Abstract: Thermosettable prepolymers are prepared by reacting (A) a heterocyclic material containing one or more rings and one nitrogen atom or a mixture of such materials wherein at least one of such materials contains at least two reactive substituent groups having at least one reactive hydrogen atom attached to a carbon atom which is attached to the ring such as 2,4,6-trimethyl pyridine; with (B) a cycloaliphatic or aromatic carboxylic acid mono- or dianhydride such as phthalic anhydride. These prepolymers or resins, can be homopolymerized without coreactants or copolymerized with N,N'-bis-imides such as 1,1'-(methylenedi-4,1-phenylene)bismaleimide, to produce products, mat castings or composites having good mechanical and thermal properties.

Abstract: A novel metal core printed circuit board and a method of making it are described. The circuit board comprises a metal substrate, a patternable metal foil, and an insulating layer of thermoplastic resin whose glass transition temperature is exceeded during assembly under pressure to bond the resin to the metal substrate and to the foil by high temperature wetting. The circuit board also provides holes whose interior is lined with a resin united fusing to the resin in the insulating layer by high temperature wetting accompanied by pressure. The thermoplastic resin is a polyetherimide engineering plastic. The layers of the printed circuit board described above, including any additional layers of insulating resin and foil, may be bonded in a single step in a laminating press.

Abstract: Thermosettable prepolymers are prepared by reacting (A) a heterocyclic material containing one or more rings and one nitrogen atom or a mixture of such materials wherein at least one of such materials contains at least two reactive substituent groups having at least one reactive hydrogen atom attached to a carbon atom which is attached to the ring such as 2,4,6-trimethyl pyridine; with (B) a cycloaliphatic or aromatic carboxylic acid mono- or dianhydride such as phthalic anhydride. These prepolymers or resins, can be homopolymerized without coreactants or copolymerized with N,N'-bis-imides such as 1,1'-(methylenedi-4,1-phenylene)-bismaleimide, to produce products, mat castings or composites having good mechanical and thermal properties.

Abstract: A silicone modified polyetherimide which contains a polyetherimide and a flow-modifying amount of a polyorganosiloxane. Modification of polyetherimides in accordance with this invention results in lower torsional forces and increased throughput rates in extrusion and injection molding operations.

Abstract: Methods of making modified polyimide adhesives and laminating compositions. These adhesives are also particularly useful as the matrix material in high strength fiber reinforced composites. The adhesive compositions are prepared by initially reacting an oxoimine with one or more tetracarboxylic acid dianhydrides, which is primarily 1, 2, 3, 4-butanetetracarboxylic acid dianhydride. The resulting bisimide is dissolved in a non-reactive solvent and a suitable diamine is added to react with the bisimide, producing a liquid resin solution which is essentially a polyamide resin solution. This solution is useful as an adhesive or a fiber composite matrix which can be cured to a polyimide at moderate processing temperatures. The final adhesive bond or matrix is found to be flexible, strong and very resistant to flame, high temperatures, oils and solvents.

Abstract: Thermosettable prepolymers or polymers are prepared by reacting (A) the reaction product of (1) a heterocyclic material having one or more rings, at least one nitrogen atom and at least two substituent groups which have at least one reactive hydrogen atom attached to a carbon atom which is attached to a heterocyclic ring such as 2,3,5,6-tetramethylpyrazine; (2) a cycloaliphatic or aromatic carboxylic acid mono- or dianhydride such as pyromellitic dianhydride; and (3) a material containing a polymerizable ethylenically unsaturated group and at least one group selected from (a) a heterocyclic material having one or more rings; at least one nitrogen atom and at least one substituent group which has at least one reactive hydrogen atom attached to a carbon atom which is attached to a heterocyclic ring such as 2-methyl-5-vinyl pyridine or (b) a cycloaliphatic or aromatic carboxylic acid mono- or dianhydride group such as cis-5-norbornene-endo-2,3-dicarboxylic anhydride; with (B) an aqueous or alcoholic solution of

Abstract: Thermosettable prepolymers are prepared by reacting (A) a heterocyclic material containing one or more rings and one nitrogen atom or a mixture of such materials wherein at least one of such materials contains at least two reactive substituent groups having at least one reactive hydrogen atom attached to a carbon atom which is attached to the ring such as 2,4,6-trimethyl pyridine; with (B) a cycloaliphatic or aromatic carboxylic acid mono- or dianhydride such as phthalic anhydride. These prepolymers or resins, can be homopolymerized without coreactants or copolymerized with N,N'-bis-imide such as 1,1'-(methylenedi-4,1-phenylene)bismaleimide, to produce products, mat castings or composites having good mechanical and thermal properties.

Abstract: A co-solvent accelerator for a polyamide-acid/ether solution which accelerates the conversion thereof to polyimide is presented. The co-solvent accelerator comprises high boiling pyrrolidone-based solvents, especially those with a boiling point of above about 250.degree. C. such as N-cyclohexyl-2-pyrrolidone (CHP). Said co-solvents are employed in concentrations of from about 0.5% to about 10% by weight, preferably 3% to about 10%.

Abstract: A low temperature processable moisture resistant polyimide and fiber reinforced composite of such a polymer and methods for making the same. The polyimide resin has repeating polymer units of the formula ##STR1## wherein n is 2 to about 20 and the molecular weight of the polymer chain is such that the polymer absorbs below about 0.2% by weight moisture at room temperature. The polyimide is made by reacting 4,4'(hexafluoroisopropylidene)bis(o-phthalic anhydride) with a diamine having the formula H.sub.2 N(CH.sub.2).sub.n NH.sub.2 wherein n is 2 to about 20 to form a polyamic acid. The polyamic acid is imidized to form the polyimide prepolymer and then further polymerized by exposing the polyimide prepolymer to heat to form the polymer described above. The composite can be made using the above process by coating fibers with the polyimide prepolymer, stacking layers of the coated fibers in a mold, and hot pressing the stacked impregnated fibers.

Abstract: A high temperature processing aid for melt processing polyimide polymers and a method of doing same is presented wherein a compatible, high boiling point N-alkyl- or N-alicyclic-substituted pyrrolidone is added to a polyimide polymer in amounts sufficient to lower the glass transition temperature of said polyimide.

Abstract: Novel fluoro-containing polyetherimides are prepared from bis ether dianhydrides, fluoro-containing dianhydrides, and organic diamines. The compolymers exhibit both increased Tg and increased solubility in halogenated solvents which enhances their value in a wide variety of uses including films, molding compounds, and coatings.

Abstract: Ether modified polyesterimide resins are prepared by reacting under esterimide forming conditions substantially free of inert solvents a mixture consisting essentially of:(i) a diamine,(ii) a carboxylic acid anhydride containing at least one additional carboxylic group,(iii) an aromatic bis (ether anhydride) or the corresponding acid thereof,(iv) terephthalic acid and/or isophthalic acid,(v) a polyhydric alcohol having at least two hydroxyl groups, and(vi) optionally, a monoether of diethylene glycol or a monoether of triethylene glycol.

Abstract: Methods of making water soluble polyimide resin compositions. A carboxy terminated bisimide is prepared by reacting a suitable aromatic dianhydride with a suitable oxoimine. The bisimide is then mixed with a sufficient quantity of a water soluble solvent to dissolve the bisimide. Water is added to make a solution of the desired viscosity. An aromatic diamine is added to this water solution. To the mixture is added a suitable quantity of a tertiary amine to stabilize the resin. The solution is coated onto a surface and dried to produce a smooth, flexible coating. The coating can then be heated to an appropriate temperature to produce a fully polymerized coating which is thermally stable and resistant to oils and solvents.

Abstract: Novel thermoplastic molding compositions comprising a thermoplastic elastomer and a modifying combination of an aromatic thermoplastic polyester and clay.

Abstract: Ovenwares produced by molding a wholly aromatic polyester resin composition comprising 30 to 80 wt. % of a wholly aromatic polyester having a repeating unit represented by the general formula, ##STR1## wherein X is a C.sub.1 -C.sub.4 alkyl group or --O--, --SO.sub.2 --, --S-- or --CO-- group, m and n are 0 or 1, a d:e ratio is in the range of from 1:1 to 10:1, an e:f ratio is in the range of from 9:10 to 10:9, and the positions of substituents at each aromatic ring of the foregoing general formula are para or meta to each other, 5 to 60 wt. % of wollastonite and 5 to 60 wt. % of titanium oxide.

Abstract: Copolyetherester molding compositions comprising a copolyetherester and modifying combination of (i) an aromatic thermoplastic polyester and (ii) clay.

Abstract: Conductive thermoplastic having high EMI shielding effectiveness comprise a thermoplastic condensation polymer and incorporated therein a synergistic combination of metal flake and conductive metal or metal coated fiber.

Abstract: Composition for the application of planar polyimide coatings comprising an aprotic solvent solution of selected aromatic dianhydrides which have been at least 20% esterified with a volatile alcohol and an equivalent amount of selected aromatic diamine.

Abstract: A novel ether solution of dinitrobenzophenone and a process for preparing an ether solution of diaminobenzophenone therefrom which comprises subjecting a dinitrobenzophenone dissolved in said ether solvent to hydrogenation in contact with a continuous nickel catalyst to obtain said solution of diaminobenzophenone dissolved in said ether solvent. In a specific embodiment said nickel catalyst is mounted on an inert support. In a still further embodiment, said diaminobenzophenone dissolved in said ether solvent, after removal of water therefrom, is reacted with an aromatic dianhydride to obtain a polyamic acid solution. The polyamic acid solution can be heated at a temperature above 100.degree. C. to drive off water of cyclization and thereby obtain the corresponding polyimide resin.

Abstract: Crystallizable hot melt adhesive compositions comprising block copolyesteramides and alkali metal carboxylates. The block copolyesteramides comprise hard or crystalline polyester blocks and soft or amorphous polyamide blocks in the weight ratio of 2:3 to 4:1. The alkali metal carboxylates provide a concentration of alkali metal cation in the range of 0.1 to 6 meq per 100 parts by weight of copolyesteramide. The hot melt adhesive compositions are useful for bonding plastic parts to form plastic structures which are relatively free of bond line distortion.

Abstract: A one-step solution technique for preparing an aromatic polyimide acid which comprises reacting an aromatic dianhydride with an aromatic diamine in the presence of diglyme and a sufficient amount of a co-solvent to maintain the polyimide acid in solution, said co-solvent having the formula:ROHwhere R is H, an aliphatic branched or straight-chain hydrocarbon having from 1 to 5 carbon atoms or a methoxy substituted aliphatic branched or straight-chain hydrocarbon having from 1 to 5 carbon atoms.

Abstract: Compositions for the application of planar and solvent resistant polyimide coatings comprising an aprotic solvent solution of selected aromatic dianhydrides which have been at least 20% esterified with a volatile alcohol and an equivalent amount of a mixture of amines comprising selected diamines and polyamines.

Abstract: Molding compositions for the fabrication of shaped articles having enhanced mechanical properties are comprised of (i) a polymeric matrix, (ii) an inorganic reinforcing filler material therefor, and, advantageously, (iii) a polymer/filler coupling agent, said reinforcing filler material consisting essentially of intimate admixture of enstatite and silica advantageously prepared by calcination of a precursor clay at a temperature of at least 800.degree. C.

Abstract: A curable polyamino-bis-imide resin, obtained by the thermal reaction of:(A) a bis-imide represented by the general formula I: ##STR1## wherein R.sub.1 stands for a divalent organic group having a carbon-carbon double bond and R.sub.2 for a divalent aromatic organic group having 1 to 3 benzene rings, with(B) a diamine represented by the general formula II: ##STR2## wherein X stands for one member selected from the group consisting of O, S, SO.sub.2, CH.sub.2, CO, COO, C(CH.sub.3).sub.2, CF.sub.2 and C(CF.sub.3).sub.2, providing that the three X's may be identical or not identical to one another and the hydrogen atoms attached to the benzene rings may be substituted by an inactive alkyl group, perfluoroalkyl group or halogen atom, a solution thereof, cross-linked resins therefrom and laminated boards therefrom.

Abstract: An improved wire enamel consisting essentially of the following materials by weight wherein basis is wire enamel weight; at least 50% by wt. of a polar organic solvent; about 2-8% by wt. of a polyimide precursor which can be cured to yield a polyimide polymer; about 0.5 to about 25% by weight of the substituted aliphatic hydrocarbon solvent for the polyimide precursor having a surface tension and polarity greater than that of the halogenated aliphatic hydrocarbon described below or a substituted aromatic hydrocarbon having a dipole moment less than or equal to the dipole moment of the halogenated aliphatic hydrocarbon described below; about 5 to 40% by wt. of a halogenated aliphatic hydrocarbon; and 0 to about 1% by wt. of an organosilane which increases the adhesion of the polyimide to an underlying substrate.

Abstract: A one-step solution technique for preparing an aromatic polyimide acid which comprises reacting an aromatic dianhydride with an aromatic diamine in the presence of propylene glycol methyl ether.

Abstract: A polyamide acid composition for preparing a polyimide which is improved in the stability in a form of solution and can extend the pot life of the composition comprising a solution of a polyamide acid in an organic solvent, the polyamide acid being a precursor of the polyimide, and an N-substituted heterocyclic compound as a chemical treating agent which can lower a rate of conversion of the polyamide acid to the polyimide. The pot life can be extremely extended to give the composition an enough flowability for a long time without reducing the excellent properties such as a heat resistance of the obtained polyimide.

Abstract: A coating composition contains partially or completely neutralized carboxyl groups and selected from the group consisting of polyesters, polyesteramides, polyesterimides, and mixtures and combinations thereof, and at least part of the free carboxyl groups in the polyester moiety of the composition is neutralized with a material selected from the group consisting of ammonia, ammonium hydroxide, a primary amine, a secondary amine and a tertiary amine.A process is also disclosed.

Abstract: A conductive pyrolytic product obtained by thermally treating specific types of heat-resistant polymers including polyamide-imide, an aromatic polymer having a heterocyclic ring of a specific type and an aromatic polyamide under certain temperature and atmospheric conditions. A conductive composition using the pyrolytic product in the form of a powder is also disclosed.

Abstract: A polyamide-imide resin which can give a varnish having a high resin content, excellent in storage stability and heat resistant final products such as insulated wire can be produced by reacting an aromatic diisocyanate with a tricarboxylic acid anhydride in the presence of a basic solvent while adjusting the resin content at 40% by weight or more, and adding a compound having one active hydrogen atom before, during or after the above-mentioned reaction so as to adjust the reduced viscosity of the resin to 0.27 or lower.

Abstract: Polymeric amide-imide-ester wire enameling compositions are prepared from (1) a monoanhydride of an aromatic tricarboxylic acid, e.g. trimellitic anhydride, (2) an aromatic primary diamine compound and (3) either polyfunctional acids and polyhydroxy compounds or the polyesters thereof. At least a portion of the polyol or polyhydroxy compound is a tris (hydroxyalkyl) isocyanurate, e.g. tris (hydroxyethyl) isocyanurate. The polyfunctional acids (3) comprise an acid component selected from the group consisting of trimellitic anhydride, isophthalic acid and esters of isophthalic and terephthalic acid. The polymeric amide-imide-ester may be blended with terephthalate or isophthalate polyesters, polyisocyanates and other materials. One particularly suitable polyisocyanate is prepared from dimethylterephthalate, tris (2-hydroxyethyl) isocyanurate and tolylene diisocyanate.

Abstract: Improved polyimide and/or polyamide-imide coating compositions are provided for use as magnet wire coatings which comprise a polyimide and/or polyamide-imide polymer and a co-solvent mixture of N-methyl pyrrolidone and acetophenone the solids content of the solution being between about 5 percent and 40 percent by weight based on the total weight of solution.

Abstract: Novel carbinol-containing polyimides capable of self-crosslinking at low temperatures are prepared by reacting a molar excess of selected 3,3',4,4'-benzhydrol tetracarboxylic acid compounds (the tetraacid, diester-diacid, or (dianhydride) with polyfunctional polyamines (e.g. 4,4'-methylenedianiline, 1,6-hexanediamine, etc.) in an inert organic solvent at about 100.degree.-150.degree. C. The molar ratio of tetracarboxylic acid compound to diamine must be between 2:1 and 9:8. The polyimides may be crosslinked at less than 200.degree. C. via a reaction between the carbinol group(s) and the end group(s) of the polyimide.

Abstract: The present invention is directed toward a process for making water soluble polyimide resin systems. The process comprises preparing a solution of a polyamic acid in an organic solvent, adding water to the solution to cause the polyamic acid to precipitate, filtering the precipitated acid, washing the precipitated acid with water to remove the organic solvent and then reacting the washed acid with a water soluble amine forming the water soluble amine salt of the polyamic acid. This polyamic acid salt may then be converted to the polyimide by heating. These water soluble polyamide systems allow for safer application of polyimide coatings to substrates.

Abstract: Improved polyetherimide compositions and processes for their production are described. Various polyetherimide derivatives including water-soluble and tri-functional isocyanate cross-linked resins are described. They permit production of water-based enamels and coatable particulates which may be employed in, for example, formulation of insulated electrical conductors.

Abstract: The present invention relates to a process for producing an of aromatic polyimide film comprising (A) casting on a support a dope containing an amide-type polar solvent and 10-45 weight percent of a polyamic acid having more than 0.4 dl/g an inherent viscosity of more than 0.4 dl/g, (B) concentrating the polymer content to be at least higher than that of the initial dope while simultaneously raising the ring closure ratio above 30%, (C) removing the solvent from the film by extraction in an aqueous medium so as to lower the solvent content of the film below 10% and (D) then heating the film to a temperature of more than 200.degree. C.The process of the present invention is useful for the production of aromatic polyimide film having a reduced rate of solvent decomposition and improved productivity.

Abstract: An essentially linear polyester oligomer having hydroxyl and carboxyl terminal groups for subsequent cure and its production are disclosed. This polyester oligomer is produced by first adducting approximately equimolar amounts of diol carrying two primary hydroxyl groups and a dicarboxylic acid anhydride to form an hydroxy acid. The carboxyl groups of this hydroxy acid are then esterified by reaction with an approximately stoichiometric proportion of diol carrying one primary hydroxyl group and one secondary hydroxyl group, the stoichiometry being based on the total hydroxyl content of the diol and the carboxyl content of the hydroxy acid, to form an hydroxyl-terminated oligomer. This hydroxyl-terminated oligomer is then adducted with a polycarboxylic acid monoanhydride having a carboxyl functionality of at least 3, this monoanhydride being used in an amount of 0.01 to 0.15 equivalents of anhydride per hydroxyl equivalent in the hydroxyl-terminated oligomer.

Abstract: A polyamide acid composition for preparing a polyimide which can extend the pot life of the composition comprising a solution of a polyamide acid in an organic solvent, the polyamide acid being a precursor of the polyimide, a dehydrating agent, a catalyst and a pot life extending agent which can lower a rate of conversion of the polyamide acid to the polyimide, and the process for preparing the polyimide from said polyamide acid composition. According to the present invention the pot life can be extremely extended to give the composition an enough flowability for a long time without reducing the excellent properties such as a heat resistance and an electric insulation of the obtained polyimide.

Abstract: A polyester, a polyester/polyamide or a polyester/polyamide/polyimide polymers are prepared from (a) a diaryl terephthalate or diaryl isophthalate, and (b) an aromatic polyol or of (a) and a mixture of (b), and an aromatic diamine, or of (a), (b), (c), and (d) a triaryl mellitate, or a copolycarbonate of any of the foregoing including units derived from (e) a diaryl carbonate. The resulting polyester, polyamide, polyester/polyamide or polyester/polyamide/polyimide polymers are adapted for use as an insulating coating on an electrical conductor.

Abstract: A method for determining the concentration of ingredients and other process variables in a polymerization process by measuring the capacitance and dissipation factor of the mixture and determining its dielectric constant at various stages of the process. By the use of an automatic capacitance bridge and a computer, the process variables can be determined and controlled in a matter of seconds.

Abstract: A method for determining the concentration of additives in a compounding process by measuring the capacitance and dissipation factor (tan.delta.) of the mixture and converting such values to the concentrations of the additives. This method may also be utilized to determine the concentration of the polymers in the mixture. This method is preferably applied to a compounding process of blending polyphenylene oxide and polystyrene thermoplastic resins and is preferably applied to a continuous compounding process of these resins to determine therein the concentration of an aryl phosphate ester flame retardant.

Abstract: A rock wool composite material obtained by mixing a fine rock wool having a diameter of 1 to 10.mu. and a length of 70 to 500.mu. and containing substantially no shots with a pulp-like substance of a heat-resistant aromatic polymer having a freeness value of 150 seconds or more and less than 500 seconds, is excellent in heat resistance, incombustibility, heat insulation and electrical insulation and is advantageously used as a substitute for an asbestos sheet or board.

Abstract: Novel copolymers and molding compositions are prepared from acyl halide derivatives of dicarboxylic acids, acyl halide derivatives of tricarboxylic aromatic anhydrides and aromatic diamines and about 1 to about 10 percent by weight of phthalic anhydride moieties. Also, glass filled copolymers are prepared. The copolymers are useful as engineering plastics.

Abstract: Injection moldable homopolymers, copolymers, and terpolymers are prepared from fully or partially acylated aromatic diamines, aliphatic diamines or a mixture of these and aromatic tricarboxylic anhydride compounds or mixtures of tricarboxylic anhydrides and dicarboxylic acids. These polymers are improved by the addition of calcium moieties such as oxide, calcium acetate and calcium hydroxide. These polymers are useful for the preparation of injection molded articles.

Abstract: Disclosed is a coating solution including an aromatic bis(ether anhydride) component, an organic diamine component, an organic triamine component, and a solvent system, and optionally water which may be coated on a substrate and polymerized to form high quality polyetherimide coatings.

Abstract: Improved polyetherimide compositions and processes for their production are described. Various polyetherimide derivatives including water-soluble and tri-functionalisocyanate cross-linked resins are described. They permit production of water-based enamels and coatable particulates which may be employed in, for example, formulation of insulated electrical conductors.

Abstract: A water soluble composition including an amine or ammonium salt of a polyimide precursor which is obtained by the reaction steps of: reacting a tetracarboxylic compound and a diamine in about equimolar amounts in a water miscible organic solvent to obtain the polyimide precursor; and reacting the polyimide precursor with ammonia, or an aqueous solution of ammonia, or a primary or secondary aliphatic amine in an amount sufficient to neutralize the free carboxyl groups of the polyimide precursor.A process of coating and a substrate are also disclosed.

Abstract: Polyimide film is manufactured by solvent casting onto a film-supporting surface. A solution of polyimide resin is dissolved in hot organic solvent to provide a casting dope. The film is coagulated by contacting an aqueous medium, substantially replacing the organic solvent in the film with water. Orienting the water-containing film and drying the oriented film to remove water produces a substantially homogeneous polyimide film having high electrical resistance, flexibility and strength.

Abstract: Disclosed is a method of making a non-aqueous emulsion from which a polymer can be electrodeposited. A mixture is prepared of about 50 to about 150 parts by weight of a non-aqueous organic, non-electrolizable, non-solvent for the polymer with about 0.8 to about 1.2 parts by weight of a nitrogen-containing base which can be a tertiary amine, an imidazole, or mixture of a tertiary amine and an imidazole. To the mixture is added a solution of 1 part by weight of the polymer which can be a polyamic acid, a polyamide imide, a polyimide, a polyparabanic acid, a polysulfone, or a mixture of these polymers. The polymer is in a non-aqueous, organic, non-electrolizable aprotic solvent such as N-methyl-2-pyrrolidone.

Abstract: Novel polyimide-amide polymers and copolymers and molding compositions are prepared from tetramethylcyclobutane-1,2,3,4-tetracarboxylic dianhydride, dicarboxylic acids and mixtures of diamines. Also glass and graphite filled polymers are prepared. The polyimide-polyamide polymers and copolymers are useful as engineering plastics.