Abstract: A polyphenylene ether resin composition includes (A) a modified polyphenylene ether that is end-modified with a substituent having a carbon-carbon unsaturated double bond, and (B) a crosslinking agent having a carbon-carbon unsaturated double bond. The crosslinking agent serving as component (B) includes from 50 to 100 mass % of (B-1) divinylbenzene and (B-2) polybutadiene. Components (A) and (B) are included in a ratio therebetween, expressed as the mass ratio (A):(B), of from 65:35 to 95:5. Components (B-1) and (B-2) are included in a ratio therebetween, expressed as the mass ratio (B-1):(B-2), of from 1:100 to 1.5:1.

Abstract: A polyphenylene ether resin composition includes (A) a modified polyphenylene ether that is end-modified with a substituent having a carbon-carbon unsaturated double bond, and (B) a crosslinking agent having a carbon-carbon unsaturated double bond. The crosslinking agent serving as component (B) includes from 50 to 100 mass % of (B-1) divinylbenzene and (B-2) polybutadiene. Components (A) and (B) are included in a ratio therebetween, expressed as the mass ratio (A):(B), of from 65:35 to 95:5. Components (B-1) and (B-2) are included in a ratio therebetween, expressed as the mass ratio (B-1):(B-2), of from 1:100 to 1.5:1.

Abstract: The present invention belongs to the technical field of a resin having low dielectric properties, and presents a vinylbenzyl-etherified-DOPO compound resin composition and a preparation method and application thereof. The composition includes a vinylbenzyl-etherified-DOPO compound resin and a vinyl-terminated polyphenylene ether resin. The DOPO resin is vinylbenzyl etherified in the present invention, thus obtaining a vinylbenzyl-etherified-DOPO compound resin having low dielectric properties, and there are no hydroxyl group on itself, no hydroxyl function group will be generated during the cross-linking reaction; and the vinylbenzyl-etherified-DOPO compound resin contains phosphorus atoms, and has flame retardancy.

Abstract: Coalesced rubber particles having an average particle size of 5-50 microns are produced by: (1) adding simultaneously to a latex of pre-crosslinked rubber particles a solvent and an electrolyte solution to form swollen rubber aggregation particles, wherein the solvent has a lower boiling point than water and a capacity of swelling the rubber by at least 10 wt %, and the electrolyte is a solution of at least one metal salt; (2) removing the solvent under atmospheric pressure or low vacuum and at temperature greater than 80° C. to coalesce the rubber into particles having an average particle size of 5-50 50 microns; (3) filtering and washing with methanol; and (4) filtering the washed particles to remove methanol. An epoxy resin is blended with the particles and residual methanol removed, to obtain a blend containing coalesced rubber particles having an average particle size of 5-50 microns in the blended state.

Abstract: The invention provides an adhesive composition for conduction between electrical elements, comprising 25 to 46 parts by weight of nitrile-butadiene rubber with Mooney viscosity ranged from 50 to 75 (ML 1+4@100)° C., 25 to 45 parts by weight of acrylic oligomer, 16 to 32 parts by weight of thermoplastic resin, two organic peroxides having different one-minute half-life temperatures from each other, and a coupling agent. The thermoplastic resin is selected from the group consisting of phenoxy resin, poly(methyl)methacrylate copolymer, polystyrene copolymer and Novolak resin.

Abstract: A thermoplastic composition comprises a polymer blend. The polymer blend comprises a first polyimide and a second polyimide. The first polyimide has repeating units derived from a first dianhydride and a first diamine. The second polyimide has repeating units derived from a second dianhydride and a second diamine. Either the first dianhydride and the second dianhydride are the same or the first diamine and the second diamine are the same.

Abstract: Fiber for reinforcing rubber products, which comprises fiber coated with a coating film formed by a treating agent, wherein the treating agent comprises a rubber latex containing at least a vinylpyridine/styrene/butadiene terpolymer, a latex of an acrylonitrile/butadiene/styrene terpolymer, and a water-soluble condensate of resorcinol and formaldehyde.

Abstract: The invention provides an adhesive composition for conduction between electrical elements, comprising 25 to 46 parts by weight of nitrile-butadiene rubber with Mooney viscosity ranged from 50 to 75 (ML 1+4@100)° C., 25 to 45 parts by weight of acrylic oligomer, 16 to 32 parts by weight of thermoplastic resin, two organic peroxides having different one-minute half-life temperatures from each other, and a coupling agent. The thermoplastic resin is selected from the group consisting of phenoxy resin, poly(methyl)methacrylate copolymer, polystyrene copolymer and Novolak resin.

Abstract: The invention provides a circuit board comprising a substrate and a dielectric material provided on the substrate. The dielectric material comprises (i) 40˜80 parts by weight of polyphenylene ether resin having a Mw of 1000˜7000, a Mn of 1000˜4000 and Mw/Mn=1.0˜1.8; (ii) 5˜30 parts by weight of bismaleimide resins; and (iii) 5˜30 parts by weight of polymer additives, wherein the dielectric material has Dk of 3.75˜4.0 and Df of 0.0025˜0.0045. The dielectric material is suitably used in prepregs and insulation layers of a circuit board, because it has high Tg, low thermal expansion coefficient, low moisture absorption and excellent dielectric properties such as Dk and Df.

Abstract: The present invention relates to a crosslinked lignin comprising a lignin structure having methylene or ethylene linking groups therein crosslinking between phenyl ring carbon atoms, wherein said crosslinked lignin is crosslinked to an extent that it has a number-average molecular weight of at least 10,000 g/mol, is melt-processible, and has either a glass transition temperature of at least 100° C., or is substantially soluble in a polar organic solvent or aqueous alkaline solution. Thermoplastic copolymers containing the crosslinked lignin are also described. Methods for producing the crosslinked lignin and thermoplastic copolymers are also described.

Abstract: A thermoplastic elastomer composition is free from halogens such as bromine, and is comparable or superior in tensile characteristic to a conventional thermoplastic elastomer composition containing a brominated alkylphenol formaldehyde resin as a crosslinking agent. The composition contains an EPDM containing 5-ethylidene-2-norbornene as a diene component, 75 to 300 mass % of an alkylphenol formaldehyde resin having methylol groups at opposite molecular terminals thereof as a crosslinking agent based on the diene amount of the EPDM, 0.7 to 3 mass % of a strong Bronsted acid as a catalyst based on the amount of the alkylphenol formaldehyde resin, and a thermoplastic resin.

Abstract: The invention relates to a cured rubber composition, its preparation and a tire with a component of such rubber composition. A reinforcing resin is used to promote stiffness for the cured rubber composition. The elastomer for the rubber composition is primarily comprised of at least one isoprene-containing elastomer.

Abstract: The present disclosure provides a thermosetting resin composition including a polymaleimide prepolymer and a poly(arylene ether) prepolymer characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards, semiconductor devices and radome composites for aerospace applications.

Abstract: The present invention relates to a crosslinked lignin comprising a lignin structure having methylene or ethylene linking groups therein crosslinking between phenyl ring carbon atoms, wherein said crosslinked lignin is crosslinked to an extent that it has a number-average molecular weight of at least 10,000 g/mol, is melt-processible, and has either a glass transition temperature of at least 100° C., or is substantially soluble in a polar organic solvent or aqueous alkaline solution. Thermoplastic copolymers containing the crosslinked lignin are also described. Methods for producing the crosslinked lignin and thermoplastic copolymers are also described.

Abstract: The present invention relates to a polyphenylene ether resin composition, and a prepreg and a copper dad laminate made therefrom. The polyphenylene ether resin composition comprises: (A) functionalized polyphenylene ether resin, (B) crosslinking agent, and (C) initiator; the component (A) functionalized polyphenylene ether resin is polyphenylene ether resin that has a number average molecular weight of 500-5000 and unsaturated double bonds at the molecule terminal; the component (B) crosslinking agent is olefin resin with a number average molecular weight of 500-10000, of which styrene structure comprises 10-50 wt %, and of which the molecule comprises 1,2-addition butadiene structure. The polyphenylene ether resin composition of the present invention is a composition of functionalized polyphenylene ether resin with a low molecular weight. The prepreg and copper clad laminate made from the polyphenylene ether resin composition have good dielectric properties and heat resistance.

Abstract: There is provided a pressure sensitive adhesive composition and a pressure sensitive adhesive. A pressure sensitive adhesive composition example of the present application can provide a pressure sensitive adhesive having, for example, a high shear resistance together with an excellent peeling property or tacking property with respect to an attachment target surface.

Abstract: The aim is to provide a flame retardant for thermoplastic resins that has a high flame-retardant imparting effect, and that produces a thermoplastic resin composition with superior moldability and workability that does not easily bleed out and a molded body with superior resistance to heat-moisture and chemicals; and a flame retardant for thermoplastic resins that has a high flame-retardant imparting effect, and that produces a flame retardant with a heat resistance to working temperatures of 300° C. or higher and a molded body with superior resistance to reflow heat and chemicals. Disclosed is a flame retardant, which is a specific flame retardant for thermoplastic resins comprising the reaction product of a nitrogen-containing compound and a phosphorous-containing compound, that is insoluble in toluene and comprises in the range of 5 to 10 wt % of phosphorus atoms.

Abstract: The invention relates to a modified hydrocarbylphenol-aldehyde resin prepared by reacting a hydrocarbylphenol-aldehyde resin with a primary or secondary amine and further with an epoxide. The invention also provides a process for preparing a modified, hydrocarbylphenol-aldehyde resin and a rubber composition containing such resin.

Abstract: A phase-separated polymeric composition comprising a first phase including polyurethane domains; and a second phase including a butyl rubber matrix.

Abstract: Disclosed is a thermoplastic resin composition comprising a cross-copolymer which meets specific requirements; and a polyphenylene ether resin, wherein the cross-copolymer is contained in an amount of 5 to 95 mass % and the polyphenylene ether resin is contained in an amount of 95 to 5 mass %. The thermoplastic resin composition has excellent heat resistant, excellent softness, excellent flexibility, excellent stretching properties, and excellent scratch-abrasion resistance.

Abstract: The present invention relates to a crosslinked lignin comprising a lignin structure having methylene or ethylene linking groups therein crosslinking between phenyl ring carbon atoms, wherein said crosslinked lignin is crosslinked to an extent that it has a number-average molecular weight of at least 10,000 g/mol, is melt-processible, and has either a glass transition temperature of at least 100° C., or is substantially soluble in a polar organic solvent or aqueous alkaline solution. Thermoplastic copolymers containing the crosslinked lignin are also described. Methods for producing the crosslinked lignin and thermoplastic copolymers are also described.

Abstract: A laser-engraveable flexographic printing precursor or patternable element comprises a laser-engraveable layer having two orthogonal dimensions. This laser-engraveable layer comprises one or more elastomeric resins and non-metallic fibers that are oriented in the laser-engraveable layer predominantly in one of its two orthogonal dimensions. The non-metallic fibers have an average length of at least 0.1 mm and an average diameter of at least 1 ?m. The oriented non-metallic fibers reduce curl and shrinkage in the precursor and improve print quality and press life.

Abstract: This disclosure relates generally to polycarbonate compositions whose hydrolysis products and residual monomer content, if any, exhibit little or no estradiol binding activity. Also disclosed are methods for making the disclosed polycarbonates and articles of manufacture comprising the disclosed polycarbonates.

Abstract: A composition includes specific amounts of a virgin poly(arylene ether) resin and a rubber-modified polystyrene that is preferably derived from post-consumer recycling. The composition includes about 0.2 to about 1.5 weight percent of polymerized acrylonitrile residue that can originate as a contaminant in the recycled rubber-modified polystyrene. The composition avoids the need for compatibilizing agents required by related compositions.

Abstract: The invention is related to a vulcanizable rubber composition comprising an elastomeric polymer, a phenol formaldehyde resin cross-linker, and an activator package characterized in that the vulcanizable rubber composition comprises an activated zeolite. The invention also relates to a process for the manufacture of a vulcanized article comprising the steps of preparing a vulcanizable rubber composition, shaping the vulcanizable rubber composition and vulcanizing the shaped rubber composition. The invention further relates to a vulcanized article.

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract: The aim is to provide a flame retardant for thermoplastic resins that has a high flame-retardant imparting effect, and that produces a thermoplastic resin composition with superior moldability and workability that does not easily bleed out and a molded body with superior resistance to heat-moisture and chemicals; and a flame retardant for thermoplastic resins that has a high flame-retardant imparting effect, and that produces a flame retardant with a heat resistance to working temperatures of 300° C. or higher and a molded body with superior resistance to reflow heat and chemicals. Disclosed is a flame retardant, which is a specific flame retardant for thermoplastic resins comprising the reaction product of a nitrogen-containing compound and a phosphorous-containing compound, that is insoluble in toluene and comprises in the range of 5 to 10 wt % of phosphorus atoms.

Abstract: Disclosed herein are 2K structural adhesive compositions comprising (a) a first component comprising (i) an epoxy-adduct formed as a reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid; and (ii) a second epoxy compound; and (b) a second component that reacts with the first component. In one embodiment, the second component is an amine compound. These adhesives may be used to bond together substrate materials such as two half shells of wind turbine blades.

Abstract: A pressure sensitive adhesive composition for attaching a solar module to a substrate includes an uncured rubbery polymer blend, at least one of a tackifier or a curing agent blend, and a polybutene homopolymer. The tackifier includes a phenolic tackifier resin and the curing agent blend includes at least one of a cure accelerator, a sulfur activator, and a curing vulcanizing agent. The composition exhibits initial tackiness when uncured and high strength when cured. The composition is cured in situ on the substrate.

Abstract: The present invention relates to a block copolymer prepared by ATRP, wherein the polymer chain terminal group is structurally modified with the functionally effective group of a lubricant or polymer additive selected from the group consisting of antioxidants, metal deactivators, antiwear and extreme pressure additives and corrosion inhibitors. The invention also relates to a composition comprising the structurally modified block copolymer and a composition of matter subject to oxidative, thermal or light induced degradation, such as lubricants or polymers.

Abstract: The invention relates to a modified hydrocarbylphenol-aldehyde resin prepared by reacting a hydrocarbylphenol-aldehyde resin with a primary or secondary amine and further with an epoxide. The invention also provides a process for preparing a modified, hydrocarbylphenol-aldehyde resin and a rubber composition containing such resin.

Abstract: As a rubber composition having an elasticity further increased as compared with the conventional rubber composition while preventing the lowering of the fracture resistance, there is provided a rubber composition comprising a rubber component of at least one of natural rubber and synthetic diene rubbers and a phenolic resin compounded therein and represented by the following formula (I): (wherein R0 is a hydrogen atom, an alkyl group, a phenyl group or a methylol group, and each of R1 and R2 is an arylene group, an alkylene group having a carbon number of 2-10, an aralkylene group, a cycloalkenylene group or a cycloalkadienylene group, and n is 0-10).

Abstract: The present invention is directed to low dielectric polymers and to methods of producing these low dielectric constant polymers, dielectric materials and layers, and electronic components. In one aspect of the present invention, an isomeric mixture of thermosetting monomers, wherein the monomers have a core structure and a plurality of arms, is provided, and the isomeric mixture of thermosetting monomers is polymerized, wherein polymerization comprises a reaction of an ethynyl group that is located in at least one arm of a monomer.

Abstract: In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arlyene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.

Abstract: A polymeric network comprises a plurality of monomers that include a cage compound with at least three arms, wherein at least one of the arms has two or more branches, and wherein each of the branches further comprises a reactive group. Monomers in contemplated polymeric networks are covalently coupled to each other via the reactive groups. Particularly contemplated cage compounds include adamantane and diamantane, and especially contemplated branched arms comprise ortho-bis(phenylethynyl)phenyl. Especially contemplated polymeric networks have a dielectric constant of no more than 3.0, and are formed on the surface of a substrate.

Abstract: In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.

Abstract: A low dielectric constant material has a first backbone with an aromatic moiety and a first reactive group, and a second backbone with an aromatic moiety and a second reactive group, wherein the first and second backbones are crosslinked via the first and second reactive groups in a crosslinking reaction without an additional crosslinker, and wherein a cage structure having at least 10 atoms is covalently bound to at least one of the first and second backbone.

Abstract: To provide a material improved in dimensional accuracy and reduced in the extent of deformation caused by warpage without suffering from a serious reduction in mechanical properties such as flexural properties, and suitable for connectors which have a ratio (L/t) of the length (L) of the product to the average thickness (t) thereof of at least 100 and a ratio (L/h) of the length (L) of the product to the height (h) thereof of at least 10. A liquid crystal polymer composition for connectors, having a ratio (L/t) of the length (L) of the product to the average thickness (t) thereof of at least 100 and a ratio (L/h) of the length (L) of the product to the height (h) thereof of not exceeding 10, which is obtained by blending 100 parts by weight of a liquid crystal polymer (A) with 5 to 100 parts by weight of a fibrous filler (B) having an average fiber diameter of 0.

Abstract: In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.

Abstract: A coating solution for forming porous organic film comprising the following A) to C), wherein A) and B) have respective heat decomposition initiation temperatures Ta and Tb satisfying a relation: Ta>Tb: A) a thermosetting resin having an aromatic ring in the main chain, B) a heat decomposable resin obtained by polymerization of monomers which include at least one compound represented by the following formula (1) or (2), and C) an organic solvent, wherein, X and each of R1 to R3 are defined in the specification.

Abstract: Block copolyestercarbonates substantially free of anhydride linkages linking at least two mers of the polymer chain may be prepared by a method which comprises the steps of: (A) preparing a hydroxy-terminated polyester intermediate in a molten reaction mixture comprising at least one 1,3-dihydroxybenzene moiety and at least one aromatic dicarboxylic acid diarylester under transesterification conditions, said polyester intermediate having a degree of polymerization of at least 4; and (B) conducting a reaction of said polyester intermediate with a carbonate precursor in a two-phase system comprising an aqueous phase and a water-immiscible organic solvent. Articles comprising the copolyestercarbonates are another aspect of the invention.

Abstract: A low dielectric constant material has a first backbone with an aromatic moiety and a first reactive group, and a second backbone with an aromatic moiety and a second reactive group, wherein the first and second backbones are crosslinked via the first and second reactive groups in a crosslinking reaction without an additional crosslinker, and wherein a cage structure having at least 10 atoms is covalently bound to at least one of the first and second backbone.

Abstract: In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.

Abstract: An elastomer-thermoplastic composition comprising styrene butadiene random copolymer and poly(arylene ether) resin and methods of making the composition are disclosed.

Abstract: The present invention relates to a resin composition comprising 5 to 60 parts by weight of a polyphenylene ether resin and 40 to 95 parts by weight of a crystalline polypropylene resin, and further containing a hydrogenation product of an aromatic vinyl compound-conjugated diene copolymer in an amount of 1 to 30 parts by weight based on 100 parts by weight of said polyphenylene ether resin and crystalline polypropylene resin combined, said crystalline polypropylene resin forming a continuous phase while said polyphenylene ether resin forming a disperse phase, the ratio of the weighted average inter-particle-wall distance (Lw) to the added average inter-particle-wall distance (Ln) of said disperse phase, Lw/Ln, being 1.0 to 3.0.

Abstract: A low dielectric constant material has a first backbone with an aromatic moiety and a first reactive group, and a second backbone with an aromatic moiety and a second reactive group, wherein the first and second backbones are crosslinked via the first and second reactive groups in a crosslinking reaction without an additional crosslinker, and wherein a cage structure having at least 10 atoms is covalently bound to at least one of the first and second backbone.

Abstract: A composition for anti-reflective coating material is disclosed, comprising a polymer compound having repeating units having specific structure, and optionally a melamine, guanamine, urea, phenol, naphthol or hydroxyanthracene compound substituted by at least one group selected from the group consisting of a methylol group and an alkoxymethyl group at two or more positions. The composition for anti-reflective coating material of the present invention is effective for the reduction of adverse effects of reflection by the substrate in a lithographic process using various radiations. A resist pattern formation process which comprises the use of the composition for anti-reflective coating material is also disclosed.

Abstract: The present invention relates to a blend comprising at least one interpolymer produced from polymerizing a monomer mixture comprising from about 5 to about 65 mole percent of (a) at least one vinylidene aromatic monomer, or (b) a combination of at least one vinylidene aromatic monomer and at least one hindered aliphatic vinylidene monomer, and from about 35 to about 95 mole percent of at least one aliphatic &agr;-olefin having from about 2 to about 20 carbon atoms; and a composition comprising an aromatic polyether and optionally (a) at least one homopolymer of a vinylidene aromatic monomer, or (b) at least one interpolymer of one or more vinylidene aromatic monomers, or (c) at least one interpolymer of at least one vinylidene aromatic monomer and at least one hindered aliphatic vinylidene monomers, or (d) at least one of (a-c) further comprising an impact modifier, or (e) a combination of any two or more of the aromatic polyether and (a-d).

Abstract: Thermoplastically processable thermotropic molding compounds of thermotropic polycondensates and 0.05 to 5% by weight functionalized polymers, such as for example functionalized polybutadiene oils, polyethylene or polypropylene.

Abstract: A blend of a polyarylene ether and a dispersible reactive solvent such as a thermoplastic polyurethane or a cyclopentadiene can be processed at temperatures below the oxidative degradation temperature of the polyarylene ether, yet form an article upon cooling that substantially retains the properties of the polyarylene ether.