Abstract: Use of a ?-phosphorylated nitroxide radical as an inhibitor for resin mixtures and reactive resin mortars, each based on radically curable compounds. The pot life of mortar compounds can be adjusted in a targeted manner with the ?-phosphorylated nitroxide radical for resin mixtures and reactive resin mortars.

Abstract: The present invention provides a resin composition useful for a copper-clad laminate and a printed circuit board, wherein the resin composition comprises the following components: (A) 100 parts by weight of vinyl-containing polyphenylene ether resin; (B) 5 to 50 parts by weight of maleimide; (C) 10 to 100 parts by weight of styrene-butadiene copolymer; and (D) 5 to 30 parts by weight of cyanate ester resin. The present invention also provides a resin composition and an article made therefrom having low dissipation factor at high frequency and excellent thermal resistance and peeling strength and being useful for a copper-clad laminate and a printed circuit board.

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract: There is provided a thermosetting resin composition having excellent flowability, low temperature moldability, curability, and heat resistance after curing or the like in the absence of a solvent. The thermosetting resin composition of the present invention contains, as essential components, a maleimide compound (A), a compound (B) having two or more polymerizable unsaturated hydrocarbon groups in its molecule, and a cyanate ester compound (C).

Abstract: A water-soluble photo-activatable polymer including: a photo-activatable group adapted to be activated by an irradiation source and to form a covalent bond between the water-soluble photo-activatable polymer and a matrix having at least one carbon; a reactive group adapted to covalently react with a biomaterial for subsequent delivery of the biomaterial to a cell; a hydrophilic group; and a polymer precursor. A composition including a monomolecular layer of the water-soluble photo-activatable polymer and a matrix having at least one carbon, wherein the monomolecular layer is covalently attached to the matrix by a covalent bond between the photo-activatable group and the at least one carbon. The composition further includes a biomaterial having a plurality of active groups, wherein the biomaterial is covalently attached to the monomolecular layer by covalent bonding between the active groups and reactive groups. Also provided is a method for delivery of a biomaterial to a cell.

Abstract: The present invention provides a flame-retardant and scratch-resistant polycarbonate resin composition including a (meth)acrylic flame-retardant copolymer.

Abstract: Disclosed herein is a curable composition comprising a polyhydroxy curable fluoroelastomer, a polyhydroxy curative, a cure accelerator and an unsaturated metal compound process aid comprising a siloxane having at least one vinyl or allyl group bonded to a silicon atom. Such curable compositions have a lower Mooney viscosity than do similar compositions absent the process aid.

Abstract: Disclosed herein is a curable composition comprising a polyhydroxy curable fluoroelastomer, a polyhydroxy curative, a cure accelerator and an unsaturated metal compound process aid. Such curable compositions have a lower Mooney viscosity than do similar compositions absent the process aid.

Abstract: Disclosed are star polymers comprising a polymeric body having a core with a site-isolated chromophore and a plurality of polymer chains emanating from the core; and at least one chelating moiety bonded to at least one polymer chain. Also disclosed are bimodal contrast agents derived from star polymers and further comprising at least one metal chelated by the at least one chelating moiety. Also disclosed are methods of making and using same. Also disclosed are imaging methods employing the disclosed star polymers and/or bimodal contrast agents. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

Abstract: A fluororubber composition according to the present invention contains 0.1 to 3 parts by weight of a polyol compound, 0.1 to 4 parts by weight of a peroxide crosslinking agent, and 1 to 9 parts by weight of a co-crosslinking agent per 100 parts by weight of a peroxide-crosslinkable fluoropolymer. A crack-resistant seal according to the present invention contains a crosslinked fluoropolymer and a polyol compound. The crack-resistant seal according to the present invention can be formed by crosslinking the fluororubber composition, and the resultant crack-resistant seal has particularly high crack resistance. With the fluororubber composition according to the present invention, a durable crack-resistant seal having high plasma resistance, crack resistance, and compression set and that produces few particles can be formed at low cost.

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract: Disclosed is a rubber composition for a conveyor belt, which is characterized by containing 0.5-3 parts by weight of zinc dimethacrylate and 1.1-4.5 parts by weight of neodecanoic acid cobalt boride per 100 parts by weight of the rubber component. Also disclosed is a conveyor belt in which a galvanized steel cord that is covered with an adhesive rubber layer formed from the rubber composition is used as the core body. The rubber composition has excellent adhesion to a galvanized steel cord and good vulcanization rate. The conveyor belt using the rubber composition has excellent durability and productivity.

Abstract: Nano-sized particles for use in making emulsion aggregation toner particles have a core portion and a shell portion, wherein the core portion of the nano-sized particles includes crystalline resin and the shell portion includes amorphous resin and is substantially to completely free of the crystalline resin.

Abstract: Compositions comprise phase separated polyetherimide/polyphenylene ether sulfone blends. The dispersed phase has an average cross sectional size of 0.1 to 10 micrometers. The composition retains has good hydrolytic stability and is capable of withstanding steam autoclaving at temperatures of 130 to 138° C.

Abstract: Polycarbonate compositions are disclosed. The compositions comprise a polycarbonate polymer (A) having repeating units derived from at least three different monomers, one monomer being 2-phenyl-3,3-bis(4-hydroxyphenyl)phthalimidine (PPPBP); and the other two monomers having the formula: wherein each Rk is independently a halogen atom, a C1-10 hydrocarbon group, or a C1-10 halogen substituted hydrocarbon group, and n is 0 to 4; and an impact modifier (B). The resulting composition has improved heat resistance and chemical resistance, particularly to Fuel C.

Abstract: An arylalkenyl ether oligomer is produced by the reaction of a polyhaloalkene with a polyhydroxyaryl compound. Halogenation of the resultant oligomer produces a flame retardant having both aromatic and aliphatic bromine groups.

Abstract: Tires and tread are made from resin formed from the polymerization of phenol, aromatic, and terpene and/or mono- and bi-cyclic mono- and bi-unsaturated hydrocarbons.

Abstract: Disclosed herein are nano-sized particles having a core portion comprising a crystalline polymer and a shell portion comprising a polymer derived from at least one monomer not miscible with the crystalline polymer of the shell portion.

Abstract: The present invention is directed to low dielectric polymers and to methods of producing these low dielectric constant polymers, dielectric materials and layers, and electronic components. In one aspect of the present invention, an isomeric mixture of thermosetting monomers, wherein the monomers have a core structure and a plurality of arms, is provided, and the isomeric mixture of thermosetting monomers is polymerized, wherein polymerization comprises a reaction of an ethynyl group that is located in at least one arm of a monomer.

Abstract: The object of the present invention is to provide a masking member(11) which has good heat resistance and can be used repeatedly. To attain this object, the present invention provides a masking member made of a polymer alloy having a sea-island structure containing polyolefin in a continuous phase and one or more kind(s) of engineering plastic selected from among a group consisting of methyl pentene copolymer, polysulphone, polyethersulphone, polyphenylenesulphide, polyphenyleneether, polyamideimide, polyetherimide, and polyether-etherketone in a dispersed phase.

Abstract: A reaction product comprising an adduct of a mid-range vinylidene content PIB polymer composition and maleic anhydride, a phenolic compound or a compound having a reactive site for subsequent amination. The PIB composition comprises a relatively low molecular weight, mid-range vinylidene content PIB polymer product wherein at least about 90% of the PIB molecules present in the product comprise alpha or beta position isomers. The vinylidene (alpha) isomer content of the product may range from 20% to 70% thereof and the content of tetra-substituted internal double bonds is very low, preferably less than about 5% and ideally less than about 1–2%. The mid-range vinylidene content PIB polymer products may be prepared employing a liquid phase polymerization process conducted in a loop reactor at a temperature of at least 60° F. using a BF3/methanol catalyst complex and a contact time of no more than 4 minutes.

Abstract: In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arlyene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.

Abstract: A polymeric network comprises a plurality of monomers that include a cage compound with at least three arms, wherein at least one of the arms has two or more branches, and wherein each of the branches further comprises a reactive group. Monomers in contemplated polymeric networks are covalently coupled to each other via the reactive groups. Particularly contemplated cage compounds include adamantane and diamantane, and especially contemplated branched arms comprise ortho-bis(phenylethynyl)phenyl. Especially contemplated polymeric networks have a dielectric constant of no more than 3.0, and are formed on the surface of a substrate.

Abstract: Thermoplastic molding materials containing the following ingredients with regard to components A-F: A) 5-70 wt. % of at least one graft copolymer A) consisting of a rubber elastic base with a glass transition temperature below 0° and a grafted overlay made of a styrene compound and acrylonitrile or methacrylonitrile or mixture thereof in addition to, optionally, other monoethylenically unsaturated monomers, B) 29-90 wt. % of a hard copolymer made of at least one styrene compound, acrylonitrile or methacrylonitrile or mixtures thereof and, optionally, other monoethylenically unsaturated monomers, C) 0-5 wt. % of at least one three-block copolymer X-Y-X with a middle block Y propylenoxide units and terminal block X made of ethyleneoxide units, D) 0.01-5 wt. % of at least one butylated reaction product of cresol with dicyclopentadiene, E) 0.01-5 wt. % of at least one thiocarboxylic acid ester, F) 0.01-5 wt.

Abstract: In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.

Abstract: A low dielectric constant material has a first backbone with an aromatic moiety and a first reactive group, and a second backbone with an aromatic moiety and a second reactive group, wherein the first and second backbones are crosslinked via the first and second reactive groups in a crosslinking reaction without an additional crosslinker, and wherein a cage structure having at least 10 atoms is covalently bound to at least one of the first and second backbone.

Abstract: An offset printing ink is provided which comprises a colophony-modified phenolic resin and at least one component selected from the group consisting of (A) a maleic resin, (B) a modified hydrocarbon resin, (C) a colophony resin ester and mixtures thereof. The ink further comprises a water-insoluble fatty acid ester of a multivalent alcohol which has a high steric spatial requirement, and/or ethinol.

Abstract: A golf ball exhibits a high spin and easily comes to a halt even when shot from the rough or when shot in a raining condition. The cover material of the golf ball is based on ionomer resin. The cover material has 5-50 parts by weight of a tackifier such as terpene resins, rosin ester resins or the like blended with respect to 100 parts by weight of the base material.

Abstract: Methods of making low molecular weight methylene acceptors are provided. The methylene acceptors are prepared by reacting a polyhydric phenol with an aromatic olefinic compound in the presence of an acid catalyst, and then further reacting the products of the first reaction with an N-methylol lactam derivative. Derivatives made by the above method, as well as rubber compositions using these derivatives are also provided.

Abstract: In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.

Abstract: A low dielectric constant material has a first backbone with an aromatic moiety and a first reactive group, and a second backbone with an aromatic moiety and a second reactive group, wherein the first and second backbones are crosslinked via the first and second reactive groups in a crosslinking reaction without an additional crosslinker, and wherein a cage structure having at least 10 atoms is covalently bound to at least one of the first and second backbone.

Abstract: The rheological properties of a crosslinkable resin system are modified by the presence of a side chain crystalline (SCC) polymer (or a similar crystalline polymer which melts over a narrow temperature range). The polymer dissolves in the curable system at temperatures above the melting point of the crystalline polymer (Tp), but when the system is then cooled to a temperature below Tp, at least partially forms a separate phase in the curable system. Below Tp, this separate phase substantially increases the viscosity of the curable system (i.e. makes it thicker than the same system without the crystalline polymer). This is particularly valuable for sheet molding composites (SMCs) in which the increase in viscosity makes the composites less tacky, and for dry film resists (DFRs). Above Tp, the curable system containing the dissolved crystalline polymer has a viscosity which is substantially less than its viscosity below Tp.

Abstract: In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.

Abstract: A low dielectric constant material has a first backbone with an aromatic moiety and a first reactive group, and a second backbone with an aromatic moiety and a second reactive group, wherein the first and second backbones are crosslinked via the first and second reactive groups in a crosslinking reaction without an additional crosslinker, and wherein a cage structure having at least 10 atoms is covalently bound to at least one of the first and second backbone.

Abstract: The invention relates to novolac resins obtained by condensation (A) of an aromatic compound containing at least two hydroxyl groups and (B) of an unconjugated diene in an (A)/(B) molar ratio of between 0.7 and 1.75 in the presence of an acidic catalyst, which are characterized in that the content of free aromatic compound is lower than 5% by weight. Also disclosed are a process for the preparation of the resins, and rubber-based compositions including from 0.5 to 20 parts by weight of the above mentioned novolac resins per 100 parts by weight of rubber. The invention also relates to the use of the resins or rubber-based compositions in the field of vulcanization, especially of tires and of conveyor belts.

Abstract: In the present invention, a process is provided for producing high impact polystyrene of improved heat resistance. According to the invention, after phase inversion of the rubber-polystyrene system, a slurry of PPE in styrene is added in situ to the process. The PPE slurry in styrene contains greater than 15 wt. % of PPE and is introduced to the process at point past rubber phase inversion, preferably at point where total polymer solids is greater than 40 wt. % of the total weight of the polymerization mixture. Preferably, four continuous stirred tank reactors in series are used in the process and preferably the slurry of PPE in styrene monomer is introduced to the third CSTR.

Abstract: Redispersible tackifier powder compositions which are redispersible in water are provided and which are comprised of one or more tackifying substances and from 2 to 50% by weight of one or more water-soluble low molecular weight homo or copolymers of olefinically unsaturated mono or dicarboxylic acids or their anhydrides. The copolymers also contain other free-radically polymerizable monomers. Antiblocking agents can also be present. Adhesives containing the compositions are also provided.

Abstract: A thermoplastic synthetic resin, especially high-density polyethylene, has its diffusion coefficient especially for hydrocarbons, reduced by the addition of 2 to 8% by weight of an additive consisting essentially of at least one phenoxy and/or epoxy resin, and at least one further component selected from the group which consists of at least one radical forming agent and at least one graft coploymerization catalyst, and optional quantities of an antioxidant selected from the group which consists of at least one phenolic antioxidant, at least one phosphitic antioxidant and mixtures thereof, at least one organosilane ester, at least one UV stabilizer, at least one antistatic composition, and polypropylene.

Abstract: The invention provides a water-based adhesive composition comprising a blend of adhesive polymers in an aqueous system, characterized in that the blend of adhesive polymers is: 20-60% by weight of an acrylic polymer having a polarity balance expressed as water absorption according to DIN 53495 of 3 to 20%; and correspondingly 40-80% by weight of a compatible tackifying resin having a degree of hydrophobicity measured as the contact angle between a dried film of the resin and a drop of distilled water of not less than 60.degree.; the percentages being based on the total of acrylic polymer plus tackifying resin expressed as dry solids. The composition shows good bond retention when wet and can be used for bonding polar substrates such as cellulose and non-polar substrates such as polyolefin. When used to bond a water absorbing substrate such as cellulose, the adhesive should have a viscosity of 200 mPas or less.

Abstract: The present invention provides an improved process for producing blends of tackifying resins and low molecular weight polyphenylene ether resins. This invention involves combining the resin solutions or redissolving one of the resins once isolated, in the other resin solution and isolation of the resin blend by devolatilization, precipitation, evaporation, spray drying, and/or stripping of the organic solvent.

Abstract: A thermoplastic synthetic resin, especially high-density polyethylene, has its diffusion coefficient especially for hydrocarbons, reduced by the addition of 2 to 8% by weight of an additive consisting essentially of at least one phenoxy resin, and at least one further component selected from the group which consists of at least one radical forming agent and at least one graft coploymerization catalyst, and optional quantities of an antioxidant selected from the group which consists of at least one phenolic antioxidant, at least one phosphitic antioxidant and mixtures thereof, at least one organosilane ester, at least one UV stabilizer, at least one antistatic composition, and polypropylene.

Abstract: Polyamide resin compositions which are useful for molding parts with excellent malleability, thoughness, rigidity, and high heat deformation temperatures are prepared from 10 to 89% by weight of a polyamide resin, 1 to 30% by weight of at least one type of elastomer selected from among elastomers composed of ethylene/propylene/dienes, elastomers composed of ethylene/unsaturated carboxylic acid unsaturated carboxylic acid esters, and elastomers obtained by graft-modifying these elastomers, and from 10 to 60% by weight of a copolymer of ethylene and cyclic olefin that is noncrystalline and has a glass transition temperature of from 100.degree. to 190.degree. C.

Abstract: A method of enhancing the drainage of residual aqueous rinse from the external surfaces of plastic parts is disclosed. The method employs an aqueous solution of a tannin compound, which when applied to the surface of plastic parts will not rinse off during subsequent rinse stages and will remain on the plastic parts.

Abstract: This invention is the polycapped oligomer adduct of a long chain fatty acid with a multi hydroxy functional or multi epoxy functional compound. This polycapped oligomer is useful in resin compositions to enhance the performance of thermoplastic low profile additives which improve the surface quality of molded composites such as automotive body panels.

Abstract: A resin composition comprising (A) a polyphenylene ether resin, (B) a polyolefin resin, and optionally (C) an elastomer, and (D) an aliphatic polycarboxylic acid derivative represented by the following general formula:(R.sub.1 O).sub.m R(COOR.sub.2).sub.n (CORN.sub.3 R.sub.4).sub.swherein R represents a saturated hydrocarbon group having 2 to 20 carbon atoms with a linear or branched chain; R.sub.1 represents a hydrogen atom or an alkyl, aryl, acyl or carbonyldioxy group having 1 to 10 carbon atoms; each R.sub.2 represents a hydrogen atom or an alkyl or aryl group having 1 to 20 carbon atoms; R.sub.3 and R.sub.4 each represents a hydrogen atom or an alkyl or aryl group having 1 to 10 carbon atoms; m represents a number equal to 1 or 2; (n+s) is larger than or equal to 2 and, n and s are each larger than or equal to 0; (OR.sub.1) is in an alpha or beta position with respect to a carbonyl group, and in which at least two carbonyl groups are separated by 2 to 6 carbon atoms.

Abstract: The invention describes a thermoplastic composition made of a continuous phase made of crystalline thermoplastic resin A, a dispersed phase made of polyphenylene ether resin B, and an amide compound C represented by formula 1,R.sub.4 --CONH--R.sub.2 --HNOC--R.sub.1 --CONH--R.sub.3 --HNOC--R.sub.5( 1)wherein R.sub.1, R.sub.2, and R.sub.3 represent divalent hydrocarbon groups, which may be identical or different, and R.sub.4 and R.sub.5 represent monovalent hydrocarbon groups, which may be identical or different. The amide compound is present in an amount between about 0.1 and about 30 parts by weight per 100 parts by weight of the resins A and B mixed together.

Abstract: Disclosed is a thermoplastic resin composition which comprises:(A) 10-90 parts by weight of a polyphenylene ether resin,(B) 90-10 parts by weight of a polyamide resin,(C) 1-100 parts by weight of a fluorocarbon resin,(D) 0-30 parts by weight of a compatibilizing agent, and(E) 0-100 parts by weight of a rubber-like material, amounts of (C), (D) and (E) being based on 100 parts by weight in total of (A) and (B).The invention provides a thermoplastic resin composition comprising a polyphenylene ether resin and a polyamide resin improved in heat resistance, impact resistance, and flowability, lowered in frictional coefficient and markedly improved in critical PV value by adding a fluorocarbon resin to a PPE/nylon alloy. Further provided is a method for producing a thermoplastic resin composition comprising a polyphenylene ether resin and a polyamide resin which is much improved in slidability.

Abstract: Preparation of vulcanizable rubber mixtures and vulcanized compounds thereof having improved adhesion to reinforcing supports based on steel cord and textile fibers, in which effective amounts of modified novolaks are added to the rubber mixtures as adhesion promotors, which are prepared by simultaneous reaction of polyhydric phenols with aldehydes and unsaturated hydrocarbons with acid catalysis at elevated temperature and do not contain any troublesome proportions of free starting phenols. Rubber mixtures according to the invention can be processed in an easy advantageous manner without liberating toxic substances which might be detrimental to persons working in processing and/or to the environment.

Abstract: A novel thermoplastic resin composition excellent in heat resistance, mechanical properties and processability is provided which comprises a composition containing (A) a dispersing phase of polyphenylene ether obtained by oxidation polymerization of at least one phenol compound represented by the formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 each represents a hydrogen atom, a halogen atom or a substituted or unsubstituted hydrocarbon residue and at least one of them is a hydrogen atom and (B) a crystalline thermoplastic resin matrix phase and (C) a mutual compatibilizer compatible with (A) and/or (B), an average particle diameter in said dispersing phase having of 0.01-10.mu..