Dmso With Additional Oxygen Or Halogen Compound Dnrm Patents (Class 524/744)
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Patent number: 7230044Abstract: The invention provides intimate physical mixtures of macrocyclic polyester oligomer (MPO) and filler, as well as methods for their preparation and use. Improved dispersion of filler in a polymer matrix is achieved upon polymerization, and larger amounts of filler with high aspect ratio can be used. In one aspect, the invention provides mixtures of MPO with magnesium silicate. In another aspect, the invention provides a mixture of MPO, filler, and polymerization catalyst as a one-part, ready-to-polymerize material with a long shelf life. The one-part material can be used, for example, in the manufacture of parts without modification of existing processing equipment.Type: GrantFiled: October 27, 2005Date of Patent: June 12, 2007Assignee: Cyclics CorporationInventors: Tohru Takekoshi, Steven R. Bahr, Steven J. Winckler
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Patent number: 6960626Abstract: The invention provides intimate physical mixtures of macrocyclic polyester oligomer (MPO) and filler, as well as methods for their preparation and use. Improved dispersion of filler in a polymer matrix is achieved upon polymerization, and larger amounts of filler with high aspect ratio can be used. In one aspect, the invention provides mixtures of MPO with magnesium silicate. In another aspect, the invention provides a mixture of MPO, filler, and polymerization catalyst as a one-part, ready-to-polymerize material with a long shelf life. The one-part material can be used, for example, in the manufacture of parts without modification of existing processing equipment.Type: GrantFiled: June 3, 2004Date of Patent: November 1, 2005Assignee: Cyclics CorporationInventors: Tohru Takekoshi, Steven R. Bahr, Steven J. Winckler
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Patent number: 6489013Abstract: A resin compound, which causes very little thermal stress even when a flip chip is mounted, has a low modulus of elasticity, and a heat resistance which is sufficiently high for solder floating at 300° C., and the resin compound also can be used in an adhesive film, a metal-clad adhesive film, a circuit board, and an assembly structure. The resin compound contains (A) a polyamide imide with siloxane bond, (B) a acrylic polymer with a weight-average molecular weight of 500,000 or more, (C) a thermoset resin, and (D) a solvent.Type: GrantFiled: February 21, 2001Date of Patent: December 3, 2002Assignees: Hitachi, Ltd., Shin-Kobe Electric MachineryInventors: Akira Nagai, Masayuki Noda
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Patent number: 6252010Abstract: Adhesive film useful for the production of semiconductor devices is produced from a siloxane-modified polyamideimide resin composition, comprising 100 parts by weight of a siloxane-modified polyamideimide resin and 1 to 200 parts by weight of a thermosetting resin ingredient.Type: GrantFiled: October 29, 1998Date of Patent: June 26, 2001Assignee: Hitachi Chemical Company, Ltd.Inventors: Kazumasa Takeuchi, Tetsuya Saito, Ken Nanaumi
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Patent number: 5977248Abstract: Gels, cast films, coatings, extruded rods, extruded fibers, compression molded discs, and machined compression molded discs, are made from organopolysiloxane sheet or tube polymers such as an apophyllite-derived 3-cyanopropyldimethyl siloxy sheet polymer of the formula [((NCC.sub.3 H.sub.6)(CH.sub.3).sub.2 SiO).sub.x (HO).sub.1-x SiO.sub.1.5 ].sub.n. Polymers are prepared by contacting sheet or tube silicates with an organohalosilane containing at least one polar group such as cyanoalkyl, acyloxy, or haloalkyl, in the presence of a polar solvent or a mixture of a polar solvent and a non-polar solvent; and heating the mixture until a polymer is formed.Type: GrantFiled: June 3, 1998Date of Patent: November 2, 1999Assignees: Dow Corning Corporation, Case Western Reserve UniversityInventors: Chenggang Chen, Dimitris Elias Katsoulis, Malcolm Edward Kenney
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Patent number: 5534563Abstract: The present invention relates to acetoxy, ketoximo, and alkoxy silicone sealants suitable for use in various sealant applications and additionally food contact applications comprising di-iodomethyl-para-tolylsulfone and having physical properties improved thereby.Type: GrantFiled: January 31, 1994Date of Patent: July 9, 1996Assignee: General Electric CompanyInventors: Chiu-Sing Lin, John J. Dziark
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Patent number: 5438094Abstract: An adhesive silicone composition comprising (A) an alkenyl group-containing organopolysiloxane, (B) an organohydrogen-polysiloxane having at least three hydrogen atoms each directly bonded to a silicon atom in a molecule, (C) a compound having at least one aliphatic unsaturated group and at least two phenyl skeletons in a molecule, and (D) a platinum catalyst is well adhesive to both metals and reins, and even to difficult-to-adhere resins such as nylon, polycarbonate and acryl resins.Type: GrantFiled: July 1, 1994Date of Patent: August 1, 1995Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Hironao Fujiki, Hiroyasu Hara, Mikio Shiono, Masayuki Ikeno
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Patent number: 5196477Abstract: Silicone compositions comprising an organopolysiloxane composition and an organic compound capable of coordination with metals are described. Since the organic compound is preferentially adsorbed on a metal surface, the composition is particularly suitable for use in electric or electronic parts to prevent contact failure. A more specific embodiment comprises a diorganopolysiloxane of the average unit formula, R.sub.a SiO.sub.(4-a)/2, wherein each R independently represents an unsubstituted or substituted monovalent hydrocarbon group, and a is a value of from 1.90 to 2.05, a filler, an alkoxysilane or its hydrolyzate, a silylation catalyst made of an organic silicon compound having at least one specific type of group, an organic tin compound, another organosilicon compound capable of reaction with an alcohol in order to stabilize the composition, and an organic compound capable of coordination with metals.Type: GrantFiled: July 24, 1990Date of Patent: March 23, 1993Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Masatoshi Arai, Yoshifumi Inoue, Kei Miyoshi
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Patent number: 5034428Abstract: A method of biomolecule immobilization is described in which the biomolecule itself or, alternatively, a monomer-conjugated biomolecule, is grafted with free monomer onto a hydrophilic, solid-phase, polymeric substrate which has been pre-irradiated with ionizing radiation. The pre-irradiation step is carried out, preferably at -78.degree. C. in air, while the grafting step is carried out at 0.degree. C. in a substantially oxygen-free atmosphere. The technique is applicable to immobilization of a wide variety of biomolecules, such as enzymes, catalysts, hormones, lectins, drugs, vitamins, antibodies, antigens, nucleic acids, DNA and RNA segments, pesticides, dyes and fertilizers. The products may be used for therapeutic or diagnostic applications or bioseparations.Type: GrantFiled: May 4, 1989Date of Patent: July 23, 1991Assignee: Board of Regents of the University of WashingtonInventors: Allan S. Hoffman, Liang C. Dong
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Patent number: 4921900Abstract: The acidic crumb of poly(paraphenylene terephthalamide) formed from the reaction of terephthaloyl chloride with para-phenylene diamine in an N-alkyl-pyrrolidone with an alkali or alkaline earth metal salt, is dissolved in a defined mixture of a base, a solvent and co-solvent for use in the direct preparation of fibrous products.Type: GrantFiled: December 14, 1988Date of Patent: May 1, 1990Assignee: E. I. Du Pont De Nemours and CompanyInventor: James E. Van Trump
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Patent number: 4732930Abstract: An ionic gel formed by polymerization of isopropylacrylamide in the presence of an ion-containing monomer, a crosslinking agent and a suitable liquid medium is provided. The gel is capable of drastic volume change in response to solvent composition, temperature, pH, or ion composition.Type: GrantFiled: May 20, 1985Date of Patent: March 22, 1988Assignee: Massachusetts Institute of TechnologyInventors: Toyoichi Tanaka, Yoshitsugu Hirokawa
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Patent number: 4459384Abstract: Described herein is a process for preparing a polyester or a poly(ester carbonate) which comprises reacting a dihydric phenol with an aromatic diacid and a diaryl carbonate in the presence of from about 10 to about 60 weight percent of a processing aid under polyester or poly(ester carbonate) forming conditions.Type: GrantFiled: April 18, 1983Date of Patent: July 10, 1984Assignee: Union Carbide CorporationInventors: Markus Matzner, Louis M. Maresca
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Patent number: 4428977Abstract: A water soluble composition including an amine or ammonium salt of a polyimide precursor which is obtained by the reaction steps of: reacting a tetracarboxylic compound and a diamine in about equimolar amounts in a water miscible organic solvent to obtain the polyimide precursor; and reacting the polyimide precursor with ammonia, or an aqueous solution of ammonia, or a primary or secondary aliphatic amine in an amount sufficient to neutralize the free carboxyl groups of the polyimide precursor.A process of coating and a substrate are also disclosed.Type: GrantFiled: September 24, 1976Date of Patent: January 31, 1984Assignee: General Electric CompanyInventor: Marvin A. Peterson
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Patent number: 4412022Abstract: Polyurethane compositions comprising a polyurethane synthesized by reacting a diol, a specific alicyclic diisocyanate, a specific alicyclic diamine and hydrazine or isophthalic acid dihydrazide in specific proportions and a solvent therefor have good solution stability and, when applied as coating compositions, give coats with good light stability, good surface properties, high softening points and sufficient flexibility at low temperatures.Type: GrantFiled: May 5, 1982Date of Patent: October 25, 1983Assignee: Kuraray Co., Ltd.Inventors: Koji Hirai, Kenji Shirano, Takayuki Okamura