Abstract: PSAs having high shear stability are disclosed. The PSAs are obtained from an aqueous dispersion comprising an effective amount of surfactant mixture comprising at least one ionic surfactant comprising a plurality, preferably at least three, aromatic rings, at least one electronegative substituent selected from a mono valent oxy substituted sulfo anion, and/or a mono valent oxy substituted phospho anion, and optionally at least one substituent comprising one or more repeating alkoxy units (e.g. Soprophor 4D 384 and/or DPOS-45), and at least one non-ionic surfactant (e.g. Abex 2535) and a monomer composition comprising: at least one hydrophobic monomer (Component I), at least one hydrophilic monomer (Component II) at least one partially hydrophilic monomer (Component III). The dispersion forms PSAs which are sufficiently stable under high shear to be curtain coatable.

Abstract: A positive image-forming material for use with infrared laser is provided. The material includes a substrate, a layer (A) containing not less than 50% by weight of a copolymer which contains, as a copolymerization component, not less than 10% by mol of at least one of the following monomers (a-1) to (a-3), wherein (a-1) is a monomer having in the molecule a sulfonamide group wherein at least one hydrogen atom is linked to a nitrogen atom, (a-2) is a monomer having in the molecule an active imino group represented by the following general formula (I): and (a-3) is a monomer selected from acrylamide, methacrylamide, acrylate, methacrylate and hydroxystyrene, which respectively have a phenolic hydroxyl group; and a layer (B) containing not less than 50% by weight of an aqueous alkali solution-soluble resin having a phenolic hydroxyl group. The layer (A) and the layer (B) contain a compound which generates heat upon absorbing light.

Abstract: A resin compound, which causes very little thermal stress even when a flip chip is mounted, has a low modulus of elasticity, and a heat resistance which is sufficiently high for solder floating at 300° C., and the resin compound also can be used in an adhesive film, a metal-clad adhesive film, a circuit board, and an assembly structure. The resin compound contains (A) a polyamide imide with siloxane bond, (B) a acrylic polymer with a weight-average molecular weight of 500,000 or more, (C) a thermoset resin, and (D) a solvent.

Abstract: Adhesive film useful for the production of semiconductor devices is produced from a siloxane-modified polyamideimide resin composition, comprising 100 parts by weight of a siloxane-modified polyamideimide resin and 1 to 200 parts by weight of a thermosetting resin ingredient.

Abstract: An adhesive silicone composition comprising (A) an alkenyl group-containing organopolysiloxane, (B) an organohydrogen-polysiloxane having at least three hydrogen atoms each directly bonded to a silicon atom in a molecule, (C) a compound having at least one aliphatic unsaturated group and at least two phenyl skeletons in a molecule, and (D) a platinum catalyst is well adhesive to both metals and reins, and even to difficult-to-adhere resins such as nylon, polycarbonate and acryl resins.

Abstract: A cyanoacrylate monomer adhesive formulation which has improved thermal properties resulting from the inclusion in the formulation of an effective amount for enhancing the thermal resistance of the cured polymer of a mono, poly or hetero aromatic compound characterized by at least three substitutions on an aromatic ring thereof, two or more of said substitutions being electron withdrawing groups selected from the group consisting of NO.sub.2, CN, CF.sub.3, NR.sup.1.sub.3.sup.+, SR.sup.1.sub.2.sup.+, C(.dbd.O)R.sup.1, C(.dbd.O)OR.sup.1, NO, CCl.sub.3, SO.sub.2, S(.dbd.O), SO.sub.3, SO.sub.2 R.sup.1, SO.sub.2 OR.sup.1 and F, one or more of said substitutions being leaving groups selected from the group consisting of F, Br, Cl, I, NO.sub.2, CN, SOR.sup.1, SO.sub.2 R.sup.1 and SO.sub.2 OR.sup.1, and R.sup.1 is an optionally substituted hydrocarbon group. Example such compounds have the formula: ##STR1## where L is the leaving group and the W groups are the electron withdrawing groups.

Abstract: The invention relates to a method of preparing sintered shapes, comprising the steps of: (1) forming a green body from a mixture comprising (A) at least one inorganic powder with (B) at least one polymer derived from (a) at least two sulfo monomers or (b) a combination of (i) a sulfo monomer with (ii) at least one monomer selected from acrylic compounds, acrylonitriles, vinyl lactams and vinyl pyrrolidones and maleic acids, anhydrides or salts, provided the mixture is substantially free of polysaccharide; (2) sintering the body. Inorganic shapes made from the compositions of the present invention have relatively high fired densities; small uniform grain sizes; and relatively low porosity. The sulfo polymers of the present invention help disperse the inorganic powder. These polymers improve deagglomeration of the inorganic powder and also help prevent reagglomeration of the powder. The polymers provide divalent ion stability for systems using water containing divalent ions, such as hard water.

Abstract: A method of producing a polyether copolymer by reacting a dihalogenobenzonitrile, 1,4-bis(4'-halobenzoyl)benzene, with 4,4'-biphenol in an aprotic polar solvent in the presence of an alkali metal compound to produce a polyether copolymer having repeating units represented by the following general formula (I) ##STR1## and the repeating units represented by the following formula (II) ##STR2## The molar ratio of the repeating units represented by the formula (I) based on the total of the repeating units represented by the formula (I) and the repeating units represented by the formula (II) (the molar ratio of (I)/{(I)+(II)}) is from 0.1 to 0.8. The polyether copolymer has a melt viscosity (the viscosity under no shearing stress) of at least 500 poise as measured 400.degree. C.

Abstract: An antistatic aromatic polyimide article comprises an aromatic polyimide and a small amount of an antistatic agent. The antistatic agent is a sulfonate having the formula (I):R(SO.sub.3 M).sub.n (I)wherein R is a substituted or unsubstituted aryl group; M is an alkali metal; and n is 1 or 2; or a sulfinate having the formula (II):RSO.sub.2 M (II)wherein R and M have the same meanings as defined above.

Abstract: When a solution of liquid allylic-functional material and bromoxylenol blue is polymerized using a thermally decomposable polymerization initiator, the color imparted by the bromoxylenol blue is brilliant yellow.

Abstract: The present invention relates to a process for the preparation of beads of copolymers bearing reactive groups, by polymerization in suspension in a non-aqueous medium. According to the invention a free radical polymerization is effected of at least two unsaturated monomers, of which one is the carrier of a reactive group such as acid chloride, alkyl chloride, alkyl dithiobenzoate or carboxyalkyl, in a medium composed of two emulsified, immiscible organic liquids, to form beads of chemically reactive copolymers.

Abstract: A water soluble composition including an amine or ammonium salt of a polyimide precursor which is obtained by the reaction steps of: reacting a tetracarboxylic compound and a diamine in about equimolar amounts in a water miscible organic solvent to obtain the polyimide precursor; and reacting the polyimide precursor with ammonia, or an aqueous solution of ammonia, or a primary or secondary aliphatic amine in an amount sufficient to neutralize the free carboxyl groups of the polyimide precursor.A process of coating and a substrate are also disclosed.

Abstract: Polyisocyanurate polymers are prepared by the polymerization of organic polyisocyanates in organic solvents employing trimerization catalysts. After deactivation of the catalysts and removal of the solvents, these polymers may be dispersed in polyols which are employed for the preparation of cellular and non-cellular polyurethane products displaying improved load bearing properties.