) 10 to 40 parts by weight of a bromine organic flame retardant, and C) 0.1 to 10 parts by weight of a coated antimony compound.
    Type: Application
    Filed: March 31, 2011
    Publication date: July 11, 2013
    Applicant: LG CHEM, LTD.
    Inventors: Je Sun Yoo, Ki Young Nam, Yong Yeon Hwang, Min Sul Jang, Jae Young Sim
  • Publication number: 20130178554
    Abstract: UV-cured pressure sensitive adhesive including one or more UV-curable acrylic oligomers, one or more tack control components, and, optionally, an elastomeric material is described herein. The adhesive includes an adhesive component ratio of the various adhesive components effective to provide desired first peel adhesions and subsequent peel adhesions.
    Type: Application
    Filed: March 1, 2013
    Publication date: July 11, 2013
    Inventors: Jeffrey James Boyce, Michael Clingerman, Colleen Marie Henry, David Chris Masterson, Vincent Daniel McGinniss
  • Patent number: 8481622
    Abstract: An improved soybean oil ester based epoxy resin and method of making the same is disclosed. A transesterification step is employed to liberate glycerol and to form new fatty acid esters with additional double bonds. The resulting fatty acid esters containing one or more double bonds are epoxidized by reacting with epoxidation reagent. The epoxidized esters serve as monomers in an epoxy resin system, which may be used to manufacture composite materials with improved mechanical properties as compared to materials obtained from epoxidized triglycerides. The soybean based epoxy resin may be used as low-cost and biocompatible coating materials for food and beverage cans.
    Type: Grant
    Filed: September 1, 2007
    Date of Patent: July 9, 2013
    Assignee: The Curators of the University of Missouri
    Inventors: Virgil Flanigan, Shubhen Kapila, K. Chandrashekhara, Rachadaporn Seemamahannop, Arun Garg, Surya Misra
  • Publication number: 20130172456
    Abstract: Blends comprising 65-95 wt % poly(trimethylene terephthalate-co-sebacate), 5 to 35 wt % polylactic acid and a chain extender are provided that exhibit greatly increased melt strength compared to that of poly(trimethylene terephthalate-co-sebacate) alone. Such improvements allow these compositions to be processed readily by melt-blowing, which is useful for packaging and for preparing items such as biodegradable garbage bags.
    Type: Application
    Filed: December 28, 2012
    Publication date: July 4, 2013
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventor: E I DU PONT DE NEMOURS AND COMPANY
  • Publication number: 20130165561
    Abstract: A polarizing plate and an optical member, the polarizing plate including an adhesive layer, the adhesive layer being prepared from an adhesive composition including a (meth)acrylic copolymer, a crosslinking agent, and a tackifier, the tackifier including an acrylic modified petroleum resin represented by Formula 1: R?—CO—O—R??[Formula 1] wherein R? is a petroleum resin and R is a C1-C20 alkyl group or a C6-C50 aryl group.
    Type: Application
    Filed: December 27, 2012
    Publication date: June 27, 2013
    Inventors: Won KIM, Yi Eun KIM, Chul JEONG, Ri Ra JUNG, Hae Ryong CHUNG
  • Publication number: 20130137789
    Abstract: A polyvinyl chloride composition having polyvinyl chloride resin and a plasticizer ester selected from di-butyl terephthalate, di-isobutyl terephthalate, or mixtures thereof.
    Type: Application
    Filed: January 24, 2013
    Publication date: May 30, 2013
    Applicant: Eastman Chemical Company
    Inventor: Eastman Chemical Company
  • Publication number: 20130102689
    Abstract: The present invention is directed to stable emulsions comprising polyolefins, in particular polyisobutene, the process to obtain said emulsions and the use of said emulsions.
    Type: Application
    Filed: December 5, 2012
    Publication date: April 25, 2013
    Applicant: BASF SE
    Inventor: BASF SE
  • Publication number: 20130102719
    Abstract: A dispersion includes a carbonaceous nanoparticle, a dispersant including a graft polymer having a poly(alkylene glycol) side chain, and a polar solvent. An article coated with the dispersion and a method of making the dispersion are disclosed.
    Type: Application
    Filed: April 13, 2012
    Publication date: April 25, 2013
    Applicant: BAKER HUGHES INCORPORATED
    Inventors: Hendrik John, Claus-Peter Klages, Sven Hartwig
  • Publication number: 20130099468
    Abstract: A liquid silicone rubber coating composition is provided. The composition comprises (A) an organopolysiloxane having at least 2 alkenyl groups bonded to silicon atoms per molecule; (B) an organohydrogenpolysiloxane having at least 2 hydrogen atoms bonded to silicon atoms per molecule; (C) an addition reaction catalyst; (D) a fine powder silica; (E) an organic compound represented by the following general formula (1): wherein R1 is a monovalent hydrocarbon group and n is an integer of 2 to 10; (F) an organosilicon compound having an epoxy group and an alkoxy group bonded to a silicon atom in the molecule; and (G) either one or both of a titanium compounds and a zirconium compounds. When used for the silicone rubber coating layer on air bag base fabric, excellent low burning speed defined by FMVSS-302 is realized and the cured coating layer exhibits low surface tackiness with high anti-blocking property.
    Type: Application
    Filed: October 18, 2012
    Publication date: April 25, 2013
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventor: Shin-Etsu Chemical Co., Ltd.
  • Publication number: 20130096243
    Abstract: A resin composition contains (A) a polylactic acid, (B) a polyhydroxyalkanoate, (C) an ammonium polyphosphate, and (D) a phenol-modified epoxy compound. With respect to the total amount of the resin composition, the polylactic acid (A) and the polyhydroxyalkanoate (B) are contained from about 60% by mass to about 95% by mass; the ammonium polyphosphate (C) is contained from about 4% by mass to about 35% by mass; the phenol-modified epoxy compound (D) is contained from about 1% by mass to about 5% by mass; the polylactic acid (A) is contained from about 40% by mass to about 90% by mass; the polyhydroxyalkanoate (B) is contained from about 5% by mass to about 55% by mass; and the amount ratio of the polylactic acid (A) to the polyhydroxyalkanoate (B) is from about 0.7 to about 18.
    Type: Application
    Filed: April 4, 2012
    Publication date: April 18, 2013
    Applicant: FUJI XEROX CO., LTD.
    Inventor: Kenji YAO
  • Publication number: 20130084454
    Abstract: A resin composition, a resin and a method for manufacturing the same. The resin composition includes a plant oil derivative, and a multifunctional carboxylic acid, anhydride compound or a copolymer containing anhydride. The multifunctional carboxylic acid, the anhydride compound or the copolymer containing anhydride has an amount of 5-60 parts by weight relative to 100 parts by weight of the plant oil derivative.
    Type: Application
    Filed: July 20, 2012
    Publication date: April 4, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsien-Kuang Lin, Man-Lin Chen, Sue-May Chen, Jauder Jeng
  • Publication number: 20130081864
    Abstract: [Problems] The present invention provides a photosensitive resin composition having good resistance to electroless gold plating and excellent filling property into a through hole, from which a cured product where a defect in the outer appearance of a cured film caused by bumping in a through hole is inhibited can be obtained; a cured film of the photosensitive resin composition; and a printed circuit board comprising the cured film. [Means for Solution] The photosensitive resin composition comprises (A) a photosensitive carboxylic acid resin and (B) a liquid bifunctional epoxy resin and is characterized by comprising (C) an aluminum-containing inorganic filler in an amount of not less than 200 parts by mass with respect to 100 parts by mass of total carboxylic acid resins.
    Type: Application
    Filed: September 28, 2012
    Publication date: April 4, 2013
    Applicant: Taiyo Ink MFG. Co., Ltd.
    Inventor: Taiyo Ink MFG. Co., Ltd.
  • Publication number: 20130074931
    Abstract: An interlayer comprised of a thermoplastic resin, varying amounts of an epoxidized vegetable oil, and, optionally, a conventional plasticizer. The use of a thermoplastic resin, an epoxidized vegetable (plant) oil, and, optionally, a conventional plasticizer creates synergy allowing the flow of the interlayer to be increased without sacrificing other characteristics typically associated with an increased flow (e.g., increased blocking and creep, exudation, surface roughness formation, decreased mechanical strength, and decreased manufacturing capability). In this regard, the epoxidized vegetable oil acts as a flow improvement agent, resulting in a high-flow interlayer. As a result, a thinner interlayer can be utilized in forming multiple layer panels because the resulting thinner interlayer has improved flow properties.
    Type: Application
    Filed: September 22, 2011
    Publication date: March 28, 2013
    Inventors: Wenjie Chen, Yinong Ma
  • Publication number: 20130059955
    Abstract: Halogen-free TPU compositions comprise in weight percent based on the weight of the composition: A. 1 to 99% thermoplastic polyurethane (TPU), B. 1 to 50% tris(2-butoxyethyl)phosphate (TBEP), C. 1 to 70% metal hydrate, and D. 1 to 70% organic phosphate ester other than tris(2-butoxyethyl)phosphate. These compositions exhibit better smoke suppression as compared with conventional organic phosphate flame retardant TPU compositions such as those based on resorcinol bis(diphenyl phosphate) (RDP) and bisphenol-A bis(diphenyl phosphate) (BPADP) in the absence of TBEP.
    Type: Application
    Filed: June 3, 2010
    Publication date: March 7, 2013
    Inventors: Xiangyang Tai, Given Jing Chen, Yurong Cao, Li Qiang Fan
  • Publication number: 20130059954
    Abstract: A glue stick formulation that includes at least one acrylic dispersion; at least one solvent; at least one defoamer; at least one fatty acid; at least one caustic solution; at least one processing oil; and at least one adhesion promoter. At least one color indicator and at least one organic amine may also be included in some versions of this formulation.
    Type: Application
    Filed: September 5, 2012
    Publication date: March 7, 2013
    Applicant: ELMER'S PRODUCTS, INC.
    Inventors: Joginder Kukreja, Van R. Foster, Dana L. Conover
  • Patent number: 8389608
    Abstract: Aminoplast-polythiol compositions resulting from the contact product, or cured reaction product, of an aminoplast resin composition and a polythiol composition are disclosed. Typically, the polythiol composition contains thiol ester molecules having an average of two or more thiol groups per molecule. Methods for preparing the aminoplast-polythiol compositions, methods for using the aminoplast-polythiol compositions to produce coatings and to coat substrates, and coatings and other articles produced using these aminoplast-polythiol compositions also are described.
    Type: Grant
    Filed: September 9, 2010
    Date of Patent: March 5, 2013
    Assignee: Chevron Phillips Chemical Company LP
    Inventors: Thomas A. Upshaw, Chad W. Brown
  • Publication number: 20130053480
    Abstract: Compositions comprising thermoplastic polymers and oils are disclosed, where the oil is dispersed throughout the thermoplastic polymer. Also disclosed are methods of making these compositions.
    Type: Application
    Filed: May 18, 2012
    Publication date: February 28, 2013
    Inventors: William Maxwell Allen, Eric Bryan Bond, Isao Noda, Donald Stuart Murray
  • Patent number: 8383708
    Abstract: An unhindered polyol is used to react with an epoxidized soyate to make epoxidized soyate diester in the presence of a catalyst. The unhindered polyol can be 1,3-propanediol or any polyol having four or more carbon atoms with no two adjacent carbon atoms having hydroxyl functionality. Preferably, a combination of catalysts is used to promote the transesterification reaction of the epoxidized soyate with the unhindered polyol to yield a high percentage of epoxidized soyate diester with epoxy functionality retained. The primary catalyst is a metallic hydroxide, and the secondary catalyst is a titanate. Bioderived epoxidized soyate diester plasticizers useful for thermoplastics and thermosets result.
    Type: Grant
    Filed: February 4, 2009
    Date of Patent: February 26, 2013
    Assignee: Polyone Coporation
    Inventors: Kebin Geng, Roger W. Avakian, Louis Dupont, Stephen D. Horton
  • Publication number: 20130018131
    Abstract: Biodegradable compositions containing an aliphatic-aromatic copolyester. Methods of making the compositions and articles made from the compositions.
    Type: Application
    Filed: March 28, 2012
    Publication date: January 17, 2013
    Applicant: SAUDI BASIC INDUSTRIES CORPORATION
    Inventors: Husnu Alp ALIDEDEOGLU, Ganesh KANNAN
  • Publication number: 20120328806
    Abstract: A compostion comprising: at least one copolymer (A) of vinylidene chloride and of at least one comonomer copolymerizable therewith selected from butyl acrylates; and from 1 to 20% by weight, relative to the total weight of the composition, of at least one polymeric plasticizer (B) selected from polyesters derived from a polycondensation reaction of at least one aliphatic polycarboxylic acid and at least one polyhydroxylated aliphatic alcohol. The composition is suitable for the preparation of mono- or multi-layer films for the packaging of food products.
    Type: Application
    Filed: March 8, 2011
    Publication date: December 27, 2012
    Applicant: SOLVAY SA
    Inventors: Pascal Dewael, Agnes Chapotot, Yves Vanderveken
  • Publication number: 20120328804
    Abstract: Molded articles formed from compositions comprising thermoplastic polymers and oils are disclosed, where the oil is dispersed throughout the thermoplastic polymer.
    Type: Application
    Filed: May 18, 2012
    Publication date: December 27, 2012
    Inventors: William Maxwell Allen, Eric Bryan Bond, Isao Noda
  • Patent number: 8338546
    Abstract: The present invention relates to a polythiophene-based conductive polymer composition having high conductivity, transparency, waterproof property and durability, and a polymer membrane prepared by using the same. In particular, the present invention relates to a polythiophene-based conductive polymer composition comprising an aqueous solution of a polythiophene-based conductive polymer, an alcohol-based organic solvent, an amide-based organic solvent or an aprotic highly-dipolar solvent, a melamine resin and a binder selected among a polyester, a polyurethane resin and an alkoxy silane in a predetermined mixed ratio. The membrane prepared using the same has a high conductivity of less than 1 k?/m2 and a high transparency of higher than 95%, thus being applicable to of an anti-static film, a film for touch panel, a film for higher or lower electrode, a film for inorganic EL and a film for display electrode.
    Type: Grant
    Filed: February 21, 2007
    Date of Patent: December 25, 2012
    Assignee: SKC Co., Ltd.
    Inventors: Jin Hwan Kim, Dae Gi Ryu, Yong Lae Yi, Jong Ho Park
  • Publication number: 20120322010
    Abstract: A novel novolac prepared by acid catalyzed condensation between biphenols or bisphenofluorenes and fluorenone is presented. The polymers exhibit excellent oxidative thermal stability and high carbon content, suitable for dielectric, etch stop applications as spin-on material.
    Type: Application
    Filed: June 6, 2012
    Publication date: December 20, 2012
    Applicant: SILECS OY
    Inventor: Jyri Paulasaari
  • Patent number: 8329794
    Abstract: A polymer composition of a compatibilized silica in blends of acrylonitrile butadiene polymer and styrene butadiene polymer comprising six to ninety percent by weight of a compatibilized silica, at least one percent by weight of a coupling agent, at least one percent by weight of a styrene butadiene polymer, and at least one percent by weight of an acrylonitrile butadiene polymer is described herein. The polymer composition can have a minimum amount of at least ten percent by weight of 15:50 ratio, acrylonitrile to butadiene polymer, with the remainder being compatibilized silica.
    Type: Grant
    Filed: January 4, 2011
    Date of Patent: December 11, 2012
    Assignee: Lion Copolymer, LLC
    Inventors: Lawrence Douglas Harris, Harold William Young, Deepak Rasiklal Parikh, Daniel Courtney Patton, Vernon Vincent Vanis
  • Patent number: 8324298
    Abstract: The present invention relates to a composition of at least one vinylidene chloride polymer, a process for preparing such a composition, a process for preparing articles, in particular films, which includes the use of such a composition and also the film comprising such a composition and the packaging or bag formed from this film.
    Type: Grant
    Filed: September 4, 2007
    Date of Patent: December 4, 2012
    Assignee: Solvay (Societe Anonyme)
    Inventors: Pascal Dewael, Christophe Fringant, Yves Vanderveken