Abstract: An underfill formulation includes a solvent (110), a plurality of amphiphilic block copolymers (120) in the solvent, and an adhesion promoter (130) in the solvent. Groups of the plurality of amphiphilic block copolymers form a plurality of micelles (140) in the solvent, with the micelles including a core (141) and a shell (142) surrounding the core, and the adhesion promoter is in the core of at least some of the plurality of micelles.

Abstract: Disclosed herein is an epoxy resin compound including an epoxy resin (A), a hardener (B), and an inorganic filler, characterized in that said inorganic filler contains silica (C) as an essential component, said hardener (B) is one which contains at least two phenolic hydroxyl groups and/or naphtholic hydroxyl groups in the molecule, and said silica (C) contains 1-99 wt % of synthetic silica and 99-1 wt % of natural fused silica. Disclosed also herein is a semiconductor device having a semiconductor element sealed therein with said epoxy resin compound. The epoxy resin compound does not cause such troubles as short shot, resin peeling, wire breakage, stage shift, and vent clogging at the time of molding. In addition, when used as a sealing material, it yields semiconductor devices which have good reliability at high temperature and high humidity and good resistance to soldering heat.

Abstract: Disclosed herein is an epoxy resin compound including an epoxy resin (A), a hardener (B), and an inorganic filler, characterized in that said inorganic filler contains silica (C) as an essential component, said hardener (B) is one which contains at least two phenolic hydroxyl groups and/or naphtholic hydroxyl groups in the molecule, and said silica (C) contains 1-99 wt % of synthetic silica and 99-1 wt % of natural fused silica. Disclosed also herein is a semiconductor device having a semiconductor element sealed therein with said epoxy resin compound. The epoxy resin compound does not cause such troubles as short shot, resin peeling, wire breakage, stage shift, and vent clogging at the time of molding. In addition, when used as a sealing material, it yields semiconductor devices which have good reliability at high temperature and high humidity and good resistance to soldering heat.

Abstract: A composition for simulated lead strips for leaded windows, which composition consists of 50-75 weight % binder, 5-15 weight % pigment, 5-20 weight % oil and 10-30 weight % filling, the binder being a polymer binder, chosen among polyvinyl alcohol based adhesives, polyurethan based adhesives and synthetic rubber based adhesives. The pigment is suitably chosen among metal pigments, bronze powder, iron oxide and graphite, or mixtures thereof. The oil consists preferably of a vegetable, drying oil, like linseed oil. The filling is suitably chosen among wood-flour, saw-dust or sand. A preferred composition consists of 65 weight % polyvinyl alcohol based adhesive, 3 weight % iron oxide, 5 weight % aluminium bronze powder, 11 weight % linseed oil and 16 weight % saw-dust.

Abstract: A method for repairing plastics, metal and the like. The method uses a compound comprising a thermosetting unsaturated polyester resin, a thermoplastic resin mixed with said polyester, particulate inorganic filler, as well as additional metallic particulate material, fibrous materials and a catalyst. The compound when cured at a relatively elevated temperature of about 325.degree.-350.degree. F. provides a low shrink material which can be painted and baked on normal processing lines up to 350.degree. F. without separating from the underlying substrate.

Abstract: An ABS resin composition comprises 100 parts by weight of an ABS resin having a melt index of at least 4.0 g/10 min. and a rubber content of from 10 to 28% by weight and from 0.5 to 30 parts by weight of powder of at least one metal selected from aluminum, copper and an copper alloy.

Abstract: A one part composition useful as a putty for filling recessed areas in flexible parts of damaged auto bodies and the like is provided. The curable composition has a viscosity in the range of 50,000 to 450,000 cps and comprises by volume 6 to 25 parts binder comprising substantially non-reactive solvent-soluble polyurethane, 43 to 68 parts solvent for the binder and 20 to 42 parts talc filler. Other fillers may also be included. The preferred polyurethane binder is a linear polyurethane elastomer which is substantially free of cross-links and has an elongation at break value in the range of 300-850% and a tensile strength in the range of 1,500 to 7,000 psi.

Abstract: A novel adhesive has been developed that is particularly adapted for use in bonding automotive components made of sheet molding compound. It is comprised of suitable amounts of cross-linkable epoxy novolac resin; an epoxy flexibilizer; natural and colloidal silica; and an imidazole curing agent substituted in the one position with a short chain hydroxyalkyl group. The adhesive cures to a high bond strength in three minutes at 150.degree. C. It is resistant to degradation due to temperatures up to 200.degree. C., salt spray, humidity and water soak.

Abstract: An extrudable thermoplastic body solder which has the necessary physical properties for automotive applications is formed from a mixture of high and low viscosity nylons based on dicarboxylic acids and hexamethylene diamine filled with suitable particulate and fibrous fillers.