Abstract: Disclosed is an organic antireflective film composition which includes a monomer containing two or more thiol groups and a monomer containing two or more vinyl groups, as crosslinking agents. When the organic antireflective film composition is used, an antireflective film formed from the composition can be rapidly etched in an ultrafine pattern forming process, and the curing rate can be increased, while the etching rate is increased, without using an acid generator and a curing agent or by using the agents only in small amounts.
Type:
Grant
Filed:
October 15, 2012
Date of Patent:
June 10, 2014
Assignee:
Korea Kumho Petrochemical Co., Ltd.
Inventors:
Jin Han Lee, Shin Hyo Bae, Seung Hee Hong, Eun Hee Han
Abstract: A resist material having a resist and particles mixed into the resist, a major component of the particles being a cluster of carbon atoms, is provided. A method for fabricating a resist material is also provided, the method repeatedly performing: a first step of coating a substrate with a resist film; and a second step of depositing particles whose major component is a cluster of carbon atoms on the resist film. Accordingly, a resist film with high etching resistance can be obtained, and it is possible to realize a reduction in the thickness of the resist film, improvements of contrast of resist patterns; resist sensitivity; heat resistance of resist films; mechanical strength of resist patterns; and further, stabilization of resist sensitivity. Therefore, highly precise fine pattern fabrication can be realized.
Type:
Grant
Filed:
June 6, 1997
Date of Patent:
January 23, 2001
Assignee:
Nippon Telegraph and Telephone Corporation
Abstract: The invention concerns thermoplastic molding materials comprising a polyphenylene ether, a graft polymer with a hydrocarbon resin as the principal chain and polyphenylene ether side chains, a functionalized polyethylene, a polyamide and optionally other polymers. Molded parts made from these polymer mixtures have improved impact strengths and dimensional stabilities at elevated temperatures.
Abstract: A composition and method of application of the composition to produce masks of the type particularly useful in the manufacture of varnished electronic terminals and components is specified. The composition consists of mixing acetone, nitrocellulose, methyl isobutyl ketone (MIBK), arylsulfonamide formaldehyde resin, and tri (b-chloroethyl) phosphate, a fire retardant, under carefully controlled conditions. This masking product is applied, prior to the varnish, on an electronic part and is subjected to heating in the varnish curing oven to about 200.degree. F. whereupon the masking product will carbonize. The resulting carbonized coating is easily removed by brushing to produce a varnish mask where the masking product was applied.